JP2018133562A - 接続構造体、異方性接着材料、および接続構造体の製造方法 - Google Patents

接続構造体、異方性接着材料、および接続構造体の製造方法 Download PDF

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Publication number
JP2018133562A
JP2018133562A JP2018016465A JP2018016465A JP2018133562A JP 2018133562 A JP2018133562 A JP 2018133562A JP 2018016465 A JP2018016465 A JP 2018016465A JP 2018016465 A JP2018016465 A JP 2018016465A JP 2018133562 A JP2018133562 A JP 2018133562A
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JP
Japan
Prior art keywords
ceramic substrate
adhesive material
connection structure
substrate
anisotropic adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018016465A
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English (en)
Japanese (ja)
Inventor
一夢 渡部
Kazumu Watanabe
一夢 渡部
雄介 田中
Yusuke Tanaka
雄介 田中
泰伸 山田
Yasunobu Yamada
泰伸 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of JP2018133562A publication Critical patent/JP2018133562A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2018016465A 2017-02-13 2018-02-01 接続構造体、異方性接着材料、および接続構造体の製造方法 Pending JP2018133562A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017024300 2017-02-13
JP2017024300 2017-02-13

Publications (1)

Publication Number Publication Date
JP2018133562A true JP2018133562A (ja) 2018-08-23

Family

ID=63107504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018016465A Pending JP2018133562A (ja) 2017-02-13 2018-02-01 接続構造体、異方性接着材料、および接続構造体の製造方法

Country Status (3)

Country Link
JP (1) JP2018133562A (zh)
TW (1) TW201842113A (zh)
WO (1) WO2018147163A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102211998B1 (ko) * 2019-04-10 2021-02-04 주식회사 디아이티 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법
JP6691998B1 (ja) * 2019-12-24 2020-05-13 株式会社鈴木 半導体装置の製造方法及び半導体装置の製造装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006154621A (ja) * 2004-12-01 2006-06-15 Canon Inc 基板の接着方法
JP2008159849A (ja) * 2006-12-25 2008-07-10 Matsushita Electric Ind Co Ltd 電極接合構造体及び電極接合方法
JP2011178953A (ja) * 2010-03-03 2011-09-15 Nippon Zeon Co Ltd 離型フィルムおよびその製造方法
JP2014031444A (ja) * 2012-08-03 2014-02-20 Hitachi Chemical Co Ltd 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体
JP2015130420A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 導電性フィルム状接着剤、半導体装置の製造方法、及び、半導体装置
JP2015167186A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 接続構造体の製造方法及び接続構造体
JP2016181442A (ja) * 2015-03-24 2016-10-13 デクセリアルズ株式会社 回路接続材料、及びその製造方法、並びに接合体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11258310A (ja) * 1998-03-13 1999-09-24 Matsushita Electric Ind Co Ltd 基板検査装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006154621A (ja) * 2004-12-01 2006-06-15 Canon Inc 基板の接着方法
JP2008159849A (ja) * 2006-12-25 2008-07-10 Matsushita Electric Ind Co Ltd 電極接合構造体及び電極接合方法
JP2011178953A (ja) * 2010-03-03 2011-09-15 Nippon Zeon Co Ltd 離型フィルムおよびその製造方法
JP2014031444A (ja) * 2012-08-03 2014-02-20 Hitachi Chemical Co Ltd 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体
JP2015130420A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 導電性フィルム状接着剤、半導体装置の製造方法、及び、半導体装置
JP2015167186A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 接続構造体の製造方法及び接続構造体
JP2016181442A (ja) * 2015-03-24 2016-10-13 デクセリアルズ株式会社 回路接続材料、及びその製造方法、並びに接合体の製造方法

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WO2018147163A1 (ja) 2018-08-16
TW201842113A (zh) 2018-12-01

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