JP2018158399A5 - - Google Patents

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Publication number
JP2018158399A5
JP2018158399A5 JP2017055976A JP2017055976A JP2018158399A5 JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5 JP 2017055976 A JP2017055976 A JP 2017055976A JP 2017055976 A JP2017055976 A JP 2017055976A JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5
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JP
Japan
Prior art keywords
polishing
substrate
conditioning
shape
polishing member
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JP2017055976A
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English (en)
Japanese (ja)
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JP6884015B2 (ja
JP2018158399A (ja
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Priority claimed from JP2017055976A external-priority patent/JP6884015B2/ja
Priority to JP2017055976A priority Critical patent/JP6884015B2/ja
Priority to US16/495,010 priority patent/US20200269383A1/en
Priority to SG11201908381R priority patent/SG11201908381RA/en
Priority to PCT/JP2018/000233 priority patent/WO2018173421A1/ja
Priority to KR1020197028236A priority patent/KR102482181B1/ko
Priority to CN201880018928.9A priority patent/CN110461542A/zh
Priority to TW107101152A priority patent/TWI763765B/zh
Publication of JP2018158399A publication Critical patent/JP2018158399A/ja
Publication of JP2018158399A5 publication Critical patent/JP2018158399A5/ja
Publication of JP6884015B2 publication Critical patent/JP6884015B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017055976A 2017-03-22 2017-03-22 基板の研磨装置および研磨方法 Active JP6884015B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
KR1020197028236A KR102482181B1 (ko) 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법
SG11201908381R SG11201908381RA (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法
US16/495,010 US20200269383A1 (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
CN201880018928.9A CN110461542A (zh) 2017-03-22 2018-01-10 基板的研磨装置及研磨方法
TW107101152A TWI763765B (zh) 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2018158399A JP2018158399A (ja) 2018-10-11
JP2018158399A5 true JP2018158399A5 (https=) 2020-03-19
JP6884015B2 JP6884015B2 (ja) 2021-06-09

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017055976A Active JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (https=)
JP (1) JP6884015B2 (https=)
KR (1) KR102482181B1 (https=)
CN (1) CN110461542A (https=)
SG (1) SG11201908381RA (https=)
TW (1) TWI763765B (https=)
WO (1) WO2018173421A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020129714A1 (ja) * 2018-12-19 2020-06-25 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

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US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3011168B2 (ja) * 1997-12-19 2000-02-21 日本電気株式会社 半導体基板研磨装置
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP2001170856A (ja) * 1999-12-14 2001-06-26 Kawasaki Heavy Ind Ltd 曲面仕上げ装置
JP2002018662A (ja) * 2000-06-30 2002-01-22 Toshiba Mach Co Ltd 磨き加工用工具
JP3762248B2 (ja) * 2001-04-24 2006-04-05 キヤノン株式会社 回折光学素子用金型加工方法
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP5589427B2 (ja) * 2010-02-19 2014-09-17 株式会社ジェイテクト カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
EP3053704A4 (en) * 2013-10-04 2017-07-19 Fujimi Incorporated Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool
CN111584354B (zh) * 2014-04-18 2021-09-03 株式会社荏原制作所 蚀刻方法
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
US10589399B2 (en) * 2016-03-24 2020-03-17 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

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