JP2018170489A - 電子部品及びシステムインパッケージ - Google Patents
電子部品及びシステムインパッケージ Download PDFInfo
- Publication number
- JP2018170489A JP2018170489A JP2017200643A JP2017200643A JP2018170489A JP 2018170489 A JP2018170489 A JP 2018170489A JP 2017200643 A JP2017200643 A JP 2017200643A JP 2017200643 A JP2017200643 A JP 2017200643A JP 2018170489 A JP2018170489 A JP 2018170489A
- Authority
- JP
- Japan
- Prior art keywords
- oxide layer
- electronic component
- metal oxide
- main body
- graphene oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 53
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 41
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 34
- 239000000126 substance Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000003566 sealing material Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000006249 magnetic particle Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052702 rhenium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 230000032798 delamination Effects 0.000 abstract description 4
- 239000008393 encapsulating agent Substances 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 description 6
- 230000035882 stress Effects 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 150000004703 alkoxides Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006355 external stress Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- -1 alkoxide silane compound Chemical class 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012767 functional filler Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Ceramic Capacitors (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
101 本体
102 素子基板
103 コイル部
104、105 外部電極
106、106'、106'' 補強部
116 金属酸化物層
126 グラフェン酸化物層
200 システムインパッケージ
201 基板
202 接着性電気連結部材
203 封止材
Claims (16)
- 電気絶縁性の本体と、
前記本体の外部に配置される外部電極と、
前記本体の表面に配置され、金属酸化物層及びグラフェン酸化物層を含む補強部と、
を含む電子部品。 - 前記金属酸化物層は、前記本体と接触し、前記金属酸化物層と前記本体とをなす物質は、化学結合を形成する請求項1に記載の電子部品。
- 前記本体は、ポリマーを含む請求項2に記載の電子部品。
- 前記本体は、前記ポリマーに分散された多数の磁性体粒子をさらに含む請求項3に記載の電子部品。
- 前記金属酸化物層と前記グラフェン酸化物層とは、化学結合を形成する請求項1から4のいずれか一項に記載の電子部品。
- 前記補強部は、前記金属酸化物層と前記グラフェン酸化物層とが厚さ方向に積層された構造をなす請求項1から5のいずれか一項に記載の電子部品。
- 前記補強部において、前記金属酸化物層と前記グラフェン酸化物層とは、互いに交互に2回以上繰り返し積層された形態である請求項6に記載の電子部品。
- 前記補強部の最外側には、前記グラフェン酸化物層が配置される請求項7に記載の電子部品。
- 前記外部電極は、一対が具備されて互いに離隔し、前記補強部は、前記一対の外部電極の間に配置される請求項1から8のいずれか一項に記載の電子部品。
- 前記本体の表面を基準として、前記補強部と前記外部電極とは同一の厚さを有する請求項9に記載の電子部品。
- 前記金属酸化物層において、金属成分は、Ti、Al、Ge、Co、Ca、Hf、Fe、Ni、Nb、Mo、La、Re、Sc、Si、Ta、W、Y、Zr及びVからなるグループから選択される少なくともいずれか一つである請求項1から10のいずれか一項に記載の電子部品。
- 前記本体内に配置されるコイル部をさらに含む請求項1から11のいずれか一項に記載の電子部品。
- 基板と、
前記基板上に配置され、電気絶縁性の本体、前記本体の外部に配置される外部電極、及び前記本体の表面に配置され、金属酸化物層及びグラフェン酸化物層を含む補強部を含む電子部品と、
前記電子部品を封止する封止材と、
を含むシステムインパッケージ。 - 前記金属酸化物層及び前記グラフェン酸化物層の少なくともいずれか一つは、前記封止材と化学結合を形成する請求項13に記載のシステムインパッケージ。
- 前記封止材は、ポリマーを含む請求項14に記載のシステムインパッケージ。
- 前記金属酸化物層は、前記本体と接触し、前記金属酸化物層と前記本体とをなす物質は、化学結合を形成する請求項13から15のいずれか一項に記載のシステムインパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0039998 | 2017-03-29 | ||
KR1020170039998A KR102370097B1 (ko) | 2017-03-29 | 2017-03-29 | 전자 부품 및 시스템 인 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018170489A true JP2018170489A (ja) | 2018-11-01 |
JP7140312B2 JP7140312B2 (ja) | 2022-09-21 |
Family
ID=63670890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017200643A Active JP7140312B2 (ja) | 2017-03-29 | 2017-10-16 | 電子部品及びシステムインパッケージ |
Country Status (3)
Country | Link |
---|---|
US (1) | US10607764B2 (ja) |
JP (1) | JP7140312B2 (ja) |
KR (2) | KR102370097B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190121226A (ko) * | 2018-11-29 | 2019-10-25 | 삼성전기주식회사 | 커패시터 부품 |
KR102185051B1 (ko) | 2019-03-06 | 2020-12-01 | 삼성전기주식회사 | 코일 전자부품 |
KR102176276B1 (ko) * | 2019-08-20 | 2020-11-09 | 삼성전기주식회사 | 코일 부품 |
Citations (9)
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JPH08124718A (ja) * | 1994-10-19 | 1996-05-17 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
JP2012117052A (ja) * | 2010-11-29 | 2012-06-21 | Samsung Electro-Mechanics Co Ltd | 多層配線基板用絶縁樹脂組成物及びこれを含む多層配線基板 |
CN103183340A (zh) * | 2013-03-27 | 2013-07-03 | 复旦大学 | 一种超高模量和高强度的氧化石墨烯薄膜及其制备方法 |
CN103692735A (zh) * | 2013-12-25 | 2014-04-02 | 桂林理工大学 | 一种采用氧化石墨烯制备高强度玻璃的方法 |
WO2015138080A1 (en) * | 2014-03-10 | 2015-09-17 | The Boeing Company | Graphene coated electronic components |
JP2015204337A (ja) * | 2014-04-11 | 2015-11-16 | アルプス・グリーンデバイス株式会社 | 電子部品、電子部品の製造方法および電子機器 |
WO2016013643A1 (ja) * | 2014-07-25 | 2016-01-28 | 株式会社村田製作所 | 電子部品及びその製造方法 |
JP2016048684A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社半導体エネルギー研究所 | 蓄電池用電極、及びその製造方法、蓄電池、電子機器、並びにグラフェン |
JP2016213190A (ja) * | 2015-05-06 | 2016-12-15 | 株式会社半導体エネルギー研究所 | 二次電池および電子機器 |
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-
2017
- 2017-03-29 KR KR1020170039998A patent/KR102370097B1/ko active IP Right Grant
- 2017-10-13 US US15/783,798 patent/US10607764B2/en active Active
- 2017-10-16 JP JP2017200643A patent/JP7140312B2/ja active Active
-
2022
- 2022-02-24 KR KR1020220024279A patent/KR102404316B1/ko active IP Right Grant
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JP2012117052A (ja) * | 2010-11-29 | 2012-06-21 | Samsung Electro-Mechanics Co Ltd | 多層配線基板用絶縁樹脂組成物及びこれを含む多層配線基板 |
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Also Published As
Publication number | Publication date |
---|---|
KR102404316B1 (ko) | 2022-06-07 |
JP7140312B2 (ja) | 2022-09-21 |
US20180286559A1 (en) | 2018-10-04 |
KR20180110448A (ko) | 2018-10-10 |
US10607764B2 (en) | 2020-03-31 |
KR102370097B1 (ko) | 2022-03-04 |
KR20220029627A (ko) | 2022-03-08 |
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