TWI673215B - Cushioning material - Google Patents

Abstract

A buffer material (100) for a storage container for storing semiconductor wafers (7) When packed in a packing box, it is arranged between the storage container (7) and the packing box; the storage container (7) includes: a main body (81), a cover (83), and a holding portion (91); a buffer The material (100) has an upper buffer material (1) including an upper storage portion (13A) in contact with the upper surface of the cover (83), and the upper storage portion (13A) includes: separated from the upper surface of the cover (83) and facing The upper facing surface (14) and the upper side rib (17) protruding from the upper facing surface (14) and in contact with the upper surface of the cover (83). The upper side rib (17) is provided in contact with the upper side rib (17). A position where the upper surface area of the cover (83) is in contact with, and the position is directly above the area where at least the holding portion (91) is provided.

Description

Cushioning material

The present invention relates to a buffer material.

In the case of transporting a semiconductor wafer, a plurality of semiconductor wafers are stored in a storage container, and after being packed in a packing box, the packing box is transported by a transfer device.

During transportation, the packing box may fall from the conveying device, and an external force such as an impact force may be applied to the storage container. Therefore, a structure that does not deform or damage the semiconductor wafer by an external force is required. This structure has a structure in which a buffer material is provided between the storage container and the packing box.

Document 1 (Japanese Patent Laid-Open No. 2014-5078) describes the following packaging body, which is provided with a storage box for storing the packaging body, an independent pallet on which the packaging body is mounted, and A foamed material as a cushioning material that at least one of them contacts.

Document 1 also describes that an independent pallet is formed of a foam material having excellent cushioning ability such as polyolefin, polystyrene, and polyurethane as a cushioning material.

Document 2 (Japanese Patent Laid-Open No. 2013-249126) describes a structure in which a substrate storage container for storing a semiconductor wafer is mounted on a pallet, and an elastic buffer is provided on the mounting surface of the pallet. body.

Reference 2 points out that an elastic buffer having a hardness of 20 ° to 120 ° is preferred. Specific examples include elastomers and rubbers.

Document 3 (Japanese Patent Laid-Open No. 2010-132331) describes a packaging body including a plurality of inner foaming buffer materials that are closely adhered to and protected by the omnidirectional surface of a semiconductor storage container, and a semiconductor storage container Corrugated cardboard box, and a plurality of viscoelastic solid buffer materials disposed between the inner foaming buffer material and the inner surface of the corrugated cardboard box.

Document 4 (Japanese Patent Laid-Open No. 2011-016549) describes a structure in which a bottom plate is provided between a semiconductor wafer box and a pallet. The bottom plate is a cushioning material that sandwiches a cylindrical elastic body by two sheets of synthetic resin corrugated cardboard.

Document 4 describes that a cushioning material made of expanded styrene may be used instead of the bottom plate. It also describes a structure in which a cover is provided on the upper surface of the semiconductor wafer box, and a sponge-like polyurethane is provided on the back of the cover to absorb the impact.

Document 5 (Japanese Patent Laid-Open No. 2014-151963) describes a packing body in which an upper buffer body and a lower buffer body are provided so as to sandwich the upper and lower sides of a wafer storage container.

The upper buffer body includes an upper recessed portion for storing an upper portion of the wafer storage container, and a pressing rib provided on an outer periphery of the upper recessed portion and in contact with an upper end surface of the wafer storage container.

A shock absorbing protrusion is provided on the bottom surface of the lower buffer. The impact absorbing protrusion is broken by the impact of the impact when the container containing the wafer storage container is dropped and hits the floor, thereby absorbing impact energy so that the impact is not transmitted to the semiconductor wafer.

In order to keep the semiconductor wafers from contacting each other and not to move inside the container, the storage container includes a holding portion such as a groove or a protrusion inside.

The outer shape of the storage container is not limited to a simple box type. There are structures including a circular arc-shaped portion along the shape of the semiconductor wafer to be stored, or a leg portion for preventing local contact of the bottom surface when the storage container is placed.

Therefore, the location of the storage container where a semiconductor wafer is likely to be deformed or damaged when an impact is applied depends on the internal structure or external shape.

In addition, if a buffer material is provided, the weight or volume of the package body increases, and workability deteriorates. Therefore, it is also necessary to pay attention to the position or size.

However, as described below, the structures described in Documents 1 to 5 do not distinguish between a portion that is highly likely to deform and damage a semiconductor wafer and a portion that is low, and a buffer material is provided. Therefore, there are cases where the semiconductor wafer cannot be protected from external forces or the workability is deteriorated.

The structure described in Documents 1 to 4 is such that the position where the storage box contacts the buffer material is the entire surface of the upper surface or the bottom surface, and does not distinguish between portions that are likely to deform or damage the semiconductor wafer and portions that are low.

The structure described in Document 2 is a structure in which a flat rectangular elastic buffer is provided at a certain interval on the pallet, and does not distinguish between a portion that is highly likely to deform and damage the semiconductor wafer and a portion that is low.

The structure described in Document 3 is a structure in which a cushioning material is closely adhered to the omnidirectional surface of the storage box, and a portion having a high possibility of deformation or damage to the semiconductor wafer is not distinguished from a portion having a low probability. In such a structure, the weight or volume of the storage box increases, and workability deteriorates.

Although the structure described in Document 5 specifies the positional relationship between the upper surface ribs and the storage box, the structure prevents the lid from vibrating so that the lid body and the ribs do not contact each other. This is not a possibility of deforming or damaging the semiconductor wafer. Structure that protects high-sex areas.

Although the structure described in Document 5 specifies the position and shape of the shock absorbing protrusion, it is provided on the outer side that does not contact the storage box, and is not a structure that protects a portion that is highly likely to deform or damage the semiconductor wafer.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a buffer material having a structure that can protect a portion that is highly likely to deform or damage a semiconductor wafer and has excellent work efficiency.

The buffer material of the present invention is a buffer material arranged between the storage container and the packing box when the storage container containing the semiconductor wafer is packed in a packing box, wherein the storage container is characterized in that: It includes: a box-shaped body with an open upper surface, a cover covering the upper surface, and a holding portion, the holding portion being provided on the back side of the cover, and the semiconductor wafer accommodated in the body. An upper peripheral edge abuts to restrict movement of the semiconductor wafer; the buffer material includes an upper buffer material including an upper storage portion that is in contact with an upper surface of the cover, and the upper storage portion includes: An upper facing surface facing away from the surface and an upper side rib protruding from the upper facing surface and contacting the upper surface of the cover, the upper side rib being provided in contact with the upper surface area of the cover The position is directly above an area where at least the holding portion is provided.

According to the present invention, the upper side rib is provided on the upper buffer material so as to press the holding portion. The holding portion is a portion where the semiconductor wafer is in contact with the storage container. When an impact is applied, the semiconductor wafer is likely to be deformed or damaged. Therefore, by providing the upper side ribs so as to press the holding portion, it is possible to preferentially protect a portion that is likely to deform or damage the semiconductor wafer during impact.

In the buffer material of the present invention, it is preferable that a planar shape of the upper side rib is a cross shape.

According to the present invention, even if the installation angle of the buffer material on the plane of the storage container is shifted by 90 °, the upper side rib is located at a position where the holding portion can be pressed, so that the degree of freedom in the position when the buffer material is installed can be improved. , Excellent operation efficiency.

In the buffer material of the present invention, it is preferable that the upper side rib is provided with an upper side hole at an intersection of the cross.

According to the present invention, the storage container can be recognized from the hole even when the buffer material is in contact with the storage container. Therefore, it is possible to easily confirm whether or not the buffer material is reliably held in the storage container. In addition, it is easy to detach the buffer material from the storage container by holding the inner periphery of the hole portion, so the work efficiency is excellent.

In the buffer material of the present invention, preferably, the storage container includes at least a pair of leg portions provided on the bottom surface so as to protrude from the bottom surface, and the buffer material has a lower portion including a lower storage portion that is in contact with the bottom surface. A cushioning material, and the lower storage portion includes a lower facing surface separated from the leg portion and facing the bottom surface of the storage container, and a protruding portion protruding from the lower facing surface and facing the storage portion A lower side rib that the bottom surface of the container contacts.

According to the present invention, in a state where the lower side ribs are in contact with the bottom surface of the storage container, the leg portion is separated from the lower facing surface. Therefore, it is possible to prevent the bottom portion of the storage container from floating from the lower side ribs by preventing the feet from coming into contact with the lower facing surface, and to reliably protect the bottom surface of the storage container.

In the buffer material of the present invention, preferably, the buffer material has a middle buffer material that is in contact with the cover and the bottom surface, and the middle buffer material includes: a plate-shaped middle buffer material body; a middle cover storage portion; The bottom surface of the middle buffer material body has a cover facing surface separated from the upper surface of the cover and facing, and a cover side rib protruding from the cover facing surface and contacting the upper surface of the cover. And a middle bottom surface storage portion provided on the upper surface of the middle cushion material body, having a bottom surface facing away from the leg portion and facing the bottom surface of the storage container, and from the bottom surface, A bottom surface side rib protruding downward from the bottom surface and in contact with the bottom surface of the storage container; and the cover side rib is provided at a position contacting an upper surface area of the cover, the position is located at least The area of the holding portion is directly above.

According to the present invention, the lid-side rib is provided on the middle cushioning material in a manner of pressing the holding portion. The holding portion is a portion where the semiconductor wafer is in contact with the storage container. When an impact is applied, the semiconductor wafer is likely to be deformed or damaged. Therefore, by providing the cover-side ribs so as to press the holding portion, it is possible to preferentially protect a portion that is likely to deform or damage the semiconductor wafer during impact.

In addition, according to the present invention, in a state where the bottom surface side ribs are in contact with the bottom surface of the storage container, the leg portion and the bottom surface are separated face to face. Therefore, it is possible to prevent the feet from coming into contact with the bottom surface to face the bottom surface of the storage container from floating from the bottom surface side ribs, and to reliably protect the bottom surface of the storage container.

Furthermore, according to the present invention, the middle buffer material can be provided on the upper surface or the bottom surface of the storage container, and therefore can also be used as an upper buffer material or a lower buffer material. In addition, the storage container can be stored in multiple layers in the height direction.

In the buffer material of the present invention, it is preferable that the upper storage portion, the lower storage portion, the middle cover storage portion, and the middle bottom storage portion are arranged in a plurality of groups.

According to the present invention, since one set of the upper buffer material, the middle buffer material, and the lower buffer material can be used to protect four or more storage containers, the work efficiency during transportation or packing is excellent.

The buffer material of the present invention preferably contains a foam having a foaming ratio of 20 times to 40 times.

According to the present invention, since the cushioning material is composed of a foam having a foaming magnification of 20 times or more and 40 times or less, both the hardness that can withstand external impact and the flexibility that absorbs the impact can be achieved.

The buffer material of the present invention preferably contains any one of expanded polyurethane, expanded polyethylene, expanded polypropylene, or expanded polystyrene.

According to the present invention, it is easy to form the buffer material into a foam having a foaming magnification of 20 times or more and 40 times or less.

The buffer material of the present invention is a buffer material arranged between the storage container and the packing box when the storage container containing the semiconductor wafer is packed in a packing box, wherein the storage container is characterized in that: It includes: a box-shaped body with an open upper surface; a cover covering the upper surface; a holding portion provided on a back side of the cover and abutting on an upper peripheral edge of the semiconductor wafer accommodated in the main body; Restricting movement of the semiconductor wafer; and at least a pair of leg portions provided at ends of the bottom surface so as to protrude from the bottom surface; the buffer material has a space between the upper surface of the lid and the storage container. The middle cushioning material in contact with the bottom surface, the middle cushioning material includes: a plate-shaped middle cushioning material body; a middle cover accommodating portion disposed on the bottom surface of the middle cushioning material body, and having a space separated from the upper surface of the cover and opposed to And a cover-side rib protruding from the cover-opposing surface and in contact with the upper surface of the cover; and a middle bottom surface storage portion provided on the upper surface of the middle cushion material body and having The foot A bottom surface facing away from the bottom surface facing the bottom surface of the storage container, and a bottom surface side rib protruding from the bottom surface facing the surface and contacting the bottom surface of the storage container; and A cover-side rib is provided at a position in contact with an upper surface area of the cover, and the position is located directly above an area where at least the holding portion is provided.

According to the present invention, the lid-side rib is provided on the middle cushioning material in a manner of pressing the holding portion. The holding portion is a portion where the semiconductor wafer is in contact with the storage container, and the semiconductor wafer is highly likely to be deformed or damaged when an impact is applied. Therefore, it is possible to preferentially protect a portion that is likely to deform or damage the semiconductor wafer during impact.

In addition, according to the present invention, in a state where the bottom surface side ribs are in contact with the bottom surface of the storage container, the leg portion and the bottom surface are separated face to face. Therefore, it is possible to prevent the feet from coming into contact with the bottom surface to face the bottom surface of the storage container from floating from the bottom surface side ribs, and to reliably protect the bottom surface of the storage container.

Furthermore, according to the present invention, the middle buffer material can be provided on the upper surface or the bottom surface of the storage container, and therefore can also be used as an upper buffer material or a lower buffer material. In addition, the storage container can be stored in multiple layers in the height direction.

Hereinafter, embodiments suitable for the present invention will be described in detail based on the drawings.

First, with reference to FIGS. 1-3, the outline structure of the cushioning material of this embodiment is demonstrated briefly.

As shown in FIG. 1 to FIG. 3, the cushioning material 100 includes the upper cushioning material, which is disposed between the storage container 7 and the packaging box when the storage container 7 is packed in a packing box (not shown). 1. Lower buffer material 3 and middle buffer material 5.

In FIG. 1, three upper storage containers 7 are provided between the upper buffer material 1 and the middle buffer material 5, and three lower storage containers 7 are provided between the middle buffer material 5 and the lower buffer material 3.

The buffer material 100 further includes a vibration absorbing material 9 provided on the bottom surface of the lower buffer material 3.

This concludes the description of the schematic configuration of the cushioning material 100 of this embodiment.

Next, the details of the configuration of the storage container 7 and the cushioning material 100 of the present embodiment will be described.

First, the structure of the storage container 7 will be described with reference to FIGS. 2, 4, 5A, and 5B.

The storage container 7 is a container for storing the semiconductor wafer 200 shown in FIG. 2, and is, for example, a Front Opening Shipping Box (FOSB). As shown in FIG. 4, the storage container 7 includes a box-shaped body 81 with an open upper surface, and a cover 83 covering the upper surface.

The body 81 includes a leg portion 87.

The leg portion 87 is at least a pair of feet provided at an end portion of the bottom surface 86 so as to protrude from the bottom surface 86 of the main body 81. Here, one for each of the four corners is provided.

As shown in FIGS. 2 and 4, a comb-shaped wafer storage portion 85 having a storage groove formed in the main body 81 of the storage container 7 is provided to store a plurality of semiconductor wafers 200 with a gap.

The wafer storage portion 85 includes a side storage portion 85A that is in contact with the outer edge side portion of the semiconductor wafer 200, and a bottom storage portion 85B that is in contact with the bottom portion of the outer edge of the semiconductor wafer 200.

Here, one pair of side accommodating portions 85A is provided on the opposite inner peripheral side surface of the main body 81. Two bottom storage portions 85B are provided directly above the bottom surface 86. The two side accommodating portions 85A are arranged parallel to each other in the arrangement direction of the grooves.

The cover 83 is a plate-shaped member having a rectangular planar shape, and has a pair of lock portions 89 and a holding portion 91 as shown in FIGS. 4, 5A, and 5B.

The lock portion 89 is a member that fixes the cover 83 to the main body 81 and, as shown in FIG. 5A, includes a lock rod 89A, a lock rod 89B, and a lock rod 89C.

The lock lever 89A and the lock lever 89B are members provided along the opposite sides of the cover 83, and are movable in the directions of D1 and D2 in FIG. 5A.

The lock lever 89C is a lever protruding from the side of the lock portion 89.

The lock lever 89C is pushed into the lock portion side, so that the lock rod 89A is moved in the direction of D1, and the lock rod 89B is moved in the direction of D2, so as to be squeezed out of the cover 83. The front ends of the extruded lock bars 89A and 89B are engaged with the recessed portions 81A of the main body 81, and the cover 83 is locked to the main body 81 and fixed. In the locked state, return the position of the lock lever 89C to the original position, thereby pulling the lock lever 89A and the lock lever 89B back to the inside of the cover 83 to release the lock.

As shown in FIG. 5B, the holding portion 91 is a vertically long comb-shaped member provided on the back side of the cover 83 and is provided between the lock portions 89. The holding portion 91 limits the movement in the axial direction or the rotation in the diameter direction of the semiconductor wafer 200 by inserting the upper peripheral edge of the semiconductor wafer 200 housed in the main body 81 between the comb teeth and abutting them, and the semiconductor wafer 200 The circles 200 are held without touching each other.

In FIG. 5B, the holding portion 91 is provided in the center portion of the cover 83 in parallel with the arrangement direction (longitudinal direction) of the semiconductor wafer 200 so as to be parallel to one side of the rectangular configuration of the cover 83.

This concludes the description of the structure of the storage container 7.

Next, the structure of the upper buffer material 1 is demonstrated with reference to FIG. 2, FIG. 6A, FIG. 6B, and FIG. 6C.

The upper buffer material 1 is a buffer material provided on the upper surface of the storage container 7 on the upper layer, and is a plate material having a rectangular planar shape. As shown in FIGS. 6A and 6C, the upper buffer material 1 includes an upper storage portion 13A, an upper storage portion 13B, and an upper storage portion 13C that are in contact with the lid 83 of the storage container 7.

The upper storage part 13A, the upper storage part 13B, and the upper storage part 13C are recessed parts of the shape provided in the bottom surface of the upper buffer material 1, and hold | maintained so that it may fit in the upper end of the storage container 7. Here is a concave portion having a rectangular planar shape. The upper storage portion 13A, the upper storage portion 13B, and the upper storage portion 13C include an upper facing surface 14, an upper side rib 15, an upper side rib 17, an upper side hole 19, and a reinforcing rib 21.

The upper facing surface 14 is a surface facing away from the lid 83 of the storage container 7 and is a bottom surface of the upper storage portion 13A, the upper storage portion 13B, and the upper storage portion 13C.

The upper side ribs 15 and the upper side ribs 17 are longitudinal ribs protruding from the upper facing surface 14. At least one of the ribs is in contact with the upper surface of the cover 83 and is provided in a region of the upper surface of the cover 83 in a state of contact. (Here, an area surrounded by a dotted line indicated by a reference numeral 91 in FIG. 5A) a position of contact directly above the area where at least the holding portion 91 is provided.

Here, as shown in FIG. 2, the upper side ribs 17 are provided at positions directly above the region where the holding portion 91 is provided and in contact with the upper surface region of the cover 83. Further, the upper-side rib 17 is provided at a position where the extending direction (longitudinal direction) of the upper side rib 17 coincides with the extending direction of the holding portion 91.

The holding portion 91 is a member that holds the semiconductor wafer 200. Since the semiconductor wafer 200 is highly likely to be deformed or damaged during an impact, the holding portion 91 is pressed by the upper side ribs 17 to preferentially protect the holding portion 91.

The upper side ribs 15 and the upper side ribs 17 are provided so as to be orthogonal to each other, and the upper side ribs 15 and the upper side ribs 17 have a planar shape in a cross shape. With the cross shape, even if the installation angle on the plane of the upper buffer material 1 is shifted by 90 °, any one of the upper side rib 15 and the upper side rib 17 is located at a position where the holding portion 91 can be pressed.

Therefore, the degree of freedom in the position when the upper buffer material 1 is installed can be improved, and the work efficiency is excellent.

The upper-side hole 19 is a through-hole provided in an intersection of the cross of the upper-side rib 15 and the upper-side rib 17.

The upper side hole 19 is used to identify the upper surface of the storage container 7 in a state where the upper buffer material 1 is provided in the storage container 7. The upper side hole 19 is also used instead of a handle when the upper buffer material 1 is removed from the storage container 7. Specifically, the upper buffer material 1 can be easily removed by holding the inner periphery of the upper side hole 19.

The reinforcing rib 21 is an L-shaped rib provided to connect the adjacent side surfaces of the upper storage portion 13A, the upper storage portion 13B, and the upper storage portion 13C. The reinforcement ribs 21 are provided to the upper storage portion 13A, the upper storage portion 13B, and the upper storage portion 13C. Enhance the sides.

The above is the description of the structure of the upper buffer material 1.

Next, the structure of the lower buffer material 3 will be described with reference to FIGS. 2, 3, 7A, 7B, and 7C.

The lower cushioning material 3 is a cushioning material provided on the bottom surface of the storage container 7 in the lower layer, and is a plate material having a rectangular planar shape. The lower buffer material 3 includes a lower storage portion 31A, a lower storage portion 31B, and a lower storage portion 31C that are in contact with the bottom surface of the storage container 7.

The lower storage portion 31A, the lower storage portion 31B, and the lower storage portion 31C are recessed portions of a shape that fits into the lower end of the storage container 7 and is retained. Here is a concave portion having a rectangular planar shape. The lower storage portion 31A, the lower storage portion 31B, and the lower storage portion 31C include a lower facing surface 33, a lower side rib 35, and a lower side hole 37.

The lower facing surface 33 is a surface separated from the leg portion 87 and opposed to the bottom surface 86 of the storage container 7, and is a bottom surface of the lower storage portion 31A, the lower storage portion 31B, and the lower storage portion 31C.

As shown in FIGS. 2 and 3, since the leg portion 87 is provided so as to straddle the lower side rib 35, the lower side rib 35 does not contact the bottom surface of the leg portion 87.

Since the lower facing surface 33 is separated from the leg portion 87, as shown in FIGS. 2 and 3, the height H1 of the lower side rib 35 is in a state in contact with the bottom surface 86 of the storage container 7, and the leg portion 87 faces the lower portion. The height of the surface 33 separation.

Therefore, it is possible to prevent the bottom portion 86 of the storage container 7 from floating from the lower side rib 35 by preventing the leg portion 87 from contacting the lower facing surface 33, and to securely protect the bottom surface 86 of the storage container 7.

The lower side rib 35 is a rib protruding from the lower facing surface 33 and is provided at a position in contact with the bottom surface 86 of the storage container 7 as shown in FIGS. 2 and 3.

The lower side rib 35 is preferably provided at a position facing the bottom storage portion 85B (directly below). The reason is as follows.

In FIGS. 2 and 3, since the bottom storage portion 85B is disposed directly above the bottom surface 86, if an impact is applied to the bottom surface 86, the impact is transmitted to the bottom storage portion 85B, and the semiconductor wafer 200 may be deformed and damaged. Therefore, by providing the lower side rib 35 at a position facing the bottom storage portion 85B, the bottom storage portion 85B can be pressed across the bottom surface 86. Thereby, since the bottom storage part 85B can be protected preferentially, it is preferable.

The lower side hole 37 is a through hole provided in the lower side rib 35 and is used to identify the bottom surface of the storage container 7 in a state where the lower buffer material 3 is provided in the storage container 7. The lower side hole 37 is also used instead of a handle when the lower cushioning material 3 is removed from the storage container 7. Specifically, the lower buffer member 3 can be easily removed by holding the inner periphery of the lower side hole 37.

The above is the description of the structure of the lower buffer material 3.

Next, the structure of the middle buffer material 5 will be described with reference to FIGS. 2, 3, 8A, 8B, 9A, and 9B.

The middle buffer material 5 is a buffer material provided on the bottom surface of the upper storage container 7 and the upper surface of the lower storage container 7, and includes a plate-shaped middle buffer material body 51.

The middle buffer material main body 51 includes a middle cover storage portion 53A, a middle cover storage portion 53B, and a middle cover storage portion 53C on the bottom surface.

The middle lid storage part 53A, the middle lid storage part 53B, and the middle lid storage part 53C are recessed parts which fit into and hold the upper end of the storage container 7. Here is a concave portion having a rectangular planar shape.

The middle lid storage portion 53A, the middle lid storage portion 53B, and the middle lid storage portion 53C include a lid facing surface 54, a lid side rib 55, a lid side rib 57, a lid side hole 59, and a lid side reinforcing rib 61.

The lid facing surface 54 is a surface opposed to the lid 83 of the storage container 7, and is a bottom surface of the middle lid storage portion 53A, the middle lid storage portion 53B, and the middle lid storage portion 53C.

The cover-side rib 55 and the cover-side rib 57 are ribs protruding from the cover-opposing surface 54, and at least one of them is in contact with the upper surface of the cover 83, and is provided at a position in contact with the upper surface area of the cover 83 in the state of contact, The position is directly above an area where at least the holding portion 91 is provided. Here, as shown in FIG. 2, a cover-side rib 57 is provided at a position in contact with the upper surface area of the cover 83 directly above the area where the holding portion 91 is provided. Further, the cover-side rib 57 is provided at a position where the extending direction (longitudinal direction) of the lid-side rib 57 coincides with the extending direction of the holding portion 91.

Therefore, similarly to the upper-side rib 17, by pressing the holding portion 91 by the cover-side rib 57, the holding portion 91 can be protected with priority.

The cover-side rib 55 and the cover-side rib 57 are provided so as to cross each other, and the planar shape becomes a cross shape by the cover-side rib 55 and the cover-side rib 57.

With the cross shape, even if the setting angle on the plane of the middle cushioning material 5 is shifted by 90 °, any one of the lid-side rib 55 and the lid-side rib 57 is located at a position where the holding portion 91 can be pressed.

The cover-side hole 59 is a through hole provided at the intersection of the cross of the cover-side rib 55 and the cover-side rib 57, and is also used in place of a handle when the middle buffer material 5 is removed from the storage container 7.

The cover-side reinforcing rib 61 is an L-shaped rib provided to connect the adjacent side surfaces of the middle cover storage portion 53A, the middle cover storage portion 53B, and the middle cover storage portion 53C, and the center cover storage portion 53A and the middle cover storage portion 53B, the side of the middle lid storage portion 53C is reinforced.

The middle buffer material body 51 has a middle bottom surface storage portion 71A, a middle bottom surface storage portion 71B, and a middle bottom surface storage portion 71C on the upper surface.

The middle bottom surface storage portion 71A, the middle bottom surface storage portion 71B, and the middle bottom surface storage portion 71C are recessed portions of a shape that is fitted into and held by the lower end of the storage container 7. Here, it is a recessed part whose planar shape is rectangular. The middle bottom surface storage portion 71A, the middle bottom surface storage portion 71B, and the middle bottom surface storage portion 71C include a bottom surface facing surface 73 and a bottom surface side rib 75.

The bottom surface facing surface 73 is a surface separated from the leg portion 87 and opposed to the bottom surface 86 of the storage container 7, and is a bottom surface of the middle bottom surface storage portion 71A, the middle bottom surface storage portion 71B, and the middle bottom surface storage portion 71C.

The bottom side ribs 75 are ribs protruding from the middle bottom surface storage portion 71A, the middle bottom surface storage portion 71B, and the middle bottom surface storage portion 71C, and are provided at positions contacting the bottom surface 86 of the storage container 7 as shown in FIGS. 2 and 3.

Since the bottom surface facing surface 73 is separated from the leg portion 87, as shown in FIGS. 2 and 3, the height H2 of the bottom surface side rib 75 is in a state in which the leg portion 87 and the bottom surface are in contact with the bottom surface 86 of the storage container 7. The height at which the facing surface 73 is separated.

Therefore, the bottom portion 86 of the storage container 7 can be prevented from floating from the lower side rib 35 by contacting the bottom portion 87 with the bottom portion 87 and the bottom portion 86 of the storage container 7 can be reliably protected.

The above is the description of the structure of the middle buffer material 5.

Next, a material constituting the buffer material 100 will be described.

The shock absorbing material 100 needs to have hardness that can withstand external impact without being damaged, and flexibility that can absorb the impact without transmitting the impact to the storage container 7. The material satisfying the above-mentioned necessary conditions is preferably a foam having a foaming ratio of 20 times or more and 40 times or less.

Specific examples of the foam include expanded polyurethane, expanded polyethylene, expanded polypropylene, and expanded polystyrene.

The above is a description of the materials constituting the buffer material 100.

Next, the configuration of the vibration absorbing material 9 will be described with reference to FIGS. 2 and 3.

The vibration absorbing material 9 includes a plate member 9A, a plate member 9B, and an elastic body 9C while absorbing the vibration generated when the storage container 7 is packed with the buffer material 100 when the storage container 7 is packed.

The plate materials 9A and 9B are members that are provided facing each other and are in contact with the buffer material and the floor, respectively. The plates 9A and 9B include, for example, a plastic plate.

The elastic body 9C is a member that absorbs vibration by being elastically deformed in response to the vibration, and is provided so as to be sandwiched between the plate materials 9A and 9B. The elastomer 9C includes, for example, polyurethane, synthetic rubber, and polyethylene.

This concludes the description of the structure of the vibration absorbing material 9.

The above is the description of the details of the configuration of the buffer material 100 and the storage container 7 according to this embodiment.

As described above, according to the present embodiment, the cushioning material 100 has the upper cushioning material 1, and the upper cushioning material 1 includes the upper side ribs 17, which are in contact with the cover 83, and are provided in contact with the upper surface area of the cover 83 in a state of contact. At a position directly above an area where at least the holding portion 91 is provided.

Therefore, if the upper buffer material 1 is provided in the storage container 7, the upper side rib 17 can press the holding portion 91, and the holding portion 91 that has a high possibility of deforming or damaging the semiconductor wafer 200 during impact can be preferentially protected.

According to this embodiment, since the planar shapes of the upper side rib 15 and the upper side rib 17 are cross-shaped, even if the installation angle on the plane of the upper buffer material 1 is shifted by 90 ° with respect to the storage container 7, it can be pressed and held. One of the upper side rib 15 and the upper side rib 17 is located at the position of the portion 91.

Therefore, the degree of freedom in the position when the upper buffer material 1 is installed can be improved, and the work efficiency is excellent.

According to this embodiment, since the upper side hole 19 is provided at the intersection of the upper side rib 15 and the upper side rib 17, the upper side hole 19 can be recognized from the upper side hole 19 even when the upper cushioning material 1 is in contact with the storage container 7. Storage container 7.

Therefore, it can be easily confirmed whether the upper buffer material 1 is reliably held in the storage container 7. In addition, when the upper cushioning material 1 is detached from the storage container 7, the upper cushioning material 1 is easily removed from the storage container 7 by holding the inner periphery of the upper side hole 19 instead of a handle, and thus has excellent work efficiency.

According to this embodiment, the cushioning material 100 includes a lower cushioning material 3, and the lower cushioning material 3 includes a lower facing surface 33 separated from the leg portion 87 and opposed to the bottom surface 86 of the storage container 7, and a bottom surface 86 of the storage container 7. The lower side ribs 35 in contact.

Therefore, it is possible to prevent the bottom portion 86 of the storage container 7 from floating from the lower side rib 35 by preventing the leg portion 87 from contacting the lower facing surface 33, and to securely protect the bottom surface 86 of the storage container 7.

According to this embodiment, the cushioning material 100 has a middle cushioning material 5, and the middle cushioning material 5 includes a cover-side rib 57 which is in contact with the cover 83 and is provided at a position in contact with the upper surface area of the cover 83 in a state of contact. The position is directly above an area where at least the holding portion 91 is provided.

Therefore, if the middle buffer material 5 is provided in the storage container 7, the lid-side rib 57 can press the holding portion 91, and can preferentially protect the holding portion 91 that is likely to deform or damage the semiconductor wafer 200 during impact.

The middle cushioning material 5 includes a bottom surface facing surface 73 that is separated from the leg portion 87 and faces the bottom surface 86 of the storage container 7, and a bottom surface side rib 75 that is in contact with the bottom surface 86 of the storage container 7.

Therefore, it is possible to prevent the bottom portion 86 of the storage container 7 from being lifted from the bottom surface side ribs 75 by contacting the bottom portion 87 with the bottom surface facing surface 73, and to reliably protect the bottom surface 86 of the storage container 7.

Furthermore, since the middle buffer material 5 includes both the lid-side rib 55, the lid-side rib 57 and the bottom-surface side rib 75, it can be provided on the upper surface of the storage container 7 or on the bottom surface.

Therefore, the middle buffer material 5 can also be used as the upper buffer material 1 or the lower buffer material 3. The storage container 7 can be stored in multiple layers in the height direction.

According to this embodiment, the cushioning material 100 includes a foam having a foaming ratio of 20 times or more and 40 times or less. Therefore, it is possible to achieve both a hardness capable of withstanding an external impact and a softness capable of absorbing the impact.

According to this embodiment, the buffer material 100 includes any one of expanded polyurethane, expanded polyethylene, expanded polypropylene, or expanded polystyrene.

Therefore, it is easy to form the buffer material 100 into a foam having a foaming ratio of 20 times or more and 40 times or less.

According to this embodiment, in the cushioning material 100, the upper storage portion 13A, the upper storage portion 13B, the upper storage portion 13C, the lower storage portion 31A, the lower storage portion 31B, the lower storage portion 31C, the middle cover storage portion 53A, and the middle cover storage portion 53B, the middle lid storage portion 53C, the middle bottom surface storage portion 71A, the middle bottom surface storage portion 71B, and the middle bottom surface storage portion 71C are arranged in a plurality of groups. There are 3 groups arranged here.

Therefore, one or more sets of the upper buffer material 1, the lower buffer material 3, and the middle buffer material 5 can protect four or more storage containers 7 (here, six), so the work efficiency during transportation or packing is excellent.

As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment. It will be apparent to those skilled in the art that various modifications and improvements can be made within the scope of the idea of the present invention, and these are also included in the scope of the present invention.

100‧‧‧ buffer material

200‧‧‧Semiconductor wafer

1‧‧‧ Upper buffer

3‧‧‧ Lower cushioning material

5‧‧‧ Central buffer material

7‧‧‧Storage Container

9‧‧‧Vibration absorbing material

9A, 9B‧‧‧ Plate

9C‧‧‧Elastomer

13A, 13B, 13C‧‧‧ Upper storage section

14‧‧‧ Opposite the upper part

15, 17‧‧‧ upper side ribs

19‧‧‧ Upper side hole

21‧‧‧ Reinforcement rib

31A, 31B, 31C‧‧‧ Lower storage section

33‧‧‧ Opposite the lower part

35‧‧‧Lower side rib

37‧‧‧Lower side hole

51‧‧‧Central buffer material body

53A, 53B, 53C‧‧‧Middle lid storage section

54‧‧‧ opposite

55, 57‧‧‧ cover side ribs

59‧‧‧ cover side hole

61‧‧‧Cap side reinforcement ribs

71A, 71B, 71C ‧‧‧ Central bottom storage section

73‧‧‧ bottom to face

75‧‧‧ bottom ribs

81‧‧‧ Ontology

81A‧‧‧Concave

83‧‧‧ cover

85‧‧‧ Wafer storage

85A‧‧‧Side Storage

85B‧‧‧ bottom storage

86‧‧‧ underside

87‧‧‧foot

89‧‧‧Lock

89A, 89B‧‧‧Locking stick

89C‧‧‧Locking lever

91‧‧‧holding department

D1, D2‧‧‧ direction

H1, H2‧‧‧ height

FIG. 1 is a perspective view showing a state where a buffer body is set in a storage container.

FIG. 2 is a cross-sectional view taken along A1-A1 of FIG. 1.

FIG. 3 is a part of the A2-A2 sectional view of FIG. 1, and the storage container is shown in a side view.

FIG. 4 is a perspective view of a storage container.

5A is a plan view of a storage container.

Fig. 5B is a rear view of the cover.

FIG. 6A is a perspective view of the upper buffer body as viewed from the bottom surface side. FIG.

FIG. 6B is a bottom view of the upper buffer body.

FIG. 6C is a view showing an upper buffer body, and is a cross-sectional view taken along A3-A3 of FIG. 6B.

FIG. 7A is a perspective view of a lower buffer body. FIG.

FIG. 7B is a plan view of the lower buffer body.

FIG. 7C is a view showing a lower buffer, and is a cross-sectional view taken along A4-A4 of FIG. 7B.

FIG. 8A is a perspective view of a middle buffer body. FIG.

FIG. 8B is a bottom view of the middle buffer body.

FIG. 9A is a plan view of a middle buffer body. FIG.

FIG. 9B is a view showing a middle buffer, and is a cross-sectional view taken along A5-A5 of FIG. 9A.

Claims (8)

A buffer material is arranged between the storage container and the packing box when a storage container containing semiconductor wafers is packed in a packing box, and the buffer material is characterized in that: the storage container It includes: a box-shaped body with an open upper surface; a cover covering the upper surface; and a holding portion provided on a back side of the cover and abutting an upper peripheral edge of the semiconductor wafer accommodated in the body. To limit the movement of the semiconductor wafer; the buffer material has an upper buffer material including an upper storage portion in contact with the upper surface of the cover; the upper storage portion includes: An upper facing surface facing upward, and an upper side rib protruding from the upper facing surface and contacting the upper surface of the cover; the upper side rib is provided at a position in contact with the upper surface area of the cover, The position is directly above an area where at least the holding portion is provided; and a planar shape of the upper side rib is a cross shape. The cushioning material according to item 1 of the scope of patent application, wherein the upper side rib is provided with an upper side hole at the intersection of the cross. The cushioning material according to item 1 of the scope of patent application, wherein the storage container includes at least a pair of feet provided on the bottom surface in a manner protruding from the bottom surface, and the cushioning material includes a material including contact with the bottom surface. Lower part of lower storage section Punching material, and the lower storage portion includes a lower facing surface separated from the leg portion and facing the bottom surface of the storage container, and a lower facing surface protruding from the lower facing surface and facing the storage A lower side rib that the bottom surface of the container contacts. The buffer material according to item 3 of the patent application scope, wherein the buffer material has a middle buffer material in contact with the cover and the bottom surface; the middle buffer material includes: a plate-shaped middle buffer material body; a middle cover The accommodating portion includes a cover facing surface which is provided on the bottom surface of the middle buffer material body and is separated from the upper surface of the cover, and which faces the cover, and an upper surface which protrudes from the cover facing surface and is opposite to the cover. A lid side rib in contact; and a middle bottom storage portion having a bottom surface provided on an upper surface of the middle cushion material body and separated from the leg portion to face the bottom surface of the storage container A bottom surface side rib protruding from the bottom surface to the surface and contacting the bottom surface of the storage container; and the cover side rib is provided at a position in contact with an upper surface area of the lid, the The position is directly above an area where at least the holding portion is provided. The buffer material according to item 4 of the scope of patent application, wherein the upper storage portion, the lower storage portion, the middle cover storage portion, and the middle bottom storage portion are arranged in a plurality of groups. The cushioning material according to any one of claims 1 to 5 of the scope of patent application, which comprises a foam having a foaming magnification of 20 times or more and 40 times or less. Buffering as described in any of claims 1 to 5 Material including any one of expanded polyurethane, expanded polyethylene, expanded polypropylene, or expanded polystyrene. A buffer material is arranged between the storage container and the packing box when a storage container containing semiconductor wafers is packed in a packing box, and the buffer material is characterized in that: the storage container It includes: a box-shaped body with an open upper surface; a cover covering the upper surface; a holding portion provided on a back side of the cover and abutting on an upper peripheral edge of the semiconductor wafer accommodated in the main body; Restricting movement of the semiconductor wafer; and at least a pair of leg portions provided at ends of the bottom surface so as to protrude from the bottom surface; the buffer material has a space between the upper surface of the lid and the storage container. The middle buffer material in contact with the bottom surface; the middle buffer material includes: a plate-shaped middle buffer material body; a middle cover accommodating portion having: a bottom surface of the middle buffer material body provided on the bottom surface of the middle buffer material and separated from the upper surface of the cover; An opposite cover facing surface, and a cover-side rib protruding from the cover facing surface and in contact with the upper surface of the cover; a middle bottom surface storage portion is provided on the upper surface of the middle buffer material body and With the feet A bottom surface facing away from the bottom surface facing the bottom surface of the storage container, and a bottom surface side rib protruding from the bottom surface facing the surface and contacting the bottom surface of the storage container; and A cover side rib is provided at a position in contact with an upper surface area of the cover, and the cover The position is directly above an area where at least the holding portion is provided.