JP2018107216A - Buffer material - Google Patents

Buffer material Download PDF

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JP2018107216A
JP2018107216A JP2016249986A JP2016249986A JP2018107216A JP 2018107216 A JP2018107216 A JP 2018107216A JP 2016249986 A JP2016249986 A JP 2016249986A JP 2016249986 A JP2016249986 A JP 2016249986A JP 2018107216 A JP2018107216 A JP 2018107216A
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lid
cushioning material
storage container
storage
rib
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JP6673185B2 (en
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朋広 堀尾
Tomohiro Horio
朋広 堀尾
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Sumco Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a buffer material of which the structure is capable of protecting a portion with a high possibility that a semiconductor wafer is deformed/damaged, and improves work efficiency.SOLUTION: The present invention relates to a buffer material 100 which is disposed between a housing container 7 in which a semiconductor wafer is accommodated, and a package case when packaging the housing container 7 in the package case. The housing container 7 comprises: a box-shaped main body 81 of which the upper surface is opened; a lid 83 which closes the upper surface; and a holding part 91 which is provided on a rear side of the lid 83 and abutted with an upper edge of a semiconductor wafer 200 that is accommodated within the main body 81, and regulates movements. The buffer material 100 comprises an upper buffer material 1 including an upper housing part 13A in contact with an upper surface of the lid 83. The upper housing part 13A includes: an upper opposite surface 14 that is separately opposite to the upper surface of the lid 83; and an upper-side rib 17 which protrudes from the upper opposite surface 14 and is brought into contact with the upper surface of the lid 83. The upper-side rib 17 is provided at a position, in contact with an upper surface region of the lid 83, located just above a region where at least the holding part 91 is provided in a contact state.SELECTED DRAWING: Figure 2

Description

本発明は緩衝材に関する。   The present invention relates to a cushioning material.

半導体ウェーハを輸送する場合、収納容器に複数の半導体ウェーハを収納し、梱包ケースに梱包した後で梱包ケースを搬送装置で輸送する。
輸送の際には、梱包ケースが搬送装置から落下する等して、衝撃力等の外力が収納容器に作用することがある。そのため、外力によって半導体ウェーハが変形・損傷しない構造が必要である。このような構造としては、収納容器と梱包ケースの間に緩衝材を設けた構造がある。
When transporting semiconductor wafers, a plurality of semiconductor wafers are stored in a storage container, packed in a packing case, and then transported by a transport device.
During transportation, an external force such as an impact force may act on the storage container because the packaging case falls from the transport device. For this reason, a structure in which the semiconductor wafer is not deformed or damaged by an external force is required. As such a structure, there is a structure in which a cushioning material is provided between the storage container and the packing case.

特許文献1には、包装体を収納する収納箱と、包装体を搭載する個別パレットと、包装体と個別パレットの少なくとも一方に接触する、緩衝材としての発泡材を設けた梱包体が記載されている。
特許文献1には、個別パレットを、ポリオレフィン、ポリスチレン、ポリウレタン等の緩衝能力に優れる発泡材料で構成して、緩衝材とすることも記載されている。
Patent Document 1 describes a packaging body provided with a storage box for housing a packaging body, an individual pallet on which the packaging body is mounted, and a foam material as a cushioning material that contacts at least one of the packaging body and the individual pallet. ing.
Patent Document 1 also describes that the individual pallet is made of a foamed material having excellent buffering capacity such as polyolefin, polystyrene, polyurethane, etc., and used as a buffer material.

特許文献2には、半導体ウェーハを収納する基板収納容器を、パレット上に搭載する構造において、パレットの搭載面に弾性緩衝体を設けた構造が記載されている。
特許文献2では、ショア00硬度が20°〜120°の弾性緩衝体が好ましいとされている。具体的にはエラストマーやゴムが挙げられている。
Patent Document 2 describes a structure in which a substrate storage container for storing a semiconductor wafer is mounted on a pallet, and an elastic buffer is provided on the mounting surface of the pallet.
In Patent Document 2, an elastic buffer having a Shore 00 hardness of 20 ° to 120 ° is preferred. Specific examples include elastomers and rubbers.

特許文献3には、半導体収納容器の全方位面に密着して保護する複数の内側発泡緩衝材と、半導体収納容器を収納する段ボール箱と、内側発泡緩衝材と段ボール箱の内面の間に設けられた、複数の粘弾性固体緩衝材を備える梱包体が記載されている。   Patent Document 3 provides a plurality of inner foam cushioning materials that are in close contact with and protect the omnidirectional surface of the semiconductor storage container, a cardboard box that houses the semiconductor storage container, and an inner foam cushioning material and an inner surface of the cardboard box. A package comprising a plurality of viscoelastic solid buffer materials is described.

特許文献4には、半導体ウェーハケースとパレットの間に、底板を設ける構造が記載されている。底板は、円柱状弾性体を2枚の合成樹脂ダンボールで挟んだ緩衝材である。
特許文献4には、底板の代わりに発泡スチロール製の緩衝材を用いてもよいことが記載されている。半導体ウェーハケースの上面に蓋体を設け、蓋体の裏面にスポンジ状のポリウレタンを設け、衝撃を吸収する構造も記載されている。
Patent Document 4 describes a structure in which a bottom plate is provided between a semiconductor wafer case and a pallet. The bottom plate is a cushioning material in which a cylindrical elastic body is sandwiched between two synthetic resin cardboards.
Patent Document 4 describes that a cushioning material made of styrene foam may be used instead of the bottom plate. There is also described a structure in which a lid is provided on the upper surface of the semiconductor wafer case and sponge-like polyurethane is provided on the back surface of the lid to absorb impact.

特許文献5には、ウェーハ収納容器の上下を挟み込むように上部緩衝体および下部緩衝体を設けた梱包体が記載されている。
上部緩衝体は、ウェーハ収納容器の上部を収納するアッパ凹部と、アッパ凹部の外周に設けられ、ウェーハ収納容器の上端面に接触する押し付けリブを備えている。
下部緩衝体の底面には衝撃吸収用突起が設けられている。衝撃吸収用突起は、ウェーハ収納容器を収納したコンテナが落下して床に衝突した際に、衝突の衝撃で潰れることにより、衝撃エネルギーを吸収して半導体ウェーハに衝撃が伝わらないようにする。
Patent Document 5 describes a packaging body provided with an upper buffer body and a lower buffer body so as to sandwich the upper and lower sides of a wafer storage container.
The upper buffer body includes an upper concave portion that accommodates the upper portion of the wafer storage container, and a pressing rib that is provided on the outer periphery of the upper concave portion and contacts the upper end surface of the wafer storage container.
An impact absorbing projection is provided on the bottom surface of the lower shock absorber. The impact absorbing protrusion absorbs impact energy and prevents the impact from being transmitted to the semiconductor wafer by collapsing due to impact when the container storing the wafer storage container falls and collides with the floor.

特開2014−5078号公報JP 2014-5078 A 特開2013−249126号公報JP 2013-249126 A 特開2010−132331号公報JP 2010-132331 A 特開2011−016549号公報JP 2011-016549 A 特開2014−151963号公報JP 2014-151963 A

収納容器は、半導体ウェーハが互いに接触しないように、かつ容器内で動かないように保持するために、内部に溝や突起等の保持部を備える。
収納容器の外形は単純な箱型に限られない。収納する半導体ウェーハの形状に沿った円弧状の部分や、収納容器を置く場合に、底面の片当たりを防ぐための脚部を備えた構造がある。
そのため、収納容器において、衝撃が加えられた場合に半導体ウェーハを変形・損傷させる可能性が高い部位がどこであるかは、内部の構造や外形に依存する。
また、緩衝材を設けると、梱包体の重量や体積が増えて作業性が悪化するため、位置や寸法にも留意する必要がある。
The storage container includes a holding portion such as a groove and a protrusion in order to hold the semiconductor wafers so as not to contact each other and to move within the container.
The outer shape of the storage container is not limited to a simple box shape. There are arcuate portions along the shape of the semiconductor wafer to be stored, and a structure provided with leg portions for preventing the bottom surface from touching when a storage container is placed.
Therefore, in the storage container, where a semiconductor wafer is likely to be deformed / damaged when an impact is applied, the location depends on the internal structure and outer shape.
In addition, if the cushioning material is provided, the weight and volume of the package increase and workability deteriorates, so it is necessary to pay attention to the position and dimensions.

しかしながら、特許文献1から特許文献5に記載の構造は、以下のように、半導体ウェーハを変形・損傷させる可能性が高い部位と低い部位を区別せずに緩衝材を設けている。そのため、外力に対して半導体ウェーハを保護できない場合や、作業性が悪化する場合があるという問題があった。   However, the structures described in Patent Document 1 to Patent Document 5 are provided with a cushioning material without distinguishing between a portion that is likely to deform and damage a semiconductor wafer and a portion that is low as described below. For this reason, there is a problem that the semiconductor wafer cannot be protected against external force or workability may be deteriorated.

特許文献1、4に記載の構造は、収納箱と緩衝材が接触する位置が上面または底面の全面であり、半導体ウェーハを変形・損傷させる可能性が高い部位と低い部位を区別していない。   In the structures described in Patent Documents 1 and 4, the position where the storage box and the cushioning material are in contact with each other is the entire upper surface or the bottom surface, and does not distinguish between a portion that is likely to deform and damage the semiconductor wafer and a portion that is low.

特許文献2に記載の構造は、パレット上に一定間隔で平面矩形の弾性緩衝体を設ける構造であり、半導体ウェーハを変形・損傷させる可能性が高い部位と低い部位を区別していない。   The structure described in Patent Document 2 is a structure in which a flat rectangular elastic buffer is provided on a pallet at regular intervals, and does not distinguish between a part that is likely to deform and damage a semiconductor wafer and a part that is low.

特許文献3に記載の構造は、収納箱の全方位面に緩衝材を密着させる構造であり、半導体ウェーハを変形・損傷させる可能性が高い部位と低い部位を区別していない。このような構造では収納箱の重量や体積が増えて作業性が悪化する。   The structure described in Patent Document 3 is a structure in which a cushioning material is brought into close contact with the omnidirectional surface of the storage box, and does not distinguish between a portion that is likely to deform and damage a semiconductor wafer and a portion that is low. In such a structure, the weight and volume of the storage box increase and workability deteriorates.

特許文献5に記載の構造は、上面リブと収納箱の位置関係が特定されているが、これは蓋体とリブが接触しないようにして蓋の振動を防止する構造であり、半導体ウェーハを変形・損傷させる可能性が高い部位を保護する構造ではない。
特許文献5に記載の構造は、衝撃吸収用突起の位置および形状が特定されているが、収納箱と接触しない外側に設けられており、半導体ウェーハを変形・損傷させる可能性が高い部位を保護する構造ではない。
In the structure described in Patent Document 5, the positional relationship between the upper surface rib and the storage box is specified, but this is a structure that prevents the lid and the rib from coming into contact with each other to prevent vibration of the lid, and deforms the semiconductor wafer. -It is not a structure that protects the parts that are likely to be damaged.
In the structure described in Patent Document 5, the position and shape of the shock absorbing protrusion are specified, but the protrusion is provided on the outside so as not to come into contact with the storage box, and protects a portion that is likely to deform or damage the semiconductor wafer. It is not a structure to do.

本発明は上記課題に鑑みてなされたものであり、半導体ウェーハを変形・損傷させる可能性が高い部位を保護可能で、作業効率に優れた構造の緩衝材を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a cushioning material having a structure capable of protecting a portion that is highly likely to deform and damage a semiconductor wafer and having excellent work efficiency.

本発明に係る緩衝材は、半導体ウェーハを収納する収納容器を梱包ケースに梱包する際に、前記収納容器と前記梱包ケースの間に配置される緩衝材であって、前記収納容器は、
上面が開放された箱型の本体と、前記上面を塞ぐ蓋と、前記蓋の裏側に設けられ、前記本体内に収容された前記半導体ウェーハの上部周縁と当接し、前記半導体ウェーハの移動を規制する保持部と、を備え、前記緩衝材は、前記蓋の上面と接触する上部収納部を備えた上部緩衝材を有し、前記上部収納部は、前記蓋の上面と離間して対向する上部対向面と、前記上部対向面から突出し、前記蓋の上面と接触する上部側リブと、を備え、前記上部側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることを特徴とする。
The buffer material according to the present invention is a buffer material disposed between the storage container and the packing case when packing the storage container storing the semiconductor wafer in a packing case, and the storage container includes:
A box-shaped main body with an open upper surface, a lid that closes the upper surface, and a back side of the lid, abutting on an upper peripheral edge of the semiconductor wafer housed in the main body, and restricting movement of the semiconductor wafer A holding portion, and the cushioning material has an upper cushioning material having an upper housing portion that contacts the upper surface of the lid, and the upper housing portion is spaced apart from the upper surface of the lid and is opposed to the upper portion An upper surface rib that protrudes from the upper surface and contacts the upper surface of the lid, and the upper rib is at least directly above the region where the holding portion is provided. It is provided in the position which contacts an area | region.

この発明によれば、保持部を押さえるように上部側リブが上部緩衝材に設けられる。保持部は半導体ウェーハと収納容器が接触する部位であり、衝撃が加えられた場合に、半導体ウェーハを変形・損傷させる可能性が高い。そのため、保持部を押さえるように上部側リブを設けることにより、衝撃の際に半導体ウェーハを変形・損傷させる可能性が高い部位を、優先して保護できる。   According to the present invention, the upper-side rib is provided on the upper cushioning material so as to hold the holding portion. The holding portion is a portion where the semiconductor wafer and the storage container are in contact with each other, and when the impact is applied, there is a high possibility that the semiconductor wafer is deformed or damaged. Therefore, by providing the upper-side rib so as to hold the holding portion, it is possible to preferentially protect a portion that is likely to deform or damage the semiconductor wafer in the event of an impact.

本発明に係る緩衝材では、前記上部側リブは、平面形状が十字形であるのが好ましい。
この発明によれば、収納容器に対して緩衝材の平面上の設置角度が90°ずれていても保持部を押さえられる位置に上部側リブが位置するため、緩衝材を設ける際の位置の自由度を高くでき、作業効率に優れる。
In the cushioning material according to the present invention, it is preferable that the upper-side rib has a cross shape in plan view.
According to this invention, since the upper rib is located at a position where the holding portion can be pressed even if the installation angle of the cushioning material on the plane with respect to the storage container is shifted by 90 °, the position of the cushioning material can be freely set. The degree can be increased and work efficiency is excellent.

本発明に係る緩衝材では、前記上部側リブは、十字の交差部に上部側孔が設けられていることが好ましい。
この発明によれば、緩衝材が収納容器と接触した状態でも孔から収納容器を視認できる。そのため、緩衝材が確実に収納容器に保持されているかを容易に確認できる。また、孔部の内周を掴むことにより、容易に収納容器から緩衝材を取り外せるため、作業効率に優れる。
In the cushioning material according to the present invention, it is preferable that the upper side rib is provided with an upper side hole at a crossing portion.
According to this invention, even when the cushioning material is in contact with the storage container, the storage container can be visually recognized from the hole. Therefore, it can be easily confirmed whether the cushioning material is reliably held in the storage container. Moreover, since the buffer material can be easily removed from the storage container by grasping the inner periphery of the hole, the working efficiency is excellent.

本発明に係る緩衝材では、前記収納容器は、底面から突出するように前記底面に設けられた少なくとも一対の脚部を備え、前記緩衝材は、前記底面と接触する下部収納部を備えた下部緩衝材を有し、前記下部収納部は、前記脚部と離間して前記収納容器の前記底面と対向する下部対向面と、前記下部対向面から突出し、前記収納容器の前記底面と接触する下部側リブを備えることが好ましい。   In the cushioning material according to the present invention, the storage container includes at least a pair of leg portions provided on the bottom surface so as to protrude from the bottom surface, and the cushioning material includes a lower storage portion that contacts the bottom surface. The lower storage part has a cushioning material, the lower storage part is spaced apart from the leg part and faces the bottom face of the storage container, and the lower part protrudes from the lower opposing face and contacts the bottom face of the storage container It is preferable to provide side ribs.

この発明によれば、下部側リブが収納容器の底面と接触した状態で、脚部が下部対向面と離間する。よって、脚部が下部対向面に接触して下部側リブから収納容器の底面が浮くのを防ぐことができ、収納容器の底面を確実に保護できる。   According to this invention, the leg portion is separated from the lower facing surface while the lower rib is in contact with the bottom surface of the storage container. Therefore, it can prevent that a leg part contacts a lower facing surface and the bottom face of a storage container floats from a lower side rib, and can protect the bottom face of a storage container reliably.

本発明に係る緩衝材では、前記緩衝材は、前記蓋および前記底面と接触する中部緩衝材を有し、前記中部緩衝材は、板状の中部緩衝材本体と、前記中部緩衝材本体の底面に設けられ、前記蓋の上面と離間してと対向する蓋対向面と、前記蓋対向面から突出し、前記蓋の上面と接触する蓋側リブとを有する中部蓋収納部と、前記中部緩衝材本体の上面に設けられ、前記脚部と離間して前記収納容器の前記底面と対向する底面対向面と、前記底面対向面から突出し、前記収納容器の前記底面と接触する底面側リブを有する中部底面収納部と、を備え、前記蓋側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることが好ましい。   In the cushioning material according to the present invention, the cushioning material includes a middle cushioning material that contacts the lid and the bottom surface, and the middle cushioning material includes a plate-shaped middle cushioning material body and a bottom surface of the middle cushioning material body. A middle lid housing portion having a lid facing surface facing away from the top surface of the lid, and a lid-side rib projecting from the lid facing surface and contacting the top surface of the lid; A middle portion that is provided on the upper surface of the main body, has a bottom surface facing the bottom surface of the storage container away from the leg, and a bottom rib protruding from the bottom surface and contacting the bottom surface of the storage container It is preferable that the lid side rib is provided at a position in contact with at least the upper surface region of the lid located immediately above the region where the holding portion is provided.

この発明によれば、保持部を押さえるように蓋側リブが中部緩衝材に設けられる。保持部は半導体ウェーハと収納容器が接触する部位であり、衝撃が加えられた場合に、半導体ウェーハを変形・損傷させる可能性が高い。そのため、保持部を押さえるように蓋側リブを設けることにより、衝撃の際に半導体ウェーハを変形・損傷させる可能性が高い部位を、優先して保護できる。
また、この発明によれば、底面側リブが収納容器の底面と接触した状態で、脚部が底面対向面と離間する。よって、脚部が底面対向面に接触して底面側リブから収納容器の底面が浮くのを防ぐことができ、収納容器の底面を確実に保護できる。
According to this invention, the lid-side rib is provided on the middle cushioning material so as to hold the holding portion. The holding portion is a portion where the semiconductor wafer and the storage container are in contact with each other, and when the impact is applied, there is a high possibility that the semiconductor wafer is deformed or damaged. Therefore, by providing the lid-side rib so as to hold the holding portion, it is possible to preferentially protect a portion that is likely to deform or damage the semiconductor wafer in the event of an impact.
Moreover, according to this invention, a leg part spaces apart from a bottom face opposing surface in the state which the bottom face side rib contacted the bottom face of the storage container. Therefore, it can prevent that a leg part contacts a bottom face and the bottom face of a storage container floats from a bottom face side rib, and can protect the bottom face of a storage container reliably.

さらに、この発明によれば、中部緩衝材は収納容器の上面にも底面にも設けることが可能なので、上部緩衝材や下部緩衝材として用いることもできる。また、収納容器を高さ方向に多段に収納できる。   Furthermore, according to the present invention, since the middle cushioning material can be provided on the upper surface and the bottom surface of the storage container, it can also be used as an upper cushioning material or a lower cushioning material. Further, the storage containers can be stored in multiple stages in the height direction.

本発明に係る緩衝材では、前記上部収納部、前記下部収納部、前記中部蓋収納部、前記中部底面収納部は複数組配列されていることが好ましい。
この発明によれば、1組の上部緩衝材、中部緩衝材、下部緩衝材で4つ以上の収納容器を保護できるため、輸送や梱包の際の作業効率に優れる。
In the cushioning material according to the present invention, it is preferable that a plurality of sets of the upper storage unit, the lower storage unit, the middle lid storage unit, and the middle bottom storage unit are arranged.
According to this invention, four or more storage containers can be protected by one set of upper cushioning material, middle cushioning material, and lower cushioning material, so that the work efficiency during transportation and packaging is excellent.

本発明に係る緩衝材は、発泡倍率が20倍以上、40倍以下の発泡体で構成されるのが好ましい。
この発明によれば、緩衝材を発泡倍率が20倍以上、40倍以下の発泡体で構成するので、外部からの衝撃に対して耐えられる硬さと、衝撃を吸収する柔らかさを両立できる。
The cushioning material according to the present invention is preferably composed of a foam having an expansion ratio of 20 times or more and 40 times or less.
According to this invention, since the cushioning material is formed of a foam having an expansion ratio of 20 times or more and 40 times or less, it is possible to achieve both hardness that can withstand external impact and softness that absorbs the impact.

本発明に係る緩衝材は、発泡ポリウレタン、発泡ポリエチレン、発泡ポリプロピレン、または発泡ポリスチレンのいずれかで構成されるのが好ましい。
この発明によれば、緩衝材を発泡倍率が20倍以上、40倍以下の発泡体に容易にできる。
The cushioning material according to the present invention is preferably composed of any of polyurethane foam, polyethylene foam, polypropylene foam, or polystyrene foam.
According to this invention, the cushioning material can be easily made into a foam having an expansion ratio of 20 times or more and 40 times or less.

本発明に係る緩衝材は、半導体ウェーハを収納する収納容器を梱包ケースに梱包する際に、前記収納容器と前記梱包ケースの間に配置される緩衝材であって、前記収納容器は、上面が開放された箱型の本体と、前記上面を塞ぐ蓋と、前記蓋の裏側に設けられ、前記本体内に収容された前記半導体ウェーハの上部周縁と当接し、前記半導体ウェーハの移動を規制する保持部と、底面から突出するように前記底面の端部に設けられた少なくとも一対の脚部と、を備え、前記緩衝材は、前記蓋の上面および前記収納容器の前記底面と接触する中部緩衝材を有し、前記中部緩衝材は、板状の中部緩衝材本体と、前記中部緩衝材本体の底面に設けられ、前記蓋の上面と離間して対向する蓋対向面と、前記蓋対向面から突出し、前記蓋の上面と接触する蓋側リブとを有する中部蓋収納部と、前記中部緩衝材本体の上面に設けられ、前記脚部と離間して前記収納容器の前記底面と対向する底面対向面と、前記底面対向面から突出し、前記収納容器の前記底面と接触する底面側リブを有する中部底面収納部と、を備え、前記蓋側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることを特徴とする。   The cushioning material according to the present invention is a cushioning material disposed between the storage container and the packing case when the storage container for storing the semiconductor wafer is packed in a packing case, and the storage container has an upper surface. An open box-shaped main body, a lid that closes the upper surface, and a holder that is provided on the back side of the lid and contacts the upper peripheral edge of the semiconductor wafer housed in the main body and regulates the movement of the semiconductor wafer And at least a pair of leg portions provided at end portions of the bottom surface so as to protrude from the bottom surface, the buffer material being in contact with the top surface of the lid and the bottom surface of the storage container The middle cushioning material is provided on the bottom surface of the plate-shaped middle cushioning material main body, on the bottom surface of the middle cushioning material main body, facing away from the top surface of the lid, and from the lid facing surface A lid that protrudes and contacts the top surface of the lid A middle lid housing portion having ribs, a bottom surface facing the bottom surface of the housing container and spaced from the leg portion, provided on the top surface of the middle cushioning material body, and protruding from the bottom surface, An intermediate bottom storage portion having a bottom side rib that contacts the bottom surface of the storage container, and the lid side rib contacts at least an upper surface region of the lid positioned immediately above the region where the holding portion is provided. It is provided in the position.

この発明によれば、保持部を押さえるように蓋側リブが中部緩衝材に設けられる。保持部は半導体ウェーハと収納容器が接触する部位であり、衝撃が加えられた場合に半導体ウェーハを変形・損傷させる可能性が高い。そのため、衝撃の際に半導体ウェーハを変形・損傷させる可能性が高い部位を優先して保護できる。   According to this invention, the lid-side rib is provided on the middle cushioning material so as to hold the holding portion. The holding portion is a portion where the semiconductor wafer and the storage container are in contact with each other, and is highly likely to be deformed or damaged when an impact is applied. Therefore, it is possible to preferentially protect a portion that is highly likely to deform or damage the semiconductor wafer in the event of an impact.

また、この発明によれば、底面側リブが収納容器の底面と接触した状態で、脚部が底面対向面と離間する。よって、脚部が底面対向面に接触して底面側リブから収納容器の底面が浮くのを防ぐことができ、収納容器の底面を確実に保護できる。   Moreover, according to this invention, a leg part spaces apart from a bottom face opposing surface in the state which the bottom face side rib contacted the bottom face of the storage container. Therefore, it can prevent that a leg part contacts a bottom face and the bottom face of a storage container floats from a bottom face side rib, and can protect the bottom face of a storage container reliably.

さらに、この発明によれば、中部緩衝材は収納容器の上面にも底面にも設けることが可能なので、上部緩衝材や下部緩衝材として用いることもできる。また、収納容器を高さ方向に多段に収納できる。   Furthermore, according to the present invention, since the middle cushioning material can be provided on the upper surface and the bottom surface of the storage container, it can also be used as an upper cushioning material or a lower cushioning material. Further, the storage containers can be stored in multiple stages in the height direction.

緩衝体を収納容器に設けた状態を示す斜視図。The perspective view which shows the state which provided the buffer body in the storage container. 図1のA1−A1断面図。A1-A1 sectional drawing of FIG. 図1のA2−A2断面図の一部であって、収納容器は側面図で示す。1. It is a part of A2-A2 sectional drawing of FIG. 1, Comprising: A storage container is shown with a side view. 収納容器の斜視図。The perspective view of a storage container. (A)は収納容器の上面図であり、(B)は蓋の裏面図である。(A) is a top view of a storage container, (B) is a back view of a lid | cover. 上部緩衝体を示す図であって、(A)は底面側から見た斜視図、(B)は底面図、(C)は(B)のA3−A3断面図。It is a figure which shows an upper buffer, Comprising: (A) is the perspective view seen from the bottom face side, (B) is a bottom view, (C) is A3-A3 sectional drawing of (B). 下部緩衝体を示す図であって、(A)は斜視図、(B)は上面図、(C)は(B)のA4−A4断面図。It is a figure which shows a lower buffer, Comprising: (A) is a perspective view, (B) is a top view, (C) is A4-A4 sectional drawing of (B). 中部緩衝体を示す図であって、(A)は斜視図、(B)は底面図。It is a figure which shows a middle buffer, Comprising: (A) is a perspective view, (B) is a bottom view. 中部緩衝体を示す図であって、(A)は上面図、(B)は(A)のA5−A5断面図。It is a figure which shows a middle buffer, Comprising: (A) is a top view, (B) is A5-A5 sectional drawing of (A).

以下、図面に基づき本発明に好適な実施形態を詳細に説明する。
まず、図1〜図3を参照して、本実施形態に係る緩衝材の概略構成について、簡単に説明する。
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
First, with reference to FIGS. 1-3, the schematic structure of the shock absorbing material which concerns on this embodiment is demonstrated easily.

図1〜図3に示すように、緩衝材100は、収納容器7を図示しない梱包ケースに梱包する際に、収納容器7と梱包ケースの間に配置される緩衝材であり、上部緩衝材1、下部緩衝材3、および中部緩衝材5を備える。
図1では、上部緩衝材1と中部緩衝材5の間に上段の収納容器7が3つ設けられ、中部緩衝材5と下部緩衝材3の間に下段の収納容器7が3つ設けられる。
緩衝材100は、さらに、下部緩衝材3の底面に設けられた振動吸収材9を備える。
以上が本実施形態に係る緩衝材100の概略構成の説明である。
As shown in FIGS. 1 to 3, the shock absorber 100 is a shock absorber disposed between the storage container 7 and the packing case when the storage container 7 is packed in a packing case (not shown). The lower cushioning material 3 and the middle cushioning material 5 are provided.
In FIG. 1, three upper storage containers 7 are provided between the upper cushioning material 1 and the middle cushioning material 5, and three lower storage containers 7 are provided between the middle cushioning material 5 and the lower cushioning material 3.
The cushioning material 100 further includes a vibration absorbing material 9 provided on the bottom surface of the lower cushioning material 3.
The above is description of schematic structure of the shock absorbing material 100 which concerns on this embodiment.

次に、収納容器7、および本実施形態に係る緩衝材100の構成の詳細について、説明する。   Next, the detail of the structure of the storage container 7 and the shock absorbing material 100 which concerns on this embodiment is demonstrated.

まず、収納容器7の構造について、図2、図4、および図5を参照して説明する。
収納容器7は、図2に示す半導体ウェーハ200を収納する容器であり、例えばFOSB(Front Opening Shipping Box)である。収納容器7は、図4に示すように、上面が開放された箱型の本体81と、上面を塞ぐ蓋83を有する。
First, the structure of the storage container 7 will be described with reference to FIGS. 2, 4, and 5.
The storage container 7 is a container for storing the semiconductor wafer 200 shown in FIG. 2, and is, for example, a FOSB (Front Opening Shipping Box). As shown in FIG. 4, the storage container 7 includes a box-shaped main body 81 having an open upper surface and a lid 83 that closes the upper surface.

本体81は、脚部87を備える。
脚部87は、本体81の底面86から突出するように底面86の端部に設けられた、少なくとも一対の脚である。ここでは4隅に1つずつ設けられる。
The main body 81 includes leg portions 87.
The legs 87 are at least a pair of legs provided at the ends of the bottom surface 86 so as to protrude from the bottom surface 86 of the main body 81. Here, one is provided at each of the four corners.

図2および図4に示すように、収納容器7の本体81内には、複数の半導体ウェーハ200を間隔を空けて収納するための収納溝が形成された、櫛型のウェーハ収納部85が設けられる。
ウェーハ収納部85は、半導体ウェーハ200の外縁側部と接触する側部収納部85Aと、半導体ウェーハ200の外縁底部と接触する底部収納部85Bから構成される。
ここでは、側部収納部85Aは、本体81の対向する内周側面に1対設けられている。底部収納部85Bは、底面86の直上に2つ設けられている。2つの側部収納部85Aは、溝の配列方向に互いに平行に配置されている。
蓋83は、平面形状が矩形の板状部材であり、図4および図5に示すように、一対のロック部89と、保持部91を有する。
As shown in FIG. 2 and FIG. 4, a comb-shaped wafer storage unit 85 is provided in the main body 81 of the storage container 7, in which storage grooves are formed for storing a plurality of semiconductor wafers 200 at intervals. It is done.
The wafer storage portion 85 includes a side storage portion 85A that contacts the outer edge side portion of the semiconductor wafer 200 and a bottom storage portion 85B that contacts the outer edge bottom portion of the semiconductor wafer 200.
Here, a pair of side storage portions 85 </ b> A are provided on the inner peripheral side surfaces of the main body 81 that face each other. Two bottom storage portions 85 </ b> B are provided immediately above the bottom surface 86. The two side storage portions 85A are arranged in parallel to each other in the groove arrangement direction.
The lid 83 is a plate-like member having a rectangular planar shape, and has a pair of lock portions 89 and a holding portion 91 as shown in FIGS. 4 and 5.

ロック部89は、蓋83を本体81に固定する部材であり、図5に示すように、ロック棒89A、89Bとロックレバー89Cを有する。   The lock portion 89 is a member that fixes the lid 83 to the main body 81, and includes lock bars 89A and 89B and a lock lever 89C as shown in FIG.

ロック棒89A、89Bは蓋83の対向する辺に沿って設けられた部材であり、図5のD1、D2の向きに移動可能である。   The lock bars 89A and 89B are members provided along the opposing sides of the lid 83, and are movable in the directions of D1 and D2 in FIG.

ロックレバー89Cはロック部89の側面から突き出したレバーである。
ロックレバー89Cは、ロック部側に押し込むことにより、ロック棒89AをD1の向きに、ロック棒89BをD2の向きに移動させて蓋83の外側に押し出す。押し出されたロック棒89A、89Bの先端は本体81の凹部81Aに係合し、蓋83を本体81にロックして固定する。ロックした状態で、ロックレバー89Cの位置を元に戻すことで、ロック棒89A、89Bを蓋83の内側に引き戻し、ロックを解除する。
The lock lever 89 </ b> C is a lever protruding from the side surface of the lock portion 89.
When the lock lever 89C is pushed into the lock portion side, the lock rod 89A is moved in the direction D1, and the lock rod 89B is moved in the direction D2, and pushed out to the outside of the lid 83. The distal ends of the extruded lock rods 89A and 89B engage with the recess 81A of the main body 81, and the lid 83 is locked and fixed to the main body 81. In the locked state, the lock lever 89C is returned to its original position, whereby the lock rods 89A and 89B are pulled back to the inside of the lid 83 to release the lock.

図5に示すように、保持部91は、蓋83の裏側に設けられた縦長の櫛形の部材であり、ロック部89の間に設けられる。保持部91は、本体81内に収容された半導体ウェーハ200の上部周縁を、櫛の歯の間に挿入して当接させることにより、半導体ウェーハ200の軸方向の移動あるいは径方向の回動を規制し、半導体ウェーハ200が互いに接触しないように保持する。
図5では、保持部91は蓋83の矩形を構成する辺の1つに平行になるように、蓋83の中央部に、半導体ウェーハ200の配列方向(縦方向)に平行に設けられている。
以上が収納容器7の構造の説明である。
As shown in FIG. 5, the holding portion 91 is a vertically long comb-shaped member provided on the back side of the lid 83 and is provided between the lock portions 89. The holding portion 91 inserts the upper peripheral edge of the semiconductor wafer 200 accommodated in the main body 81 between the teeth of the comb and makes it contact, thereby moving the semiconductor wafer 200 in the axial direction or rotating in the radial direction. The semiconductor wafers 200 are regulated and held so as not to contact each other.
In FIG. 5, the holding portion 91 is provided in the central portion of the lid 83 in parallel with the arrangement direction (vertical direction) of the semiconductor wafers 200 so as to be parallel to one of the sides constituting the rectangle of the lid 83. .
The above is the description of the structure of the storage container 7.

次に、図2および図6を参照して、上部緩衝材1の構造を説明する。
上部緩衝材1は、上段の収納容器7の上面に設けられる緩衝材であり、平面形状が矩形の板材である。上部緩衝材1は、図6に示すように、収納容器7の蓋83と接触する上部収納部13A、13B、13Cを備える。
Next, the structure of the upper cushioning material 1 will be described with reference to FIGS.
The upper cushioning material 1 is a cushioning material provided on the upper surface of the upper storage container 7, and is a plate material having a rectangular planar shape. As shown in FIG. 6, the upper cushioning material 1 includes upper storage portions 13 </ b> A, 13 </ b> B, and 13 </ b> C that come into contact with the lid 83 of the storage container 7.

上部収納部13A、13B、13Cは、上部緩衝材1の底面に設けられ、収納容器7の上端に嵌まり込んで保持される形状の凹部である。ここでは、平面形状が矩形の凹部である。上部収納部13A、13B、13Cは、上部対向面14、上部側リブ15、17、上部側孔19、補強リブ21を備える。   The upper storage portions 13 </ b> A, 13 </ b> B, and 13 </ b> C are recessed portions that are provided on the bottom surface of the upper cushioning material 1 and fit into the upper end of the storage container 7. Here, the planar shape is a rectangular recess. The upper storage portions 13A, 13B, and 13C include an upper facing surface 14, upper side ribs 15 and 17, an upper side hole 19, and a reinforcing rib 21.

上部対向面14は、収納容器7の蓋83と離間して対向する面であり、上部収納部13A、13B、13Cの底面である。
上部側リブ15、17は上部対向面14から突出した縦長のリブであり、少なくとも一方が蓋83の上面と接触し、接触した状態で、少なくとも保持部91が設けられた領域の直上に位置する、蓋83の上面領域(ここでは、図5の符号91の示す点線で囲まれた領域)と接触する位置に設けられる。
ここでは、図2に示すように、保持部91が設けられた領域の直上に位置する、蓋83の上面領域と接触する位置に上部側リブ17が設けられる。さらに、上部側リブ17は、その延在方向(縦方向)が、保持部91の延在方向と一致する位置に設けられる。
保持部91は半導体ウェーハ200を保持する部材であり、衝撃の際に半導体ウェーハ200を変形・損傷させる可能性が高いので、上部側リブ17が保持部91を押さえることにより、保持部91を優先して保護できる。
The upper facing surface 14 is a surface facing away from the lid 83 of the storage container 7 and is the bottom surface of the upper storage portions 13A, 13B, 13C.
The upper ribs 15 and 17 are vertically long ribs protruding from the upper facing surface 14, and at least one of them is in contact with the upper surface of the lid 83, and is located immediately above the region where at least the holding portion 91 is provided. The lid 83 is provided at a position in contact with the upper surface region (here, the region surrounded by the dotted line 91 shown in FIG. 5).
Here, as shown in FIG. 2, the upper rib 17 is provided at a position in contact with the upper surface region of the lid 83, which is located immediately above the region where the holding portion 91 is provided. Further, the upper rib 17 is provided at a position where the extending direction (vertical direction) coincides with the extending direction of the holding portion 91.
Since the holding part 91 is a member that holds the semiconductor wafer 200 and is highly likely to be deformed or damaged in the event of an impact, the holding part 91 is given priority by the upper side rib 17 pressing the holding part 91. Can be protected.

上部側リブ15と上部側リブ17は、互いに直交するように設けられ、上部側リブ15と上部側リブ17で平面形状が十字形になる。十字形であることにより、上部緩衝材1の平面上の設置角度が90°ずれていても、保持部91を押さえられる位置に上部側リブ15、17のいずれかが位置する。
そのため、上部緩衝材1を設ける際の位置の自由度を高くでき、作業効率に優れる。
The upper side rib 15 and the upper side rib 17 are provided so as to be orthogonal to each other, and the upper side rib 15 and the upper side rib 17 have a cross shape in a cross shape. Due to the cross shape, even if the installation angle on the plane of the upper cushioning material 1 is shifted by 90 °, one of the upper ribs 15 and 17 is located at a position where the holding portion 91 can be pressed.
Therefore, the freedom degree of the position at the time of providing the upper shock absorbing material 1 can be made high, and it is excellent in working efficiency.

上部側孔19は、上部側リブ15、17の十字の交差部に設けられた貫通孔である。
上部側孔19は、上部緩衝材1が収納容器7に設けられた状態で、収納容器7の上面を視認するために用いられる。上部側孔19は、収納容器7から上部緩衝材1を取り外す際の取っ手の代わりにも用いられる。具体的には、上部側孔19の内周を掴むことにより、容易に上部緩衝材1を取り外せる。
The upper side hole 19 is a through hole provided at a crossing portion of the upper side ribs 15 and 17.
The upper side hole 19 is used for visually recognizing the upper surface of the storage container 7 in a state where the upper cushioning material 1 is provided in the storage container 7. The upper side hole 19 is also used as a handle when removing the upper cushioning material 1 from the storage container 7. Specifically, the upper cushioning material 1 can be easily removed by grasping the inner periphery of the upper side hole 19.

補強リブ21は、上部収納部13A、13B、13Cの隣接する側面を連結するように設けられたL字型のリブであり、上部収納部13A、13B、13Cの側面を補強する。
以上が上部緩衝材1の構造の説明である。
The reinforcing rib 21 is an L-shaped rib provided so as to connect adjacent side surfaces of the upper storage portions 13A, 13B, and 13C, and reinforces the side surfaces of the upper storage portions 13A, 13B, and 13C.
The above is the description of the structure of the upper cushioning material 1.

次に、図2、図3および図7を参照して、下部緩衝材3の構造を説明する。
下部緩衝材3は、下段の収納容器7の底面に設けられる緩衝材であり、平面形状が矩形の板材である。下部緩衝材3は、収納容器7の底面と接触する下部収納部31A、31B、31Cを備える。
Next, the structure of the lower cushioning material 3 will be described with reference to FIGS. 2, 3 and 7.
The lower cushioning material 3 is a cushioning material provided on the bottom surface of the lower storage container 7, and is a plate material having a rectangular planar shape. The lower cushioning material 3 includes lower storage portions 31 </ b> A, 31 </ b> B, and 31 </ b> C that come into contact with the bottom surface of the storage container 7.

下部収納部31A、31B、31Cは、収納容器7の下端に嵌まり込んで保持される形状の凹部である。ここでは平面形状が矩形の凹部である。下部収納部31A、31B、31Cは、下部対向面33、下部側リブ35、下部側孔37を備える。
下部対向面33は、脚部87と離間して収納容器7の底面86と対向する面であり、下部収納部31A、31B、31Cの底面である。
The lower storage portions 31 </ b> A, 31 </ b> B, and 31 </ b> C are recessed portions that are fitted and held at the lower end of the storage container 7. Here, the planar shape is a rectangular recess. The lower storage portions 31 </ b> A, 31 </ b> B, and 31 </ b> C include a lower facing surface 33, a lower side rib 35, and a lower side hole 37.
The lower facing surface 33 is a surface that is separated from the leg portion 87 and faces the bottom surface 86 of the storage container 7, and is the bottom surface of the lower storage portions 31A, 31B, and 31C.

図2および図3に示すように、脚部87は、下部側リブ35をまたぐように設けられるので、下部側リブ35は、脚部87の底面とは接触しない。
下部対向面33は脚部87と離間するので、図2および図3に示すように、下部側リブ35の高さH1は、収納容器7の底面86と接触した状態で、脚部87が下部対向面33と離間する高さである。
よって、脚部87が下部対向面33に接触して、下部側リブ35から収納容器7の底面86が浮くのを防ぐことができ、収納容器7の底面86を確実に保護できる。
As shown in FIGS. 2 and 3, the leg 87 is provided so as to straddle the lower rib 35, and therefore the lower rib 35 does not contact the bottom surface of the leg 87.
Since the lower facing surface 33 is separated from the leg portion 87, the height H 1 of the lower side rib 35 is in contact with the bottom surface 86 of the storage container 7 as shown in FIG. 2 and FIG. The height is spaced from the facing surface 33.
Therefore, it can prevent that the leg part 87 contacts the lower opposing surface 33, and the bottom face 86 of the storage container 7 floats from the lower side rib 35, and can protect the bottom face 86 of the storage container 7 reliably.

下部側リブ35は、下部対向面33から突出したリブであり、図2および図3に示すように、収納容器7の底面86と接触する位置に設けられる。
下部側リブ35は、底部収納部85Bと対向する位置(ここでは直下)に設けられるのが好ましい。理由は以下の通りである。
図2および図3では、底部収納部85Bは、底面86の直上に設けられているため、底面86に衝撃が加えられると、衝撃が底部収納部85Bに伝わり、半導体ウェーハ200を変形・損傷させる可能性がある。そのため、下部側リブ35を、底部収納部85Bと対向する位置に設けることにより、底面86を介して底部収納部85Bを押さえることができる。これにより、底部収納部85Bを優先して保護でき、好ましい。
The lower-side rib 35 is a rib protruding from the lower facing surface 33 and is provided at a position in contact with the bottom surface 86 of the storage container 7 as shown in FIGS. 2 and 3.
The lower rib 35 is preferably provided at a position (here, directly below) facing the bottom storage portion 85B. The reason is as follows.
In FIGS. 2 and 3, since the bottom storage portion 85B is provided immediately above the bottom surface 86, when an impact is applied to the bottom surface 86, the impact is transmitted to the bottom storage portion 85B, and the semiconductor wafer 200 is deformed or damaged. there is a possibility. Therefore, by providing the lower side rib 35 at a position facing the bottom storage portion 85B, the bottom storage portion 85B can be pressed through the bottom surface 86. Thereby, the bottom storage portion 85B can be protected with priority, which is preferable.

下部側孔37は、下部側リブ35に設けられた貫通孔であり、下部緩衝材3が収納容器7に設けられた状態で、収納容器7の底面を視認するために用いられる。下部側孔37は、収納容器7から下部緩衝材3を取り外す際の取っ手の代わりにも用いられる。具体的には、上部側孔19の内周を掴むことにより、容易に下部緩衝材3を取り外せる。
以上が下部緩衝材3の構造の説明である。
The lower side hole 37 is a through hole provided in the lower side rib 35 and is used for visually recognizing the bottom surface of the storage container 7 with the lower cushioning material 3 provided in the storage container 7. The lower side hole 37 is also used as a handle when the lower cushioning material 3 is removed from the storage container 7. Specifically, the lower cushioning material 3 can be easily removed by grasping the inner periphery of the upper side hole 19.
The above is the description of the structure of the lower cushioning material 3.

次に、図2、図3、図8、および図9を参照して、中部緩衝材5の構造を説明する。
中部緩衝材5は、上段の収納容器7の底面、および下段の収納容器7の上面に設けられる緩衝材であり、板状の中部緩衝材本体51を備える。
Next, the structure of the middle cushioning material 5 will be described with reference to FIGS. 2, 3, 8, and 9.
The middle cushioning material 5 is a cushioning material provided on the bottom surface of the upper storage container 7 and the upper surface of the lower storage container 7, and includes a plate-shaped middle cushioning material body 51.

中部緩衝材本体51は、底面に、中部蓋収納部53A、53B、53Cを有する。
中部蓋収納部53A、53B、53Cは、収納容器7の上端に嵌まり込んで保持される凹部である。ここでは、平面形状が矩形の凹部である。
中部蓋収納部53A、53B、53Cは、蓋対向面54、蓋側リブ55、57、蓋側孔59、蓋側補強リブ61を備える。
The middle cushioning material main body 51 has middle lid housing portions 53A, 53B, and 53C on the bottom surface.
The middle lid storage portions 53 </ b> A, 53 </ b> B, and 53 </ b> C are recessed portions that are fitted and held at the upper end of the storage container 7. Here, the planar shape is a rectangular recess.
The middle lid storage portions 53A, 53B, and 53C include a lid facing surface 54, lid side ribs 55 and 57, a lid side hole 59, and a lid side reinforcing rib 61.

蓋対向面54は、収納容器7の蓋83と対向する面であり、中部蓋収納部53A、53B、53Cの底面である。
蓋側リブ55、57は蓋対向面54から突出したリブであり、少なくとも一方が蓋83の上面と接触し、接触した状態で、少なくとも保持部91が設けられた領域の直上に位置する、蓋83の上面領域と接触する位置に設けられる。ここでは、図2に示すように、保持部91が設けられた領域の直上に位置する、蓋83の上面領域と接触する位置に蓋側リブ57が設けられる。さらに、蓋側リブ57は、その延在方向(縦方向)が、保持部91の延在方向と一致する位置に設けられる。
よって、上部側リブ17と同様に、蓋側リブ57が保持部91を押さえることにより、保持部91を優先して保護できる。
The lid facing surface 54 is a surface facing the lid 83 of the storage container 7 and is the bottom surface of the middle lid storage portions 53A, 53B, and 53C.
The lid-side ribs 55 and 57 are ribs protruding from the lid facing surface 54, and at least one of them is in contact with the upper surface of the lid 83, and in the state of contact, the lid side ribs 55 and 57 are located immediately above the region where at least the holding portion 91 is provided. 83 is provided at a position in contact with the upper surface region. Here, as shown in FIG. 2, the lid-side rib 57 is provided at a position in contact with the upper surface region of the lid 83, which is located immediately above the region where the holding portion 91 is provided. Further, the lid-side rib 57 is provided at a position where the extending direction (vertical direction) coincides with the extending direction of the holding portion 91.
Therefore, similarly to the upper side rib 17, the lid side rib 57 can hold the holding unit 91 to protect the holding unit 91 with priority.

蓋側リブ55と蓋側リブ57は、互いに交差するように設けられ、蓋側リブ55と蓋側リブ57とで、平面形状が十字形になる。
十字形であることにより、中部緩衝材5の平面上の設置角度が90°ずれていても、保持部91を押さえられる位置に蓋側リブ55、57のいずれかが位置する。
The lid side rib 55 and the lid side rib 57 are provided so as to intersect with each other, and the planar shape of the lid side rib 55 and the lid side rib 57 is a cross shape.
Due to the cross shape, one of the lid-side ribs 55 and 57 is positioned at a position where the holding portion 91 can be pressed even if the installation angle on the plane of the middle cushioning material 5 is shifted by 90 °.

蓋側孔59は、蓋側リブ55、57の十字の交差部に設けられた貫通孔であり、収納容器7から中部緩衝材5を取り外す際の取っ手の代わりにも用いられる。
蓋側補強リブ61は、中部蓋収納部53A、53B、53Cの隣接する側面を連結するように設けられたL字型のリブであり、中部蓋収納部53A、53B、53Cの側面を補強する。
The lid-side hole 59 is a through-hole provided at the crossing portion of the lid-side ribs 55 and 57 and is also used as a handle when removing the middle cushioning material 5 from the storage container 7.
The lid-side reinforcing rib 61 is an L-shaped rib provided so as to connect adjacent side surfaces of the middle lid storage portions 53A, 53B, and 53C, and reinforces the side surfaces of the middle lid storage portions 53A, 53B, and 53C. .

中部緩衝材本体51は、上面に、中部底面収納部71A、71B、71Cを有する。
中部底面収納部71A、71B、71Cは収納容器7の下端に嵌まり込んで保持される形状の凹部である。ここでは、平面形状が矩形の凹部である。中部底面収納部71A、71B、71Cは、底面対向面73、底面側リブ75を備える。
The middle cushioning material body 51 has middle bottom housing parts 71A, 71B, 71C on the upper surface.
The middle bottom storage parts 71 </ b> A, 71 </ b> B, 71 </ b> C are recessed parts that are fitted and held at the lower end of the storage container 7. Here, the planar shape is a rectangular recess. The middle bottom housing parts 71A, 71B, 71C include a bottom surface 73 and a bottom side rib 75.

底面対向面73は、脚部87と離間して収納容器7の底面86と対向する面であり、中部底面収納部71A、71B、71Cの底面である。
底面側リブ75は中部底面収納部71A、71B、71Cから突出したリブであり、図2および図3に示すように収納容器7の底面86と接触する位置に設けられる。
底面対向面73は脚部87と離間するので、図2および図3に示すように、底面側リブ75の高さH2は、収納容器7の底面86と接触した状態で、脚部87が底面対向面73と離間する高さである。
よって、脚部87が底面対向面73に接触して、下部側リブ35から収納容器7の底面86が浮くのを防ぐことができ、収納容器7の底面86を確実に保護できる。
以上が中部緩衝材5の構造の説明である。
The bottom facing surface 73 is a surface that is separated from the leg portion 87 and faces the bottom surface 86 of the storage container 7 and is the bottom surface of the middle bottom surface storage portions 71A, 71B, 71C.
The bottom surface side rib 75 is a rib protruding from the middle bottom surface storage portions 71A, 71B, 71C, and is provided at a position in contact with the bottom surface 86 of the storage container 7, as shown in FIGS.
Since the bottom facing surface 73 is separated from the leg portion 87, the height H2 of the bottom side rib 75 is in contact with the bottom surface 86 of the storage container 7 as shown in FIGS. The height is spaced from the facing surface 73.
Therefore, it can prevent that the leg part 87 contacts the bottom face opposing surface 73, and the bottom face 86 of the storage container 7 floats from the lower side rib 35, and can protect the bottom face 86 of the storage container 7 reliably.
The above is the description of the structure of the middle cushioning material 5.

次に、緩衝材100を構成する材料について、説明する。
緩衝材100は、外部からの衝撃に対して破損せずに耐えられる硬さと、衝撃を吸収して、収納容器7に衝撃が伝わらないようにできる程度の柔らかさが必要である。このような要件を満たす材料としては、発泡倍率が20倍以上、40倍以下の発泡体が好ましい。
具体的な発泡体としては、発泡ポリウレタン、発泡ポリエチレン、発泡ポリプロピレン、または発泡ポリスチレンが挙げられる。
以上が、緩衝材100を構成する材料の説明である。
Next, materials constituting the cushioning material 100 will be described.
The cushioning material 100 needs to be hard enough to withstand an external impact without being damaged, and soft enough to absorb the impact and prevent the impact from being transmitted to the storage container 7. As a material satisfying such requirements, a foam having an expansion ratio of 20 times or more and 40 times or less is preferable.
Specific examples of the foam include foamed polyurethane, foamed polyethylene, foamed polypropylene, and foamed polystyrene.
The above is description of the material which comprises the buffer material 100. FIG.

次に、図2および図3を参照して、振動吸収材9の構造を説明する。
振動吸収材9は、収納容器7を緩衝材100で梱包した状態で、床に置く際に生じる振動を吸収する部材であり、板材9A、9B、および弾性体9Cを備える。
板材9A、9Bは、互いに対向して設けられ、それぞれ緩衝材および床と接触する部材である。板材9A、9Bは、例えばプラスチック板で構成される。
弾性体9Cは、振動に対して弾性変形することにより、振動を吸収する部材であり、板材9A、9Bに挟まれるように設けられる。弾性体9Cは、例えばポリウレタン、合成ゴム、ポリエチレンで構成される。
以上が、振動吸収材9の構造の説明である。
Next, the structure of the vibration absorber 9 will be described with reference to FIGS.
The vibration absorbing material 9 is a member that absorbs vibration generated when the storage container 7 is packed with the cushioning material 100 and placed on the floor, and includes plate members 9A and 9B and an elastic body 9C.
The plate members 9A and 9B are members that are provided to face each other and are in contact with the cushioning material and the floor, respectively. The plate members 9A and 9B are made of, for example, a plastic plate.
The elastic body 9C is a member that absorbs vibration by elastic deformation with respect to vibration, and is provided so as to be sandwiched between the plate materials 9A and 9B. The elastic body 9C is made of, for example, polyurethane, synthetic rubber, or polyethylene.
The above is the description of the structure of the vibration absorbing material 9.

以上が、本実施形態に係る緩衝材100、および収納容器7の構成の詳細の説明である。   The above is the detailed description of the configuration of the cushioning material 100 and the storage container 7 according to the present embodiment.

このように、本実施形態によれば、緩衝材100は、上部緩衝材1を有し、上部緩衝材1は、蓋83と接触し、接触した状態で、少なくとも保持部91が設けられた領域の直上に位置する、蓋83の上面領域と接触する位置に設けられた上部側リブ17を備える。
そのため、上部緩衝材1を収納容器7に設けると、上部側リブ17が保持部91を押さえることができ、衝撃の際に半導体ウェーハ200を変形・損傷させる可能性が高い、保持部91を優先して保護できる。
Thus, according to the present embodiment, the cushioning material 100 has the upper cushioning material 1, and the upper cushioning material 1 is in contact with the lid 83, and in the contacted state, at least the region where the holding portion 91 is provided. The upper side rib 17 provided in the position which contacts the upper surface area | region of the lid | cover 83 located immediately above is provided.
For this reason, when the upper cushioning material 1 is provided in the storage container 7, the upper rib 17 can hold the holding portion 91, and the holding portion 91 has a high possibility of being deformed or damaged in the event of an impact. Can be protected.

本実施形態によれば、上部側リブ15、17は平面形状が十字形であるため、収納容器7に対して、上部緩衝材1の平面上の設置角度が90°ずれていても、保持部91を押さえられる位置に上部側リブ15、17のいずれかが位置する。
そのため、上部緩衝材1を設ける際の位置の自由度を高くでき、作業効率に優れる。
According to the present embodiment, since the upper ribs 15 and 17 have a cross shape in plan view, even if the installation angle on the plane of the upper cushioning material 1 is shifted by 90 ° with respect to the storage container 7, the holding portion One of the upper ribs 15 and 17 is located at a position where 91 can be pressed.
Therefore, the freedom degree of the position at the time of providing the upper shock absorbing material 1 can be made high, and it is excellent in working efficiency.

本実施形態によれば、上部側リブ15、17の交差部に上部側孔19が設けられているため、上部緩衝材1が収納容器7と接触した状態でも上部側孔19から収納容器7を視認できる。
そのため、上部緩衝材1が確実に収納容器7に保持されているかを容易に確認できる。また、収納容器7から上部緩衝材1を取り外す際に、上部側孔19の内周を取っ手の代わりに掴むことにより、容易に収納容器7から上部緩衝材1を取り外せるため、作業効率に優れる。
According to the present embodiment, since the upper side hole 19 is provided at the intersection of the upper side ribs 15, 17, the storage container 7 is removed from the upper side hole 19 even when the upper cushioning material 1 is in contact with the storage container 7. Visible.
Therefore, it can be easily confirmed whether the upper cushioning material 1 is securely held in the storage container 7. Moreover, when removing the upper shock absorbing material 1 from the storage container 7, the upper shock absorbing material 1 can be easily removed from the storage container 7 by grasping the inner periphery of the upper side hole 19 instead of a handle, and it is excellent in working efficiency.

本実施形態によれば、緩衝材100は、下部緩衝材3を有し、下部緩衝材3は、脚部87と離間して収納容器7の底面86と対向する下部対向面33と、収納容器7の底面86と接触する下部側リブ35を備える。
そのため、脚部87が下部対向面33に接触して、下部側リブ35から収納容器7の底面86が浮くのを防ぐことができ、収納容器7の底面86を確実に保護できる。
According to the present embodiment, the cushioning material 100 includes the lower cushioning material 3, and the lower cushioning material 3 is separated from the leg portion 87 and faces the bottom surface 86 of the storage container 7, and the storage container. 7 is provided with a lower rib 35 that comes into contact with the bottom surface 86.
Therefore, it can prevent that the leg part 87 contacts the lower opposing surface 33, and the bottom face 86 of the storage container 7 floats from the lower side rib 35, and can protect the bottom face 86 of the storage container 7 reliably.

本実施形態によれば、緩衝材100は中部緩衝材5を有し、中部緩衝材5は、蓋83と接触し、接触した状態で、少なくとも保持部91が設けられた領域の直上に位置する、蓋83の上面領域と接触する位置に設けられた蓋側リブ57を備える。
そのため、中部緩衝材5を収納容器7に設けると、蓋側リブ57が保持部91を押さえることができ、衝撃の際に半導体ウェーハ200を変形・損傷させる可能性が高い、保持部91を優先して保護できる。
According to the present embodiment, the cushioning material 100 includes the middle cushioning material 5, and the middle cushioning material 5 is in contact with the lid 83, and is located immediately above the region where at least the holding portion 91 is provided. And a lid-side rib 57 provided at a position in contact with the upper surface region of the lid 83.
Therefore, when the middle cushioning material 5 is provided in the storage container 7, the lid-side rib 57 can hold the holding portion 91, and the holding portion 91 is highly likely to be deformed / damaged in the event of an impact. Can be protected.

また、中部緩衝材5は、脚部87と離間して収納容器7の底面86と対向する底面対向面73と、収納容器7の底面86と接触する底面側リブ75を備える。
そのため、脚部87が底面対向面73に接触して、底面側リブ75から収納容器7の底面86が浮くのを防ぐことができ、収納容器7の底面86を確実に保護できる。
Further, the middle cushioning material 5 includes a bottom facing surface 73 that is spaced apart from the leg portion 87 and faces the bottom surface 86 of the storage container 7, and a bottom surface side rib 75 that contacts the bottom surface 86 of the storage container 7.
Therefore, it can prevent that the leg part 87 contacts the bottom face opposing surface 73, and the bottom face 86 of the storage container 7 floats from the bottom face side rib 75, and can protect the bottom face 86 of the storage container 7 reliably.

さらに、中部緩衝材5は蓋側リブ55、57と底面側リブ75の両方を備えるので、収納容器7の上面にも底面にも設けられる。
よって中部緩衝材5は、上部緩衝材1や下部緩衝材3として用いることもできる。また、収納容器7を高さ方向に多段に収納できる。
Furthermore, since the middle cushioning material 5 includes both the lid-side ribs 55 and 57 and the bottom-side rib 75, it is provided on the top surface and the bottom surface of the storage container 7.
Therefore, the middle cushioning material 5 can also be used as the upper cushioning material 1 and the lower cushioning material 3. Moreover, the storage container 7 can be stored in multiple stages in the height direction.

本実施形態によれば、緩衝材100は、発泡倍率が20倍以上、40倍以下の発泡体で構成される。そのため、外部からの衝撃に対して耐えられる硬さと、衝撃を吸収する柔らかさを両立できる。   According to the present embodiment, the cushioning material 100 is formed of a foam having an expansion ratio of 20 times or more and 40 times or less. Therefore, it is possible to achieve both hardness that can withstand external impact and softness that absorbs the impact.

本実施形態によれば、緩衝材100は、発泡ポリウレタン、発泡ポリエチレン、発泡ポリプロピレン、または発泡ポリスチレンのいずれかで構成される。
そのため、緩衝材100を発泡倍率が20倍以上、40倍以下の発泡体に容易にできる。
According to the present embodiment, the cushioning material 100 is made of any of polyurethane foam, polyethylene foam, polypropylene foam, or polystyrene foam.
Therefore, the buffer material 100 can be easily made into a foam having an expansion ratio of 20 times or more and 40 times or less.

本実施形態によれば、緩衝材100では、上部収納部13A、13B、13C、下部収納部31A、31B、31C、中部蓋収納部53A、53B、53C、中部底面収納部71A、71B、71Cは複数組配列されている。ここでは3組配列されている。
そのため1組の上部緩衝材1、下部緩衝材3、中部緩衝材5で4つ以上(ここでは6つ)の収納容器7を保護できるため、輸送や梱包の際の作業効率に優れる。
According to this embodiment, in the cushioning material 100, the upper storage portions 13A, 13B, 13C, the lower storage portions 31A, 31B, 31C, the middle lid storage portions 53A, 53B, 53C, and the middle bottom storage portions 71A, 71B, 71C are Multiple sets are arranged. Here, three sets are arranged.
Therefore, four or more (six in this case) storage containers 7 can be protected by one set of the upper cushioning material 1, the lower cushioning material 3, and the middle cushioning material 5, so that the work efficiency during transportation and packaging is excellent.

以上、本発明を実施形態に基づき説明したが、本発明は上記の実施形態に限定されない。当業者であれば、本発明の思想の範囲内において、各種変形例および改良例に想到するのは当然のことであり、これらも本発明の範囲に含まれる。   As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to said embodiment. It is natural for a person skilled in the art to come up with various modifications and improvements within the scope of the idea of the present invention, and these are also included in the scope of the present invention.

1…上部緩衝材、3…下部緩衝材、5…中部緩衝材、7…収納容器、13A、13B、13C…上部収納部、14…上部対向面、15、17…上部側リブ、19…上部側孔、31A、31B、31C…下部収納部、33…下部対向面、35…下部側リブ、51…中部緩衝材本体、53A、53B、53C…中部蓋収納部、54…蓋対向面、55、57…蓋側リブ、59…蓋側孔、71A、71B、71C…中部底面収納部、73…底面対向面、75…底面側リブ、81…本体、83…蓋、85…ウェーハ収納部、86…底面、87…脚部、91…保持部、100…緩衝材。   DESCRIPTION OF SYMBOLS 1 ... Upper buffer material, 3 ... Lower buffer material, 5 ... Middle buffer material, 7 ... Storage container, 13A, 13B, 13C ... Upper storage part, 14 ... Upper opposing surface, 15, 17 ... Upper side rib, 19 ... Upper part Side hole, 31A, 31B, 31C ... lower storage part, 33 ... lower facing surface, 35 ... lower side rib, 51 ... middle cushion body, 53A, 53B, 53C ... middle lid storage part, 54 ... lid facing surface, 55 57 ... Lid on the lid side, 59 ... Lid on the lid side, 71A, 71B, 71C ... Middle bottom housing part, 73 ... Bottom facing surface, 75 ... Bottom rib, 81 ... Main body, 83 ... Lid, 85 ... Wafer housing part, 86 ... Bottom, 87 ... Leg, 91 ... Holding part, 100 ... Cushioning material.

Claims (9)

半導体ウェーハを収納する収納容器を梱包ケースに梱包する際に、前記収納容器と前記梱包ケースの間に配置される緩衝材であって、
前記収納容器は、
上面が開放された箱型の本体と、前記上面を塞ぐ蓋と、前記蓋の裏側に設けられ、前記本体内に収容された前記半導体ウェーハの上部周縁と当接し、前記半導体ウェーハの移動を規制する保持部と、を備え、
前記緩衝材は、前記蓋の上面と接触する上部収納部を備えた上部緩衝材を有し、
前記上部収納部は、
前記蓋の上面と離間して対向する上部対向面と、前記上部対向面から突出し、前記蓋の上面と接触する上部側リブと、
を備え、
前記上部側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることを特徴とする、緩衝材。
When packing a storage container for storing a semiconductor wafer in a packing case, a cushioning material disposed between the storage container and the packing case,
The storage container is
A box-shaped main body with an open upper surface, a lid that closes the upper surface, and a back side of the lid, abutting on an upper peripheral edge of the semiconductor wafer housed in the main body, and restricting movement of the semiconductor wafer And a holding part that
The cushioning material has an upper cushioning material having an upper storage portion that comes into contact with the upper surface of the lid,
The upper storage part is
An upper facing surface facing away from the upper surface of the lid; an upper rib projecting from the upper facing surface and contacting the upper surface of the lid;
With
The cushioning material, wherein the upper rib is provided at a position in contact with at least an upper surface region of the lid located immediately above the region where the holding portion is provided.
請求項1に記載の緩衝材であって、
前記上部側リブは、平面形状が十字形であることを特徴とする、緩衝材。
The cushioning material according to claim 1,
The cushioning material, wherein the upper rib has a cross shape in plan view.
請求項2に記載の緩衝材であって、
前記上部側リブは、十字の交差部に上部側孔が設けられていることを特徴とする、緩衝材。
The cushioning material according to claim 2,
The cushioning material, wherein the upper side rib is provided with an upper side hole at a crossing portion.
請求項1から請求項3のいずれか一項に記載の緩衝材であって、
前記収納容器は、底面から突出するように前記底面に設けられた少なくとも一対の脚部を備え、
前記緩衝材は、前記底面と接触する下部収納部を備えた下部緩衝材を有し、
前記下部収納部は、前記脚部と離間して前記収納容器の前記底面と対向する下部対向面と、前記下部対向面から突出し、前記収納容器の前記底面と接触する下部側リブを備えることを特徴とする、緩衝材。
The shock-absorbing material according to any one of claims 1 to 3,
The storage container includes at least a pair of legs provided on the bottom surface so as to protrude from the bottom surface,
The cushioning material has a lower cushioning material provided with a lower storage portion that comes into contact with the bottom surface,
The lower storage portion includes a lower facing surface that is separated from the leg portion and faces the bottom surface of the storage container, and a lower-side rib that protrudes from the lower facing surface and contacts the bottom surface of the storage container. A cushioning material.
請求項4に記載の緩衝材であって、
前記緩衝材は、前記蓋および前記底面と接触する中部緩衝材を有し、
前記中部緩衝材は、板状の中部緩衝材本体と、
前記中部緩衝材本体の底面に設けられ、前記蓋の上面と離間してと対向する蓋対向面と、前記蓋対向面から突出し、前記蓋の上面と接触する蓋側リブとを有する中部蓋収納部と、
前記中部緩衝材本体の上面に設けられ、前記脚部と離間して前記収納容器の前記底面と対向する底面対向面と、前記底面対向面から突出し、前記収納容器の前記底面と接触する底面側リブを有する中部底面収納部と、
を備え、
前記蓋側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることを特徴とする、緩衝材。
The cushioning material according to claim 4,
The cushioning material has a middle cushioning material in contact with the lid and the bottom surface,
The middle cushioning material is a plate-shaped middle cushioning material body,
A middle lid storage provided on the bottom surface of the middle cushioning material main body, having a lid facing surface facing away from the top surface of the lid, and a lid side rib protruding from the lid facing surface and contacting the top surface of the lid And
A bottom surface provided on the top surface of the middle cushioning material body, spaced apart from the leg and facing the bottom surface of the storage container, and a bottom surface side protruding from the bottom surface and contacting the bottom surface of the storage container A middle bottom receiving portion having a rib;
With
The cushioning material, wherein the lid-side rib is provided at a position in contact with at least an upper surface region of the lid located immediately above a region where the holding portion is provided.
請求項5に記載の緩衝材であって、
前記上部収納部、前記下部収納部、前記中部蓋収納部、前記中部底面収納部は複数組配列されていることを特徴とする、緩衝材。
The cushioning material according to claim 5,
A cushioning material, wherein a plurality of sets of the upper storage unit, the lower storage unit, the middle lid storage unit, and the middle bottom storage unit are arranged.
請求項1から請求項6のいずれか一項に記載の緩衝材であって、発泡倍率が20倍以上、40倍以下の発泡体で構成されることを特徴とする、緩衝材。   It is a shock absorbing material as described in any one of Claims 1-6, Comprising: It is comprised with a foam whose expansion ratio is 20 times or more and 40 times or less, The shock absorbing material characterized by the above-mentioned. 請求項1から請求項7のいずれか一項に記載の緩衝材であって、発泡ポリウレタン、発泡ポリエチレン、発泡ポリプロピレン、または発泡ポリスチレンのいずれかで構成されることを特徴とする、緩衝材。   The shock-absorbing material according to any one of claims 1 to 7, wherein the shock-absorbing material is made of any of polyurethane foam, polyethylene foam, polypropylene foam, or polystyrene foam. 半導体ウェーハを収納する収納容器を梱包ケースに梱包する際に、前記収納容器と前記梱包ケースの間に配置される緩衝材であって、
前記収納容器は、
上面が開放された箱型の本体と、前記上面を塞ぐ蓋と、前記蓋の裏側に設けられ、前記本体内に収容された前記半導体ウェーハの上部周縁と当接し、前記半導体ウェーハの移動を規制する保持部と、
底面から突出するように前記底面の端部に設けられた少なくとも一対の脚部と、を備え、
前記緩衝材は、前記蓋の上面および前記収納容器の前記底面と接触する中部緩衝材を有し、
前記中部緩衝材は、板状の中部緩衝材本体と、
前記中部緩衝材本体の底面に設けられ、前記蓋の上面と離間して対向する蓋対向面と、前記蓋対向面から突出し、前記蓋の上面と接触する蓋側リブとを有する中部蓋収納部と、
前記中部緩衝材本体の上面に設けられ、前記脚部と離間して前記収納容器の前記底面と対向する底面対向面と、前記底面対向面から突出し、前記収納容器の前記底面と接触する底面側リブを有する中部底面収納部と、
を備え、
前記蓋側リブは、少なくとも前記保持部が設けられた領域の直上に位置する前記蓋の上面領域と接触する位置に設けられていることを特徴とする、緩衝材。
When packing a storage container for storing a semiconductor wafer in a packing case, a cushioning material disposed between the storage container and the packing case,
The storage container is
A box-shaped main body with an open upper surface, a lid that closes the upper surface, a back side of the lid, abuts on an upper peripheral edge of the semiconductor wafer housed in the main body, and restricts movement of the semiconductor wafer Holding part to
And at least a pair of legs provided at the end of the bottom so as to protrude from the bottom,
The cushioning material has a middle cushioning material in contact with the top surface of the lid and the bottom surface of the storage container,
The middle cushioning material is a plate-shaped middle cushioning material body,
A middle lid storage portion provided on the bottom surface of the middle cushioning material main body, having a lid facing surface that is spaced apart from the upper surface of the lid, and a lid-side rib that protrudes from the lid facing surface and contacts the upper surface of the lid When,
A bottom surface provided on the top surface of the middle cushioning material body, spaced apart from the leg and facing the bottom surface of the storage container, and a bottom surface side protruding from the bottom surface and contacting the bottom surface of the storage container A middle bottom receiving portion having a rib;
With
The cushioning material, wherein the lid-side rib is provided at a position in contact with at least an upper surface region of the lid located immediately above a region where the holding portion is provided.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020093805A (en) * 2018-12-11 2020-06-18 三菱電機株式会社 Packaging device
WO2023210078A1 (en) * 2022-04-27 2023-11-02 株式会社Sumco Packaging unit and transportation container
KR20240128953A (en) 2021-12-28 2024-08-27 가부시키가이샤 사무코 Buffering materials, packing materials and packing methods
TWI856534B (en) 2022-04-27 2024-09-21 日商Sumco股份有限公司 Packaging unit and delivery container

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946880U (en) * 1982-09-21 1984-03-28 積水化成品工業株式会社 Cushioning packaging materials for automobile heater units, etc.
JPS60110676A (en) * 1983-11-09 1985-06-17 株式会社日立製作所 Cushioning material for packaging braun tube
JP2002068364A (en) * 2000-06-13 2002-03-08 Shin Etsu Polymer Co Ltd Sealing member, airtight container, and sealing method therefor
JP2004168324A (en) * 2002-11-15 2004-06-17 Kanegafuchi Chem Ind Co Ltd Wafer container cushioning material
JP2007137454A (en) * 2005-11-16 2007-06-07 Shin Etsu Polymer Co Ltd Package
JP2010208659A (en) * 2009-03-10 2010-09-24 Sekisui Plastics Co Ltd Shock-absorbing packaging material
JP2011105319A (en) * 2009-11-13 2011-06-02 Sekisui Plastics Co Ltd Packing material, packing body using it, and method for assembling packing material
JP2014151963A (en) * 2013-02-14 2014-08-25 Sumco Corp Cushioning material for packaging wafer storing container

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6644477B2 (en) * 2002-02-26 2003-11-11 Entegris, Inc. Wafer container cushion system
CN102883973B (en) * 2010-03-11 2016-02-24 恩特格林斯公司 Thin wafer shipper
JP5687575B2 (en) * 2011-07-11 2015-03-18 株式会社東芝 Wafer transfer container protection case
TWI568653B (en) * 2012-05-04 2017-02-01 恩特葛瑞斯股份有限公司 Wafer container with door mounted shipping cushions
TWM488102U (en) * 2014-06-12 2014-10-11 Yeuh Tai Ind Co Ltd Combination of wafer cassette buffer body structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946880U (en) * 1982-09-21 1984-03-28 積水化成品工業株式会社 Cushioning packaging materials for automobile heater units, etc.
JPS60110676A (en) * 1983-11-09 1985-06-17 株式会社日立製作所 Cushioning material for packaging braun tube
JP2002068364A (en) * 2000-06-13 2002-03-08 Shin Etsu Polymer Co Ltd Sealing member, airtight container, and sealing method therefor
JP2004168324A (en) * 2002-11-15 2004-06-17 Kanegafuchi Chem Ind Co Ltd Wafer container cushioning material
JP2007137454A (en) * 2005-11-16 2007-06-07 Shin Etsu Polymer Co Ltd Package
JP2010208659A (en) * 2009-03-10 2010-09-24 Sekisui Plastics Co Ltd Shock-absorbing packaging material
JP2011105319A (en) * 2009-11-13 2011-06-02 Sekisui Plastics Co Ltd Packing material, packing body using it, and method for assembling packing material
JP2014151963A (en) * 2013-02-14 2014-08-25 Sumco Corp Cushioning material for packaging wafer storing container

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020093805A (en) * 2018-12-11 2020-06-18 三菱電機株式会社 Packaging device
JP7263752B2 (en) 2018-12-11 2023-04-25 三菱電機株式会社 packing equipment
KR20240128953A (en) 2021-12-28 2024-08-27 가부시키가이샤 사무코 Buffering materials, packing materials and packing methods
WO2023210078A1 (en) * 2022-04-27 2023-11-02 株式会社Sumco Packaging unit and transportation container
TWI856534B (en) 2022-04-27 2024-09-21 日商Sumco股份有限公司 Packaging unit and delivery container

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