JP2018154875A - スパッタリング装置 - Google Patents
スパッタリング装置 Download PDFInfo
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- JP2018154875A JP2018154875A JP2017053128A JP2017053128A JP2018154875A JP 2018154875 A JP2018154875 A JP 2018154875A JP 2017053128 A JP2017053128 A JP 2017053128A JP 2017053128 A JP2017053128 A JP 2017053128A JP 2018154875 A JP2018154875 A JP 2018154875A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3471—Introduction of auxiliary energy into the plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20228—Mechanical X-Y scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Abstract
Description
この構成では、各ターゲットから飛び出すスパッタ粒子が重なり合ってアンテナの配列方向において周期的な分布が発生するが、本発明のように基板をアンテナの配列方向に沿って往復走査させることによって、その周期的な分布に起因する膜厚の不均一を低減することができる。
本実施形態のスパッタリング装置100は、誘導結合型のプラズマPを用いてターゲットTをスパッタリングして基板Wに成膜するものである。ここで、基板Wは、例えば、液晶ディスプレイや有機ELディスプレイ等のフラットパネルディスプレイ(FPD)用の基板、フレキシブルディスプレイ用のフレキシブル基板等である。
本実施形態のスパッタリング装置100において、基板Wの走査速度を変化させた場合の成膜の均一性を評価した。なお、使用したターゲットTは、IGZO1114であり、サイズは、150×1000mmである。アンテナ間距離(ピッチ幅a)は、200mmである。ターゲット−基板間距離は、125mmである。基板Wのサイズは、320×400mmである。
このように構成した本実施形態のスパッタリング装置100によれば、基板保持部3に保持された基板Wをアンテナ5の配列方向Xに沿って往復走査させているので、アンテナ5の配列方向Xに沿ったプラズマPの濃淡及びスパッタ粒子の濃淡による膜厚のばらつきを低減することができ、成膜の均一性を向上させることができる。
なお、本発明は前記実施形態に限られるものではない。
W ・・・基板
P ・・・プラズマ
T ・・・ターゲット
2 ・・・真空容器
3 ・・・基板保持部
4 ・・・ターゲット保持部
5 ・・・アンテナ
14 ・・・往復走査機構
51 ・・・導体要素
52 ・・・絶縁要素
53 ・・・容量素子
Claims (5)
- プラズマを用いてターゲットをスパッタリングして基板に成膜するスパッタリング装置であって、
真空排気され且つガスが導入される真空容器と、
前記真空容器内において前記基板を保持する基板保持部と、
前記真空容器内において前記基板と対向して前記ターゲットを保持するターゲット保持部と、
前記基板保持部に保持された基板の表面に沿って配列され、前記プラズマを発生させる複数のアンテナと、
前記基板保持部に保持された基板を、前記複数のアンテナの配列方向に沿って往復走査する往復走査機構と、を備えるスパッタリング装置。 - 前記ターゲット保持部は、平面視において矩形状をなすターゲットを保持するものであり、
前記アンテナは、平面視において直線状をなすものであり、前記ターゲットの長手方向と平行となるように配置されている、請求項1記載のスパッタリング装置。 - 前記ターゲット保持部を複数有し、これら複数のターゲット保持部は等間隔に配列されており、
前記複数のアンテナは等間隔に配列されるとともに、前記各ターゲット保持部により保持された前記ターゲットの両側に配置されている、請求項1又は2記載のスパッタリング装置。 - 前記複数のターゲットのピッチ幅と、前記複数のアンテナのピッチ幅とが同一であり、
前記走査機構は、前記基板保持部の走査範囲を前記ピッチ幅としている、請求項3記載のスパッタリング装置。 - 前記アンテナは、少なくとも2つの導体要素と、互いに隣り合う前記導体要素の間に設けられて、それら導体要素を絶縁する絶縁要素と、互いに隣り合う前記導体要素と電気的に直列接続された容量素子とを備えている、請求項1乃至4の何れか一項に記載のスパッタリング装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017053128A JP7061257B2 (ja) | 2017-03-17 | 2017-03-17 | スパッタリング装置 |
PCT/JP2018/010013 WO2018168942A1 (ja) | 2017-03-17 | 2018-03-14 | スパッタリング装置 |
US16/494,773 US11328913B2 (en) | 2017-03-17 | 2018-03-14 | Sputtering device |
KR1020197025702A KR102235995B1 (ko) | 2017-03-17 | 2018-03-14 | 스퍼터링 장치 |
CN201880016032.7A CN110382734B (zh) | 2017-03-17 | 2018-03-14 | 溅射装置 |
TW107109002A TWI738986B (zh) | 2017-03-17 | 2018-03-16 | 濺鍍裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017053128A JP7061257B2 (ja) | 2017-03-17 | 2017-03-17 | スパッタリング装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018154875A true JP2018154875A (ja) | 2018-10-04 |
JP7061257B2 JP7061257B2 (ja) | 2022-04-28 |
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JP2017053128A Active JP7061257B2 (ja) | 2017-03-17 | 2017-03-17 | スパッタリング装置 |
Country Status (6)
Country | Link |
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US (1) | US11328913B2 (ja) |
JP (1) | JP7061257B2 (ja) |
KR (1) | KR102235995B1 (ja) |
CN (1) | CN110382734B (ja) |
TW (1) | TWI738986B (ja) |
WO (1) | WO2018168942A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021080533A (ja) * | 2019-11-21 | 2021-05-27 | 日新電機株式会社 | スパッタリング装置 |
KR20230147693A (ko) | 2021-08-03 | 2023-10-23 | 닛신덴키 가부시키 가이샤 | 플라즈마 처리 장치 |
WO2024101066A1 (ja) * | 2022-11-08 | 2024-05-16 | 日新電機株式会社 | プラズマ処理装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7172839B2 (ja) * | 2019-04-26 | 2022-11-16 | 日新電機株式会社 | スパッタリング装置 |
JP2022085103A (ja) * | 2020-11-27 | 2022-06-08 | 日新電機株式会社 | プラズマ処理装置 |
Citations (3)
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JP2014037555A (ja) * | 2012-08-10 | 2014-02-27 | Dainippon Screen Mfg Co Ltd | スパッタリング装置 |
JP2015172240A (ja) * | 2010-09-30 | 2015-10-01 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スパッタされた材料の層を形成するシステムおよび方法 |
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-
2017
- 2017-03-17 JP JP2017053128A patent/JP7061257B2/ja active Active
-
2018
- 2018-03-14 WO PCT/JP2018/010013 patent/WO2018168942A1/ja active Application Filing
- 2018-03-14 US US16/494,773 patent/US11328913B2/en active Active
- 2018-03-14 KR KR1020197025702A patent/KR102235995B1/ko active IP Right Grant
- 2018-03-14 CN CN201880016032.7A patent/CN110382734B/zh active Active
- 2018-03-16 TW TW107109002A patent/TWI738986B/zh active
Patent Citations (3)
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JP2015172240A (ja) * | 2010-09-30 | 2015-10-01 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スパッタされた材料の層を形成するシステムおよび方法 |
JP2014037555A (ja) * | 2012-08-10 | 2014-02-27 | Dainippon Screen Mfg Co Ltd | スパッタリング装置 |
JP2017004602A (ja) * | 2015-06-04 | 2017-01-05 | 日新電機株式会社 | プラズマ発生用のアンテナおよびそれを備えるプラズマ処理装置 |
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JP2021080533A (ja) * | 2019-11-21 | 2021-05-27 | 日新電機株式会社 | スパッタリング装置 |
KR20230147693A (ko) | 2021-08-03 | 2023-10-23 | 닛신덴키 가부시키 가이샤 | 플라즈마 처리 장치 |
WO2024101066A1 (ja) * | 2022-11-08 | 2024-05-16 | 日新電機株式会社 | プラズマ処理装置 |
Also Published As
Publication number | Publication date |
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WO2018168942A1 (ja) | 2018-09-20 |
TWI738986B (zh) | 2021-09-11 |
CN110382734A (zh) | 2019-10-25 |
TW201841265A (zh) | 2018-11-16 |
JP7061257B2 (ja) | 2022-04-28 |
US11328913B2 (en) | 2022-05-10 |
US20200027708A1 (en) | 2020-01-23 |
CN110382734B (zh) | 2022-11-29 |
KR20190113898A (ko) | 2019-10-08 |
KR102235995B1 (ko) | 2021-04-05 |
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