JP2018158399A5 - - Google Patents

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Publication number
JP2018158399A5
JP2018158399A5 JP2017055976A JP2017055976A JP2018158399A5 JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5 JP 2017055976 A JP2017055976 A JP 2017055976A JP 2017055976 A JP2017055976 A JP 2017055976A JP 2018158399 A5 JP2018158399 A5 JP 2018158399A5
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JP
Japan
Prior art keywords
polishing
substrate
conditioning
shape
polishing member
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JP2017055976A
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English (en)
Japanese (ja)
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JP6884015B2 (ja
JP2018158399A (ja
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Priority claimed from JP2017055976A external-priority patent/JP6884015B2/ja
Priority to JP2017055976A priority Critical patent/JP6884015B2/ja
Priority to PCT/JP2018/000233 priority patent/WO2018173421A1/ja
Priority to US16/495,010 priority patent/US20200269383A1/en
Priority to KR1020197028236A priority patent/KR102482181B1/ko
Priority to CN201880018928.9A priority patent/CN110461542A/zh
Priority to SG11201908381R priority patent/SG11201908381RA/en
Priority to TW107101152A priority patent/TWI763765B/zh
Publication of JP2018158399A publication Critical patent/JP2018158399A/ja
Publication of JP2018158399A5 publication Critical patent/JP2018158399A5/ja
Publication of JP6884015B2 publication Critical patent/JP6884015B2/ja
Application granted granted Critical
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JP2017055976A 2017-03-22 2017-03-22 基板の研磨装置および研磨方法 Active JP6884015B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
CN201880018928.9A CN110461542A (zh) 2017-03-22 2018-01-10 基板的研磨装置及研磨方法
US16/495,010 US20200269383A1 (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
KR1020197028236A KR102482181B1 (ko) 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法
SG11201908381R SG11201908381RA (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
TW107101152A TWI763765B (zh) 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2018158399A JP2018158399A (ja) 2018-10-11
JP2018158399A5 true JP2018158399A5 (enrdf_load_stackoverflow) 2020-03-19
JP6884015B2 JP6884015B2 (ja) 2021-06-09

Family

ID=63584243

Family Applications (1)

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JP2017055976A Active JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (enrdf_load_stackoverflow)
JP (1) JP6884015B2 (enrdf_load_stackoverflow)
KR (1) KR102482181B1 (enrdf_load_stackoverflow)
CN (1) CN110461542A (enrdf_load_stackoverflow)
SG (1) SG11201908381RA (enrdf_load_stackoverflow)
TW (1) TWI763765B (enrdf_load_stackoverflow)
WO (1) WO2018173421A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12377519B2 (en) 2018-12-19 2025-08-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

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JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
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US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
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JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
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WO2015050185A1 (ja) * 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
KR102431971B1 (ko) * 2014-04-18 2022-08-16 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

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