JP6068096B2 - Package of wafer cassette - Google Patents

Description

  The present invention relates to a package of a wafer cassette for storing various wafers represented by semiconductor wafers.

  Conventionally, when shipping semiconductor wafers subjected to predetermined processing and processing, although not shown, a plurality of semiconductor wafers are stored in a dedicated storage container, and the storage container is heat-sealed with a laminate bag, The heat-sealed storage container is packed in a cardboard box via a plurality of secondary cushioning materials, and then shipped and transported (see Patent Document 1).

  The storage container used for shipping includes a substantially rectangular tube-shaped cassette for aligning and storing a plurality of semiconductor wafers in an upright state, a lower box for a top open box for detachably storing the lower half of the cassette, An upper box that is detachably fitted to the upper opening of the lower box to cover and protect the remaining upper half of the cassette, and a presser that is detachably attached to the inner ceiling of the upper box and presses and holds the upper peripheral edge of the semiconductor wafer. It is configured to include a member and a frame-shaped gasket that is interposed in a fitting portion between the lower box and the upper box and exhibits a sealing function.

  By the way, the storage container is generally composed of five parts: a cassette, a lower box, an upper box, a pressing member, and a gasket. However, if the number of parts is large, the cost can be reduced. Therefore, there will be problems in research and development and capital investment. In view of this point, a method has been proposed in which at least two parts of the five parts constituting the storage container are integrated, the number of parts is reduced, and the cost is suppressed. According to this method, for example, by integrally forming the pressing member on the inner ceiling of the upper box, it is possible to provide the upper box with the covering protection function and the pressing function of the pressing member.

JP 2002-160769 A

However, according to such a technique, two parts constituting the storage container can be integrated to reduce the number of parts. However, when two or more parts are formed integrally, the function of the storage container, that is, the semiconductor wafer is stored. The function to do will be impaired. Therefore, it is very difficult to reduce the number of parts beyond this.
However, if the number of parts in the storage container can be reduced more than now, it will be possible to significantly reduce costs and promote R & D and capital investment, etc., and contribute to the protection of the global environment through the reduction of industrial waste. it can.

  The present invention has been made in view of the above, and it is an object of the present invention to provide a wafer cassette package that can contribute to cost reduction, cost reduction, promotion of research and development, capital investment, etc., and protection of the global environment. It is said.

In the present invention, in order to solve the above-described problem, the wafer cassette is provided with a wafer cassette, and the first and second buffer bodies that hold the wafer cassette sandwiched from above and below,
The wafer cassette includes a cassette that can be aligned and stored in a state where a plurality of wafers are erected, and a lid that is detachably fitted to the opened upper portion of the cassette. The upper part of each side wall of the lid is bent outwardly to form a flange, a positioning projection is formed on the flange, the lid is formed in a substantially dish shape, and at least both sides of the circumferential wall of the lid are cassettes. It is possible to interfere with the flange of the lid, and a groove is defined between the center of the inner surface of the lid and the peripheral wall, and a hollow dome portion that covers the positioning convex portion of the cassette is formed in the groove,
The first buffer includes a counter plate facing the second buffer and an outer wall bent downward from the peripheral edge of the counter plate, and the counter plate has a storage recess for partially storing the wafer cassette. And forming the accommodating recess with a wide portion for accommodating and mounting a part of the wafer cassette, a step portion formed below the wide portion, and a buffer portion formed at the step portion and projecting downward Formed from
The second buffer includes a counter plate facing the counter plate of the first buffer and an outer wall bent upward from the peripheral edge of the counter plate, and partially accommodates the wafer cassette in the counter plate. An accommodating recess is formed, and the accommodating recess is configured to accommodate a remaining portion other than a part of the wafer cassette, a stepped portion formed above the widened portion and contacting the lid of the wafer cassette, and the stepped portion. It is formed from the buffer part which protrudes upwards, and the avoidance part which avoids interference facing the dome part of a cover body is formed in the level | step-difference part, It is characterized by the above-mentioned.

Note that an avoidance portion that avoids interference can be formed on either the wide portion or the step portion of the second buffer body so as to face the dome portion of the lid.

In addition, a holding portion that holds the upper peripheral edge of the wafer can be formed inside the lid.
In addition, a locking recess is formed in one of the counter plate of the first buffer and the counter plate of the second buffer, and a locking protrusion that is fitted into the locking recess is formed on the other. Is also possible.

  Here, the wafers in the claims include at least a semiconductor wafer such as a silicon wafer, a compound wafer, a sapphire wafer, a carbon wafer, a glass wafer, a solar wafer, a mask glass, a liquid crystal substrate, and the like. In particular, wafers for discrete devices such as transistors and diodes are preferably used. The wafer cassette and the first and second buffer bodies may be transparent, opaque, or translucent. The wafer cassette can be packaged in various packaging bags.

  A positioning recess that covers the dome portion of the lid can be formed on the flange of the cassette. If necessary, either the wide part or the step part of the second buffer body can be brought into contact with the peripheral edge of the surface of the lid. The first and second buffer bodies preferably have a plurality of wafer cassettes arranged side by side (for example, 1 × 2, 3 × 3, etc.). The first and second buffer bodies can be stored in various storage boxes or shipped and transported in a state of being mounted in a container. Furthermore, the locking recess can be formed in a hole, a groove, or the like.

  According to the present invention, a part of the wafer cassette is housed in the housing recess of the first buffer body, the second buffer body is covered with the first buffer body, and the wafer cassette is not housed in the first buffer body. If the receiving recess of the second buffer is inserted into the remaining portion, the wafer cassette can be sandwiched between the first and second buffers.

  At this time, since the stepped portion of the second buffer body contacts the lid of the wafer cassette, the lid strongly contacts the flange of the cassette. As described above, the first and second shock absorbers also have a function of protecting the lower and upper boxes of the conventional storage container in addition to the buffer function, so at least omit the lower and upper boxes of the storage container. Can do.

According to the present invention, there is an effect that the number of parts can be reduced to contribute to cost reduction, promotion of research and development and capital investment, and protection of the global environment. In addition, since the step portion of the second buffer contacts the lid of the wafer cassette, it effectively prevents the lid from coming into contact with the flange of the cassette and causing the contamination of the wafer by removing the lid from the cassette. can do. Moreover, since it can prevent that the dome part of a cover body and the avoidance part of a 2nd buffer body interfere, it may interfere with the operation | work which overlaps and integrates a 1st and 2nd buffer body. Less, the first and second buffer bodies can be stacked and firmly integrated.

According to the second aspect of the present invention , since the holding portion is integrated with the lid, the lid is provided with a function of covering and protecting the wafer and a function of pressing the wafer to prevent rattling. It becomes possible to reduce the number of parts. Further, the wafer can be safely transported and transported without using a conventional robust storage container.
According to the third aspect of the present invention , it is possible to prevent the wafer and the wafer cassette from being damaged and the wafer from being contaminated by removing the first and second buffer bodies holding the wafer cassette. become.

It is explanatory drawing which shows typically embodiment of the packaging body of the wafer cassette which concerns on this invention. It is a perspective explanatory view showing typically the cassette of a wafer cassette in an embodiment of a packing object of a wafer cassette concerning the present invention. It is explanatory drawing which shows typically the cover body in embodiment of the packaging body of the wafer cassette which concerns on this invention. It is explanatory drawing which shows typically the inner surface of the cover body in embodiment of the packaging body of the wafer cassette which concerns on this invention. It is explanatory drawing which shows typically the packaging state of the wafer cassette in embodiment of the packaging body of the wafer cassette which concerns on this invention. It is explanatory drawing which shows typically the clamping state of the 1st, 2nd buffer in the embodiment of the packaging body of the wafer cassette which concerns on this invention. It is a plane explanatory view showing typically the 1st buffer in the embodiment of the packing object of the wafer cassette concerning the present invention. It is a plane explanatory view showing typically the 2nd buffer in the embodiment of the packing object of the wafer cassette concerning the present invention.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A wafer cassette packaging body according to the present embodiment is a wafer in which a plurality of semiconductor wafers W are stored side by side as shown in FIGS. A cassette 1 and first and second buffer bodies 30 and 40 for holding a plurality of wafer cassettes 1 sandwiched from above and below are provided. The plurality of wafer cassettes 1 and the first and second buffer bodies 30 and 40 are provided. 40 together are stored in a shipping storage box.

  As shown in FIGS. 1, 2, 5, and 6, each wafer cassette 1 includes a cassette 2 in which a plurality of (for example, 25) semiconductor wafers W can be aligned and stored in an upright state, and the cassette 2. And a lid 12 that is detachably fitted to the opened upper portion 6. After the lid 12 is fitted to the upper portion 6 of the cassette 2, it is packaged in a protective packaging bag 20. Each semiconductor wafer W is made of, for example, a small silicon wafer of 4 to 6 inches that is relatively difficult to damage and is suitable for studying a simple packaging form.

  As shown in the figure, the cassette 2 is injection-molded with a molding material containing, for example, polypropylene or polycarbonate. The cassette 2 includes a front wall 3 having a substantially H-shape that is positioned by a dedicated positioning device (not shown), a rear wall 4 that faces the front wall 3 with a storage space for a plurality of semiconductor wafers W, Each of the front wall 3 and the rear wall 4 is provided with a pair of side walls 5 arranged opposite to each other and opposed to each other. The semiconductor wafer W is taken in and out.

  The upper part 6 of the cassette 2 is opened in a substantially rectangular plane wider than the lower part from the viewpoint of smoothing out the semiconductor wafer W. On the other hand, the opened lower portion of the cassette 2 exposes the center of the lower peripheral edge of the semiconductor wafer W to the outside downward, and the center of the lower peripheral edge of the semiconductor wafer W is pushed up by a dedicated device, so that the semiconductor wafer W is It is taken out from the cassette 2.

  Of the front wall 3, the rear wall 4, and the pair of side walls 5 that form the peripheral wall 7 of the cassette 2, the upper portions of the pair of side walls 5 are bent horizontally outward to form flanges 8. A plurality of hemispherical positioning projections 9 are formed on the surface of the flange 8 of one side wall 5, and a plurality of positioning recesses 10 are formed in a hemispherical shape on the surface of the flange 8 of the other side wall 5.

  The plurality of positioning projections 9 are formed, for example, at both ends of the surface of the flange 8, and are formed to protrude from one end, the other end, the center, and the like as necessary. The plurality of positioning recesses 10 are formed, for example, at both ends of the surface of another flange 8, but are selectively formed as recesses at one end, the other end, the center, and the like. The plurality of positioning protrusions 9 and the positioning recesses 10 are, for example, fitted when the cassette 2 containing the semiconductor wafer W and the open upper portion 6 of the empty cassette are abutted to each other, and exhibit a positioning function. The operation of transferring the wafer W to an empty cassette is facilitated.

  Each of the pair of side walls 5 is formed in a deformed substantially J-shaped cross section, and the central portion extends linearly from the upper portion, and the lower portion from the central portion is curved so as to follow the peripheral edge portion of the semiconductor wafer W. The lowermost part is linearly extended downward from the lower part. From the upper part to the lower part of the inner surfaces of the pair of side walls 5, the alignment grooves 11 for vertically fitting and supporting the peripheral side portions of the semiconductor wafer W are respectively formed to be recessed, and the pair of alignment grooves 11 are predetermined in the front-rear direction of the cassette 2. Are arranged at intervals of

  For example, from the viewpoint of positioning of the semiconductor wafer W and prevention of rattling, each alignment groove 11 is formed in a substantially V-shaped cross section sandwiching the peripheral side portion of the semiconductor wafer W, and the central portion is linearly extended from the top. From the center portion to the lower portion of the alignment groove 11, a curve is formed along the peripheral edge portion of the semiconductor wafer W to regulate the position of the semiconductor wafer W.

The lid 12 is formed by press forming, vacuum forming, pressure forming, or the like of a sheet material such as polyolefin or polystyrene. As the material of the lid 12, a biodegradable material such as polylactic acid can be selected in addition to polyolefin and polystyrene. If this biodegradable material is selected, it can be expected to reduce the environmental burden.
As shown in FIGS. 1, 3, 4, etc., the lid body 12 is formed in a substantially rectangular plane having substantially the same size as the opened upper portion 6 of the cassette 2. The peripheral wall 13 that surrounds the upper portion 6 from the outside is integrally formed to form a substantially dish-shaped cross section.

  The center of the inner surface of the lid body 12 is recessed in a planar rectangle in the thickness direction, and a frame-shaped groove 14 is defined between the center of the inner surface of the lid body 12 and the peripheral wall 13. A hollow dome portion 15 that covers the plurality of positioning projections 9 of the cassette 2 or faces the plurality of positioning recesses 10 via gaps is bulged and formed on the portion or the like. The frame-shaped groove 14 is adjusted so that its dimension is substantially equal to the width dimension of the flange 8 of the cassette 2, and is detachably fitted and locked to the flange 8 of the cassette 2.

  At the center of the inner surface of the lid 12, an elongated planar substantially rectangular holding portion 16 that fits and holds the upper peripheral edge of the plurality of semiconductor wafers W with the holding grooves 17 is integrally formed. The holding portion 16 is formed by arranging a plurality of holding grooves 17 at a predetermined interval in the front-rear direction of the lid 12, and each holding groove 17 has a substantially V-shaped cross section sandwiching the upper peripheral edge of the semiconductor wafer W from the front-rear direction. It is formed.

  The holding portion 16 is formed by arranging a pair of opposing ribs in parallel in the front-rear direction of the lid body 12 at a predetermined interval, and the opposing surfaces of the pair of ribs are formed on inclined surfaces, respectively. The upper peripheral edge of the semiconductor wafer W may be sandwiched from the front-rear direction on the inclined surface of the rib.

As schematically shown in FIG. 5, the packaging bag 20 is formed in a two-layer structure including a bag for directly packaging the wafer cassette 1 and an opaque aluminate bag 21 for sealing and packaging the bag from the outside. Is done. The opening of the bag and the aluminate bag 21 is sealed by, for example, a heating method or an ultrasonic method. The bag is made of a resin material such as polyethylene or polyethylene terephthalate. The aluminate bag 21 is colored, for example, silver to improve the design and barrier properties.
Although the packaging bag 20 is shown in a rectangular shape in FIG. 5 for convenience of explanation, it is actually indefinite and is in close contact with the wafer cassette 1.

  The first and second buffer bodies 30 and 40 are molded translucently from a resin material such as polyolefin, polystyrene, polyurethane, or the like, or a material obtained by foaming them, and exhibits excellent buffering capacity. The first and second buffer bodies 30 and 40 can also be made of a biodegradable material such as polylactic acid that can reduce the environmental load, like the lid body 12.

  As shown in FIGS. 1, 6, and 7, the first buffer 30 includes a substantially rectangular counter plate 31 that faces the second buffer 40 from below, and front, rear, left, and right peripheral edges of the counter plate 31. Is formed in a substantially U-shaped cross section having an outer wall 37 that protrudes from the portion and bends vertically downward, and fits and accommodates the lower halves of the plurality of wafer cassettes 1 and acts on the semiconductor wafer W and the wafer cassette 1 from the outside. It functions to alleviate vibration and shock.

  The counter plate 31 has a plurality of receiving recesses 32 for partially storing the wafer cassette 1 arranged in a matrix (for example, 2 × 2) in the majority of the counter plate 31 except for the peripheral edge, and a plurality of engagement recesses 32 are arranged in the circumferential direction of the peripheral edge. The stop holes 33 are formed to be recessed at intervals, and each locking hole 33 is formed in a hollow truncated cone shape and is detachably locked to the second buffer body 40.

  Each housing recess 32 includes, for example, a substantially truncated pyramid wide portion 34 for fitting and housing the lower half of the wafer cassette 1, a step portion 35 integrally formed below the wide portion 34, and the step portion 35. And a hollow portion provided with a substantially rectangular buffer portion 36 that protrudes downward. The wide part 34 is formed so that the width gradually becomes narrower from the upper side to the lower side. In addition, the stepped portion 35 and the buffer portion 36 are formed such that the stepped portion 35 is narrower than the wide portion 34 and the buffered portion 36 is narrower than the stepped portion 35. The step portion 35 is formed in a substantially planar frame shape and reinforces the housing recess 32.

  The outer wall 37 is formed in a substantially plane frame shape that surrounds the plurality of receiving recesses 32, and when the first buffer 30 is stored in the lower portion of the storage box (not shown), the outer wall 37 comes into surface contact with the inner surface of the peripheral wall of the storage box, The posture of the first buffer 30 is stabilized.

  As shown in FIGS. 1, 6, and 8, the second buffer 40 includes a substantially rectangular opposing plate 41 facing the opposing plate 31 of the first buffer 30 from above, and the opposing plate 41. It is formed in a substantially U-shaped cross section having an outer wall 48 that protrudes from the front, rear, left and right peripheral portions and bends vertically upward. The upper half of the plurality of wafer cassettes 1 is fitted and accommodated. Relieve vibrations and shocks from outside.

  The counter plate 41 has a plurality of receiving recesses 42 for partially storing the wafer cassette 1 in a matrix (for example, 2 × 2) in a majority of the counter plate 41 except for the peripheral edge portion, and a plurality of locking portions in the peripheral edge circumferential direction. The protrusions 43 are formed to protrude at intervals. Each of the locking protrusions 43 is formed in a tapered truncated cone shape, and is detachably fitted and locked in the locking hole 33 of the first buffer body 30, so that the first and second buffer bodies 30 and 40 are engaged. Prevent separation.

  Each accommodating recess 42 is integrally formed above the wide portion 44, for example, with a substantially truncated pyramid wide portion 44 that fits and accommodates the upper half of the wafer cassette 1 protruding from the opposing plate 31 of the first buffer 30. And a stepped portion 45 that is integrally formed with the stepped portion 45 and protrudes upward and has a substantially rectangular flat buffer portion 46 that is formed in a hollow shape. The wide portion 44 is formed so that the width is gradually narrowed from the bottom to the top. Further, the step 45 and the buffer 46 are formed such that the step 45 is narrower than the wide 44 and the buffer 46 is narrower than the step 45.

The step portion 45 is formed in a substantially flat frame shape, and functions to press the lid 12 against the flange 8 of the cassette 2 by contacting the peripheral edge of the surface of the lid 12. At the four corners in the vicinity of the boundary between the stepped portion 45 and the wide portion 44, a substantially hemispherical avoiding portion 47 that bulges away from the plurality of dome portions 15 of the lid 12 and avoids pressure contact deformation is formed. The
The outer wall 48 is formed in a substantially planar frame shape surrounding the plurality of receiving recesses 42. When the second buffer body 40 is stored in the upper part of the storage box, the outer wall 48 comes into surface contact with the inner surface of the peripheral wall of the storage box. The posture of the shock absorber 40 is stabilized.

The storage box is not particularly limited, and a type similar to a known cardboard box is used. There are various types of storage boxes such as paper, plastic, grooving, and telescope types, but the storage box is not limited as long as it is a type suitable for packing a plurality of wafer cassettes 1.
However, from the viewpoint of durability and low contamination, it is preferable to use a plastic hollow structure plate (plastic stage). Further, when the first and second buffer bodies 30 and 40 are transported and transported, a plastic container can be used instead of a storage box made of a cardboard box or the like.

  In the above configuration, when a plurality of wafer cassettes 1 are packed in a storage box, shipped and transported, the plurality of wafer cassettes 1 are first packaged and sealed (see FIG. 5) with a packaging bag 20, respectively. The lower half of each wafer cassette 1 is accommodated in the accommodating recess 32 of the first buffer 30 (see FIG. 1).

  When the wafer cassettes 1 are sequentially received in the plurality of receiving recesses 32 of the first buffer 30, the second buffer 40 is placed on the first buffer 30 from above, and the remaining upper half of each packaged wafer cassette 1. The receiving recess 42 of the second buffer body 40 is fitted to the second buffer body 40, and the locking protrusions 43 of the second buffer body 40 are fitted and locked in the plurality of locking holes 33 of the first buffer body 30 (FIG. 6). If it is possible to prevent backlash during transportation, the wafer cassettes 1 can be packaged with the plurality of wafer cassettes 1 sandwiched between the first and second buffer bodies 30 and 40.

  At this time, since the stepped portion 45 of the second buffer 40 contacts the lid 12 of the wafer cassette 1, the lid 12 comes into pressure contact with the flange 8 of the cassette 2, and the lid 12 is detached from the upper portion 6 of the cassette 2. Thus, it is possible to effectively prevent the semiconductor wafer W from being contaminated. Further, since the avoidance portion 47 of the second buffer body 40 faces the dome portion 15 of the lid body 12 to avoid interference, the second buffer body is caused by improper pressure contact between the dome portion 15 and the avoidance portion 47. The first and second shock absorbers 30 and 40 can be firmly assembled without deforming the stepped portion 45 of the 40 or hindering the holding of the first and second shock absorbers 30 and 40. .

  Next, the first and second buffer bodies 30 and 40 are arranged in the storage box, the first buffer body 30 is positioned below, the plurality of flaps opened in the storage box are closed, and then the peripheral wall of the storage box If the adhesive tape is adhered to a plurality of closed flaps, the plurality of wafer cassettes 1 can be packed in a storage box, safely shipped and transported. When the first and second shock absorbers 30 and 40 are disposed in the storage box, a buffer material such as a cardboard board may be incorporated in the storage box to improve the buffer capacity.

  According to the above configuration, since the holding portion 16 is integrally formed with the lid body 12 and the conventional lower box, upper box, and gasket are omitted, the number of parts can be reduced more than ever. Therefore, it is possible to greatly reduce costs and promote research and development, capital investment, etc., and contribute to the protection of the global environment through reduction of industrial waste. Moreover, the amount of transportable transport at a time can be increased by reducing the packing volume and mass. Further, since the peripheral surfaces of the locking hole 33 and the locking projection 43 are inclined and the peripheral surface of the locking hole 33 exhibits a guiding function, the locking projection 43 is appropriately inserted into the locking hole 33. The first and second shock absorbers 30 and 40 can be assembled without gaps by tightly fitting them.

  In the above embodiment, the upper part of the pair of side walls 5 of the front wall 3, the rear wall 4, and the pair of side walls 5 of the cassette 2 is formed on the flange 8. The flange 8 may be bent. Moreover, the positioning convex part 9 may be formed in the one end part of each flange 8 surface, and the positioning recessed part 10 may be dented in the other end part.

  Further, each positioning projection 9 may be formed in a pin shape. Further, a flat frame-shaped locking groove is formed in the opposing plate 31 of the first buffer body 30 by cutting out, and a flat frame-shaped locking protrusion that fits closely into the locking groove in the second buffer body 40. 43 can also be formed. Moreover, although the some locking hole 33 was arrange | positioned in the opposing board 31 of the 1st shock absorbing body 30, the some locking protrusion 43 was arrange | positioned instead and several locking holes 43 were attached to the 2nd shock absorbing body 40. Holes 33 can also be provided. Furthermore, a substantially hemispherical avoiding portion 47 that avoids pressure contact deformation may be formed at the four corners near the boundary between the wide portion 44 and the stepped portion 45 so as to face the plurality of dome portions 15 of the lid 12. it can.

  The package of the wafer cassette according to the present invention is used in the field of manufacturing electric, electronic, semiconductor, liquid crystal devices and the like.

DESCRIPTION OF SYMBOLS 1 Wafer cassette 2 Cassette 5 Side wall 6 Upper part 7 Peripheral wall 8 Flange 9 Positioning convex part 10 Positioning concave part 11 Alignment groove 12 Cover body 13 Perimeter wall 14 Frame-shaped groove (groove)
15 Dome part 16 Holding part 17 Holding groove 20 Packaging bag 30 First buffer 31 Countering plate 32 Housing recess 33 Locking hole (Locking recess)
34 Wide portion 35 Stepped portion 36 Buffer portion 37 Outer wall 40 Second buffer body 41 Opposing plate 42 Housing recess 43 Locking projection 44 Wide portion 45 Stepped portion 46 Buffer portion 48 Outer wall W Semiconductor wafer (wafer)

Claims (3)

A wafer cassette package comprising a wafer cassette for storing wafers, and first and second buffer bodies for holding the wafer cassette sandwiched from above and below,
The wafer cassette includes a cassette that can be aligned and stored in a state in which a plurality of wafers are erected, and a lid that is detachably fitted to the opened upper portion of the cassette, and at least a pair of opposing peripheral walls of the cassette. The upper part of each side wall of the lid is bent outwardly to form a flange, a positioning projection is formed on the flange, the lid is formed in a substantially dish shape, and at least both sides of the circumferential wall of the lid are cassettes. It is possible to interfere with the flange of the lid, and a groove is defined between the center of the inner surface of the lid and the peripheral wall, and a hollow dome portion that covers the positioning convex portion of the cassette is formed in the groove,
The first buffer includes a counter plate facing the second buffer and an outer wall bent downward from the peripheral edge of the counter plate, and the counter plate has a storage recess for partially storing the wafer cassette. And forming the accommodating recess with a wide portion for accommodating and mounting a part of the wafer cassette, a step portion formed below the wide portion, and a buffer portion formed at the step portion and projecting downward Formed from
The second buffer includes a counter plate facing the counter plate of the first buffer and an outer wall bent upward from the peripheral edge of the counter plate, and partially accommodates the wafer cassette in the counter plate. An accommodating recess is formed, and the accommodating recess is configured to accommodate a remaining portion other than a part of the wafer cassette, a stepped portion formed above the widened portion and contacting the lid of the wafer cassette, and the stepped portion. And a buffer part protruding upward, and an avoiding part for avoiding interference facing the dome part of the lid is formed on the step part . The package of a wafer cassette according to claim 1, wherein a holding portion for holding the upper peripheral edge of the wafer is formed inside the lid. The locking recess is formed in one of the first buffer body facing plate facing plate and the second buffer body of the other, according to claim 1 formed with the locking projection to be fitted into the locking recess Or the package of the wafer cassette of 2 .

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