JP2004168324A

JP2004168324A - Wafer container cushioning material

Info

Publication number: JP2004168324A
Application number: JP2002332851A
Authority: JP
Inventors: Kazuyoshi Watanabe; 数義渡辺; Noriko Ikeda; 紀子池田
Original assignee: Kanegafuchi Chemical Industry Co Ltd
Current assignee: Kanegafuchi Chemical Industry Co Ltd
Priority date: 2002-11-15
Filing date: 2002-11-15
Publication date: 2004-06-17
Anticipated expiration: 2022-11-15
Also published as: JP4193472B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide wafer container cushioning materials, which can be arranged vertically in a compact manner while retaining a sufficient cushioning function. <P>SOLUTION: When a wafer container 4 containing a plurality of semiconductor wafers is housed in an outer packaging box 5, a pair of the expanded resin cushioning materials 1, 2 are placed on the top and bottom of the wafer container 4, respectively, so that each cushioning material is arranged between the wafer container 4 and the outer packaging box 5. The cushioning material 1 has a base 21 and the cushioning material 2 has a base 41, and a cushioning projection 29 of a closed circular shape is formed on the bases 21, 41, where the cushioning projections 29 come in contact with the bottom and the ceiling of the outer packaging box 5 are protrusively formed at the interior thereof, respectively. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、シリコンウェーハ等の半導体ウェーハが複数枚収納されたプラスチック製のウェーハ容器を搬送する時に、輸送中の衝撃や振動から起こるウェーハの破損を防止するため、ダンボールケース等の外装箱内で、該容器の上下に配置する１組の発泡樹脂製緩衝体に関し、特に、容器の上下に配置された１組の発泡樹脂製緩衝体の外装箱内で外装箱の上下に当接する緩衝突起の形状に関するものである。
【０００２】
【従来の技術】
従来から、複数枚の半導体ウェーハを収納したプラスチック製のウェーハ容器を搬送する方法として、ダンボールケース等の箱体が外装箱に使用され、該外装箱内で容器の上下に１組の樹脂製あるいは発泡樹脂製の緩衝材を挿入して、搬送中の衝撃や振動を緩和させ、容器内に収納されている高価な半導体ウェーハの割れや損傷を防ぐ搬送方法が良く知られている。
【０００３】
前記プラスチック製のウェーハ容器で現行使用されている代表例は、直径が６インチ（約１５０ｍｍ）、８インチ（約２００ｍｍ）のシリコンウェーハ用のポリプロピレン製などのウェーハ容器であるが、最近１２インチ（約３００ｍｍ）用も開発されており、容器は大型化しているが形状は類似した方形の箱体である（特許文献１参照。）。
【０００４】
樹脂製の緩衝体としては、ポリプロピレンなどポリオレフィン系樹脂からなる厚さ１ｍｍ前後の樹脂シートの加熱・真空成形法により製造されものが使用されており、緩衝性能は成形された樹脂シートの凹凸部が衝撃時に撓むあるいは凹むことにより発揮される（例えば、特許文献２，３参照。）。
【０００５】
また、発泡樹脂製の緩衝体としては、発泡スチロールや発泡ポリプロピレンからなるものや、発泡ポリウレタンからなるものが知られている（例えば、特許文献４，５参照。）。
【０００６】
シリコンウェーハは直径が６インチサイズから８インチサイズと大型化し、近年さらに１２インチへと移行しつつある。この様な傾向から、収納するウェーハ容器のサイズが大きくかつ重くなり、ウェーハ１枚当たりの重量も重くなっているので、例えば、１２インチウェーハ２５枚入り（１２５ｇ／枚）とすると、ウェーハを収納したウェーハ容器の総重量は８ｋｇにも及ぶ。また、航空貨物としての搬送が一般的であるので、貨物室の高さ制限から積載効率が要望され、緩衝材の厚み低減や緩衝性能の向上がますます必要となって来た。
【０００７】
これまで、６インチや８インチのシリコンウェーハ容器の上下に配置される発泡樹脂製の緩衝材としては、図１に示す緩衝材１００のように、ウェーハ容器に外嵌する嵌合凹部１０１を有する方形状のベース部１０２を設け、ベース部１０２の嵌合凹部１０１の開口側とは反対側の面の４つの角部付近に４つの緩衝突起１０３を持ち、ベース部１０２の４つの側面に２つの緩衝突起１０４をそれぞれ持つ形状が一般的である。また、図２に示す緩衝材１１０のように、４つのウェーハ容器の嵌合凹部１１１を有する方形状のベース部１１２を設け、ベース部１１２に各ウェーハ容器に対応させてその中央部に開口部１１３を形成し、この開口部１１３の周囲に４つの緩衝突起１１４を形成するとともに、ベース部１１２の外縁部付近に複数の緩衝突起１１５を形成したものが知られている。
【０００８】
【特許文献１】
特開２００１−３０８１７１号公報
【特許文献２】
特開平７−３０７３７８号公報
【特許文献３】
特開２００２−１６０７６９号公報
【特許文献４】
米国特許第６１３７３９号明細書
【特許文献５】
特開２０００−２０８６２号公報
【０００９】
【発明が解決しようとする課題】
上述の様に、シリコンウェーハの口径が大型化すると、樹脂製の緩衝材では掛かる荷重だけでも持ち支えられなくなることと、元々緩衝性能は発泡樹脂製と比較して悪いため、集中的衝撃荷重を受けるとウェーハが容易に破損してしまい、もはや大型のウェーハ輸送容器の緩衝材としては適さなくなっている。
【００１０】
一方、発泡樹脂製の緩衝材においても種々の課題を抱え、発泡スチロールにおいては、一般的に衝撃に弱い緩衝突起を緩衝体のベース部の外方に突出させる緩衝包装設計はせず、内側の商品の方向に緩衝突起を設置し、ダンボールケースとの接触は緩衝体全面とし、しかも安全性を考慮して内側に向いた緩衝突起を長くすることが多く、今回のように厚みの制限がある場合には採用は難しい。また、図３に示すように、２回目落下において急激な緩衝性能の低下があり、航空機への積み荷、積み下ろしが必ずしも丁寧であるとは限らないので、高価なウェーハを損傷させる心配がある。さらに、発泡スチロールは衝撃や摩擦で細かく砕けるので、ウェーハ収納容器に直接、ないしはアルミ袋などの容器保護カバーに付着してクリーンルーム内に侵入し、汚染の原因になる。尚、図３は、発泡スチロール（ＥＰＳ）と発泡ポリプロピレン（ＥＰＰ）と発泡ポリエチレン（ＥＰＥ）の落下回数と緩衝係数の推移を示すグラフで、割れ性に関する記号は、「×」が悪く、「△」はやや悪く、「◎」は大変良好であることを示す。
【００１１】
発泡ポリウレタンは低耐荷重性の欠点があり、軽量物用の緩衝材であって、しかも包装厚みを必要とする素材であり、本発明の目的にははじめから合致しない。
【００１２】
発泡ポリプロピレンや発泡ポリエチレンなどの発泡ポリオレフィン系は、発泡スチロールに比較して柔軟性、復元性が優れ、しかも緩衝材の割れ、破砕の問題も解決され、塵埃の発生もないので、繰り返し衝撃を受けると破損し易い商品や高価で安全性を重視する商品あるいは輸出包装では広く使用されている素材である。
【００１３】
しかし、最近のウェーハの大型化によるウェーハ容器総重量のアップ、航空貨物室の高さ制限からくる緩衝材厚みの低減、落下高さを５０ｃｍから１００ｃｍ（通常この場合、緩衝材厚み２倍を必要とする。）に引き上げたいなどの要求から極めて厳しい緩衝包装設計が要望されており、発泡ポリオレフィン製の緩衝体であっても通常の緩衝包装設計では困難であることが判明した。
【００１４】
次世代の１２インチウェーハに対して、日本のシリコンウェーハ製造メーカー数社からなる工業会である新金属協会のシリコン委員会から、２０００年６月に図４のごとく外装箱５の外寸法が提案されたが、これが緩衝包装設計上問題となるのは、水平２方向の幅ではなく、外装箱の外寸高さ４６０ｍｍにおいてである。即ち、高さ４６０ｍｍの中に、ウェーハ容器（例えば、信越ポリマー製ＭＷ３００ＦＧ；高さ３６１ｍｍ）、１組の緩衝材高さ、上下のダンボール紙厚みを含ませる必要があり、緩衝材の厚みは約５ｃｍ前後となり、ウェーハを含む総重量８ｋｇの容器の内容物を保護するには、厚みにおいて非常に厳しい条件となっている。
【００１５】
即ち、次式の緩衝包装設計における緩衝材の厚さの計算式から、
Ｔ＝Ｃ・Ｈ／Ｇ
緩衝材厚みＴと落下高さＨが規制されてしまうと、ビーズ法発泡樹脂緩衝体の緩衝係数Ｃもほとんど差がないためＧ値（商品が受ける衝撃の大きさ）も変更できない。ここに、今回の緩衝包装設計条件、Ｔ＝５ｃｍ，Ｃ＝２．７（ビーズ法発泡ポリエチレンを適用）、Ｈ＝１００ｃｍを代入すると、Ｇ値＝５４Ｇ（一定値）となり、このＧ値にウェーハ容器内のシリコンウェーハが１枚たりとも損傷しないかは疑問である。
【００１６】
一方、外装箱の側面方向からの外力にたいする包装設計は、上述した図４の新金属協会シリコン委員会の設定値は外装箱の水平２方向の幅が５００×５８０ｍｍであるので、ウェーハ容器（例えば、信越ポリマー製ＭＷ３００ＦＧ）の側面方向の最大外寸は容器の蓋のサイズで、３３８×３８９ｍｍであることから、左右に約８０ｍｍ以上の緩衝材厚みが許容されるので、前式でＧ値を求めると、Ｇ値＝３４Ｇとなり、低Ｇ値となり図１のような従来法による緩衝突起形状が利用できる。
【００１７】
【課題を解決するための手段】
本発明者らは、上述のように緩衝材の厚みを多く取れず、しかも落下高さを１００ｃｍとする厳しい条件においては、残された解決手段は緩衝突起の形状について検討するしかないと判断し、各種の形状を持った緩衝突起について検討を重ね、緩衝突起を閉じた環状とすることにより大幅な緩衝特性の向上が可能となることを発見し、本発明を完成するに至った。
【００１８】
本発明に係るウェーハ容器緩衝体は、複数枚の半導体ウェーハを収納したウェーハ容器を外装箱内に収容するに際して、外装箱とウェーハ容器間においてウェーハ容器の上下に配置される１組の発泡樹脂製の緩衝体であって、これら１組の発泡樹脂製緩衝体のベース部に外装箱内で外装箱の底および天井に当接する緩衝突起を突出状に設け、この緩衝突起を閉じた環状に形成したものである。
【００１９】
ここで言う閉じた環状とは、図１や図２のような従来法のように緩衝突起が分散したものではなく、本発明のごとくその分散した緩衝突起の先端の集計面積（受圧面積）相当分を閉じた環状に１周させた形状を指し、丸でも、楕円でも、方形でもその形状は問わない。また、環状がわずかに途切れている程度ならば、本発明は緩衝突起を連続的にしたことから効果が得られているので、必ずしも完全に閉じた形状でなくても良い。
【００２０】
ただし、どのような緩衝突起の形状であっても、緩衝体がウェーハ容器を落下時に接触して支持する位置との関連は極めて重要であり、緩衝体全体がウェーハ容器の底面あるいは天面全域を当接支持する場合もあるが、突出部で支持させる場合が多く、この場合突出部の面の中心線と、閉じた環状の緩衝突起が外装箱と当接する面の中心線の位置を一致させ、衝撃時に受ける応力が一直線に伝達するよう設計することが好ましい。一般的に、緩衝体がウェーハ容器を支持する位置の中心線は、容器底面の形状の外縁部からやや内側の位置させ、付加的に中央部を線又は点の広がりで支持することもあるが、閉じた環状の緩衝突起の配置もウェーハ容器底面の形状の外縁部からやや内側の位置に設置し、ウェーハ容器が緩衝体の突出部に伝達する応力と緩衝突起が外装箱に伝達する応力とが衝撃を受ける方向に一直線に伝達する位置に配置させるのが望ましい。
【００２１】
シリコンウェーハ収納容器は円柱状のものもあるが、一般的には概ね立方形の容器であり、緩衝体が容器を支持する位置の中心線は、容器底面の方形の外縁部からやや内側に設置される。従って、本発明の緩衝突起は閉じた方形環状であることが好ましい。
【００２２】
また、緩衝突起を閉じた方形の環状とした上で、緩衝突起の少なくとも４角部を４辺部よりも幅広に構成すると、落下衝撃時の応力を４角部で集約的に吸収でき、緩衝性能を一段と向上できる。
【００２３】
さらに、緩衝体がウェーハ容器を支持する位置の中心線を容器底面の形状の外縁部からやや内側の位置とし、これに付加的に中央部を線又は点の広がりで支持した場合、緩衝突起の方にも環状内を区画する区画緩衝突起、ないしは環状内に島状に配置した島状緩衝突起を緩衝突起と略同高に形成し、衝突時の応力分散をスムーズに行うことが、緩衝性能の向上にも繋がることが分かった。
【００２４】
本発明に使用できる発泡樹脂製緩衝体としては、ビーズ法にて成形したポリオレフィン系樹脂製の発泡体を好適に利用できる。ビーズ法とは、ビーズ法発泡ポリスチレン（発泡スチロール）の製造方法に代表されるが、予め発泡した粒子状の予備発泡粒子を、所定の形状の金型に充填し、加熱して２回目の発泡膨張を起こさせ、粒子どうしが空間をなくして相互融着し、冷却して金型形状どおりの成形体を得る発泡体製造方法のことである。加熱媒体は普通加圧蒸気が使用される。また、ポリオレフィン系樹脂の発泡体とは、ポリエチレン、ポリプロピレン、スチレン／エチレンの複合ポリマーなどの発泡体などであって、発泡スチレンと比較すると柔軟性、耐久性のある発泡体である。また、その発泡倍率に関しては、ポリプロピレン製の発泡体では市販されている３０倍品、４５倍品（例えば、鐘淵化学工業（株）製；エペランＰＰ−４５）やビーズ法発泡ポリエチレン製で市販の２０倍、３８倍（例えば、鐘淵化学工業（株）製；エペランＡＸＬ３８）が好適に使用される。緩衝体自身の割れにくさはビーズ法発泡ポリオレフィン系の中では、発泡ポリエチレンが最も優れる。
【００２５】
本発明は、通常の直径６インチや８インチのシリコンウェーハが１２インチと大型化し、ウェーハ容器総重量のアップ、航空貨物室の高さ制限からくる緩衝材厚みの低減、落下高さを５０ｃｍから１００ｃｍに引き上げるなどの要求から発明されたもので、直径１２インチのシリコンウェーハの搬送に好適に利用できるが、直径が６インチや８インチのシリコンウェーハにおいても適用が可能である。
【００２６】
【発明の実施の形態】
以下、本発明の実施例について図面を参照しながら説明する。
図４、図５に示すように、ウェーハ容器緩衝体１、２は、複数枚の半導体ウェーハ３を収納したウェーハ容器４を外装箱５内に収容するに際して、外装箱５とウェーハ容器４間においてウェーハ容器４の上下に配置されるものである。
【００２７】
外装箱５は、段ボールなどからなる直方体状の周知の構成のもので、収容する半導体ウェーハ３の直径に応じたサイズに設定されたものである。例えば、直径１２インチのシリコンウェーハ用の外装箱５では、高さ４６０ｍｍ、前後幅が５００ｍｍ、左右幅が５８０ｍｍのものを採用することになる。
【００２８】
ウェーハ容器４は、複数の半導体ウェーハ３を収納できるものであれば、任意の構成のものを採用できる。ここでは、信越ポリマー製ＭＷ３００ＦＧ；高さ３６１ｍｍのウェーハ容器を例に、本発明と関連する部分についてのみ説明する。ウェーハ容器４の下端部には左右１対の脚部１０が前後方向に略全長にわたって形成され、左右の脚部１０間には部分円筒状の底面を有する膨出部１１が前後方向に略全長にわたって形成されている。ウェーハ容器４の上部には外縁部に上方へ延びる外壁部を形成した蓋部材１２が設けられ、この蓋部材１２には前後方向に延びる１対のリブ部１３が左右に間隔をあけて形成されている。
【００２９】
上下の緩衝体１、２は、前述したように、ポリオレフィン系樹脂製の予備発泡粒子を用いてビーズ法にて製作した発泡成形体から構成されている。ポリオレフィン系樹脂としては、ポリエチレン、ポリプロピレン、スチレン／エチレンの複合ポリマーなどを採用可能で、ポリエチレンからなる発泡成形体は割れにくいので好適である。
【００３０】
上側の緩衝体１について説明すると、図４〜図９に示すように、ウェーハ容器４の上部に外嵌する嵌合凹部２０を形成した方形状のベース部２１が設けられ、ベース部２１の上壁部の中央部には方形状の開口部２２が形成され、ベース部２１の前後左右の側壁部には相互に間隔をあけて１対の側部緩衝突起２３が突出状にそれぞれ形成され、ベース部２１の左右の側壁部には嵌合凹部２０側へ突出する４つの保持突起２４が側部緩衝突起２３に対応させて形成されている。ベース部２１の上壁部の下面にはウェーハ容器４の蓋部材１２の左部及び右部に当接される前後方向に延びる左右１対の左右押さえ部２５が下方へ突出状に形成されるとともに、ウェーハ容器４の蓋部材１２の中央部に当接される前後１対の中央押さえ部２６が下方へ突出状に形成されている。ベース部２１の上壁部の上面側には、開口部２２を取り囲むように形成された平面視略方形枠状の環状緩衝突起２７と、環状緩衝突起２７の前後２辺の途中部から内側へ延びる補助緩衝突起２８とを備えた上緩衝突起２９が上方へ突出状に形成されている。
【００３１】
そして、ウェーハ容器４に上下の緩衝体１、２を取り付けてこれを外装箱５に装填した状態で、ベース部２１の前後の側壁部と保持突起２４がウェーハ容器４の側面上部に当接されるとともに、左右押さえ部２５及び中央押さえ部２６がウェーハ容器４の蓋部材１２の上面に当接されて、ウェーハ容器４の上部が上側の緩衝体１に保持され、また側部緩衝突起２３が外装箱５の側壁部の内面に当接されるとともに、上緩衝突起２９が外装箱５の天井に当接されて、上側の緩衝体１を介してウェーハ容器４が外装箱５に緩衝保持される。但し、上側の緩衝体１のうち上緩衝突起２９以外の構成は、ウェーハ容器４の構成等に応じてその配設位置や形状を任意に設定してもよい。
【００３２】
環状緩衝突起２７と補助緩衝突起２８とは断面台形状に形成され、その上面には外装箱５の天井に当接する当接面３０が連続的に連なって形成されている。環状緩衝突起２７の４角部と環状緩衝突起２７と補助緩衝突起２８との合流部は環状緩衝突起２７の４辺部よりも幅広な略円形の幅広部３１が形成され、落下衝撃時の荷重を幅広部３１により集約的に吸収して、緩衝性能を向上できるように構成されている。但し、幅広部３１及び補助緩衝時は、緩衝性能を向上させる上で設けることが好ましいが必ずしも必要なものではなく省略してもよい。
【００３３】
環状緩衝突起２７及び補助緩衝突起２８は、その中心線Ｌ１が左右押さえ部２５の中心線Ｌ２と中央押さえ部２６の中心線Ｌ３上に位置するように配置され、左右押さえ部２５及び中央押さえ部２６に作用するウェーハ容器４からの上方への荷重を環状緩衝突起２７及び補助緩衝突起２８で効率的に受け止めることができるように構成されている。
【００３４】
直径１２インチのシリコンウェーハ用の緩衝体においては、例えば環状緩衝突起２７及び補助緩衝突起２８の高さを２２ｍｍ、ベース部２１側の基部の幅を２５ｍｍ、緩衝突起２７、２８における当接面３０の幅を１５ｍｍ、幅広部３１の基部の半径を２５ｍｍ、幅広部３１における当接面３０の半径を２０ｍｍに設定することになる。また、ベース部２１の上壁部の厚さを１５ｍｍ、押さえ部２５、２６の高さを１７ｍｍに設定することになる。但し、これらの寸法は、半導体ウェーハ３のサイズによって適宜に設定することになる。
【００３５】
下側の緩衝体２について説明すると、図４、図５、図１０〜図１３に示すように、ウェーハ容器４の下部に外嵌する嵌合凹部４０を形成した方形状のベース部４１が設けられ、ベース部４１の前後左右の側壁部には相互に間隔をあけて１対の側部緩衝突起４３が突出状にそれぞれ形成され、ベース部４１の前後左右の側壁部には嵌合凹部４０側へ突出する４つの保持突起４４が側部緩衝突起４３に対応させて形成されている。ベース部４１の下壁部の上側にはウェーハ容器４の脚部１０を載置する左右１対の載置面４５が形成されるとともに、左右の載置面４５間にはウェーハ容器４の膨出部１１を受け止める３つの受け部４６が上方へ突出状に形成されている。ベース部２１の下壁部の下面側には、ベース部４１の外縁部からやや中央部側部位に平面視略方形枠状の環状緩衝突起４７と、環状緩衝突起４７の前後２辺の途中部に連なり、環状緩衝突起４７の内側を２つに区画する区画緩衝突起４８とを備えた下緩衝突起４９が下方へ突出状に形成されている。尚、符号４２は、外装箱５の下側のフラップを閉じた時に、左右のフラップ間に形成される隙間を埋める為の突起である。
【００３６】
そして、ウェーハ容器４に上下の緩衝体１、２を取り付けてこれを外装箱５に装填した状態で、保持突起４４がウェーハ容器４の脚部１０の側面及び前後面に当接されるとともに、ウェーハ容器４の脚部１０が載置面４５に載置され且つウェーハ容器４の膨出部１１が受け部４６に載置されて、ウェーハ容器４の下部が下側の緩衝体２に保持され、また側部緩衝突起４３が外装箱５の側壁部の内面に当接されるとともに、下緩衝突起４９が外装箱５の底面に当接されて、下側の緩衝体２を介してウェーハ容器４が外装箱５に緩衝保持される。但し、下側の緩衝体２のうち下緩衝突起４９以外の構成は、ウェーハ容器４の構成等に応じてその配設位置や形状を任意に設定してもよい。
【００３７】
環状緩衝突起４７と区画緩衝突起４８とは断面台形状に形成され、その下面には外装箱５の底面に当接する当接面５０が連続的に連なって形成されている。環状緩衝突起４７の４角部と環状緩衝突起４７と区画緩衝突起４８との合流部は環状緩衝突起４７の４辺部よりも幅広な略円形の幅広部５１が形成され、落下衝撃時の荷重を幅広部５１により集約的に吸収して、緩衝性能を向上できるように構成されている。但し、区画緩衝突起４８は省略してもよいし、複数本形成してもよい。また、幅広部５１は省略してもよい。また、区画緩衝突起４８に代えて、環状緩衝突起４７の内側に環状緩衝突起４７と切り離した島状の島状緩衝突起を形成してもよい。
【００３８】
環状緩衝突起４７及び区画緩衝突起４８は、その中心線Ｌ４が左右の載置面４５の中心線Ｌ５と受け部４６の中心線Ｌ６上に位置するように配置され、載置面４５及び受け部４６に作用するウェーハ容器４からの下方への荷重を環状緩衝突起４７及び区画緩衝突起４８で効率的に受け止めることができるように構成されている。
【００３９】
直径１２インチのシリコンウェーハ用の緩衝体においては、例えば環状緩衝突起４７及び区画緩衝突起４８の高さを２２ｍｍ、基部の幅を２５ｍｍ、緩衝突起４７、４８における当接面５０の幅を１５ｍｍ、幅広部５１の基部の半径を２５ｍｍ、幅広部５１における当接面５０の半径を２０ｍｍに設定することになる。また、ベース部４１の下壁部の厚さを１５ｍｍ、受け部４６の最も低い位置での高さを８ｍｍに設定することになる。但し、これらの寸法は、半導体ウェーハ３のサイズによって適宜に設定することになる。
【００４０】
尚、環状緩衝突起２７、４７は、連続した環状に形成することが好ましいが、その一部が欠損した形状のものも本発明の範疇である。また、必ずしも方形状に形成する必要はなく、ウェーハ容器４との当接面の形状に応じて円形や楕円形等の任意の形状に構成できる。
【００４１】
次に本発明を完成するに至った経緯について説明する。
まず、図４に示されるように、新金属協会シリコン委員会からのダンボールケースの外装箱５の外寸で高さ方向の設定値は４６０ｍｍと決められており、図５に示すように、上下のダンボール紙が１枚だけの単層部分と左右のフラップが重ね合わされた２層部分とがあり、単層部分の厚みの合計を１０ｍｍとし、２層部分の厚みの合計を２６ｍｍとすると、外装箱５内の空間の高さは４３４〜４５０ｍｍとなる。この中での緩衝包装設計となり、ウェーハ容器４の高さを引いた寸法が１組の緩衝体１、２に与えられた厚みであり、片方で最低３７ｍｍ〜最高６５ｍｍの間にあり、概ね５０ｍｍ厚が緩衝体１、２に与えられている。
発泡樹脂製緩衝材の材質は、柔軟性と繰り返しの落下で緩衝係数が大きく低下しないポリオレフィン系のビーズ法発泡ポリエチレンとビーズ法発泡ポリプロピレンを選定した。
【００４２】
まず、緩衝包装設計の基本である、落下時に衝撃を受ける緩衝体１、２の緩衝突起の面積（受圧面積）を求める。受圧面積Ａは、次式から与えられ、
Ａ＝Ｇ・Ｗ／σｍａｘ
上述したＧ値＝５４Ｇ、Ｗ（商品総重量）＝８ｋｇ、σｍａｘ（緩衝体１、２の最大応力）＝２．８ｋｇ／ｃｍ^２（発泡ポリエチレン３８倍発泡品）、（発泡ポリプロピレン４５倍品＝２．７ｋｇ／ｃｍ^２）を代入して１５５ｃｍ^２（１６０ｃｍ^２）を得た。ここから緩衝包装設計を開始した。側面方向の緩衝包装設計については上述したように緩衝体１、２厚みに余裕があるため通常の緩衝包装設計が可能で低Ｇ値で落下時の衝撃受けることができるためその設計内容は省略する。
【００４３】
受圧面積と落下高さが決められてしまったので、基本的にＧ値は変えることができないため、緩衝突起形状の検討で緩衝性能の向上が見られないか種々の形状について検討する。まず、図１の従来法で緩衝包装設計して、１００ｃｍ落下（以下の落下試験は全て１００ｃｍ）させ、ウェーハ容器４に収納されたシリコンウェーハ３に変化がないか確認したところ、ウェーハ３がウェーハ容器４内のサポートから外れたり、回転したり、ウェーハ３自身が損傷したりする現象が発生し、従来法では緩衝効果が期待できないことが分かった。
【００４４】
その後、緩衝体におけるウェーハ容器４の支持面の中心線と緩衝突起の中心線の位置を上下に一致させることが好ましいことが分かり、緩衝突起の総受圧面積を数本の細長い帯状に分割して、緩衝体におけるウェーハ容器４の支持面の中心線に緩衝突起の中心線を合わせて落下試験した結果、緩衝性能の改良が見られた。しかし、ウェーハ３の衝撃からの保護にはまだ不充分であった。
【００４５】
次に、緩衝体がウェーハ容器を支持する位置の中心線と緩衝突起の中心線の位置を一致させ（以下の緩衝突起はこの方法を取り入れている。）、緩衝突起の形状を閉じた環状として、落下試験を行ったところ、緩衝性能は大幅に向上した。これは、Ｇ値が変えられないケースでも、緩衝突起が閉じた環状であったために、落下時の衝撃応力を均等に分散させ、落下時の振動のぶれを抑制したためではないかと思われる。
【００４６】
さらに、閉じた環状の衝突突起の内側を区画したり、中心部に島を形成させる方法も緩衝性能を向上させる方向にある落下試験結果が得られている。
【００４７】
最後に本発明がその目的を達成するに至ったのは、緩衝突起を閉じた方形の環状として、内側が区画された形状や中心部に島のある形状であっても良いが、閉じた方形の環状の４角部を４辺部よりも幅広にして、落下衝撃時の応力を４角部に集約的に吸収させる方法を講じたことである。本形状で落下試験した結果、シリコンウェーハ３のウェーハ容器４内での動きが止まり、破損に至る可能性が低下し、薄肉でも緩衝突起形状設計で要求された厳しい緩衝要求性能を満足させられることを証明した。
【００４８】
次に、比較試験について説明する。
（比較例１）
図１４に示す緩衝体６１、６２は、図１のごとく従来法に基づく包装設計により製作したもので、上下の緩衝体６１、６２は共に外装箱５の天面と底面の接する緩衝突起６４が４角部に配置されており、側面４方向に各辺２つの緩衝突起６３を持つ形状である。上の緩衝体６１に開口部６５があるのは、ウェーハ容器に貼られた内容物の識別表示を見るためのものである。本設計通りに、発泡ポリエチレン３８倍発泡品および発泡ポリプロピレン４５倍品を切削加工して緩衝体６１、６２を作製した。次に、図４のダンボールケースに１２インチのシリコンウェーハ３２５枚入りのウェーハ容器４を、その上下に緩衝体６１、６２を挿入配置させてなる包装体を製作した。そして、この包装体を１０個用いて１角３稜６面のそれぞれについて高さ１００ｃｍからの落下試験を実施したところ、表１（落下試験１、２）（ただし、底面と天面以外の１角３稜４側面は全て合格となったので表記しないものとする。）のごとくで、２種の発泡ポリエチレン３８倍発泡品および発泡ポリプロピレン４５倍品製の緩衝体６１、６２でウェーハ３の回転、外れ、割れが発生した。なお、発泡ポリプロピレン４５倍品製緩衝体６２は落下１回目で自らも破損した。尚、評価項目における「回転」は、ウェーハ３にマーキングを施して、ウェーハ３のマーキング位置が移動しているか否かを目視にて確認し、移動している場合には「×」、移動していない場合には「○」とした。「外れ」は、ウェーハ容器４に形成したウェーハ装填用レールからウェーハ３が外れているか否かを目視にて確認し、外れている場合には「×」、外れていない場合には「○」とした。「割れ」は、ウェーハ３に割れ或いはクラックが入っているか否かを目視にて確認し、割れ或いはクラックが発生している場合には「×」、割れ或いはクラックが発生していない場合には「○」とした。また、以下に説明する、比較例２、本発明例１、２、３に関しても、その落下試験は比較例１と同様の方法で行った。
【００４９】
【表１】

【００５０】
（比較例２）
図１５に示す緩衝体７１、７２は、図１４に示す緩衝体６１、６２の緩衝突起６３と同一受圧面積を持つ緩衝突起７３の中心線の位置を緩衝体７１、７２におけるウェーハ容器４の支持面の中心線に一致させ、その形状を上緩衝体７１の緩衝突起７３は２本の長い短冊形状とし、下緩衝体７２の緩衝突起７３は３本の長い短冊形状として、衝撃時の応力を中心部から分散させようと試みた。試作は発泡ポリエチレン３８倍発泡品のみとした。緩衝体７１、７２を用いた落下試験結果は表２（落下試験３）のごとく落下１回目でのウェーハ３の割れは防止でき改良は見られるが、まだシリコンウェーハ３の回転や外れがある。
【００５１】
【表２】

【００５２】
（本発明例１）
図１６に示す緩衝体８１、８２は、図１５に示す緩衝体７１、７２の緩衝突起７３と同一受圧面積を持つが、図１４に示す緩衝体６１、６２と同じく緩衝突起８３の中心線の位置を緩衝体８１、８２におけるウェーハ容器４の支持面の中心線に一致させ、その形状を閉じた方形の環状とした。試作は発泡ポリエチレン３８倍発泡品のみとした。緩衝体８１、８２を用いた落下試験結果は表３（落下試験４）のごとくで大幅に改良され、落下２回目で天面でウェーハ３の回転が見られたものの、ウェーハ３の破損は天面落下３回目ではじめて割れが発生したのみである。
【００５３】
【表３】

【００５４】
（本発明例２）
図１７に示す緩衝体９１、９２は、図１６に示す緩衝体８１、８２の緩衝突起８３と同一受圧面積を持ち、緩衝突起８３と同じく緩衝突起９３の中心線の位置を緩衝体９１、９２におけるウェーハ容器４の支持面の中心線に一致させ、その形状を閉じた方形の環状とし、さらに方形の中央に、緩衝突起９３における前後辺を連結する１本の区画緩衝突起９４を追加し（上緩衝体９１は開口部９５があるため途切れた形状となった）応力分散を図った。試作は発泡ポリエチレン３８倍発泡品のみで行い、落下試験に供した。緩衝体９１、９２を用いた落下試験結果は表４（落下試験５）のごとくで、天面落下３回目でウェーハ３の回転が見られた。シリコンウェーハ３の割れは落下３回でも起こらなかった。３回以上の落下は現実には起こりそうにないのでほぼ合格と言える。
【００５５】
【表４】

【００５６】
（本発明例３）
図６〜図１３に示す緩衝体１、２は、図１７に示す緩衝体９１、９２の緩衝突起９３、９４と同一受圧面積を持つが、図１６に示す緩衝体８１、８２と同じく緩衝突起８３の中心線の位置を緩衝体１、２におけるウェーハ容器４の支持面の中心線に一致させ、その形状を閉じた方形の環状とし、さらに方形の中央に、区画緩衝突起４８を追加して応力分散を図ると共に、方形の角部の幅を４辺部の幅よりも広げた形状とした。試作は発泡ポリエチレン３８倍発泡品と発泡ポリプロピレン４５倍品の両方を行い、落下試験に供した。緩衝体１、２を用いた落下試験結果は表５（落下試験６，７）のごとくで落下３回の試験においてウェーハ３の異常は全く見られなかった。ただし、発泡ポリプロピレン４５倍品は落下３回目で緩衝体２自らが破損した。
【００５７】
【表５】

【００５８】
【発明の効果】
シリコンウェーハの口径が１２インチまで大型化すると、収納した容器総重量が増し、航空貨物室の高さから緩衝体に与えられた厚みが減じられ、かつ落下高さの要望が従来の５０ｃｍから１００ｃｍまで引き上げられ、従来の緩衝包装設計では対応がつかない状態であった。本発明はこのような状況に鑑み、緩衝体のベース部から突き出す緩衝突起の形状を閉じた環状とすること、方形の容器では閉じた方形の環状に、また環状内を区画するか中央に島部を設けること、閉じた方形の環状の４角部を４辺部の幅より広くすることにより緩衝性能を大幅に向上させることができ、シリコン委員会で決められた外寸のダンボールケースでも、ウェーハ容器内のシリコンウェーハを輸送中の振動や衝撃から破損を防止できた。
【図面の簡単な説明】
【図１】（ａ）は従来法の緩衝包装設計による緩衝体の正面図、（ｂ）は同緩衝体の底面図。
【図２】（ａ）は米国特許に見られる緩衝体の平面図、（ｂ）は（ａ）のＡ−Ａ線断面図。
【図３】落下回数と緩衝係数Ｃの関係を示すグラフ。
【図４】外装箱に対するウェーハ容器の収納状態を示す分解斜視図。
【図５】外装箱に対するウェーハ容器の収納状態を示す縦断面図。
【図６】本発明例３に係る上緩衝体の平面図
【図７】同緩衝体の底面図
【図８】図６のＡ−Ａ線断面図
【図９】図６のＢ−Ｂ線断面図
【図１０】本発明例３に係る下緩衝体の平面図
【図１１】同緩衝体の底面図
【図１２】図１０のＡ−Ａ線断面図
【図１３】図１０のＢ−Ｂ線断面図
【図１４】（ａ）は比較例１の下緩衝体の底面図、（ｂ）は比較例１の上緩衝体の平面図
【図１５】（ａ）は比較例２の下緩衝体の底面図、（ｂ）は比較例２の上緩衝体の平面図
【図１６】（ａ）は本発明例１の下緩衝体の底面図、（ｂ）は本発明例１の上緩衝体の平面図
【図１７】（ａ）は本発明例２の下緩衝体の底面図、（ｂ）は本発明例２の上緩衝体の平面図
【符号の説明】
１上緩衝体２下緩衝体
３ウェーハ４ウェーハ容器
５外装箱
１０脚部１１膨出部
１２蓋部材１３リブ部
２０嵌合凹部２１ベース部
２２開口部２３側部緩衝突起
２４保持突起２５左右押さえ部
２６中央押さえ部２７環状緩衝突起
２８補助緩衝突起２９上緩衝突起
３０当接面３１幅広部
４０嵌合凹部４１ベース部
４２突起４３側部緩衝突起
４４保持突起４５載置面
４６受け部４７環状緩衝突起
４８区画緩衝突起４９下緩衝突起
５０当接面５１幅広部
６１上緩衝体６２下緩衝体
６３緩衝突起６４緩衝突起
６５開口部
７１上緩衝体７２下緩衝体
７３緩衝突起
８１上緩衝体８２下緩衝体
８３緩衝突起
９１上緩衝体９２下緩衝体
９３緩衝突起９４区画緩衝突起
９５開口部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention, when transporting a plastic wafer container containing a plurality of semiconductor wafers such as silicon wafers, in order to prevent damage to the wafer caused by shock and vibration during transport, in an outer box such as a cardboard case The present invention relates to a set of foamed resin shock absorbers disposed above and below the container, and more particularly, to a set of shock-absorbing protrusions that contact the upper and lower sides of the outer case within the outer case of a set of foamed resin shock absorbers disposed above and below the container. It is about shape.
[0002]
[Prior art]
BACKGROUND ART Conventionally, as a method of transporting a plastic wafer container containing a plurality of semiconductor wafers, a box body such as a cardboard case has been used for an outer box, and a pair of resin or 2. Description of the Related Art There is a well-known transport method in which a shock-absorbing material made of a foamed resin is inserted to reduce shocks and vibrations during transport and prevent cracking and damage of an expensive semiconductor wafer stored in a container.
[0003]
A typical example of the plastic wafer container currently used is a wafer container made of polypropylene for silicon wafers having a diameter of 6 inches (about 150 mm) or 8 inches (about 200 mm). A container with a size of about 300 mm) has also been developed.
[0004]
As the resin buffer, a material manufactured by heating / vacuum forming a resin sheet having a thickness of about 1 mm made of a polyolefin resin such as polypropylene is used. It is exerted by bending or denting upon impact (for example, see Patent Documents 2 and 3).
[0005]
Further, as a buffer made of a foamed resin, those made of foamed styrene or foamed polypropylene and those made of foamed polyurethane are known (for example, see Patent Documents 4 and 5).
[0006]
Silicon wafers have increased in diameter from 6 inches to 8 inches in size, and have recently shifted to 12 inches. From such a tendency, the size of the wafer container to be stored is large and heavy, and the weight per wafer is also heavy. For example, if the 12-inch wafer contains 25 wafers (125 g / sheet), the wafer is stored. The total weight of the wafer container thus obtained reaches as much as 8 kg. In addition, since transportation as air cargo is common, loading efficiency is demanded due to the height limitation of the cargo compartment, and it has become increasingly necessary to reduce the thickness of cushioning material and improve cushioning performance.
[0007]
Until now, as a cushioning material made of a foamed resin disposed above and below a 6-inch or 8-inch silicon wafer container, there is a fitting concave portion 101 which fits outside the wafer container like a cushioning material 100 shown in FIG. A rectangular base 102 is provided, and four buffer protrusions 103 are provided near four corners of a surface of the base 102 opposite to the opening side of the fitting recess 101, and two buffer protrusions 103 are provided on four side surfaces of the base 102. A shape having two buffer protrusions 104 is common. As shown in FIG. 2, a rectangular base 112 having fitting recesses 111 for four wafer containers is provided, and an opening is formed in the center of the base 112 corresponding to each wafer container. It is known that a plurality of buffer protrusions 115 are formed near the outer edge of the base portion 112 while forming a plurality of buffer protrusions 114 around the opening 113.
[0008]
[Patent Document 1]
JP 2001-308171 A
[Patent Document 2]
JP-A-7-307378
[Patent Document 3]
JP-A-2002-176069
[Patent Document 4]
US Pat. No. 6,137,739
[Patent Document 5]
JP-A-2000-20862
[0009]
[Problems to be solved by the invention]
As described above, when the diameter of the silicon wafer is increased, the resin cushioning material cannot support the load alone, and the buffering performance is originally worse than that of the foamed resin. When received, the wafer is easily broken and is no longer suitable as a cushioning material for a large wafer transport container.
[0010]
On the other hand, foamed resin cushioning materials also have various problems, and foamed polystyrene generally does not have a cushioning packaging design that protrudes shock-sensitive cushioning projections outward from the base portion of the cushioning body. The cushioning projection is installed in the direction of the direction, the contact with the cardboard case is the entire surface of the cushioning body, and in consideration of safety, the inwardly facing cushioning projection is often lengthened. Is difficult to adopt. In addition, as shown in FIG. 3, there is a sudden drop in the buffering performance at the second drop, and loading and unloading to an aircraft is not always careful, and there is a concern that an expensive wafer may be damaged. Furthermore, since the styrene foam is finely broken by impact or friction, it adheres directly to the wafer storage container or to a container protective cover such as an aluminum bag and enters the clean room, causing contamination. FIG. 3 is a graph showing the transition of the number of drops and the buffer coefficient of the expanded polystyrene (EPS), expanded polypropylene (EPP), and expanded polyethylene (EPE). Slightly poor, “◎” indicates very good.
[0011]
Foamed polyurethane has a drawback of low load resistance, is a cushioning material for lightweight objects, and is a material requiring a packaging thickness, and does not meet the purpose of the present invention from the beginning.
[0012]
Expanded polyolefins such as expanded polypropylene and expanded polyethylene have better flexibility and resilience than Styrofoam, and also solve the problem of cracking and crushing of the cushioning material, and do not generate dust. It is a widely used material for easily damaged products, expensive and safety-oriented products, and export packaging.
[0013]
However, the recent increase in the size of wafers has increased the total weight of the wafer container, reduced the thickness of the cushioning material due to restrictions on the height of the air cargo compartment, and reduced the drop height from 50 cm to 100 cm. ), It is found that it is difficult to design a cushioning package made of expanded polyolefin with a normal cushioning packaging design.
[0014]
For the next generation of 12-inch wafers, the Silicon Committee of the New Metal Association, an association of several Japanese silicon wafer manufacturers, proposed the outer dimensions of the outer box 5 in June 2000, as shown in Fig. 4 However, it is not the width in the horizontal two directions but the outer height of the outer box of 460 mm that is a problem in the cushioning packaging design. That is, it is necessary to include a wafer container (for example, MW300FG made by Shin-Etsu Polymer; height 361 mm) in a height of 460 mm, a pair of cushioning material heights, and upper and lower cardboard paper thicknesses. In order to protect the contents of the container having a total weight of 8 kg including the wafer, which is about 5 cm, the thickness is very severe.
[0015]
That is, from the following formula for calculating the thickness of the cushioning material in the cushioning packaging design,
T = CH / G
If the buffer material thickness T and the drop height H are regulated, the G value (the magnitude of the impact received by the product) cannot be changed because the buffer coefficient C of the bead-formed foamed resin buffer has almost no difference. Substituting the buffer packaging design conditions of this time, T = 5 cm, C = 2.7 (applying the beads method foamed polyethylene), and H = 100 cm, the G value becomes 54 G (constant value), and the wafer becomes the G value. It is doubtful that any silicon wafer in the container will not be damaged.
[0016]
On the other hand, in the packaging design for the external force from the side direction of the outer box, the setting value of the Silicon Committee of the New Metal Association shown in FIG. 4 is such that the width of the outer box in the two horizontal directions is 500 × 580 mm. The maximum outer dimension in the lateral direction of Shin-Etsu Polymer MW300FG is the size of the container lid, which is 338 x 389 mm. Therefore, a buffer material thickness of about 80 mm or more is allowed on the left and right. As a result, the G value is 34 G, which is a low G value, and a buffer protrusion shape according to the conventional method as shown in FIG. 1 can be used.
[0017]
[Means for Solving the Problems]
The present inventors have determined that, under the severe conditions where the thickness of the cushioning material cannot be increased as described above and the drop height is 100 cm, the remaining solution is to study the shape of the cushioning projection. The present inventor has repeatedly studied buffer projections having various shapes, and has found that the buffer projections can be significantly improved by forming the buffer projections into a closed annular shape, thereby completing the present invention.
[0018]
The wafer container buffer according to the present invention comprises a set of foamed resin arranged above and below the wafer container between the outer box and the wafer container when the wafer container containing a plurality of semiconductor wafers is accommodated in the outer box. A cushioning projection that abuts the bottom and ceiling of the outer box in the outer box in the base portion of the set of foamed resin buffers, and forms the closed projection in a closed annular shape. It was done.
[0019]
Here, the term “closed ring” does not mean that the buffer projections are dispersed as in the conventional method as shown in FIGS. 1 and 2, but corresponds to the total area (pressure receiving area) of the tips of the dispersed buffer projections as in the present invention. It refers to the shape of one round of a closed circle, and it does not matter whether it is round, elliptical, or square. If the annular shape is slightly interrupted, the present invention is effective because the buffer projections are made continuous, so that the shape is not necessarily completely closed.
[0020]
However, regardless of the shape of the buffer projection, the relationship between the buffer and the position where the buffer contacts and supports the wafer container when dropped is extremely important, and the entire buffer covers the entire bottom surface or top surface of the wafer container. In some cases, they are abutted and supported, but in many cases they are supported by protrusions.In this case, the center line of the surface of the protrusion and the position of the center line of the surface where the closed annular buffer protrusion comes into contact with the outer box are matched. It is preferable to design so that the stress received at the time of impact is transmitted straight. In general, the center line of the position where the buffer supports the wafer container is positioned slightly inside from the outer edge of the shape of the container bottom, and the center may be additionally supported by a line or point spread. The arrangement of the closed ring-shaped buffer projections is also set at a position slightly inside from the outer edge of the shape of the bottom surface of the wafer container, and the stress transmitted by the wafer container to the protrusion of the buffer and the stress transmitted by the buffer projections to the outer box are reduced. Is desirably arranged at a position where it is transmitted in a straight line in the direction in which an impact is received.
[0021]
Silicon wafer storage containers are generally cylindrical, but they are generally cubic containers, and the center line of the position where the buffer supports the container is located slightly inside from the rectangular outer edge of the container bottom. Is done. Therefore, it is preferable that the cushioning projection of the present invention is a closed rectangular ring.
[0022]
Further, if the buffer protrusion is formed in a closed rectangular shape and at least the four corners of the buffer protrusion are configured to be wider than the four sides, the stress at the time of a drop impact can be collectively absorbed by the four corners, and the buffer is formed. Performance can be further improved.
[0023]
Furthermore, the center line of the position where the buffer supports the wafer container is set to a position slightly inside from the outer edge of the shape of the bottom of the container, and if the center is additionally supported by the spread of lines or points, the buffer protrusions On the other hand, the partitioning buffer projections that partition the inside of the ring or the island-shaped buffering protrusions arranged in an island shape in the ring are formed at approximately the same height as the buffering projections, so that stress distribution at the time of collision can be performed smoothly, so that the buffering performance Was found to lead to improvement of
[0024]
As a foamed resin buffer usable in the present invention, a polyolefin resin foam molded by a bead method can be suitably used. The bead method is represented by a method for producing expanded polystyrene (expanded polystyrene) by the bead method. A pre-expanded particulate pre-expanded particle is filled in a mold having a predetermined shape, and heated to form a second expanded foam. This is a method for producing a foam in which particles are fused together without any space, and cooled to obtain a molded product in the shape of a mold. Pressurized steam is usually used as a heating medium. The polyolefin-based resin foam is a foam such as polyethylene, polypropylene, or a styrene / ethylene composite polymer, and is a foam that is more flexible and durable than foamed styrene. Regarding the expansion ratio, polypropylene foams are commercially available, such as 30-fold and 45-fold products (for example, Eperan PP-45, manufactured by Kanebuchi Chemical Industry Co., Ltd.) and bead-processed polyethylene foam. 20 times and 38 times (for example, Eperan AXL38 manufactured by Kanegafuchi Chemical Co., Ltd.) are preferably used. Among the bead method foamed polyolefins, foamed polyethylene is the most excellent in the resistance of the buffer itself to cracking.
[0025]
The present invention increases the size of normal 6 inch or 8 inch silicon wafers to 12 inches, increases the total weight of wafer containers, reduces the thickness of cushioning material due to the height limitation of the air cargo compartment, and reduces the drop height from 50 cm. It was invented from the requirement of raising it to 100 cm and can be suitably used for transporting a silicon wafer having a diameter of 12 inches, but is also applicable to a silicon wafer having a diameter of 6 inches or 8 inches.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
As shown in FIGS. 4 and 5, when the

wafer container buffers

1 and 2 accommodate the wafer container 4 accommodating a plurality of semiconductor wafers 3 in the outer box 5, the

wafer container buffers

1 and 2 are disposed between the outer box 5 and the wafer container 4. They are arranged above and below the wafer container 4.
[0027]
The outer box 5 has a well-known rectangular parallelepiped configuration made of cardboard or the like, and is set to a size corresponding to the diameter of the semiconductor wafer 3 to be accommodated. For example, the outer box 5 for a silicon wafer having a diameter of 12 inches has a height of 460 mm, a front-rear width of 500 mm, and a left-right width of 580 mm.
[0028]
The wafer container 4 may have any configuration as long as it can store a plurality of semiconductor wafers 3. Here, only a portion related to the present invention will be described using a Shin-Etsu Polymer MW300FG; wafer container having a height of 361 mm as an example. A pair of left and right legs 10 are formed at the lower end of the wafer container 4 over substantially the entire length in the front-rear direction, and a swelling portion 11 having a partially cylindrical bottom surface is formed between the left and right legs 10 substantially in the front-rear direction. It is formed over. At the upper part of the wafer container 4, a lid member 12 having an outer wall portion extending upward at an outer edge portion is provided, and a pair of rib portions 13 extending in the front-rear direction are formed on the lid member 12 at right and left intervals. ing.
[0029]
As described above, the upper and

lower buffers

1 and 2 are each formed of a foam molded body manufactured by using a bead method using pre-expanded particles made of a polyolefin resin. As the polyolefin-based resin, polyethylene, polypropylene, a styrene / ethylene composite polymer, or the like can be adopted, and a foamed molded article made of polyethylene is preferable because it is hard to crack.
[0030]
The upper buffer 1 will be described. As shown in FIGS. 4 to 9, a rectangular base 21 having a fitting recess 20 formed on the upper part of the wafer container 4 is provided. A square opening 22 is formed at the center of the wall, and a pair of side buffer protrusions 23 are formed in the front, rear, left and right side walls of the base 21 at intervals from each other so as to protrude. Four holding projections 24 projecting toward the fitting recess 20 are formed on the left and right side walls of the base 21 so as to correspond to the side buffer projections 23. On the lower surface of the upper wall of the base portion 21, a pair of left and right pressing portions 25 extending in the front-rear direction and abutting on the left and right portions of the lid member 12 of the wafer container 4 are formed to protrude downward. At the same time, a pair of front and rear center pressing portions 26 abutting on the center portion of the lid member 12 of the wafer container 4 is formed so as to protrude downward. On the upper surface side of the upper wall portion of the base portion 21, a substantially rectangular frame-shaped annular buffering projection 27 formed so as to surround the opening 22, and inward from the middle of two front and rear sides of the annular buffering projection 27. An upper buffering projection 29 having an extended auxiliary buffering projection 28 is formed to project upward.
[0031]
With the upper and

lower buffers

1 and 2 attached to the wafer container 4 and loaded into the outer box 5, the front and rear side walls of the base 21 and the holding projections 24 abut on the upper side surface of the wafer container 4. At the same time, the left and right holding parts 25 and the center holding part 26 are in contact with the upper surface of the lid member 12 of the wafer container 4, the upper part of the wafer container 4 is held by the upper buffer 1, and the side buffer protrusions 23 are The upper buffer protrusion 29 abuts on the inner surface of the side wall of the outer box 5, and the upper buffer projection 29 abuts on the ceiling of the outer box 5, so that the wafer container 4 is buffered and held by the outer box 5 via the upper buffer 1. You. However, in the configuration of the upper buffer 1 other than the upper buffer protrusion 29, the arrangement position and shape thereof may be set arbitrarily according to the configuration of the wafer container 4.
[0032]
The annular buffer protrusion 27 and the auxiliary buffer protrusion 28 are formed in a trapezoidal cross section, and a contact surface 30 that contacts the ceiling of the outer box 5 is continuously formed on the upper surface thereof. A substantially circular wide portion 31 wider than the four sides of the annular buffer projection 27 is formed at the junction of the four corners of the annular buffer projection 27 and the annular buffer projection 27 and the auxiliary buffer projection 28, and the load at the time of a drop impact is formed. Is collectively absorbed by the wide portion 31 so that the buffering performance can be improved. However, at the time of the wide portion 31 and the auxiliary buffer, it is preferable to provide the buffer portion in order to improve the buffer performance, but it is not always necessary and may be omitted.
[0033]
The annular buffering projection 27 and the auxiliary buffering projection 28 are arranged such that the center line L1 thereof is located on the center line L2 of the left and right holding section 25 and the center line L3 of the center holding section 26, and the left and right holding section 25 and the center holding section 25 are arranged. An upward load from the wafer container 4 acting on 26 is configured to be efficiently received by the annular buffer protrusion 27 and the auxiliary buffer protrusion 28.
[0034]
In the buffer for a silicon wafer having a diameter of 12 inches, for example, the height of the annular buffering projection 27 and the auxiliary buffering projection 28 is 22 mm, the width of the base on the base 21 side is 25 mm, and the contact surfaces 30 of the

buffering projections

27 and 28 are provided. Is set to 15 mm, the radius of the base of the wide portion 31 is set to 25 mm, and the radius of the contact surface 30 in the wide portion 31 is set to 20 mm. In addition, the thickness of the upper wall portion of the base portion 21 is set to 15 mm, and the heights of the holding

portions

25 and 26 are set to 17 mm. However, these dimensions are appropriately set according to the size of the semiconductor wafer 3.
[0035]
The lower buffer 2 will be described. As shown in FIGS. 4, 5, and 10 to 13, a square base portion 41 having a fitting concave portion 40 externally fitted to the lower portion of the wafer container 4 is provided. A pair of side buffer protrusions 43 are formed in the front, rear, left and right side wall portions of the base portion 41 at an interval from each other so as to protrude. Four holding projections 44 projecting to the side are formed corresponding to the side buffer projections 43. A pair of left and right mounting surfaces 45 on which the legs 10 of the wafer container 4 are mounted are formed on the upper side of the lower wall of the base portion 41, and the expansion of the wafer container 4 is provided between the left and right mounting surfaces 45. Three receiving portions 46 for receiving the protrusions 11 are formed so as to protrude upward. On the lower surface side of the lower wall portion of the base portion 21, a substantially rectangular frame-shaped annular buffering protrusion 47 is provided from the outer edge portion of the base portion 41 to a slightly central portion side, and a halfway portion of two front and rear sides of the annular buffering protrusion 47. And a lower buffering projection 49 having a partitioning buffering projection 48 for partitioning the inside of the annular buffering projection 47 into two parts is formed in a downwardly projecting shape. Reference numeral 42 denotes a projection for filling a gap formed between the left and right flaps when the lower flap of the outer box 5 is closed.
[0036]
Then, in a state where the upper and

lower buffers

1 and 2 are attached to the wafer container 4 and loaded into the outer box 5, the holding projections 44 are brought into contact with the side surfaces and the front and rear surfaces of the legs 10 of the wafer container 4, The leg 10 of the wafer container 4 is mounted on the mounting surface 45, and the bulging portion 11 of the wafer container 4 is mounted on the receiving portion 46, and the lower portion of the wafer container 4 is held by the lower buffer 2. In addition, the side buffer protrusion 43 is in contact with the inner surface of the side wall of the outer box 5, and the lower buffer protrusion 49 is in contact with the bottom surface of the outer box 5. 4 is buffered and held in the outer box 5. However, in the configuration of the lower buffer 2 other than the lower buffer projection 49, the arrangement position and shape thereof may be arbitrarily set according to the configuration of the wafer container 4.
[0037]
The annular buffer projection 47 and the partition buffer projection 48 are formed in a trapezoidal cross section, and a contact surface 50 that contacts the bottom surface of the outer box 5 is continuously formed on the lower surface thereof. A substantially circular wide portion 51 wider than the four sides of the annular buffering projection 47 is formed at the converging portion of the four corners of the annular buffering projection 47, the annular buffering projection 47, and the partitioning buffering projection 48. Is absorbed intensively by the wide portion 51 so that the buffering performance can be improved. However, the partition buffer protrusion 48 may be omitted, or a plurality of partition buffer protrusions 48 may be formed. Further, the wide portion 51 may be omitted. Also, instead of the partition buffer protrusion 48, an island buffer protrusion may be formed inside the annular buffer protrusion 47 and separated from the annular buffer protrusion 47.
[0038]
The annular buffer protrusion 47 and the partition buffer protrusion 48 are arranged such that their center lines L4 are located on the center line L5 of the left and right mounting surfaces 45 and the center line L6 of the receiving portion 46, respectively. It is configured such that a downward load acting on the wafer container 4 from the wafer container 4 can be efficiently received by the annular buffer projection 47 and the partition buffer projection 48.
[0039]
In a buffer for a silicon wafer having a diameter of 12 inches, for example, the height of the annular buffer projection 47 and the partition buffer projection 48 is 22 mm, the width of the base is 25 mm, and the width of the contact surface 50 in the

buffer projections

47 and 48 is 15 mm. The radius of the base of the wide portion 51 is set to 25 mm, and the radius of the contact surface 50 in the wide portion 51 is set to 20 mm. In addition, the thickness of the lower wall of the base portion 41 is set to 15 mm, and the height of the receiving portion 46 at the lowest position is set to 8 mm. However, these dimensions are appropriately set according to the size of the semiconductor wafer 3.
[0040]
The

annular buffer projections

27 and 47 are preferably formed in a continuous annular shape, but those having a partially missing shape are also within the scope of the present invention. Further, it is not always necessary to form it in a square shape, and it can be formed in an arbitrary shape such as a circle or an ellipse according to the shape of the contact surface with the wafer container 4.
[0041]
Next, the process of completing the present invention will be described.
First, as shown in FIG. 4, the set value in the height direction in the outer dimension of the outer box 5 of the cardboard case from the New Metal Association Silicon Committee is determined to be 460 mm, and as shown in FIG. If the total thickness of the single-layer part is 10 mm and the total thickness of the two-layer part is 26 mm, the exterior The height of the space in the box 5 is 434 to 450 mm. In this case, the buffer package is designed, and the dimension obtained by subtracting the height of the wafer container 4 is the thickness given to one set of the

buffer bodies

1 and 2, which is between 37 mm to 65 mm on one side and about 50 mm on one side. Thickness is provided for the

cushions

1,2.
As the material of the foamed resin cushioning material, a polyolefin-based bead foamed polyethylene and a beaded foamed polypropylene were selected, which are flexible and do not greatly reduce the buffer coefficient due to repeated drops.
[0042]
First, the area (pressure receiving area) of the buffer projections of the

buffer bodies

1 and 2 that receive an impact when dropped, which is the basis of the buffer packaging design, is determined. The pressure receiving area A is given by the following equation:
A = GW / σmax
The above-mentioned G value = 54G, W (gross product weight) = 8 kg, σmax (maximum stress of the buffer bodies 1 and 2) = 2.8 kg / cm ² (Expanded polyethylene 38 times expanded product), (Expanded polypropylene 45 times product = 2.7 kg / cm) ² ) To 155cm ² (160cm ² ) Got. From here, the design of the buffer packaging was started. As for the cushioning design in the lateral direction, as described above, the

cushioning bodies

1 and 2 have a sufficient thickness, so that a normal cushioning packaging design can be performed, and a low G value can be used to receive a shock at the time of a fall. .
[0043]
Since the pressure receiving area and the drop height have been determined, the G value cannot be basically changed. Therefore, in the examination of the shape of the cushioning protrusion, various shapes are examined for any improvement in the cushioning performance. First, a buffer package is designed by the conventional method of FIG. 1 and dropped by 100 cm (all of the following drop tests are 100 cm), and it is confirmed whether or not the silicon wafer 3 stored in the wafer container 4 has changed. Phenomena such as detachment from the support in the container 4, rotation, and damage to the wafer 3 themselves occurred, and it was found that the buffering effect could not be expected by the conventional method.
[0044]
Thereafter, it was found that it is preferable that the center line of the support surface of the wafer container 4 in the buffer and the center line of the buffer protrusion are aligned vertically, and the total pressure receiving area of the buffer protrusion is divided into several elongated strips. As a result of a drop test in which the center line of the buffer projection was aligned with the center line of the support surface of the wafer container 4 in the buffer, the buffer performance was improved. However, it was still insufficient to protect the wafer 3 from impact.
[0045]
Next, the center line of the position where the buffer supports the wafer container and the center line of the buffer protrusion are matched (the following buffer protrusion adopts this method), and the shape of the buffer protrusion is a closed ring. When a drop test was performed, the buffer performance was greatly improved. This is probably because even in the case where the G value cannot be changed, the shock-absorbing projections are closed and annular, so that the impact stress at the time of drop is evenly distributed and the vibration at the time of drop is suppressed.
[0046]
Further, drop test results have been obtained in which the method of partitioning the inside of the closed annular collision projection or forming an island at the center improves the cushioning performance.
[0047]
Finally, the present invention has attained its object, as a closed annular shape having a closed cushioning projection, a shape with an inner section or an island at the center may be used. The width of the ring-shaped square portion is made wider than the four side portions, so that the stress at the time of the drop impact is intensively absorbed by the square portion. As a result of the drop test in this shape, the movement of the silicon wafer 3 in the wafer container 4 is stopped, the possibility of damage is reduced, and the strict buffer performance required in the design of the buffer protrusion shape can be satisfied even with a thin wall. Proved.
[0048]
Next, a comparative test will be described.
(Comparative Example 1)
The

buffer bodies

61 and 62 shown in FIG. 14 are manufactured by a packaging design based on the conventional method as shown in FIG. 1, and both the upper and

lower buffer bodies

61 and 62 have buffer projections 64 that contact the top surface and the bottom surface of the outer box 5. It is arranged at four corners, and has a shape having two buffer protrusions 63 on each side in the four side directions. The opening 65 in the upper buffer 61 is for viewing the identification of the contents affixed to the wafer container.

Buffers

61 and 62 were manufactured by cutting a 38-fold foamed polyethylene product and a 45-fold foamed polypropylene product as designed. Next, a package was manufactured in which the wafer container 4 containing 325 12-inch silicon wafers was inserted and arranged above and below the cardboard case shown in FIG. Then, a drop test from a height of 100 cm was performed on each of the six corners and three ridges using ten pieces of this package, and Table 1 (drop tests 1 and 2) (however, 1 other than the bottom surface and the top surface) was used. Rotation of the wafer 3 by two kinds of

cushions

61 and 62 made of foamed polyethylene 38 times foamed product and foamed polypropylene 45 times product, as shown in FIG. , Coming off and cracking. The buffer 62 made of 45-fold foamed polypropylene itself was damaged at the first drop. In addition, "rotation" in the evaluation item is performed by marking the wafer 3 and visually checking whether or not the marking position of the wafer 3 is moving. If not, it was marked as “○”. "Disengagement" is visually confirmed whether or not the wafer 3 is detached from the wafer loading rail formed in the wafer container 4, and is "X" if it is detached, "O" if it is not detached. And The “crack” is visually checked to see if the wafer 3 has cracks or cracks. If the crack or crack has occurred, “x”; if the crack or crack has not occurred, "O" was set. Further, the drop test of Comparative Example 2 and Inventive Examples 1, 2, and 3 described below was performed in the same manner as in Comparative Example 1.
[0049]
[Table 1]

[0050]
(Comparative Example 2)
The

buffer bodies

71 and 72 shown in FIG. 15 support the wafer container 4 in the

buffer bodies

71 and 72 by setting the center line position of the buffer projection 73 having the same pressure receiving area as the buffer projection 63 of the

buffer bodies

61 and 62 shown in FIG. The shape of the buffer projection 73 of the upper buffer 71 is made into two long strips, and the shape of the buffer projection 73 of the lower buffer 72 is made into three long strips. Tried to disperse from the center. The prototype was made only of a foamed polyethylene foam 38 times. As shown in Table 2 (Drop test 3), the results of the drop test using the

buffers

71 and 72 can prevent cracking of the wafer 3 at the first drop and can be improved, but the silicon wafer 3 still rotates and comes off.
[0051]
[Table 2]

[0052]
(Example 1 of the present invention)
The

buffer bodies

81 and 82 shown in FIG. 16 have the same pressure receiving area as the buffer projections 73 of the

buffer bodies

71 and 72 shown in FIG. 15, but have the same pressure receiving area as the

buffer bodies

61 and 62 shown in FIG. The position was made coincident with the center line of the support surface of the wafer container 4 in the

buffers

81 and 82, and the shape was a closed rectangular ring. The prototype was made only of a foamed polyethylene foam 38 times. The results of the drop test using the

shock absorbers

81 and 82 were greatly improved as shown in Table 3 (drop test 4). Although the rotation of the wafer 3 was observed on the top surface at the second drop, the damage of the wafer 3 was Cracks only occurred for the first time after the third drop.
[0053]
[Table 3]

[0054]
(Example 2 of the present invention)
The

buffers

91 and 92 shown in FIG. 17 have the same pressure receiving area as the buffer projections 83 of the

buffers

81 and 82 shown in FIG. , The shape of the supporting surface of the wafer container 4 is matched with the center line, and the shape is a closed rectangular ring. Further, at the center of the rectangular shape, one partition buffer protrusion 94 connecting the front and rear sides of the buffer protrusion 93 is added ( The upper buffer 91 has an interrupted shape due to the opening 95). Trial production was performed using only a 38-fold expanded polyethylene foam product and subjected to a drop test. The results of the drop test using the

buffers

91 and 92 are as shown in Table 4 (drop test 5). The rotation of the wafer 3 was observed at the third drop of the top surface. The crack of the silicon wafer 3 did not occur even if it was dropped three times. Three or more drops are unlikely to occur in reality, so it can be said that they almost passed.
[0055]
[Table 4]

[0056]
(Example 3 of the present invention)
The

buffer bodies

1 and 2 shown in FIGS. 6 to 13 have the same pressure receiving areas as the

buffer projections

93 and 94 of the

buffer bodies

91 and 92 shown in FIG. 17, but have the same cushioning projections as the

buffer bodies

81 and 82 shown in FIG. The position of the center line 83 coincides with the center line of the support surface of the wafer container 4 in the

buffers

1 and 2, the shape is a closed rectangular ring, and a partition buffer protrusion 48 is added at the center of the square. In addition to stress distribution, the width of the square corner was made wider than the width of the four sides. For the trial production, both a foamed polyethylene 38 times expanded product and a foamed polypropylene 45 times product were subjected to a drop test. The results of the drop test using the

buffers

1 and 2 are as shown in Table 5 (drop tests 6 and 7). In the test of three drops, no abnormality of the wafer 3 was observed at all. However, in the case of the 45 times expanded polypropylene, the buffer 2 itself was damaged at the third drop.
[0057]
[Table 5]

[0058]
【The invention's effect】
When the diameter of the silicon wafer is increased to 12 inches, the total weight of the stored containers is increased, the thickness given to the buffer is reduced from the height of the air cargo compartment, and the drop height is required to be reduced from the conventional 50 cm to 100 cm. Up to the point where conventional cushioning packaging designs could not cope. In view of such a situation, the present invention considers that the shape of the buffer projection protruding from the base of the buffer body is a closed ring, a closed rectangular ring for a rectangular container, and an island that is partitioned or centered in the ring. By providing a part and making the closed square ring-shaped square part wider than the width of the four sides, the cushioning performance can be greatly improved, and even in the outer cardboard case determined by the Silicon Committee, The silicon wafer in the wafer container was prevented from being damaged by vibration and impact during transportation.
[Brief description of the drawings]
FIG. 1A is a front view of a shock absorber according to a conventional shock absorber packaging design, and FIG. 1B is a bottom view of the shock absorber.
FIG. 2 (a) is a plan view of a shock absorber found in a US patent, and FIG. 2 (b) is a cross-sectional view taken along line AA of FIG. 2 (a).
FIG. 3 is a graph showing the relationship between the number of drops and a buffer coefficient C;
FIG. 4 is an exploded perspective view showing a state where the wafer container is stored in an outer box.
FIG. 5 is a longitudinal sectional view showing a state where a wafer container is stored in an outer box.
FIG. 6 is a plan view of an upper buffer according to a third embodiment of the present invention.
FIG. 7 is a bottom view of the shock absorber.
FIG. 8 is a sectional view taken along line AA of FIG. 6;
9 is a sectional view taken along line BB of FIG. 6;
FIG. 10 is a plan view of a lower buffer according to a third embodiment of the present invention.
FIG. 11 is a bottom view of the shock absorber.
FIG. 12 is a sectional view taken along line AA of FIG. 10;
FIG. 13 is a sectional view taken along line BB of FIG. 10;
14A is a bottom view of the lower buffer of Comparative Example 1, and FIG. 14B is a plan view of the upper buffer of Comparative Example 1.
15A is a bottom view of a lower buffer of Comparative Example 2, and FIG. 15B is a plan view of an upper buffer of Comparative Example 2. FIG.
16A is a bottom view of the lower buffer of the first embodiment of the present invention, and FIG. 16B is a plan view of the upper buffer of the first embodiment of the present invention.
17A is a bottom view of the lower buffer of the second embodiment of the present invention, and FIG. 17B is a plan view of the upper buffer of the second embodiment of the present invention.
[Explanation of symbols]
1 Upper buffer 2 Lower buffer
3 wafer 4 wafer container
5 Outer box
10 legs 11 bulge
12 Lid 13 Rib
20 Fitting recess 21 Base part
22 Opening 23 Side buffer protrusion
24 Holding projection 25 Left and right holding part
26 Central holding part 27 Annular buffer protrusion
28 Auxiliary buffer protrusion 29 Upper buffer protrusion
30 abutment surface 31 wide part
40 Fitting recess 41 Base part
42 projection 43 side buffer projection
44 Holding projection 45 Mounting surface
46 Receiving part 47 Annular buffer protrusion
48 Section buffer protrusion 49 Lower buffer protrusion
50 Contact surface 51 Wide part
61 Upper buffer 62 Lower buffer
63 buffer protrusion 64 buffer protrusion
65 opening
71 Upper buffer 72 Lower buffer
73 buffer projection
81 Upper buffer 82 Lower buffer
83 buffer projection
91 Upper buffer 92 Lower buffer
93 Buffer projection 94 Partition buffer projection
95 opening

Claims

When accommodating a wafer container accommodating a plurality of semiconductor wafers in an outer box, a set of foamed resin buffers arranged above and below the wafer container between the outer box and the wafer container. A wafer container buffer characterized in that a buffer projection is provided in the base portion of the foamed resin buffer body protrudingly in contact with the bottom and ceiling of the outer box in the outer box, and the buffer projection is formed in a closed annular shape.

2. The wafer container buffer according to claim 1, wherein the buffer projection is formed in a closed rectangular shape.

3. The wafer container buffer according to claim 2, wherein at least four corners of said buffer projection are wider than four sides.

The wafer container buffer according to any one of claims 1 to 3, wherein a partition buffer projection that partitions an inside of the buffer protrusion or an island buffer protrusion arranged in an island shape in the ring is formed at substantially the same height as the buffer protrusion. body.

The wafer container buffer according to any one of claims 1 to 4, wherein the one set of buffers is made of a polyolefin resin foam molded by a bead method.

The wafer container buffer according to claim 5, wherein the polyolefin resin is polyethylene.

7. The wafer container buffer according to claim 1, wherein the semiconductor wafer is a silicon wafer having a diameter of 12 inches.