SG11201908780RA - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
SG11201908780RA
SG11201908780RA SG11201908780RA SG11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA
Authority
SG
Singapore
Prior art keywords
polishing
wafer
elastic membrane
strain
processing apparatus
Prior art date
Application number
Inventor
Keisuke Namiki
Makoto Fukushima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201908780RA publication Critical patent/SG11201908780RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

SUBSTRATE PROCESSING APPARATUS A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors. Figure 4
SG11201908780R 2017-03-31 2018-01-16 Substrate processing apparatus SG11201908780RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (en) 2017-03-31 2017-03-31 Board processing equipment
PCT/JP2018/000912 WO2018179685A1 (en) 2017-03-31 2018-01-16 Substrate processing device

Publications (1)

Publication Number Publication Date
SG11201908780RA true SG11201908780RA (en) 2019-10-30

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908780R SG11201908780RA (en) 2017-03-31 2018-01-16 Substrate processing apparatus

Country Status (7)

Country Link
US (1) US11969858B2 (en)
JP (1) JP6990980B2 (en)
KR (1) KR102474471B1 (en)
CN (1) CN110476226B (en)
SG (1) SG11201908780RA (en)
TW (1) TWI758436B (en)
WO (1) WO2018179685A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102629679B1 (en) * 2018-11-09 2024-01-29 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
JP2022080370A (en) * 2020-11-18 2022-05-30 株式会社荏原製作所 Substrate holding device
KR20230150383A (en) * 2021-03-05 2023-10-30 어플라이드 머티어리얼스, 인코포레이티드 Machine learning to classify retaining rings
TWI789926B (en) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 Grinding system, grinding states sensing system, database and method thereof
WO2023162714A1 (en) * 2022-02-25 2023-08-31 株式会社荏原製作所 Substrate polishing device
JP2023148615A (en) * 2022-03-30 2023-10-13 株式会社荏原製作所 Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method
JP2023162749A (en) * 2022-04-27 2023-11-09 株式会社荏原製作所 Initialization device for elastic membrane, polishing device, method for initializing elastic membrane, and method for determining life of elastic membrane

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4033632B2 (en) * 1999-02-02 2008-01-16 株式会社荏原製作所 Substrate gripping apparatus and polishing apparatus
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
JP4101403B2 (en) 1999-06-22 2008-06-18 株式会社荏原製作所 Wafer polishing apparatus and wafer manufacturing method
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (en) 2000-11-21 2002-08-06 Nikon Corp Grinding device, method for manufacturing semiconductor device using it and semiconductor device manufactured thereby
JP2005123485A (en) 2003-10-17 2005-05-12 Ebara Corp Polishing device
EP1758711B1 (en) * 2004-06-21 2013-08-07 Ebara Corporation Polishing apparatus and polishing method
TW200610615A (en) 2004-07-15 2006-04-01 Disco Corp Grindstone tool
WO2007086529A1 (en) 2006-01-25 2007-08-02 Jsr Corporation Chemical mechanical polishing pad and method for manufacturing same
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
DE102007011880A1 (en) 2007-03-13 2008-09-18 Peter Wolters Gmbh Processing machine with means for detecting processing parameters
JP5093652B2 (en) 2007-06-12 2012-12-12 株式会社ニコン Polishing equipment
JP5551479B2 (en) 2010-03-19 2014-07-16 ニッタ・ハース株式会社 Polishing apparatus, polishing pad and polishing information management system
JP5552401B2 (en) * 2010-09-08 2014-07-16 株式会社荏原製作所 Polishing apparatus and method
JP5677004B2 (en) 2010-09-30 2015-02-25 株式会社荏原製作所 Polishing apparatus and method
JP5868081B2 (en) 2011-09-05 2016-02-24 株式会社ディスコ Processing equipment
JP5891127B2 (en) 2012-07-03 2016-03-22 株式会社荏原製作所 Polishing apparatus and polishing method
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
WO2014078151A1 (en) 2012-11-16 2014-05-22 Applied Materials, Inc. Recording measurements by sensors for a carrier head
JP2014223684A (en) 2013-05-15 2014-12-04 株式会社東芝 Polishing device, and polishing method
US9454684B2 (en) 2014-05-28 2016-09-27 Taiwan Semiconductor Manufacturing Company Limited Edge crack detection system
US9878421B2 (en) 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
KR101913701B1 (en) * 2015-03-13 2018-11-02 주식회사 케이씨텍 Carrier head of chemical mechanical polishing apparatus
JP6557049B2 (en) 2015-04-23 2019-08-07 株式会社ディスコ Processing equipment

Also Published As

Publication number Publication date
KR20190134665A (en) 2019-12-04
CN110476226A (en) 2019-11-19
KR102474471B1 (en) 2022-12-06
TW201836763A (en) 2018-10-16
US20200023487A1 (en) 2020-01-23
CN110476226B (en) 2023-08-18
JP6990980B2 (en) 2022-01-12
JP2018174230A (en) 2018-11-08
US11969858B2 (en) 2024-04-30
TWI758436B (en) 2022-03-21
WO2018179685A1 (en) 2018-10-04

Similar Documents

Publication Publication Date Title
SG11201908780RA (en) Substrate processing apparatus
PH12019502321A1 (en) Picture-based vehicle loss assessment method and apparatus, and electronic device
MY193739A (en) Picture-based vehicle loss assessment method and apparatus, and electronic device
TW201611950A (en) Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method
EP3624092A3 (en) Display device and a testing method thereof
PH12020552245A1 (en) Probe card for high frequency applications
MX2019013900A (en) Devices, systems, and methods for cleaning vessels.
EP2995244A3 (en) Wearable biometric information measurement device
WO2016064237A3 (en) Touch input device
GB201008089D0 (en) Apparatus for use in diagnosing neurological disorder
MY164221A (en) Polishing pad
SE1750836A1 (en) Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module
MY179995A (en) Device and method for discrete distributed optical fiber pressure sensing
WO2011008628A8 (en) Method and apparatus for multi-touch game commands
MY185331A (en) Imprint apparatus and method of manufacturing article
MX2016016342A (en) Sensor arrangement, measuring device and measuring method.
PH12019550124A1 (en) Pressure sensitive stylus
MX2016006079A (en) Inspection system.
MX2016005424A (en) Method and device for determining energy consumption value.
JP2018174230A5 (en)
WO2015180826A3 (en) Device and method for geometrically measuring an object
TWI541510B (en) Can improve the detection efficiency of the point measurement method
JP2014017428A5 (en)
TW201612704A (en) Touch panel and display panel with function of fingerprint identification
MX2016012079A (en) Device for detection of disease states and applications of same.