TWI763765B - 基板的研磨裝置及研磨方法 - Google Patents

基板的研磨裝置及研磨方法

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Publication number
TWI763765B
TWI763765B TW107101152A TW107101152A TWI763765B TW I763765 B TWI763765 B TW I763765B TW 107101152 A TW107101152 A TW 107101152A TW 107101152 A TW107101152 A TW 107101152A TW I763765 B TWI763765 B TW I763765B
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
grinding
polishing pad
shape
Prior art date
Application number
TW107101152A
Other languages
English (en)
Chinese (zh)
Other versions
TW201834786A (zh
Inventor
安田穂積
小畠厳貴
高橋信行
作川卓
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201834786A publication Critical patent/TW201834786A/zh
Application granted granted Critical
Publication of TWI763765B publication Critical patent/TWI763765B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW107101152A 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法 TWI763765B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-055976 2017-03-22
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
TW201834786A TW201834786A (zh) 2018-10-01
TWI763765B true TWI763765B (zh) 2022-05-11

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107101152A TWI763765B (zh) 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (enrdf_load_stackoverflow)
JP (1) JP6884015B2 (enrdf_load_stackoverflow)
KR (1) KR102482181B1 (enrdf_load_stackoverflow)
CN (1) CN110461542A (enrdf_load_stackoverflow)
SG (1) SG11201908381RA (enrdf_load_stackoverflow)
TW (1) TWI763765B (enrdf_load_stackoverflow)
WO (1) WO2018173421A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12377519B2 (en) 2018-12-19 2025-08-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

Citations (6)

* Cited by examiner, † Cited by third party
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JPH11179648A (ja) * 1997-12-19 1999-07-06 Nec Corp 半導体基板研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) * 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
US20090247050A1 (en) * 2008-03-31 2009-10-01 Shigeharu Arisa Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
JP2011167813A (ja) * 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
TW201622889A (zh) * 2014-12-26 2016-07-01 荏原製作所股份有限公司 研磨裝置及其控制方法

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US4974368A (en) * 1987-03-19 1990-12-04 Canon Kabushiki Kaisha Polishing apparatus
JPH0818241B2 (ja) * 1987-03-19 1996-02-28 キヤノン株式会社 研磨工具の製造方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP2001170856A (ja) * 1999-12-14 2001-06-26 Kawasaki Heavy Ind Ltd 曲面仕上げ装置
JP2002018662A (ja) * 2000-06-30 2002-01-22 Toshiba Mach Co Ltd 磨き加工用工具
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
WO2015050185A1 (ja) * 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
KR102431971B1 (ko) * 2014-04-18 2022-08-16 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179648A (ja) * 1997-12-19 1999-07-06 Nec Corp 半導体基板研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) * 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
US20090247050A1 (en) * 2008-03-31 2009-10-01 Shigeharu Arisa Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
JP2011167813A (ja) * 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
TW201622889A (zh) * 2014-12-26 2016-07-01 荏原製作所股份有限公司 研磨裝置及其控制方法

Also Published As

Publication number Publication date
US20200269383A1 (en) 2020-08-27
JP6884015B2 (ja) 2021-06-09
TW201834786A (zh) 2018-10-01
JP2018158399A (ja) 2018-10-11
CN110461542A (zh) 2019-11-15
SG11201908381RA (en) 2019-10-30
WO2018173421A1 (ja) 2018-09-27
KR102482181B1 (ko) 2022-12-29
KR20190131501A (ko) 2019-11-26

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