JP2007119020A - Shock absorbing material for transportation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shock absorbing material for transportation which can be used even for different types of FOSB (substrate storage container) and protects a semi-conductor wafer properly from a shock and vibration during transportation. <P>SOLUTION: This shock absorbing material is provided with a square tube shaped shock absorbing material body 11 positioned in a carton box, the first protruding parts 12a-12h which protrude on each outside face of the material body with a predetermined interval and are provided extensively in the axis direction of the material body having a trapezoidal cross section, the second protruding parts 13a-13h which protrude on the outside of the corner of the body in the side face extending direction of the body and are provided extensively in the axis direction of the body having a trapezoidal cross section, and the third protruding parts 14a-14h which protrude with a predetermined interval on the inside of each side face of the body and are provided extensively in the axis direction of the body having a trapezoidal cross section. The third protruding parts are brought into contact with the side face of a substrate storage container and the first and the second protruding parts are brought into contact with the inside face of the carton box. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a transfer cushioning material, for example, a transfer cushioning material for a substrate storage container disposed inside a carton box.

Along with the recent increase in the diameter of semiconductor wafers and the like, the size of a substrate storage container used for transporting a semiconductor wafer has increased, and the shape of the container has also become complicated.
A substrate storage container used for transporting a semiconductor wafer is generally called a FOSB (Front Opening Shipping Box), which is a manual FOSB that manually opens and closes the lid and stores the semiconductor wafer W, and a dedicated device. There is an automatic door-FOSB that automatically opens and closes the lid.

An example of a conventional manual FOSB (substrate storage container) will be described with reference to FIG.
As shown in FIG. 4, the FOSB (substrate storage container) 20 has a box 21 for placing a semiconductor wafer W on a rib piece 21 a and arranging and storing a plurality of wafers in a vertical direction, and a front surface of the box 21 that is open. It is comprised from the cover body 22 opened and closed via packing 22a. The operator manually opens and closes the lid 22 to store the semiconductor wafer W.

  A FOSB (substrate storage container) containing semiconductor wafers is packed and transported in a cardboard carton box. At this time, a buffer material is disposed between the FOSB (substrate storage container) and the carton box in order to protect the semiconductor wafer in the FOSB (substrate storage container) from vibration and impact during transportation.

By the way, since the specifications of the FOSB (substrate storage container) are different for each manufacturer, the shapes thereof are various.
On the other hand, the shape of the cushioning material is designed in accordance with the shape of the side surface and the bottom surface of FOSB (substrate storage container). For this reason, as described above, when the shape of the FOSB (substrate storage container) to be used is diversified, different cushioning materials are required depending on the shape of the FOSB (substrate storage container).

In general, the FOSB (substrate storage container) is determined by a semiconductor wafer manufacturer in response to an instruction from a device manufacturer as a customer. For this reason, when the FOSB (substrate storage container) used is changed in accordance with an instruction from the device manufacturer, the semiconductor wafer manufacturer needs to change the design of the buffer material.
As the material of the cushioning material, corrugated cardboard, polyethylene foam material, polypropylene die-cutting material, etc. are generally used.
Therefore, when a molding material such as a polyethylene foam material is used as the cushioning material, it is necessary to produce a molding die, and the cost burden is large. In addition, in the semiconductor wafer manufacturer, it is necessary to manage the buffer material for each type of FOSB (substrate storage container), and management work and the like are complicated.

  Therefore, the applicant of the present invention is not limited to the FOSB (substrate storage container) that is manufactured in conformity with the SEMI standard (M31), although the overall external dimensions vary depending on the shape of the corner portion (corner portion). Focusing on the fact that it has a portion with common dimensions, we have intensively studied the shape of the cushioning material that can be used even if the type of FOSB (substrate storage container) is different. Furthermore, the applicant of the present application has intensively studied a cushioning material having a shape suitable for protecting a semiconductor wafer from vibration and impact during transportation, and has completed the present invention.

  The present invention has been made in view of the above circumstances, and can be used even if the type of FOSB (substrate storage container) is different, and it can be suitably protected from vibration and impact during transportation. An object is to provide a cushioning material.

  The transfer cushioning material according to the present invention made to achieve the above object is a transfer cushioning material disposed between the carton box and the substrate storage container when the substrate storage container is stored in the carton box. A rectangular cylindrical cushioning material body disposed in the carton box, and protrudes outside the respective side surfaces of the cushioning material body with a predetermined interval, and extends in the axial direction of the cylindrical cushioning material body. A cross-sectional shape having a trapezoidal first projecting portion and an outer side of the corner portion of the cushioning material main body, projecting in the side surface extension direction of the cushioning material main body, and extending in the axial direction of the cylindrical cushioning material main body Has a trapezoidal second projecting portion and a third portion having a trapezoidal cross section extending in the axial direction of the cylindrical cushioning material main body and projecting inside the respective side surfaces of the cushioning material main body at a predetermined interval. And the third protrusion is housed in the substrate. Vessel abuts against the side surfaces of the first and second protrusions are characterized by abutting the side surface in the carton box.

As described above, since the third protrusion is configured to hold the side surface of the substrate storage container, the substrate storage container having a different corner portion (corner portion) shape or the like can be used as one type of cushioning material. Can be securely held.
As a result, the cost burden is small, and the buffer material management work and the like can be easily performed.

Here, it is preferable that a space is formed between the pair of second protrusions provided at one corner of the cushioning material body and the corner of the carton box.
As described above, since the cushioning material is not disposed at the inner corner portion of the carton box, the impact can be effectively absorbed by deforming the corner portion of the carton box at the time of collision.

Moreover, it is desirable to provide a spacer having a height dimension smaller than the dimension in the height direction of the cylindrical cushioning material main body and fitted between the third protrusions formed on the cushioning material main body.
As described above, by using the spacer, the substrate storage containers having different heights can be reliably held by one kind of cushioning material.

  The transfer cushioning material according to the present invention having the above-described configuration can be used even if the type of FOSB (substrate storage container) is different, and suitably protects the semiconductor wafer from vibration and impact during transfer. The buffer material for conveyance which can be obtained can be obtained.

Hereinafter, an embodiment of a transfer cushioning material according to the present invention will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a plan view of the transfer cushioning material according to the embodiment of the present invention, and FIG. 2 is an explanatory view showing a use state of the transfer cushioning material according to the embodiment of the present invention.
In these drawings, reference numeral 1 denotes a transfer buffer material (hereinafter referred to as a buffer material), and when the FOSB (substrate storage container) 20 is stored in the carton box C and transported, the carton box C and the FOSB ( The FOSB (substrate storage container) 20 is arranged between the substrate storage container (20) and the semiconductor wafer W in the FOSB (substrate storage container) 20 is protected from vibration and impact during transportation.

  In particular, the cushioning material 1 is disposed between the side surface of the FOSB (substrate storage container) 20 and the inner side surface of the carton box C. Accordingly, another buffer material, for example, a flat plate shape, is provided between the bottom surface of the FOSB (substrate storage container) 20 and the inner bottom surface of the carton box C, and between the upper surface of the FOSB (substrate storage container) 20 and the ceiling surface of the carton box C. A cushioning material is arranged.

  The cushioning material 1 is provided with a square cylindrical cushioning material main body 11 and protruding outside the respective side surfaces of the cushioning material main body 11 with a predetermined interval, and extends in the axial direction of the cylindrical cushioning material main body. The first protrusions (12a, 12b), (12c, 12d), (12e, 12f), (12g, 12h) having a trapezoidal cross-sectional shape are formed outside the corners of the cushioning material body 11, Second protrusions (13a, 13b), (13c, 13d) having a trapezoidal cross-sectional shape provided so as to protrude in the side surface extension direction of the buffer material body and extending in the axial direction of the cylindrical buffer material body, (13e, 13f), (13g, 13h), and a cross-sectional shape that is provided on the inner side of each side surface of the cushioning body 11 with a predetermined interval and extends in the axial direction of the cylindrical cushioning body. Trapezoidal third protrusions (14a, 14b), (14c, 1 d), (14e, 14f), and is configured from a (14g, 14h).

Also, the tip of the first protrusions (12a, 12b), (12c, 12d), (12e, 12f), (12g, 12h) and the second protrusions (13a, 13b), (13c, 13d) , (13e, 13f), (13g, 13h), the outer dimensions of the cushioning body 11 need to be stored in the carton box C without rattling. They are set to approximately the same dimensions.
On the other hand, the internal dimensions of the cushioning body 11 formed at the tips of the third protrusions (14a, 14b), (14c, 14d), (14e, 14f), (14g, 14h) are FOSB (substrate storage Since it is necessary to store the container 20 without rattling, the outer dimensions of the FOSB (substrate storage container) 20 are set to be approximately the same.

The first protrusions (12a, 12b), (12c, 12d), (12e, 12f), (12g, 12h) are not particularly limited in terms of the number and shape provided on each side surface, but the cylindrical buffer A cross-sectional shape extending in the axial direction (height direction) of the material main body is preferably a trapezoidal shape from the viewpoint of effectively absorbing an impact.
With such a configuration, the first protrusions (12a, 12b), (12c, 12d), (12e, 12f), (12g, 12h) are in contact with the inner surface of the carton box C, and the cushioning body 11 movements can be limited.

In particular, the second protrusions (13a, 13b), (13c, 13d) having a trapezoidal cross-section provided outside the corners of the shock absorber main body 11 so as to protrude in the side surface extension direction of the shock absorber main body, (13e, 13f), (13g, 13h) are formed, and no cushioning material that contacts the inner corner of the carton box C is provided.
That is, no cushioning material is disposed at the inner corner of the carton box C, and a space A is formed. In this way, the cushioning material is not disposed at the inner corner of the carton box C. The corner of the carton box C is likely to collide during transportation. When the carton box C collides, the corner of the carton box C is deformed to cause an impact. This is to absorb effectively.

  The third protrusions 14 (14a, 14b), (14c, 14d), (14e, 14f), and (14g, 14h) are cylindrical, two on each side of the FOSB (substrate storage container) 20. The buffer material body is formed so as to extend in the axial direction, and is configured to contact and hold a side surface of a FOSB (substrate storage container) 20 accommodated in the buffer material body 11. A space B is formed so that the inner corner B of the cushioning body 11 does not contact the FOSB (substrate storage container) 20.

  Here, when the FOSB (substrate storage container) 20 to be transported is a manual FOSB for storing a semiconductor wafer having a diameter of 300 mm, the curved surface shape of the corner of the FOSB (substrate storage container) 20 differs depending on the company, but the SEMI standard is used. Since it complies with (M31), it has a portion common to the external dimensions (side dimensions).

For this reason, the third protrusions 14 (14a, 14b), (14c, 14d), (14e, 14f), (14g, 14h) holding the FOSB 20 (substrate storage container) are provided on the FOSB 20 (substrate storage container). It is formed so as to abut only on a portion having a common external dimension on the side surface.
In other words, the space B is formed so as not to hold the corners of the FOSB (substrate storage container) 20 having different dimensions and shapes, and the space B is formed so as to be in contact with the eight side portions having the same external dimensions. Yes.

  In addition, as a material of the buffer material 1, a cardboard, a polyethylene foam material, a polypropylene die-cut material, etc. can be used like the past.

Next, the spacer used when the heights of the substrate storage containers are different will be described. For example, the automatic door-FOSB is designed so that the height of the FOSB (substrate storage container) is about 5 mm to 100 mm lower than the manual FOSB.
Therefore, when the cushioning material manufactured corresponding to the height of the manual FOSB (substrate storage container) is used for the automatic door-FOSB (substrate storage container), a gap is formed above the cushioning material. That is, the automatic door-FOSB (substrate storage container) is not securely held in the vertical direction (height direction), and may move within the cushioning material.

In order to prevent this, as shown in FIGS. 3A and 3B, spacers 14 that are inside the cushioning body 11 and have a certain thickness between the second protrusions 14 are provided. It is fitted and the gap is closed.
As shown in FIG. 3 (b), the spacer 14 is located on the inner side of the cushioning body 11 and can be fitted between the second protrusions 13 to form a second protrusion from the rectangle. The shape is obtained by removing the portion 13.
Further, the thickness is not particularly limited, but at least the height is smaller than the size of the cushioning body 11 in the height direction. Specifically, it is preferably in the range of 5 mm to 150 mm so as to be able to cope with the case where the height of FOSB differs by about 5 mm to 100 mm. Furthermore, the material is preferably formed of a polyethylene foam material. In addition to this, the material of the spacer can be changed to a silicon elastomer resin or silicon rubber having higher anti-vibration properties in consideration of the case weight, transportation condition, and the like.

  As described above, the spacer 14 having a certain thickness is fitted between the third protrusions 14 and the gap is closed, so that the FOSB (substrate storage container) is in the vertical direction (height direction). In this case, the movement of the FOSB (substrate storage container) in the buffer material is restricted. In addition, by using the spacer 14, the common cushioning material 1 can be used for FOSBs (substrate storage containers) having different heights.

In the above-described embodiment, the FOSB that stores the semiconductor wafer W having a diameter of 300 mm has been described as an example. However, the present invention is not limited to this, and the FOSB (substrate storage) that stores semiconductor wafers of different sizes. It can also be used as a buffer material for containers.
In this case, if the size of the semiconductor wafer is different, the external dimensions of the FOSB (substrate storage container) are greatly different. Therefore, it is necessary to prepare a buffer material for each size of the semiconductor wafer to be stored.

  The present invention is not limited to the buffer material for transporting the substrate storage container, and can be widely used as a buffer material for containers having different corner shapes.

FIG. 1 is a plan view of a transfer cushioning material for a substrate storage container according to the present invention. FIG. 2 is an explanatory view showing a state in which the transfer buffer material of the substrate storage container according to the present invention is used. Fig.3 (a) is explanatory drawing which shows the state which fitted the spacer in the shock absorbing material concerning this invention, FIG.3 (b) is a top view which shows a spacer. FIG. 4 is a schematic explanatory diagram of the substrate storage container.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Buffer material 11 Buffer material main body 12 1st protrusion part 13 2nd protrusion part 14 Spacer 20 Board | substrate storage container (FOSB)
W Semiconductor wafer

Claims (3)

When storing the substrate storage container in the carton box, a transfer cushioning material disposed between the carton box and the substrate storage container,
A rectangular cylindrical cushioning material body disposed in the carton box;
A first protrusion having a trapezoidal cross-sectional shape extending in the axial direction of the cylindrical shock-absorbing material body, projecting outside the side surfaces of the shock-absorbing material body with a predetermined interval;
A second projecting portion having a trapezoidal cross-sectional shape extending in the axial direction of the cylindrical cushioning material main body, projecting in the side surface extending direction of the cushioning material main body on the outer side of the corner of the cushioning material main body
A third projecting portion having a trapezoidal cross-sectional shape extending in the axial direction of the cylindrical cushioning material body, projecting inside each side surface of the cushioning material body at a predetermined interval;
The transfer cushioning material, wherein the third projecting portion contacts the side surface of the substrate storage container, and the first and second projecting portions contact the inner surface of the carton box.   The space according to claim 1, wherein a space is formed between a pair of second protrusions provided at one corner of the cushioning material main body and a corner of the carton box. Cushioning material.   It has a height dimension smaller than the dimension of the height direction of the said cylindrical buffer material main body, and is provided with the spacer engage | inserted between the 3rd protrusion parts formed in the said buffer material main body. Claim | item 1 or the buffer material for conveyance described in Claim 2.

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