JP6018301B2 - Packing structure for packing the substrate storage container - Google Patents

Description

  The present invention relates to a packing structure for packing a substrate storage container for storing a substrate such as a semiconductor wafer.

  As a container for storing a substrate such as a semiconductor wafer, a substrate storage container including a container main body and a lid is conventionally known. When such a substrate storage container is packed in a packaging box and transported, a cushioning material made of a resin foam or a cushioning material formed of a plastic sheet is placed in the packaging box. And these hold | maintain a board | substrate storage container in a packaging box, and reduce the transmission of the impact and vibration to the board | substrate storage container from the exterior of a packaging box (refer patent document 1).

JP 2010-132331 A

  However, there is a need for a packaging structure that reduces the transmission of shocks and vibrations to the substrate storage container, rather than a conventional packaging structure that uses a cushioning material.

  The present invention provides a packing structure for packing a substrate storage container that can suppress as much as possible shock and vibration from being transmitted to a plurality of substrates stored in the substrate storage container during transportation of the substrate storage container. For the purpose.

  The present invention is a packing structure for packing a substrate storage container for storing and transporting a substrate made of a semiconductor wafer, and is placed on the upper portion of the substrate storage container in the packing box An upper cushioning material and a lower cushioning material on which the substrate storage container is placed, and the upper cushioning material and the lower cushioning material are arranged in the packing box so as to sandwich the substrate storage container in the vertical direction A first rigid body disposed in the packing box and having a flat upper surface and a lower surface and having a plate shape, the upper surface of the first rigid body being the lower cushioning material A first rigid body that contacts the lower end surface of the first cushion member, and a first cushion member that is disposed in the packaging box and has an upper surface and a lower surface, wherein the upper surface of the first cushion member is the first rigid body. The first rigid body is slidable with respect to the lower surface of the first rigid body A first cushioning material that is in surface contact with a lower surface, wherein the upper cushioning material and the lower cushioning material directly place the substrate storage container storing the semiconductor wafer on the upper cushioning material or the lower cushioning material. However, the position and posture of the substrate storage container in a direction perpendicular to the vertical direction in the packaging box has a hardness capable of retaining the shape of the upper cushioning material and the lower cushioning material itself without plastic deformation. The first and second shock absorbers can be held and absorbs at least part of an impact transmitted to the substrate storage container via the upper cushioning material and the lower cushioning material. The upper surface of the first rigid body is wider than the lower end surface of the lower cushioning material, and the first rigid body can come into surface contact with the upper surface of the first cushion material over the entire lower surface of the first rigid body. The shape of the first rigid body itself can be maintained. The first cushion material is elastically deformed when the substrate storage container storing the semiconductor wafer is directly placed on the first cushion material, and the placed substrate storage container is removed. The present invention relates to a packing structure for packing a substrate storage container, which has elastic flexibility to restore the original shape.

  The first cushion material is formed by laminating a plurality of plate-like first cushion materials each having a flat upper surface and a lower surface in the vertical direction, and the lower plate-like first cushion adjacent to the lamination direction. The upper surface of the material and the lower surface of the upper plate-shaped first cushion material are in slidable surface contact and are disposed in the packaging box, and each has a flat upper surface and a lower surface and has a plate shape. A second rigid body, wherein the upper surface of the second rigid body is slidably in contact with the lower surface of the lowermost plate-like first cushion material, and the second rigid body comprises: It is preferable that the entire upper surface of the second rigid body has a hardness capable of maintaining the shape of the second rigid body itself so as to be able to come into surface contact with the lower surface of the lowermost plate-like first cushion material.

  The second cushion material is disposed in the packaging box and has an upper surface and a lower surface, and the upper surface of the second cushion material is slidable with respect to the lower surface of the second rigid body. A second cushion material that contacts the lower surface of the second rigid body is provided, and the second cushion material is elastic when the substrate storage container storing the semiconductor wafer is placed directly on the second cushion material. It is preferable to have elastic flexibility that restores the original shape when the deformed and placed substrate storage container is removed.

  Further, the second cushion material is formed by laminating a plurality of plate-like second cushion materials each having an upper surface and a lower surface in the vertical direction, and the second cushion material of the lower plate-like second cushion material adjacent to the lamination direction. The upper surface and the lower surface of the upper plate-shaped second cushion material each have a flat shape, and the upper surface of the lower plate-shaped second cushion material and the upper plate-shaped second cushion material adjacent to each other in the stacking direction. It is preferable that the lower surface of the material is in slidable surface contact.

  The upper surface of the second cushion member has an upper protrusion protruding upward, and the upper protrusion is slidable with respect to the lower surface of the second rigid body. It is preferable to abut on the lower surface.

  Further, the lower surface of the second cushion material has a lower protruding portion that protrudes downward, and the lower protruding portion abuts against the inner surface of the packing box so as to be slidable with respect to the inner surface of the packing box. Is preferred.

  Moreover, it is preferable that the side surface of the said 2nd cushion material in the direction orthogonal to an up-down direction is always contact | abutting to the inner surface of the said packaging box.

  Moreover, it is preferable that the side surface of the said 1st cushion material in the direction orthogonal to an up-down direction is always contact | abutting to the inner surface of the said packaging box.

  In addition, an upper cushion material placed on top of the upper cushioning material in the packing box is provided, and the upper cushion material directly places the substrate storage container storing the semiconductor wafer on the upper cushion material. Then, it is elastically deformed, and it is preferable to have elastic flexibility to restore the original shape when the placed substrate storage container is removed.

  According to the present invention, there is provided a packing structure for packing a substrate storage container, which can suppress as much as possible the transmission of impact and vibration to a plurality of substrates stored in the substrate storage container during transportation of the substrate storage container. Can be provided.

It is a disassembled perspective view which shows the packing structure 1 for packing the substrate storage container based on 1st Embodiment of this invention. It is a perspective view showing packing box 10 of packing structure 1 for packing a substrate storage container concerning a 1st embodiment of the present invention. It is a top view showing packing box 10 of packing structure 1 for packing a substrate storage container concerning a 1st embodiment of the present invention. It is sectional drawing along the AA line of FIG. It is sectional drawing along the BB line of FIG. It is a disassembled perspective view which shows the substrate storage container 2 packed by the packing structure 1 for packing a substrate storage container based on 1st Embodiment of this invention. It is a disassembled perspective view which shows 1A of packing structures for packing a substrate storage container based on 2nd Embodiment of this invention. It is a top view which shows the packing box 10 of 1 A of packing structures for packing a substrate storage container based on 2nd Embodiment of this invention. It is sectional drawing along CC line of FIG. It is sectional drawing along the DD line of FIG.

  Hereinafter, a packing structure 1 for packing a substrate storage container according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a packing structure 1 for packing a substrate storage container according to the first embodiment of the present invention. FIG. 2 is a perspective view showing the packing box 10 of the packing structure 1 for packing the substrate storage container according to the first embodiment of the present invention. FIG. 3 is a plan view showing the packing box 10 of the packing structure 1 for packing the substrate storage container according to the first embodiment of the present invention. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a cross-sectional view taken along line BB in FIG. FIG. 6 is an exploded perspective view showing the substrate storage container 2 packed by the packing structure 1 for packing the substrate storage container according to the first embodiment of the present invention.

  Here, for convenience of explanation, a direction (lower left direction in FIG. 1) from the back plate 14 to the front plate 13 of the packaging box 10 described later is defined as the front direction D11, and the opposite direction is defined as the rear direction D12. These are defined as the front-rear direction D1. Further, a direction (upward direction in FIG. 1) from the bottom plate 16 described later to the top plate 15 is defined as an upper direction D21, the opposite direction is defined as a lower direction D22, and these are defined as an up and down direction D2. Further, a direction (upper left direction in FIG. 1) from the second side plate 12 described later to the first side plate 11 is defined as the left direction D31, the opposite direction is defined as the right direction D32, and these are defined as the left-right direction D3. Define.

  As shown in FIG. 6, the substrate storage container 2 packed by the packing structure 1 for packing the substrate storage container has a container main body 202 and a lid 203.

  The container body 202 has a cylindrical wall part 220 in which a container body opening 221 is formed at one end and the other end is closed. A substrate storage space 227 is formed in the container main body 202. The substrate storage space 227 is formed so as to be surrounded by the wall 220. A substrate support plate-like portion 205 and a rear retainer (not shown) are disposed in a portion of the wall portion 220 that forms the substrate storage space 227. A plurality of substrates W can be stored in the substrate storage space 227.

  The substrate support plate-like portions 205 are provided on the wall portion 220 so as to form a pair in the substrate storage space 227. The substrate support plate-like portion 205 is configured so that, when the container main body opening 221 is not closed by the lid 203, the adjacent substrates W are separated from each other at a predetermined interval and are arranged in parallel. The part can be supported. The rear retainer (not shown) can support the rear portions of the edges of the plurality of substrates W when the container main body opening 221 is closed by the lid 203.

  The lid 203 can be attached to and detached from the container body opening 221 and can close the container body opening 221. The lid 203 is provided with a front retainer (not shown). A front retainer (not shown) is provided in a portion of the lid 203 that faces the substrate storage space 227 when the container main body opening 221 is closed by the lid 203. The front retainer (not shown) is arranged to make a pair with the rear retainer (not shown).

  The front retainer (not shown) can support the front portions of the edges of the plurality of substrates W when the container main body opening 221 is closed by the lid 203. A front retainer (not shown) supports adjacent substrates by supporting a plurality of substrates W in cooperation with a rear retainer (not shown) when the container body opening 221 is closed by the lid 203. A plurality of substrates W are held in a state where the Ws are separated from each other at a predetermined interval and are arranged in parallel.

  The substrate W (see FIG. 6) stored in the substrate storage container 2 is a disk-shaped silicon wafer, glass wafer, sapphire wafer, or the like, and is a thin one used in the industry. The substrate W in the present embodiment is a silicon wafer having a diameter of 300 mm to 450 mm.

  As shown in FIG. 1, the packing structure 1 for packing the substrate storage container 2 includes a packing box 10, an upper cushioning material 20, an upper cushioning material 30, a lower cushioning material 40, and a first rigid body. 50, a first cushion material 60, a second rigid body 70, and a second cushion material 80. The packing structure 1 for packing the substrate storage container 2 packs the substrate storage container 2 for storing and transporting the substrate W made of a semiconductor wafer.

  As shown in FIGS. 1 and 2, the packaging box 10 is constituted by a so-called plastic cardboard box (pradan), and includes a first side plate 11, a second side plate 12, a front plate 13, a back plate 14, A top plate 15 and a bottom plate 16 are provided. The first side plate 11 and the second side plate 12 have a parallel positional relationship. The front plate 13 and the back plate 14 have a parallel positional relationship. The top plate 15 and the bottom plate 16 have a parallel positional relationship. The first side plate 11, the second side plate 12, the front plate 13, and the back plate 14 each have a rectangular shape. The first side plate 11, the second side plate 12, the front plate 13, and the back plate 14 constitute a rectangular columnar cylindrical body 110 having openings at the upper end and the lower end.

  The top plate 15 includes a front plate 151, a rear plate 152, a left plate 153, and a right plate 154 (see FIG. 2) each having a rectangular shape. The front plate 151 is integrally connected to the upper side of the front plate 13. The rear plate 152 is integrally connected to the upper side of the back plate 14. The left plate 153 is integrally connected to the upper side of the first side plate 11. The right part plate 154 is integrally connected to the upper side of the second side plate 12.

  The front plate 151 and the rear plate 152 are in a positional relationship (horizontal positional relationship) orthogonal to the front plate 13 and the back plate 14, and the upper end opening of the cylindrical body 110 is partially blocked. And the left part board 153 and the right part board 154 are made into the positional relationship (horizontal positional relationship) orthogonal to the 1st side plate 11 and the 2nd side plate 12 from the top, and upper end opening of the cylindrical body 110 is carried out. The whole is blocked. Since the bottom plate 16 has the same configuration as the top plate 15, description thereof is omitted.

  The upper cushion material 20 is elastically deformed when the substrate storage container 2 storing the substrate W is directly placed on the upper cushion material 20, and is elastically restored to the original shape when the placed substrate storage container 2 is removed. It is comprised with the material which has a softness | flexibility, and is comprised with the sponge in this embodiment. The upper cushion material 20 has a rectangular plate shape, which is formed by the inner surface of the cylindrical body 110 in the cross section of the cylindrical body 110 cut by a plane parallel to the left-right direction D3 and the front-rear direction D1. Matches the enclosed rectangle. The upper cushion material 20 is disposed at the top in the packaging box 10 with the rectangular upper surface 21 and lower surface 22 parallel to the left-right direction D3 and the front-rear direction D1, and is placed on the upper cushioning material 30. The The entire surface of the side surface 23 of the upper cushion material 20 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110. The side surface 23 of the upper cushion material 20 is not bonded to the inner surface of the cylindrical body 110 and is slidable with respect to the inner surface of the cylindrical body 110.

  The upper cushioning material 30 has a hardness capable of maintaining the shape of the upper cushioning material 30 without plastic deformation even when the substrate storage container 2 storing the substrate W is directly placed on the upper cushioning material 30. Yes. Specifically, the upper cushioning material 30 can hold the position and posture of the substrate storage container 2 in the direction orthogonal to the vertical direction D2 in the packaging box 10 and acts on the packaging box 10 to act on the upper cushioning material 30. It is comprised with the material which has a softness | flexibility which can absorb at least one part of the impact transmitted to the board | substrate storage container 2. Therefore, the upper cushioning material 30 is plastically deformed and does not return to its original shape when it receives an impact stronger than a predetermined impact, but it can absorb an impact weaker than the predetermined impact. Almost no deformation. It is harder than the upper cushion material 20, the first cushion material 60, and the second cushion material 80, but softer than the first rigid body 50 and the second rigid body 70. In this embodiment, it is comprised by the polystyrene foam.

  The upper cushioning material 30 has a substantially rectangular parallelepiped shape. The upper surface 31 of the upper cushioning material 30 is a flat surface. Three convex portions 331 are provided on the front and rear side surfaces 33 of the upper cushioning material 30, and four rectangular parallelepiped convex portions 341 are provided on the left and right side surfaces 34 of the upper cushioning material 30. . The lower portion 32 of the upper cushioning material 30 has a recess 321. The recess 321 has substantially the same shape as the lid 203 of the substrate storage container 2, and the lid 203 is engaged with the recess 321.

  The upper cushioning material 30 has the upper surface 31 parallel to the left-right direction D3 and the front-rear direction D1 so that the upper surface 31 of the upper cushioning material 30 comes into surface contact with the lower surface 22 of the upper cushion material 20. It is mounted on the upper part of the substrate storage container 2 inside. The lower surface 22 of the upper cushion material 20 is not bonded to the upper surface 31 of the upper cushioning material 30, and the lower surface 22 of the upper cushion material 20 is slidable with respect to the upper surface 31 of the upper cushioning material 30. Further, the tip surfaces of the convex portions 331 and 341 of the upper cushioning material 30 are always in contact with the inner surface of the cylindrical body 110 in the packaging box 10. The tip surfaces of the convex portions 331 and 341 are not bonded to the inner surface of the cylindrical body 110, and can slide on the inner surface of the cylindrical body 110.

  The lower cushioning material 40 has a hardness capable of holding the shape of the lower cushioning material 40 itself without plastic deformation even when the substrate storage container 2 storing the substrate W is directly placed on the lower cushioning material 40. Yes. Specifically, the lower cushioning material 40 can hold the position and posture of the substrate storage container 2 in the direction orthogonal to the vertical direction D2 in the packaging box 10 and acts on the packaging box 10 to act on the lower cushioning material 40. It is comprised with the material which has a softness | flexibility which can absorb at least one part of the impact transmitted to the board | substrate storage container 2. In the present embodiment, the foamed polystyrene is the same as that of the upper cushioning material 30.

  The lower cushioning member 40 has a substantially rectangular parallelepiped shape. The upper portion 41 of the lower cushioning material 40 has a recess 411. The concave portion 411 includes a lower portion of the substrate storage container 2 when the lid 203 of the substrate storage container 2 is disposed on the upper side (the back portion of the wall 220 with respect to the container main body opening 221 in the substrate storage container 2). It has substantially the same shape, and the lower portion engages with the recess 411. That is, the substrate storage container 2 is placed on the lower cushioning material 40, and the upper cushioning material 30 and the lower cushioning material 40 are arranged in the packaging box 10 so as to sandwich the substrate storage container 2 in the vertical direction D2. Three convex portions 431 are provided on the front and rear side surfaces 43 of the lower cushioning material 40, and four rectangular parallelepiped convex portions 441 are provided on the left and right side surfaces 44 of the lower cushioning material 40. . A total of nine lower convex portions 421 are provided on the lower surface 42 of the lower cushioning material 40 in three rows in the left-right direction D3 and three rows in the front-rear direction D1.

  The lower cushioning material 40 has a positional relationship parallel to the left-right direction D3 and the front-rear direction D1, so that the tip surface of the lower convex portion 421 of the lower cushioning material 40 comes into surface contact with the upper surface 51 of the first rigid body 50. In the packing box 10, it is arranged below the substrate storage container 2. The tip surface of the lower convex portion 421 as the lower end surface of the lower cushioning member 40 is not bonded to the upper surface 51 of the first rigid body 50 and slides with respect to the upper surface 51 of the first rigid body 50. Is possible. The front end surfaces of the convex portions 431 and 441 of the lower cushioning member 40 are always in contact with the inner surface of the cylindrical body 110 in the packaging box 10. The tip surfaces of the convex portions 431 and 441 are not bonded to the inner surface of the cylindrical body 110 and can slide with respect to the inner surface of the cylindrical body 110.

  The first rigid body 50 has a hardness capable of maintaining the shape of the first rigid body 50 itself so that the entire lower surface 52 of the first rigid body 50 can come into surface contact with the upper surface 62 of the first cushion material 60. It is made of a material, and in this embodiment, it is made of a cardboard plate or a plastic plate. In other words, the first rigid body 50 does not need to absorb vibrations and shocks by itself, and is made of a relatively hard material that can maintain its own shape. Therefore, the first rigid body 50 is harder than any of the upper cushion material 20, the upper cushioning material 30, the lower cushioning material 40, the first cushion material 60, and the second cushion material 80. The first rigid body 50 has a rectangular plate shape, and this rectangular shape is a cylindrical body 110 in a cross section of the cylindrical body 110 cut by a plane parallel to the left-right direction D3 and the front-rear direction D1. It coincides with the rectangular shape surrounded by the inner surface.

  The first rigid body 50 has a flat upper surface 51 and a lower surface 52, respectively, and the upper surface 51 and the lower surface 52 are parallel to the left-right direction D3 and the front-rear direction D1, and the lower cushioning material 40 is placed in the packaging box 10. It is arranged below. The entire side surface 53 of the first rigid body 50 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110. The side surface 53 of the first rigid body 50 is not bonded to the inner surface of the cylindrical body 110 and is slidable with respect to the inner surface of the cylindrical body 110. The area of the upper surface 51 of the first rigid body 50 is larger than the total area of the front end surfaces of the lower convex portions 421 as the lower end surface of the lower cushioning material 40, and the front end surfaces of all the lower convex portions 421 are The upper surface 51 of the rigid body 50 is in contact with the surface.

  The first cushion material 60 is elastically deformed when the substrate storage container 2 storing the substrate W is directly placed on the first cushion material 60, and is restored to its original shape when the placed substrate storage container 2 is removed. It has elastic flexibility. In the present embodiment, the first cushion material 60 is composed of the same sponge as the upper cushion material 20.

  More specifically, the first cushion material 60 is formed by laminating five rectangular plate-shaped first cushion materials 61 each having a flat upper surface 62 and a lower surface 63, each of which is made of sponge, in the vertical direction D2. ing. The plate-like first cushion material 61 is disposed below the first rigid body 50 in the packaging box 10 with the upper surface 62 and the lower surface 63 being parallel to the left-right direction D3 and the front-rear direction D1, respectively. The entire surface of the side surface 64 of the plate-like first cushion material 61 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110.

  Further, the upper surface 62 of the lower plate-shaped first cushion material 61 adjacent to the vertical direction D2 as the stacking direction and the lower surface 63 of the upper plate-shaped first cushion material 61 are in surface contact with each other. The upper surface 62 of the lower plate-shaped first cushion material adjacent to the stacking direction and the lower surface 63 of the upper plate-shaped first cushion material are not bonded to each other and are slidable with each other. The upper surface 62 of the uppermost plate-like first cushion material 61 is not bonded to the lower surface 52 of the first rigid body 50, is in surface contact, and is slidable. Accordingly, the upper surface 62 of the first cushion member 60 is in surface contact with the lower surface 52 of the first rigid body 50 so as to be slidable with respect to the lower surface 52 of the first rigid body 50.

  The second rigid body 70 can hold the shape of the second rigid body 70 itself so that the entire upper surface 71 of the second rigid body 70 can come into surface contact with the lower surface 63 of the lowermost plate-like first cushion material 61. In this embodiment, the first rigid body 50 is made of the same cardboard plate or plastic plate. The second rigid body 70 has a rectangular plate shape, and the rectangular shape of the cylindrical body 110 in a cross section of the cylindrical body 110 cut by a plane parallel to the left-right direction D3 and the front-rear direction D1. Matches the rectangular shape surrounded by the inner surface.

  The second rigid body 70 has a flat upper surface 71 and a lower surface 72, respectively, and the upper surface 71 and the lower surface 72 are parallel to the left-right direction D3 and the front-rear direction D1, and are the lowermost plate-like in the packing box 10. It is arranged below the first cushion material 61. The entire surface of the side surface 73 of the second rigid body 70 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110. The side surface 73 of the second rigid body 70 is not bonded to the inner surface of the cylindrical body 110 and can slide on the inner surface of the cylindrical body 110.

  The upper surface 71 of the second rigid body 70 is not bonded to the lower surface 63 of the lowermost plate-like first cushion material, and slidably contacts the surface. The area of the lower surface 72 of the second rigid body 70 is larger than the area of the contact surface of the upper projecting portion 814 of the upper surface 811 of the second cushion member 80 to be described later with the lower surface 72 of the second rigid body 70. . All the contact surfaces are not bonded to the lower surface 72 of the second rigid body 70 and are in surface contact with each other so as to be slidable.

  The second cushion material 80 is elastically deformed when the substrate storage container 2 storing the substrate W is directly placed on the second cushion material 80, and is restored to its original shape when the placed substrate storage container 2 is removed. It has elastic flexibility. In the present embodiment, the second cushion material 80 is composed of the same sponge as the first cushion material 60.

  The second cushion material 80 is configured by laminating a plurality of plate-like second cushion materials 81, 82, 83 having upper surfaces 811, 821, 831 and lower surfaces 812, 822, 832, respectively, in the vertical direction D2. Yes. The upper surfaces 821 and 831 of the lower plate-shaped second cushion materials 82 and 83 adjacent to the vertical direction D2 as the stacking direction and the lower surfaces 812 and 822 of the upper plate-shaped second cushion materials 81 and 82 are flat. Has a shape. The upper surfaces 821 and 831 of the lower plate-shaped second cushion materials 82 and 83 adjacent to each other in the stacking direction and the lower surfaces 812 and 822 of the upper plate-shaped second cushion materials are not bonded to each other and can slide. Is in surface contact.

  More specifically, the second cushion material 80 includes an upper plate-shaped second cushion material 81, a plate-shaped second cushion material 82, and a lower plate-shaped second cushion material 83, each formed of a sponge. .

  The upper plate-shaped second cushion material 81 has a rectangular plate shape having an upper surface 811 having a large number of upper protruding portions 814 and a flat lower surface 812. The upper protrusion 814 protrudes upward. The upper protruding portion 814 is not bonded to the lower surface 72 of the second rigid body 70, and abuts on the lower surface 72 of the second rigid body 70 so as to be slidable.

  The upper plate-like second cushion material 81 is disposed below the second rigid body 70 in the packaging box 10 with the lower surface 812 positioned parallel to the left-right direction D3 and the front-rear direction D1. The entire surface of the side surface 813 of the upper plate-like second cushion material 81 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110.

  The plate-like second cushion material 82 has a rectangular plate shape having a flat upper surface 821 and a lower surface 822. The upper surface 821 of the plate-shaped second cushion material 82 is not bonded to the lower surface 812 of the upper plate-shaped second cushion material 81 and is slidably contacted with the lower surface 812 of the upper plate-shaped second cushion material 81. Touch.

  The plate-like second cushion material 82 is disposed below the upper plate-like second cushion material 81 in the packaging box 10 with the upper surface 821 and the lower surface 822 being in a positional relationship parallel to the left-right direction D3 and the front-rear direction D1, respectively. . The entire side surface 823 of the plate-like second cushion material 82 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110.

  The lower plate-shaped second cushion material 83 has a rectangular plate shape having a flat upper surface 831 and a lower surface 832 having a number of lower protrusions 834. The upper surface 831 of the lower plate-shaped second cushion material 83 is not bonded to the lower surface 822 of the plate-shaped second cushion material 82 and is slidably contacted with the lower surface 822 of the plate-shaped second cushion material 82. . The lower protrusion 834 protrudes downward. The lower protruding portion 834 is not bonded to the inner surface of the bottom plate 16 of the packaging box 10, and slidably contacts the inner surface of the bottom plate 16 of the packaging box 10.

  The lower plate-shaped second cushion material 83 is disposed below the plate-shaped second cushion material 82 in the packaging box 10 with the upper surface 831 positioned parallel to the left-right direction D3 and the front-rear direction D1. The entire surface of the side surface 833 of the lower plate-shaped second cushion material 83 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110.

  According to the packaging structure 1 for packaging the substrate storage container 2 according to the first embodiment having the above configuration, the following effects can be obtained.

  As described above, the packing structure 1 for packing the substrate storage container 2 includes the upper cushioning material 30 placed on the upper part of the substrate storage container 2 in the packing box 10 and the substrate storage container 2. A lower cushioning material 40 disposed in the packaging box 10 so as to sandwich the substrate storage container 2 in the vertical direction D2 between the upper cushioning material 30 and the lower cushioning material 40. With this configuration, the posture and position of the substrate storage container 2 can be stably held in a predetermined posture and position in the packaging box 10.

  The packaging structure 1 for packaging the substrate storage container 2 is a first rigid body 50 that is disposed in the packaging box 10 and has a flat upper surface 51 and a lower surface 52, and has a plate shape. A first rigid body 50 in which the upper surface 51 of the first rigid body 50 abuts against the lower end surface of the lower convex portion 421 of the lower cushioning material 40, and a first rigid body 50 disposed in the packaging box 10 and having an upper surface 62 and a lower surface 63. The upper surface 62 of the first cushion material 60 is in contact with the lower surface 52 of the first rigid body 50 so as to be slidable with respect to the lower surface 52 of the first rigid body 50. Cushion material 60.

  The upper cushioning material 30 and the lower cushioning material 40 are not plastically deformed even when the substrate storage container 2 in which the substrate W is accommodated is directly placed on the upper cushioning material 30 or the lower cushioning material 40. It has a hardness that can hold the shape of the material 40 itself, can hold the position and orientation of the substrate storage container 2 in the direction perpendicular to the vertical direction D2 in the packaging box 10, and acts on the packaging box 10. Thus, it has the flexibility to absorb at least part of the impact transmitted to the substrate storage container 2 via the upper cushioning material 30 and the lower cushioning material 40.

  Further, the upper surface 51 of the first rigid body 50 is wider than the lower end surface of the lower cushioning material 40, and the first rigid body 50 is formed on the entire lower surface 52 of the first rigid body 50 with respect to the first cushion material 60. The first rigid body 50 itself has a hardness capable of maintaining the shape of the first rigid body 50 so as to be able to come into surface contact with the upper surface 62. Further, the first cushion material 60 is elastically deformed when the substrate storage container 2 storing the substrate W is directly placed on the first cushion material 60, and when the placed substrate storage container 2 is removed, the original shape is obtained. It has elastic flexibility to restore.

  With this configuration, the upper surface 51 of the first rigid body 50 is wider than the lower end surface of the lower convex portion 421 of the lower cushioning material 40, and only a part of the upper surface 51 of the first rigid body 50 is the lower cushioning material 40. Even in the configuration in which the lower end surface of the lower convex portion 421 is in contact with the entire lower end surface, the surface of the lower surface 52 of the first rigid body 50 can be in contact with the upper surface 62 of the first cushion material 60 on the wide surface. For this reason, the lower cushioning material 40 can be supported by the entire upper surface 62 of the first cushion material 60 via the first rigid body 50. As a result, the impact can be distributed over the entire upper surface 51 and lower surface 52 of the first rigid body 50, and the impact and vibration applied to the packaging box 10 can be absorbed by the first cushion material 60 having a large area. Further, it is possible to suppress the shock and vibration transmitted to the lower cushioning material 40 as much as possible.

  In addition, the upper surface 62 of the first cushion material 60 includes a first cushion material 60 that is in surface contact with the lower surface 52 of the first rigid body 50 so as to be slidable with respect to the lower surface 52 of the first rigid body 50. For this reason, when the upper surface 62 of the first cushion material 60 slides with respect to the lower surface 52 of the first rigid body 50, vibrations of a predetermined frequency applied to the packaging box 10 can be absorbed, and the substrate is stored. In the container 2, it can suppress as much as possible that the board | substrate W vibrates with respect to a front retainer and a rear retainer. As a result, it is possible to suppress as much as possible that the substrate W is rubbed against the front retainer and the rear retainer, the substrate W is scraped, and the substrate W is contaminated in the substrate storage container 2.

  The first cushion material 60 is formed by laminating a plurality of plate-like first cushion materials 61 each having a flat upper surface 62 and a lower surface 63 in the vertical direction D2, and is a lower plate shape adjacent in the laminating direction. The upper surface 62 of the first cushion material 61 and the lower surface 63 of the upper plate-like first cushion material 61 are in slidable surface contact. Therefore, a predetermined frequency applied to the packaging box 10 by sliding the upper surface 62 of the lower plate-shaped first cushion material 61 adjacent to the stacking direction and the lower surface 63 of the upper plate-shaped first cushion material 61. Can be effectively absorbed. Moreover, the plurality of plate-like first cushion materials 61 can be used repeatedly. When any one of the plurality of plate-like first cushion materials 61 is damaged or the like, only the damaged plate-like first cushion material 61 can be replaced.

  Moreover, it is the 2nd rigid body 70 which is arrange | positioned in the packaging box 10, and has the flat upper surface 71 and the lower surface 72, respectively, and has plate shape, Comprising: The upper surface 71 of the 2nd rigid body 70 is plate shape of the lowest layer. A second rigid body 70 slidably in contact with the lower surface 63 of the first cushion material 61 is provided, and the second rigid body 70 is the lowermost plate-like first layer on the entire upper surface 71 of the second rigid body 70. 1 It has the hardness which can hold | maintain the shape of 2nd rigid body 70 itself so that surface contact | abutting can be carried out to the lower surface 63 of the cushion material 61. FIG. For this reason, the strength of the bottom plate 16 divided and configured in the same manner as the top plate 15 can be supplemented, and the impact toward the upward direction D21 in the figure can be dispersed, and the cushioning effect of the cushioning material can be enhanced.

  The second cushion material 80 is disposed in the packaging box 10 and has an upper surface 811 and a lower surface 832, and the upper surface 811 of the second cushion material 80 is in relation to the lower surface 72 of the second rigid body 70. And a second cushion member 80 that comes into contact with the lower surface 72 of the second rigid body 70 so as to be slidable. The second cushion member 80 is configured to connect the substrate storage container 2 in which the substrate W is stored to the second cushion member 80. When it is directly placed on 80, it is elastically deformed, and when the placed substrate storage container 2 is removed, it has elastic flexibility to restore its original shape.

  For this reason, when the upper surface 811 of the second cushion member 80 slides with respect to the lower surface 72 of the second rigid body 70, vibrations of a predetermined frequency applied to the packaging box 10 can be effectively absorbed. . Further, the second cushion material 80 can effectively absorb the impact applied to the packaging box 10.

  The second cushion material 80 is configured by laminating a plurality of plate-like second cushion materials 81, 82, 83 having upper surfaces 811, 821, 831 and lower surfaces 812, 822, 832 in the vertical direction D2, respectively. The upper surfaces of the lower plate-shaped second cushion materials 82 and 83 adjacent to the stacking direction and the lower surfaces 812 and 822 of the upper plate-shaped second cushion materials 81 and 82 have flat shapes, respectively. The upper surfaces 821 and 831 of the adjacent lower plate-like second cushion materials 82 and 83 and the lower surfaces 812 and 822 of the upper plate-like second cushion materials 81 and 82 are in slidable surface contact.

  For this reason, the upper surfaces 821 and 831 of the lower plate-like second cushion materials 82 and 83 adjacent in the stacking direction and the lower surfaces 812 and 822 of the upper plate-like second cushion materials 81 and 82 slide, The vibration of the predetermined frequency added to the packaging box 10 can be effectively absorbed. Further, the plurality of plate-like second cushion materials 81, 82, 83 can be used repeatedly. When any of the plurality of plate-like second cushion materials 81, 82, 83 is damaged or the like, only the plate-like second cushion material that is damaged or the like can be replaced.

  The upper surface 811 of the second cushion member 80 has an upper protrusion 814 that protrudes upward, and the upper protrusion 814 is slidable with respect to the lower surface 72 of the second rigid body 70. It contacts the lower surface 72 of the rigid body 70. By sliding the upper projecting portion 814 relative to the lower surface 72 of the second rigid body 70, it is possible to effectively absorb vibration of a predetermined frequency applied to the packaging box 10. Further, the upper projecting portion 814 is partially crushed by the lower surface 72 of the second rigid body 70, so that the impact applied to the packaging box 10 can be effectively absorbed.

  The lower surface 832 of the second cushion material 80 has a lower protrusion 834 that protrudes downward, and the lower protrusion 834 is slidable with respect to the inner surface of the bottom plate 16 of the packaging box 10. It contacts the inner surface of the bottom plate 16. When the lower protrusion 834 slides with respect to the inner surface of the bottom plate 16 of the packaging box 10, vibration of a predetermined frequency applied to the packaging box 10 can be effectively absorbed. Moreover, the lower protrusion 834 abuts against the inner surface of the bottom plate 16 of the packaging box 10 and is partially crushed, so that the impact applied to the packaging box 10 can be effectively absorbed.

  Further, the side surfaces 813, 823, and 833 of the second cushion member 80 in the direction orthogonal to the vertical direction D2 are always in contact with the inner surface of the packaging box 10. For this reason, when the side surfaces 813, 823, and 833 of the second cushion material 80 slide on the inner surface of the packaging box 10, vibrations of a predetermined frequency applied to the packaging box 10 can be effectively absorbed.

  Further, the side surface 64 of the first cushion material 60 in the direction orthogonal to the vertical direction D2 is always in contact with the inner surface of the packaging box 10. For this reason, when the side surface 64 of the 1st cushion material 60 slides on the inner surface of the packaging box 10, the vibration of the predetermined frequency added to the packaging box 10 can be absorbed effectively.

  In addition, an upper cushion material 20 placed on the upper surface 31 of the upper cushioning material 30 is provided in the packing box 10, and the upper cushion material 20 directly places the substrate storage container 2 storing the substrate W on the upper cushion material 20. When placed, it is elastically deformed, and when the placed substrate storage container 2 is removed, it has elastic flexibility to restore its original shape. For this reason, the impact and vibration of the predetermined frequency which are added to the upper part of the packaging box 10 can be absorbed.

  Hereinafter, a packing structure 1A for packing the substrate storage container 2 according to the second embodiment of the present invention will be described. FIG. 7 is an exploded perspective view showing a packing structure 1A for packing the substrate storage container 2 according to the second embodiment of the present invention. FIG. 8 is a plan view showing the packing box 10 of the packing structure 1A for packing the substrate storage container according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view taken along the line CC of FIG. FIG. 10 is a cross-sectional view taken along the line DD of FIG.

  In the second embodiment, the second cushion material 80 is configured in such a manner that three plate-like second cushion materials 82 each having a flat upper surface 821 and a lower surface 822 are stacked in the vertical direction D2. Different from one embodiment. Moreover, it differs from the first embodiment in that the upper cushion material 20 is not provided. Since the configuration other than this is the same as that of the first embodiment, the same members are illustrated by the same reference numerals and description thereof is omitted.

  The upper surface 821 of the uppermost plate-like second cushion material 82 among the three plate-like second cushion materials 82 is not bonded to the lower surface 72 of the second rigid body 70 and can slide. In contact with the lower surface 72 of the second rigid body 70. Of the three plate-like second cushion materials 82, the upper surface 821 of the intermediate plate-like second cushion material 82 is not bonded to the lower surface 822 of the uppermost plate-like second cushion material 82. The lower surface 822 of the uppermost plate-like second cushion material 82 is slidably contacted. Of the three plate-like second cushion materials 82, the lower surface 822 of the intermediate plate-like second cushion material 82 is not bonded to the upper surface 821 of the lowermost plate-like second cushion material 82. The lowermost plate-like second cushion material 82 comes into contact with the upper surface 821 so as to be slidable. The lower surface 822 of the lowermost plate-like second cushion material 82 of the three plate-like second cushion materials 82 is not bonded to the inner surface of the bottom plate 16 of the packaging box 10 and is slidable. It contacts the inner surface of the bottom plate 16 of the packaging box 10.

  Each plate-like second cushion material 82 is disposed below the second rigid body 70 in the packaging box 10 with the upper surface 821 and the lower surface 822 positioned parallel to the left-right direction D3 and the front-rear direction D1. The entire side surface 823 of the plate-like second cushion material 82 having a positional relationship parallel to the vertical direction D2 is always in contact with the inner surface of the cylindrical body 110.

  According to the packing structure 1A for packing the substrate storage container 2 according to the second embodiment having the above-described configuration, the following effects can be obtained.

  The second cushion material 80 is configured by stacking three plate-like second cushion materials 82 each having a flat upper surface 821 and a lower surface 822 in the vertical direction D2. For this reason, the upper surface 821 of the uppermost plate-like second cushion material 82 can slide with respect to the lower surface 72 of the second rigid body 70 in a wider area, and vibration with a predetermined frequency applied to the packaging box 10. Can be effectively absorbed. Further, the lower surface 822 of the lowermost plate-like second cushion material 82 having a larger area can slide with respect to the inner surface of the bottom plate 16 of the packaging box 10, and vibration with a predetermined frequency applied to the lower portion of the packaging box 10. Can be effectively absorbed. That is, in this embodiment, vibration of a predetermined frequency applied to the packing box 10 can be absorbed more effectively than the packing structure 1 according to the first embodiment.

  The present invention is not limited to the above-described embodiments, and can be modified within the technical scope described in the claims. For example, the material of the upper cushion material 20, the first cushion material 60, the second cushion material 80, the upper cushioning material 30, the lower cushioning material 40, the first rigid body 50, and the second rigid body 70 is the present embodiment. It is not limited to each material of form. For example, the first rigid body 50 and the second rigid body 70 may be formed of a plywood board or a stone board.

  Moreover, although the packaging box 10 was comprised by what is called a plastic cardboard box (pradan), it is not limited to this. For example, it may be made of paper cardboard or an aluminum frame.

  In addition, the upper cushion material 20, the first rigid body 50, the second rigid body 70, the first cushion material 60, and the side surfaces 23, 53 of the second cushion material 80 having a positional relationship parallel to the vertical direction D2, 73, 64, 813, 823, and 833, and the entire top surfaces of the convex portions 331, 341, 431, and 441 of the upper cushioning material 30 and the lower cushioning material 40 are always in contact with the inner surface of the cylindrical body 110. However, it is not limited to this.

  For example, a part of the side surface may always contact the inner surface of the cylindrical body 110 instead of the entire side surface, and a part of the side surface may be slidable on the inner surface of the cylindrical body 110. Alternatively, the entire side surface and the front end surface may not be in contact with the inner surface of the cylindrical body 110 at all.

  In addition, the first cushion material 60 is configured by laminating a plurality of rectangular plate-shaped first cushion materials 61 each having a flat upper surface 62 and a lower surface 63, which are made of sponge, in the vertical direction D2. It is not limited to this. For example, the number of plate-like first cushion materials 61 is not limited to the number in the present embodiment. Moreover, you may be comprised by one thick 1st cushion material which is comprised with sponge and has the flat upper surface and lower surface.

  Similarly, the second cushion material 80 is configured by laminating a plurality of rectangular plate-shaped second cushion materials 81, 82, and 83 each formed of a sponge in the vertical direction D2, but this is not limitative. Not. For example, the number of the plate-like second cushion members 82 is not limited to the number in the present embodiment. Moreover, you may be comprised with one thick 2nd cushion material which is comprised with sponge and has the flat upper surface and lower surface.

  Further, the substrate storage container is not limited to the shape of the present embodiment.

DESCRIPTION OF SYMBOLS 1 Packing structure for packing a substrate storage container 2 Substrate storage container 10 Packing box 20 Upper cushion material 30 Upper cushioning material 40 Lower cushioning material 50 First rigid body 51 Upper surface 52 Lower surface 60 First cushion material 61 Plate shape First cushion material 62 Upper surface 63 Lower surface 70 Second rigid body 71 Upper surface 72 Lower surface 80 Second cushion material 81 Upper plate-like second cushion material 82 Plate-like second cushion material 83 Lower plate-like second cushion material 814 Projecting upward Part 834 lower protrusion W substrate

Claims (9)

A packing structure for packing a substrate storage container for storing and transporting a substrate made of a semiconductor wafer,
A packing box,
An upper cushioning material placed on top of the substrate storage container in the packaging box;
A lower cushioning material on which the substrate storage container is placed, and a lower cushioning material disposed in the packing box so as to sandwich the substrate storage container in the vertical direction between the upper cushioning material and the lower cushioning material;
A first rigid body disposed in the packaging box, each having a flat upper surface and a lower surface and having a plate shape, wherein the upper surface of the first rigid body is in contact with the lower end surface of the lower cushioning material. 1 rigid body;
A first cushion material disposed in the packaging box and having an upper surface and a lower surface, wherein the upper surface of the first cushion material is slidable with respect to the lower surface of the first rigid body. A first cushion material in surface contact with the lower surface of the rigid body,
The upper cushioning material and the lower cushioning material do not plastically deform even when the substrate storage container in which the semiconductor wafer is accommodated is placed directly on the upper cushioning material or the lower cushioning material. It has a hardness capable of holding its own shape, can hold the position and posture of the substrate storage container in the direction perpendicular to the vertical direction in the packing box, and acts on the packing box to Having a flexibility capable of absorbing at least part of the impact transmitted to the substrate storage container via the upper cushioning material and the lower cushioning material;
The upper surface of the first rigid body is wider than the lower end surface of the lower cushioning material,
The first rigid body has a hardness capable of maintaining the shape of the first rigid body itself so that the entire lower surface of the first rigid body can come into surface contact with the upper surface of the first cushion material,
The first cushion material is elastically deformed when the substrate storage container storing the semiconductor wafer is directly placed on the first cushion material, and when the placed substrate storage container is removed, the first cushion material is restored to its original shape. A packing structure for packing a substrate storage container having elastic flexibility to restore. The first cushion material is configured by laminating a plurality of plate-like first cushion materials each having a flat upper surface and a lower surface in the vertical direction,
The upper surface of the lower plate-shaped first cushion material adjacent to the stacking direction and the lower surface of the upper plate-shaped first cushion material are in slidable surface contact,
A second rigid body disposed in the packing box and having a flat upper surface and a lower surface and having a plate shape, and the upper surface of the second rigid body is the lower surface of the plate-shaped first cushion material. A second rigid body that slidably contacts the surface,
The second rigid body has a hardness capable of maintaining the shape of the second rigid body itself so that the entire upper surface of the second rigid body can come into surface contact with the lower surface of the lowermost plate-like first cushion material. A packing structure for packing the substrate storage container according to claim 1. A second cushion material disposed in the packaging box and having an upper surface and a lower surface, wherein the upper surface of the second cushion material is slidable relative to the lower surface of the second rigid body. A second cushion material that contacts the lower surface of the rigid body of
The second cushion material is elastically deformed when the substrate storage container storing the semiconductor wafer is directly placed on the second cushion material, and when the placed substrate storage container is removed, the second cushion material returns to its original shape. The packing structure for packing the board | substrate storage container of Claim 2 which has the elastic softness | flexibility to restore | restore. The second cushion material is configured by laminating a plurality of plate-like second cushion materials each having an upper surface and a lower surface in the vertical direction,
The upper surface of the lower plate-shaped second cushion material adjacent to the stacking direction and the lower surface of the upper plate-shaped second cushion material each have a flat shape,
4. The substrate storage container according to claim 3, wherein an upper surface of the lower plate-like second cushion material adjacent to the stacking direction and a lower surface of the upper plate-like second cushion material are in slidable surface contact. Packing structure to do.   The upper surface of the second cushion material has an upper protrusion that protrudes upward, and the upper protrusion is slidable with respect to the lower surface of the second rigid body. The packing structure for packing the substrate storage container in any one of Claims 3-4 which contact | abuts.   The lower surface of the second cushion material has a lower protrusion that protrudes downward, and the lower protrusion abuts against the inner surface of the packing box so as to be slidable with respect to the inner surface of the packing box. A packing structure for packing the substrate storage container according to claim 5.   The packing for packing the substrate storage container according to any one of claims 3 to 6, wherein a side surface of the second cushion material in a direction orthogonal to the vertical direction is always in contact with an inner surface of the packing box. Structure.   The packing for packing the substrate storage container according to any one of claims 1 to 7, wherein a side surface of the first cushion member in a direction orthogonal to the vertical direction is always in contact with an inner surface of the packing box. Structure. An upper cushion material placed on top of the upper cushioning material in the packing box,
The upper cushion material is elastically deformed when the substrate storage container storing the semiconductor wafer is directly placed on the upper cushion material, and is restored to the original shape when the placed substrate storage container is removed. A packing structure for packing the substrate storage container according to any one of claims 1 to 8, which has a high degree of flexibility.

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