JP6990980B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6990980B2
JP6990980B2 JP2017071573A JP2017071573A JP6990980B2 JP 6990980 B2 JP6990980 B2 JP 6990980B2 JP 2017071573 A JP2017071573 A JP 2017071573A JP 2017071573 A JP2017071573 A JP 2017071573A JP 6990980 B2 JP6990980 B2 JP 6990980B2
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JP
Japan
Prior art keywords
substrate
polishing
strain
control device
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017071573A
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English (en)
Japanese (ja)
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JP2018174230A5 (enExample
JP2018174230A (ja
Inventor
計介 並木
誠 福島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017071573A priority Critical patent/JP6990980B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US16/499,576 priority patent/US11969858B2/en
Priority to KR1020197030937A priority patent/KR102474471B1/ko
Priority to PCT/JP2018/000912 priority patent/WO2018179685A1/ja
Priority to SG11201908780R priority patent/SG11201908780RA/en
Priority to CN201880022273.2A priority patent/CN110476226B/zh
Priority to TW107108771A priority patent/TWI758436B/zh
Publication of JP2018174230A publication Critical patent/JP2018174230A/ja
Publication of JP2018174230A5 publication Critical patent/JP2018174230A5/ja
Application granted granted Critical
Publication of JP6990980B2 publication Critical patent/JP6990980B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2017071573A 2017-03-31 2017-03-31 基板処理装置 Active JP6990980B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
KR1020197030937A KR102474471B1 (ko) 2017-03-31 2018-01-16 기판 처리 장치
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置
SG11201908780R SG11201908780RA (en) 2017-03-31 2018-01-16 Substrate processing apparatus
US16/499,576 US11969858B2 (en) 2017-03-31 2018-01-16 Substrate processing apparatus
CN201880022273.2A CN110476226B (zh) 2017-03-31 2018-01-16 基板处理装置
TW107108771A TWI758436B (zh) 2017-03-31 2018-03-15 彈性膜、扣環及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Publications (3)

Publication Number Publication Date
JP2018174230A JP2018174230A (ja) 2018-11-08
JP2018174230A5 JP2018174230A5 (enExample) 2020-05-07
JP6990980B2 true JP6990980B2 (ja) 2022-01-12

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017071573A Active JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Country Status (7)

Country Link
US (1) US11969858B2 (enExample)
JP (1) JP6990980B2 (enExample)
KR (1) KR102474471B1 (enExample)
CN (1) CN110476226B (enExample)
SG (1) SG11201908780RA (enExample)
TW (1) TWI758436B (enExample)
WO (1) WO2018179685A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
WO2022187055A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Machine learning for classifying retaining rings
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
KR20240154574A (ko) * 2022-02-25 2024-10-25 가부시키가이샤 에바라 세이사꾸쇼 기판 연마 장치
JP7496932B2 (ja) * 2022-03-23 2024-06-07 株式会社日立ハイテク 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2023162749A (ja) * 2022-04-27 2023-11-09 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、弾性膜の初期化方法、および弾性膜の寿命判定方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

Citations (10)

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WO2000045993A1 (en) 1999-02-02 2000-08-10 Ebara Corporation Wafer holder and polishing device
JP2001009712A (ja) 1999-06-22 2001-01-16 Mitsubishi Materials Corp ウェーハ研磨装置及びウェーハ製造方法
JP2008310404A (ja) 2007-06-12 2008-12-25 Nikon Corp 研磨装置
JP2009542449A (ja) 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
JP2011194509A (ja) 2010-03-19 2011-10-06 Nitta Haas Inc 研磨装置、研磨パッドおよび研磨情報管理システム
JP2013052483A (ja) 2011-09-05 2013-03-21 Disco Corp 加工装置
JP2014011432A (ja) 2012-07-03 2014-01-20 Ebara Corp 研磨装置および研磨方法
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
JP2015051501A (ja) 2010-09-30 2015-03-19 株式会社荏原製作所 研磨装置および方法
JP2016207862A (ja) 2015-04-23 2016-12-08 株式会社ディスコ 加工装置

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TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (ja) 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
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KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
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Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000045993A1 (en) 1999-02-02 2000-08-10 Ebara Corporation Wafer holder and polishing device
JP2001009712A (ja) 1999-06-22 2001-01-16 Mitsubishi Materials Corp ウェーハ研磨装置及びウェーハ製造方法
JP2009542449A (ja) 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
JP2008310404A (ja) 2007-06-12 2008-12-25 Nikon Corp 研磨装置
JP2011194509A (ja) 2010-03-19 2011-10-06 Nitta Haas Inc 研磨装置、研磨パッドおよび研磨情報管理システム
JP2015051501A (ja) 2010-09-30 2015-03-19 株式会社荏原製作所 研磨装置および方法
JP2013052483A (ja) 2011-09-05 2013-03-21 Disco Corp 加工装置
JP2014011432A (ja) 2012-07-03 2014-01-20 Ebara Corp 研磨装置および研磨方法
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
JP2016207862A (ja) 2015-04-23 2016-12-08 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR20190134665A (ko) 2019-12-04
CN110476226A (zh) 2019-11-19
CN110476226B (zh) 2023-08-18
TWI758436B (zh) 2022-03-21
US11969858B2 (en) 2024-04-30
WO2018179685A1 (ja) 2018-10-04
TW201836763A (zh) 2018-10-16
KR102474471B1 (ko) 2022-12-06
US20200023487A1 (en) 2020-01-23
JP2018174230A (ja) 2018-11-08
SG11201908780RA (en) 2019-10-30

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