JP2018101676A - Coating device and coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform application accurately by holding a substrate securely on a stage.SOLUTION: A coating device 1 includes a stage 4 on which a substrate S is placed, a coating part 6 for coating a liquid material L on the substrate S on the stage 4, a suction part 9 provided on the stage 4 for sucking the placed substrate S, a clamp mechanism 10 which is movable forward and backward relative to the upper part of the stage 4 and which presses a part of the substrate S placed on the stage 4 at the advanced position to the stage 4, and a driving unit 5 for relatively moving the stage 4 and an application part 6.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a coating apparatus and a coating method.

  There is known a coating apparatus that applies a liquid material to a substrate placed on a stage. For example, while applying the coating liquid to the substrate, with the plurality of positions on the back surface of the substrate being sucked and held, the substrate is pressed against the surface of the stage, and a plurality of sucking portions that hold the substrate flat with respect to the stage are provided. A coating apparatus provided has been proposed (for example, Patent Document 1 below).

JP 2013-0699969 A

  The substrate may be warped depending on the material or size. If the substrate is warped, the substrate may not be completely held on the stage. If the substrate cannot be completely held on the stage, the coating accuracy deteriorates, and the substrate and the nozzle may collide and the substrate or the nozzle may be damaged.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating method capable of coating with high accuracy by securely holding a substrate on a stage.

  According to the first aspect of the present invention, a stage on which the substrate is placed, an application unit that applies a liquid material to the substrate on the stage, an adsorption unit that is provided on the stage and adsorbs the placed substrate, A clamp mechanism that can move forward and backward with respect to the stage, and presses a part of the substrate placed on the stage at the advanced position, and a drive unit that relatively moves the stage and the application unit; An applicator is provided.

  According to the second aspect of the present invention, there is provided a method of applying a liquid material to a substrate, wherein the substrate is placed on the stage, and the clamp mechanism is advanced above the stage and placed on the stage. While pressing a part of the substrate against the stage by the clamp mechanism, adsorbing the substrate to the stage by the adsorption unit, retreating the clamp mechanism above the stage and moving the stage and the application unit relatively, Applying a liquid material to a substrate adsorbed on a stage by an application unit.

  According to the third aspect of the present invention, a stage on which the substrate is placed, an application unit that applies a liquid material to the substrate on the stage, an adsorption unit that is provided on the stage and adsorbs the placed substrate, A clamp mechanism that can move forward and backward with respect to the stage, and presses a part of the substrate placed on the stage at the advanced position, and a drive unit that relatively moves the stage and the application unit; An applicator is provided.

  According to the present invention, it is possible to apply the liquid material with high accuracy by securely holding the substrate on the stage.

It is a perspective view which shows an example of the coating device which concerns on 1st Embodiment. (A) And (B) is a figure which shows an example of the operation | movement at the time of apply | coating a liquid material to a board | substrate. It is a figure which shows an example of an adsorption | suction part. (A) And (B) is a figure which shows an example of an adsorption pad, (A) is a figure which shows the state before an adsorption pad adsorb | sucks a board | substrate, (B) is an adsorption pad adsorb | sucked a board | substrate. It is a figure which shows a state (A)-(C) are figures which show an example of operation | movement of a clamp mechanism. It is a flowchart which shows an example of the coating method which concerns on 1st Embodiment. It is a figure which shows an example of operation | movement of a coating device. FIG. 8 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 7. FIG. 9 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 8. FIG. 10 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 9. FIG. 11 is a diagram illustrating an example of operation of the coating apparatus following FIG. 10. (A) And (B) is a figure which shows an example of the coating device which concerns on 2nd Embodiment, (A) is the figure seen from upper direction, (B) is GG line of (A). It is a figure which shows the cross section along. (A) And (B) is a figure which shows an example of operation | movement of the clamp mechanism of 2nd Embodiment, (A) is the figure seen from upper direction, (B) is along the HH line of (A). FIG. It is a flowchart which shows an example of the coating method which concerns on 2nd Embodiment. It is a figure which shows an example of operation | movement of a coating device. FIG. 16 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 15. FIG. 17 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 16. FIG. 18 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 17. FIG. 19 is a diagram illustrating an example of the operation of the coating apparatus following FIG. 18. It is a figure which shows an example of the coating device which concerns on 3rd Embodiment, (A) is the figure seen from upper direction, (B) is the figure seen from the side. It is a figure which shows an example of the coating device which concerns on 4th Embodiment. It is a figure which shows an example of a structure and operation | movement of a 1st clamp mechanism. FIG. 23 is a diagram illustrating an example of a configuration and operation of a first clamp mechanism following FIG. 22. It is a figure which shows an example of a structure and operation | movement of a 2nd clamp mechanism. FIG. 25 is a diagram illustrating an example of the configuration and operation of the first clamp mechanism following FIG. 24. It is a figure which shows operation | movement of a 1st clamp mechanism and a 2nd clamp mechanism. It is a flowchart which shows an example of the coating method which concerns on 4th Embodiment. It is a figure which shows an example of a structure and operation | movement of the coating device which concerns on 5th Embodiment. FIG. 29 is a diagram illustrating an example of the configuration and operation of a coating apparatus according to a fifth embodiment, following FIG.

[First Embodiment]
A first embodiment will be described. In the following description, the XYZ orthogonal coordinate system shown in FIG. In this XYZ orthogonal coordinate system, the X direction and the Y direction are horizontal directions (lateral directions), and the Z direction is a vertical direction. In each direction, the same side as the tip of the arrow is appropriately referred to as a + side (eg, + Z side), and the opposite side of the arrow is referred to as a − side (eg, −Z side). For example, in the vertical direction (Z direction), the upper side is the + Z side and the lower side is the -Z side. In the drawings, in order to describe the embodiments, a part or the whole is schematically described, and a part expressed by changing the scale as appropriate, for example, partly enlarged or emphasized is included.

  FIG. 1 is a perspective view showing a coating apparatus according to the first embodiment. The coating apparatus 1 applies a liquid L (see FIG. 2A) to the substrate S. The coating apparatus 1 includes, for example, a frame 2, a control unit 3, a stage 4, a stage drive unit 5 (drive unit), a coating unit 6, a liquid material supply unit 7, a lift drive unit 8, and an adsorption unit. 9 and a clamp mechanism 10. The substrate S has a rectangular shape, for example. The formation material of the board | substrate S is not specifically limited, It is arbitrary. For example, the substrate S can be formed of silicon or various glass materials. The liquid L is not particularly limited and is arbitrary.

  The frame 2 supports each part. The frame 2 includes a base 11 and a gantry 12, for example. The base 11 is arrange | positioned at the lowest part of the coating device 1, for example. The base 11 is installed on the floor surface, for example. The base 11 supports, for example, the stage 4 and the gantry 12. The base 11 has, for example, a rectangular shape when viewed from above. The gantry 12 has a pair of support columns 12a and a bridging portion 12b. Two support columns 12a are provided with the stage 4 sandwiched in the Y direction. Each column portion 12a is supported by the base 11 respectively. Each strut portion 12a supports the bridging portion 12b. The bridging portion 12b extends in a direction parallel to the Y direction. Both ends of the bridging portion 12b are connected to the side surfaces on the upper end side (+ Z side) of each support column portion 12a. The bridging part 12b supports the application part 6 described later. The gantry 12 may be formed to be movable.

  The control unit 3 controls each unit. The control unit 3 is communicably connected to each unit of the coating apparatus 1. The control part 3 is a computer apparatus provided with memory | storage devices (not shown), such as CPU (not shown) and a hard disk, memory, for example. For example, the control unit 3 can execute a program for controlling each unit of the coating apparatus 1. This program is stored in advance in a storage device, for example.

  The stage 4 places the substrate S thereon. The stage 4 is disposed above the base 11. The stage 4 has, for example, a rectangular shape when viewed from above. The stage 4 includes, for example, an upper surface 4a parallel to the XY plane (horizontal plane). The upper surface 4a is, for example, a surface plate. By placing the substrate S on the upper surface 4a, the substrate S is arranged on a plane parallel to the XY plane (horizontal plane). The stage 4 is supported by the base 11 via a guide (not shown) or the like so as to be movable in a direction parallel to the X direction with respect to the base 11.

  The stage drive unit 5 (drive unit) moves the stage 4 relative to the application unit 6. The stage drive unit 5 is, for example, an electric motor. For example, the stage drive unit 5 moves the stage 4 with respect to the base 11 in a direction parallel to the X direction. The stage drive unit 5 is connected to the control unit 3 so as to be communicable, for example, and is controlled by the control unit 3. For example, the stage drive unit 5 moves the stage 4 to a predetermined position by controlling the drive timing, drive amount, drive direction, drive speed, and the like by the control unit 3.

  The application unit 6 applies the liquid L to the substrate S on the stage 4. The application unit 6 is, for example, a slit nozzle. The application unit 6 includes a discharge port 14 (see FIG. 2B) through which the liquid L is discharged. For example, the discharge port 14 is an opening facing downward and is arranged in a direction parallel to the Y direction. In addition, the application part 6 is not limited to a slit nozzle, and is arbitrary. For example, the application unit 6 may use an inkjet or the like.

  The application part 6 is arrange | positioned above the stage 4, for example. For example, the application unit 6 can move in the vertical direction (direction parallel to the Z direction) with respect to the gantry 12 via a guide unit 16 that guides the application unit 6 in the vertical direction (direction parallel to the Z direction). Supported. The application unit 6 is connected to, for example, the elevation drive unit 8 and moves by driving the elevation drive unit 8. The elevation drive unit 8 drives the application unit 6. The raising / lowering drive part 8 is an electric motor etc., for example. The raising / lowering drive part 8 is connected to the control part 3 so that communication is possible, for example, and is controlled by the control part 3. The raising / lowering drive part 8 moves the application part 6 to a predetermined position, for example, the drive timing, drive amount, drive direction, drive speed, etc. are controlled by the control part 3.

  Moreover, the application part 6 is connected with the liquid supply part 7 by piping (not shown), for example. The liquid supply unit 7 supplies the liquid L to the application unit 6. The liquid supply unit 7 includes, for example, a liquid holding unit (not shown) that holds the liquid L and a pump (not shown). The liquid supply unit 7 is communicably connected to the control unit 3, and its operation is controlled by the control unit 3. In the liquid supply unit 7, for example, the timing at which the liquid L is supplied to the application unit 6, the amount of the liquid L supplied to the application unit 6, and the like are controlled by the control unit 3. For example, under the control of the control unit 3, the liquid material supply unit 7 is driven by a pump to supply a predetermined amount of the liquid material L held in the liquid material holding unit to the application unit 6.

  Next, operations of the stage 4 and the application unit 6 when applying the liquid L to the substrate S will be described. FIGS. 2A and 2B are diagrams illustrating an example of the operation of the stage 4 and the application unit 6 when the liquid L is applied to the substrate S, respectively.

  When the liquid material L is applied to the substrate S, first, as shown in FIG. 2A, the stage drive unit 5 is driven by the control of the control unit 3, and a predetermined direction in a direction parallel to the X direction of the substrate S is obtained. The stage 4 moves in a direction parallel to the X direction so that the discharge port 14 is disposed above the position. Subsequently, under the control of the control unit 3, the elevating drive unit 8 is driven, and the application unit 6 moves downward so that the discharge port 14 is arranged in the vicinity of the substrate S. Subsequently, as shown in FIG. 2 (B), the stage drive unit 5 is driven by the control of the control unit 3 to supply the liquid material while moving the stage 4 in a direction parallel to the + X direction at a predetermined speed. When the pump of the unit 7 is driven and a predetermined amount of the liquid L is supplied to the application unit 6, the application unit 6 discharges a predetermined amount of the liquid L from the discharge port 14 onto the substrate S. As a result, the liquid L is applied to the upper surface of the substrate S.

  Next, returning to the description of FIG. 1, the suction unit 9 will be described. The suction unit 9 sucks the substrate S placed on the stage 4. The substrate S is fixed to the stage 4 by the suction of the suction unit 9. The suction unit 9 includes, for example, a vacuum groove 18 and a suction pad 19. FIG. 3 is a diagram illustrating an example of the suction unit 9. The vacuum groove 18 is formed in a groove shape on the upper surface 4 a of the stage 4. For example, the vacuum groove 18 is formed into a plurality of straight grooves in a direction parallel to the X direction and a plurality of straight grooves in a direction parallel to the Y direction as viewed from above. For example, the vacuum groove 18 is disposed over the entire upper surface 4 a of the stage 4.

  Further, the vacuum groove 18 is formed on the stage 4 so as to be arranged so that the outer region outside the central region is larger than the central region of the substrate S. In this case, the outer region of the substrate S can be effectively attracted to the stage 4. By the way, when the outer region of the substrate S is not attracted to the stage 4, a gap is generated between the lower portion of the outer region of the substrate S and the stage 4, so that leakage occurs. The suction state cannot be achieved, and the adsorption of the outer region of the substrate S to the stage 4 becomes poor. When the central region of the substrate S is not attracted to the stage 4, even if there is a gap on the lower surface of the central region of the substrate S, the outer region of the lower surface of the substrate S and the stage 4 are in close contact with each other. A sealed space is formed between the lower surface of the substrate and the stage 4. Since this sealed space is brought into a vacuum state by driving the vacuum pump 21, the lower surface of the central region of the substrate S is finally attracted to the stage 4.

  In the vacuum groove 18, for example, a plurality of straight lines in a direction parallel to the X direction intersect with a plurality of straight lines in a direction parallel to the Y direction, and are connected to each other. The vacuum groove 18 is formed so as to be disposed under the substrate S when the substrate S is placed on the upper surface 4 a of the stage 4, for example. For example, when the substrate S is disposed in the vacuum groove 18, a gas flow path is formed by the lower surface of the substrate S and the vacuum groove 18. The vacuum groove 18 is connected to a vacuum pump 21 via piping (not shown).

  The vacuum pump 21 generates a vacuum pressure. The vacuum pump 21 is connected to the control unit 3 in a communicable manner and is controlled by the control unit 3, for example. For example, the drive timing of the vacuum pump 21 is controlled by the control unit 3. By driving the vacuum pump 21, the gas flow path formed by the lower surface of the substrate S and the vacuum groove 18 is pulled, and the lower surface of the substrate S is adsorbed to the stage 4.

  Note that the shape and size of the vacuum groove 18 are not limited to the example shown in FIG. For example, at least a part of the vacuum groove 18 may be formed in a curved shape when viewed from above. Further, the number of grooves in the vacuum groove 18 is not particularly limited and is arbitrary. Further, the vacuum pump 21 may be configured to be driven manually by the user without being controlled by the control unit 3.

  The suction pad 19 is formed on the stage 4. A plurality of suction pads 19 are formed on the stage 4. The suction pad 19 can suck the substrate S placed on the stage 4. 4A and 4B are diagrams showing an example of the suction pad, respectively, FIG. 4A is a diagram showing a state before the suction pad sucks the substrate, and FIG. It is a figure which shows the state which the pad adsorb | sucked the board | substrate. As shown in FIG. 4 (A), the suction pad 19 includes, for example, a tube part 22, a stretchable part 23, and an opening part 23a. The suction pad 19 is disposed in the hole 4 b formed in the stage 4.

  The tube portion 22 is disposed at the lower portion of the suction pad 19. The pipe part 22 is connected to the vacuum ejector 26 via a pipe (not shown). The expansion / contraction part 23 is connected to the upper end part of the pipe part 22, for example. The stretchable part 23 can be stretched. The stretchable part 23 has a space (not shown) therein. The expansion / contraction part 23 is formed of, for example, a material such as resin that can be elastically deformed, and can be expanded and contracted by elastic deformation. The expansion / contraction part 23 is a bellows structure, for example.

  The opening 23 a is an opening formed in the upper end 23 b of the extendable part 23. The opening 23a is formed so that the opening faces upward. The upper end portion 23b is formed so as to be in close contact with the substrate S.

  The vacuum ejector 26 generates a vacuum pressure. For example, the vacuum ejector 26 generates a vacuum pressure in a state where the upper end portion 23b is in close contact with the substrate S, thereby bringing the inside of the tube portion 22 and the expansion / contraction portion 23 into a vacuum state. For example, the vacuum ejector 26 is communicably connected to the control unit 3 and controlled by the control unit 3. For example, the drive timing of the vacuum ejector 26 is controlled by the control unit 3. The suction pad 19 may be connected to the vacuum pump 21 instead of the vacuum ejector 26. Further, the vacuum ejector 26 may be configured to be driven manually by the user without being controlled by the control unit 3.

  Further, the suction pad 19 is formed so as to be able to protrude and immerse from the stage 4, for example. The suction pad 19 is immersed when the substrate S is sucked. For example, as shown in FIG. 4A, the extendable portion 23 is formed so as to protrude from the upper end of the stage 4. In this case, when the substrate S is placed on the stage 4, the extendable portion 23 can easily bring the upper end 23 b into close contact with the lower surface of the substrate S. The stretchable part 23 is formed so as to protrude from the upper end of the stage 4 by a length L2 at the time of extension, for example. Although this length L2 is not limited, For example, it is about 1 mm-3 mm. For example, the length L <b> 2 from which the stretchable part 23 projects from the upper end of the stage 4 is the same in each suction pad 19, for example. The length L2 may be different in each suction pad 19. For example, the length L2 is set so that the length L2 in the suction pad 19 disposed in the outer region outside the central region is longer than the length L2 in the suction pad 19 disposed in the central region of the substrate S. May be set.

  The operation of the suction pad 19 will be described. As shown in FIG. 4A, the suction pad 19 is disposed so that the stretchable portion 23 protrudes from the stage 4. When the substrate S is placed on the stage 4, the upper end portion 23 b comes into close contact with the lower surface of the substrate S. Subsequently, as shown in FIG. 4B, when the vacuum ejector 26 is driven with the suction pad 19 in a state where the upper end portion 23b is in close contact with the lower surface of the substrate S, the inside of the expansion and contraction portion 23 becomes a suction pressure. The upper end portion 23b is attracted to the lower surface of the substrate S. Thereafter, when the pressure inside the expansion / contraction part 23 is further reduced, the expansion / contraction part 23 contracts due to elastic deformation as shown in FIG. 4B, and is immersed in the hole 4 b of the stage 4. At this time, since the upper end portion 23b is adsorbed to the lower surface of the substrate S, the substrate S moves downward and is adsorbed to the stage 4 when the extendable portion 23 contracts.

  In addition, when forming the expansion-contraction part 23 so that protrusion and immersion are possible from the stage 4, the length from the upper end to the lower end at the time of expansion | extension of the expansion-contraction part 23 is L1 (refer FIG. 4 (A)), for example, When the length of the portion protruding from the stage 4 is L2 (see FIG. 4 (A)) and the length from the upper end to the lower end when the telescopic portion 23 is extended is L3 (see FIG. 4 (B)), L3 The stretchable part 23 is formed so as to satisfy the relationship of ≦ L1-L2.

  Next, returning to the description of FIG. 3, the arrangement of the suction pads 19 will be described. A plurality of suction pads 19 are provided on the stage 4. For example, the plurality of suction pads 19 are uniformly arranged on the upper surface 4 a of the stage 4. For example, the plurality of suction pads 19 are arranged at predetermined intervals on the edge of the stage 4, and on a plurality of concentric circles (not shown) centering on the center of the stage 4 inside the edge of the stage 4. It is arranged in either. Further, the plurality of suction pads 19 are arranged so that the number of arrangement per unit area is larger in the outer region outside the central region than in the central region of the substrate S, for example. In this case, the outer region of the substrate S can be effectively adsorbed.

  Note that the configuration, size, number, and position of the suction pad 19 are not limited to the example shown in FIG. 3 and are arbitrary. For example, the suction pad 19 may not be arranged on any of a plurality of concentric circles centered on the center of the stage 4. For example, the plurality of suction pads 19 may be arranged side by side at a predetermined interval. Further, the suction pad 19 may be configured to be driven in the vertical direction by a driving device. In this case, for example, after the suction pad 19 is sucked to the substrate S, the substrate S may be sucked to the stage 4 by driving the suction pad 19 downward by a driving device. In addition, the coating apparatus 1 may include a sensor capable of measuring the vacuum pressure, and may include a mechanism for detecting the state of adsorption of the substrate S by the adsorption unit 9 using this sensor.

  Next, returning to the description of FIG. 1, the clamp mechanism 10 will be described. The clamp mechanism 10 presses a part of the substrate S placed on the stage 4 against the stage 4. The coating device 1 includes a plurality of clamp mechanisms 10a to 10d, for example. For example, the clamp mechanisms 10a to 10d are provided in four directions with respect to the substrate S, respectively. For example, each of the clamp mechanisms 10 a to 10 d is disposed at a central portion in any one of the stages 4.

  Each clamp mechanism 10a-10d is provided with the support part 25, the arm support part 27, the arm 28, the raising / lowering drive part 29, the rotation drive part 30, and the pressing part 31, respectively. The clamp mechanisms 10a to 10d have the same configuration.

  Each of the clamp mechanisms 10 a to 10 d is attached to the stage 4 via the support portion 25. The support unit 25 supports the arm support unit 27. The support part 25 is a pair of members provided with the arm support part 27 interposed therebetween, for example. The support portion 25 supports the arm support portion 27 so as to be rotatable around an axis AX parallel to the long axis of the arm support portion 27. The support portion 25 supports the arm support portion 27 so as to be rotatable around the axis AX, for example, via a shaft portion 27a arranged coaxially with the axis AX.

  The arm support portion 27 supports a pair of arms 28. The arm support portion 27 supports the pair of arms 28 so as to be movable in the vertical direction. The arm support part 27 rotates around the axis AX by the drive of the rotation drive part 30. The clamp mechanism 10 moves forward and backward with respect to the upper side of the stage 4 by the rotation of the arm support portion 27.

  The rotation drive unit 30 drives the arm support unit 27. The rotation drive unit 30 is an actuator such as an electric motor, for example. The rotation drive unit 30 is communicably connected to the control unit 3, and the drive is controlled by the control unit 3. In the rotation drive unit 30, for example, the drive timing, the drive amount, the drive direction, the drive speed, and the like are controlled by the control unit 3. The rotation drive unit 30 may not be provided. In this case, the arm support portion 27 may be a mechanism that rotates manually, for example.

  The pair of arms 28 support the pressing portion 31. The pair of arms 28 move in the vertical direction by driving of the elevating drive unit 29. The drive of the elevating drive unit 29 drives the pair of arms 28 and the pressing unit 31 in the vertical direction.

  The elevating drive unit 29 drives the pair of arms 28. The elevating drive unit 29 is an actuator such as an electric motor, for example. The raising / lowering drive part 29 is connected so that communication with the control part 3 is possible, and the drive is controlled by the control part 3. As for the raising / lowering drive part 29, the timing, drive amount, drive direction, drive speed, etc. of a drive are controlled by the control part 3, for example. In addition, the raising / lowering drive part 29 does not need to be. In this case, for example, a mechanism in which the pair of arms 28 are manually driven in the vertical direction may be used.

  The pressing portion 31 is formed to be able to press the substrate S against the stage 4. For example, the pressing portion 31 has a flat surface 31a. For example, the surface 31a is disposed at a lower portion on the distal end side with respect to a proximal end side to which the pair of arms 28 are attached. The pressing portion 31 can press the substrate S against the stage 4 by sandwiching the surface 31 a and the side portion Sa of the substrate S. The pressing portion 31 can press the side portion Sa of the substrate S against the stage 4 when the pair of arms 28 are driven downward by driving the elevating drive portion 29.

  Next, the operation of the clamp mechanism will be described. FIG. 5A to FIG. 5C are diagrams illustrating an example of the operation of the clamp mechanism. 5A to 5C, of the four clamp mechanisms 10a to 10d shown in FIG. 1, two clamp mechanisms 10b and 10d attached to the + X side and the -X side of the stage 4 are used. The two clamp mechanisms 10a and 10d attached to the + Y side and the −Y side of the stage 4 are not shown.

  Each of the clamp mechanisms 10a to 10d is retracted from above the stage 4 as shown in FIG. 5A before pressing a part of the substrate S placed on the stage 4 against the stage 4. Yes (evacuation state). When each clamp mechanism 10a to 10d presses a part of the substrate S against the stage 4, first, as shown in FIG. 5B, in each clamp mechanism 10a to 10d, the rotation drive unit 30 is controlled by the control unit 3. Is driven, the arm support 27 is rotated, and the presser 31 is advanced above the stage 4 (advanced state). The control unit 3 controls the operations of the clamp mechanisms 10a to 10d to be synchronized. Subsequently, as shown in FIG. 5 (C), in each of the clamp mechanisms 10a to 10d, the lifting and lowering drive unit 29 is driven by the control of the control unit 3, whereby the arm 28 and the pressing unit 31 are moved downward, The side portion Sa of the substrate S is pressed against the stage 4 by the surface 31a.

  By the way, the substrate S is not completely flat and may be deformed. For example, as shown in FIG. 5A, the end of the substrate S may be warped upward. This occurs frequently, for example, depending on the forming material of the substrate S, the manufacturing method of the substrate S, the processing method of the substrate S, and the like. When the end portion of the substrate S is warped upward, a gap is formed between the end portion of the substrate S and the stage 4, so that a vacuum state is formed between the lower surface of the substrate S and the stage 4 by the vacuum groove 18. As a result, the end of the substrate S may not be attracted to the stage 4 in some cases. Further, when the end portion of the substrate S is warped upward, even if the suction pad 19 protrudes from the stage 4, it does not reach the lower surface of the substrate S, so that the suction of the substrate S by the suction pad 19 cannot be performed. In some cases, the end of the substrate S cannot be attracted to the stage 4. When the end portion of the substrate S cannot be attracted to the stage 4, in addition to the accuracy of application of the end portion of the substrate S, the substrate S and the application portion 6 may collide at the time of application and the substrate may be damaged. .

  In the coating apparatus 1 of the present embodiment, as shown in FIG. 5B, the clamping mechanism 10 presses the side portion Sa of the substrate S against the stage 4, so that the end portion of the substrate S extends along the upper surface 4 a of the stage 4. Therefore, the end portion of the substrate S can be securely brought into close contact with the stage 4. Thereby, the coating device 1 can apply | coat the board | substrate S to the edge part with sufficient precision.

  In the clamp mechanism 10, after the side portion Sa of the substrate S is pressed against the stage 4, the pressing portion 31 moves upward by the drive of the lift drive unit 29, and the arm support unit 27 is driven by the rotation drive unit 30. It rotates and the presser part 31 is retracted from above the stage 4. The raising / lowering drive unit 29 and the rotation drive unit 30 are controlled by the control unit 3, respectively. In the coating apparatus 1 of the present embodiment, the end portion of the substrate S can be reliably brought into close contact with the stage 4 and the clamp mechanism 10 is retracted from above the stage 4, so that the coating can be performed accurately to the vicinity of both ends of the substrate S. can do.

  The clamp mechanism 10 is not limited to the configuration shown in FIG. 1 and the like as long as it has a configuration capable of pressing a part of the substrate S placed on the stage 4 against the stage 4, and the configuration is arbitrary. is there. For example, the clamp mechanism 10 may include two or more pressing portions 31. For example, the arm 28 may not be a pair but may be one, or may be three or more. Moreover, the clamp mechanism 10 does not need to be arrange | positioned at each center part of the four directions of the stage 4, for example. For example, the clamp mechanism 10 may be disposed at a corner of the substrate S. For example, the number of the clamp mechanisms 10 may not be four. For example, the number of clamp mechanisms 10 may be one to three, or five or more.

  Next, the coating method according to the first embodiment will be described based on the operation of the coating apparatus 1. FIG. 6 is a flowchart showing an example of the coating method according to the present embodiment. 7 to 11 are diagrams each illustrating an example of the operation of the coating apparatus 1. In describing FIG. 6, reference is made to FIGS. 1, 2, 4, and 7 to 11 as appropriate.

  In the coating method of the present embodiment, the substrate S is placed on the stage 4 in step S1 shown in FIG. For example, as shown in FIG. 1, the substrate S is placed at a predetermined position on the stage 4. The placement of the substrate S may be performed by the user manually or by an apparatus such as a transfer device, for example.

  Subsequently, in step S2 shown in FIG. 6, the suction unit 9 is driven. For example, as shown in FIG. 7A, under the control of the control unit 3, the vacuum pump 21 and the vacuum ejector 26 are driven, and the vacuum groove 18 and the suction pad 19 are driven. By driving the vacuum groove 18, the portion between the vacuum groove 18 and the lower surface of the substrate S is in an attractive state, and the portion between the lower surface of the substrate S and the upper surface 4 a of the stage 4 is in an attractive state. The substrate S is adsorbed on the stage 4. Further, as shown in FIGS. 4A and 4B, the suction pad 19 is attracted to the substrate S by driving the suction pad 19, and the suction pad 19 is immersed in the stage 4, so that the substrate S Adsorbs to the stage 4. However, even if the suction unit 9 is driven, as shown in FIG. 7B, when the end portion of the substrate S described above is warped upward, the suction pad 19 and the vacuum near the end portion of the substrate S The groove 18 may not contact the substrate S.

  Note that the driving of the vacuum pump 21 and the vacuum ejector 26 may or may not be performed simultaneously. For example, the vacuum pump 21 may be driven before the vacuum ejector 26, or the vacuum ejector 26 may be driven before the vacuum pump 21.

  Subsequently, in step S <b> 3 shown in FIG. 6, the clamp mechanism 10 is advanced above the stage 4. For example, as shown in FIG. 8, each of the clamp mechanisms 10 a to 10 d is driven by the rotation driving unit 30 under the control of the control unit 3, whereby the arm support unit 27 is rotated and the pressing unit 31 is moved to the stage 4. Advance above. For example, each operation | movement of each clamp mechanism 10a-10d is controlled by the control part 3 to synchronize including the operation | movement described below.

  Subsequently, in step S <b> 4 shown in FIG. 6, a part of the substrate S placed on the stage 4 is pressed against the stage 4 by the clamp mechanism 10. For example, as shown in FIG. 9, in each of the clamp mechanisms 10 a to 10 d, the arm 28 and the pressing unit 31 move downward when the lifting drive unit 29 is driven by the control of the control unit 3. Thereby, the clamp mechanism 10 presses the side portion Sa of the substrate S against the stage 4 with the surface 31 a of the pressing portion 31. By the downward movement of the pressing portion 31, the side portion Sa of the substrate S is deformed horizontally along the upper surface 4 a of the stage 4. Thereby, the edge part of the board | substrate S contacts the suction pad 19 and the vacuum groove 18 reliably, and is adsorb | sucked. When the end portion of the substrate S reliably contacts the suction pad 19 and the vacuum groove 18, the lower portion of the substrate S can be surely brought into a vacuum state, so that the entire substrate S can be reliably attracted to the stage 4. .

  Subsequently, in step S5 shown in FIG. 6, the clamp mechanism 10 is raised. For example, in each of the clamp mechanisms 10 a to 10 d, the lifting drive unit 29 is driven by the control of the control unit 3, the arm support unit 27 and the pressing unit 31 are moved upward, and the pressing unit 31 is separated from the substrate S. Even in this state, since the suction unit 9 is driven, the substrate S is kept in the state of being sucked to the stage 4. Note that step S5 may not be performed.

  Subsequently, in step S <b> 6 shown in FIG. 6, the clamp mechanism 10 is retracted from above the stage 4. For example, as shown in FIG. 10, each of the clamp mechanisms 10 a to 10 d is driven by the rotation drive unit 30 under the control of the control unit 3, whereby the arm support unit 27 is rotated and the pressing unit 31 is moved to the stage 4. Retreat from above. In addition, the drive of the rotation drive part 30 of step S3 and step S6 may be manually performed by the user.

  Subsequently, in step S <b> 7 shown in FIG. 6, the liquid L is applied by the application unit 6 to the substrate S adsorbed on the stage 4 while relatively moving the stage 4 and the application unit 6. For example, as shown in FIG. 2A, the stage drive unit 5 is driven by the control of the control unit 3, and the discharge port 14 is disposed above a predetermined position in a direction parallel to the X direction of the substrate S. Thus, the stage 4 moves in a direction parallel to the X direction. Subsequently, under the control of the control unit 3, the elevating drive unit 8 is driven, and the application unit 6 moves downward so that the discharge port 14 is arranged in the vicinity of the substrate S. Then, as shown in FIG. 11, the pump of the liquid material supply unit 7 is driven by the control of the control unit 3, and a predetermined amount of the liquid material L is supplied from the liquid material supply unit 7 to the application unit 6. Discharges a predetermined amount of the liquid L from the discharge port 14 to the substrate S, and the stage drive unit 5 is driven by the control of the control unit 3 to move the stage 4 in the + X direction. A liquid L is applied to the upper surface of the substrate. After the application is completed, the application unit 6 stops the supply of the liquid material L from the liquid material supply unit 7 under the control of the control unit 3, and then the elevation drive unit 8 is driven under the control of the control unit 3, The application part 6 rises. In the coating apparatus 1 of the present embodiment, the substrate S is adsorbed to the stage 4 to the end, and the clamp mechanism 10 is retracted, so that the liquid L can be accurately applied to the vicinity of both ends of the substrate S. it can.

  Subsequently, in step S8 shown in FIG. 6, the driving of the suction unit 9 is stopped. For example, when the application by the application unit 6 is completed, the drive of the suction unit 9 is stopped. Thereby, adsorption | suction to the stage 4 of the board | substrate S is complete | finished. The driving of the suction unit 9 is stopped by, for example, stopping the driving of the vacuum pump 21 (see FIG. 1) and the vacuum ejector 26 (see FIG. 1) by the control unit 3. The driving of the vacuum pump 21 and the vacuum ejector 26 may be stopped manually by the user.

  Subsequently, in step S9 shown in FIG. 6, the substrate S is unloaded. The unloading of the substrate S may be performed manually by the user, or may be performed by a transfer device or the like, for example.

  In addition, although the example which performs the drive of the adsorption | suction part 9 in step S2 before making the clamp mechanism 10 advance in the upper direction of the stage 4 in step S3 was demonstrated, the timing which performs step S2 is not limited to this. For example, after performing Step S3 and Step S4, the suction unit 9 in Step S2 may be driven.

  As described above, the coating apparatus and the coating method of the present embodiment can apply the liquid material L with high accuracy by reliably holding the substrate S on the stage 4.

[Second Embodiment]
A second embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  FIG. 12 is a view showing an example of a coating apparatus 1A according to the second embodiment, (A) is a view seen from above, and (B) is a cross section taken along line GG of (A). FIG. The coating apparatus 1A of the present embodiment includes, for example, a frame 2, a control unit 3, a stage 4A, a stage drive unit 5 (drive unit), a coating unit 6, a liquid supply unit 7, and a lift drive unit 8. And a suction portion 9 and a clamp mechanism 10A. The frame 2, the control unit 3, the stage drive unit 5, the application unit 6, the liquid material supply unit 7, the elevating drive unit 8, and the suction unit 9 are the same as those in the first embodiment. Omitted.

  As shown in FIG. 12A, the stage 4A includes a cutout portion 33 in the side portion 4c. For example, a plurality of cutout portions 33 are provided. For example, two notches 33 are provided at the −Y side end of the stage 4A and two at the + X side end of the stage 4A. Each notch 33 is formed such that, for example, when each clamp mechanism 10A advances to the stage 4A, a positioning part 34 described later enters the notch 33, and the positioning part 34 is arranged at a predetermined position. For example, the notch 33 at the −Y side end of the stage 4A is arranged corresponding to the positioning part 34 of the clamp mechanism 10Ac, and the positioning part 34 of the clamp mechanism 10Ac is arranged. For example, the notch 33 at the + X side end of the stage 4A is arranged corresponding to the positioning part 34 of the clamp mechanism 10Ab, and the positioning part 34 of the clamp mechanism 10Ac is arranged.

  For example, a plurality of clamp mechanisms 10A are provided. For example, the plurality of clamp mechanisms 10A are a clamp mechanism 10Ab provided on the + X side of the stage 4A and a clamp mechanism 10Ac provided on the −Y side of the stage 4A. For example, each clamp mechanism 10Ab, 10Ac includes a positioning part 34, a support part 25, an arm support part 27, an arm 28A, a lift drive part 29, a rotation drive part 30, and a pressing part 31. The support unit 25, the arm support unit 27, the elevating drive unit 29, the rotation drive unit 30, and the pressing unit 31 are the same as those in the first embodiment, and description thereof is omitted.

  In each of the clamp mechanisms 10Ab and 10Ac, the positioning unit 34 is disposed, for example, on the arm 28A. The arm 28A is the same as the arm 28 shown in FIG. 1 except that the positioning portion 34 is disposed. The positioning unit 34 has, for example, a flat surface 34c (see FIG. 12B). For example, the flat surface 34 c is arranged on the arm 28 </ b> A so as to face the side surface of the substrate S when the clamp mechanism 10 </ b> A advances above the stage 4.

  In each clamp mechanism 10Ab, 10Ac, the support portion 25 (not shown) and the arm support portion 27 are disposed below the stage 4A, as shown in FIG. Thereby, the positioning part 34 enters the notch part 33 when the clamp mechanism 10 </ b> A advances above the stage 4 </ b> A, and can be arranged in the notch part 33.

  Next, the operation of the clamp mechanism 10A will be described. FIGS. 13A and 13B are views showing an example of the operation of the clamp mechanism 10A, where FIG. 13A is a view from above, and FIG. 13B is taken along the line H-H in FIG. FIG.

  In each of the clamp mechanisms 10Ab and 10Ac, when the rotary drive unit 30 is driven and advanced above the stage 4A, the positioning unit 34 enters the notch 33 and is arranged in the notch 33. In this state, the substrate S is positioned by abutting the end of the substrate S against the positioning unit 34. Note that the abutting of the substrate S to the positioning unit 34 may be performed manually by a user or by an apparatus capable of moving the substrate S.

  Next, a coating method according to the second embodiment will be described based on the operation of the coating apparatus 1A. FIG. 14 is a flowchart illustrating an example of a coating method according to the present embodiment. 15-19 is a figure which shows an example of operation | movement of the coating device 1. FIG. In addition, when FIG. 14 is demonstrated, FIGS. 15-19 is referred suitably.

  In the coating method of the present embodiment, the clamp mechanism 10A is advanced in step S10 shown in FIG. 14 following step S1 shown in FIG. For example, as shown in FIG. 16, each of the clamp mechanisms 10 </ b> Ab (not shown) and 10 Ac in the retracted state shown in FIG. 15 is driven by the rotation drive unit 30 under the control of the control unit 3 (see FIG. 1). The arm support part 27 rotates, and the pressing part 31 advances above the stage 4A. At this time, the positioning portions 34 of the clamp mechanisms 10Ab and 10Ac are respectively disposed in the notches 33. In addition, each clamp mechanism 10Ab and 10Ac are controlled by the control part 3 so that each operation | movement including the operation | movement demonstrated later is synchronized, for example.

  Subsequently, in step S <b> 11 shown in FIG. 14, the substrate S is positioned by abutting the substrate S against the positioning unit 34. For example, as shown in FIG. 17, the end portion of the substrate S is abutted against the positioning portions 34 of the clamp mechanisms 10Ab and 10Ac. Thereby, the board | substrate S is positioned.

  Subsequently, in step S12 shown in FIG. 14, the suction unit 9 is driven. Step S12 is performed similarly to step S2 shown in FIG. 6, for example.

  Subsequently, in step S4 shown in FIG. 6, as shown in FIG. 18, the clamp mechanisms 10 </ b> Ab and 10 </ b> Ac control the side part Sa of the substrate S placed on the stage 4 </ b> A by the control part 3. To press on stage 4A. Thereby, the substrate S is attracted to the stage 4A in a positioned state.

  Subsequently, in step S5 shown in FIG. 6, as shown in FIG. 19, the clamp mechanisms 10Ab and 10Ac are retracted from above the stage 4A. Then, the liquid L is apply | coated to the board | substrate S by performing step S6-step S9 shown in FIG.

  As described above, the coating apparatus 1A and the coating method according to the present embodiment can accurately apply the liquid L by holding the substrate S on the stage 4A in a state where the substrate S is positioned with respect to the stage 4A. .

  The positioning unit 34 may not be disposed on the arm 28A. For example, the positioning unit 34 may be disposed on the pressing unit 31. Further, the number and position of the clamp mechanisms 10A are not limited to the above-described example, and are arbitrary. For example, each of the clamp mechanisms 10Ab and 10Ac only needs to be disposed at a position sandwiching the corner of the stage 4A among the four sides of the stage 4A. Further, for example, the clamp mechanism 10A may be one instead of a plurality. In this case, for example, the clamp mechanism 10A may be disposed on any one of the four sides of the stage 4A.

[Third Embodiment]
A third embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  FIG. 20 is a diagram illustrating an example of a coating apparatus 1B according to the third embodiment. FIG. 20A is a diagram viewed from above, and FIG. 20B is a diagram viewed from the side. The coating apparatus 1B of the present embodiment includes, for example, a frame 2, a control unit 3, a stage 4, a stage driving unit 5 (driving unit), a coating unit 6, a liquid supply unit 7, and a lift driving unit 8. And a suction portion 9 and a clamp mechanism 10B. The frame 2, the control unit 3, the stage 4, the stage drive unit 5, the application unit 6, the liquid material supply unit 7, the lift drive unit 8, and the suction unit 9 are the same as those in the first embodiment. Description of is omitted.

  As with the first embodiment, the clamp mechanism 10B is provided with a plurality of clamp mechanisms 10Ba to 10Bd. In addition, since several clamp mechanism 10Ba-10Bd is respectively the same structure, in the following description, clamp mechanism 10Bc is demonstrated to an example among several clamp mechanism 10Ba-10Bd.

  For example, the clamp mechanisms 10Ba to 10Bd are provided on four sides of the stage 4 as in the first embodiment. For example, each clamp mechanism 10Ba to 10Bd includes a support portion 25B, an arm support portion 27B, an arm 28, an elevating drive portion 29, a slide drive portion 37, and a pressing portion 31. The arm 28, the raising / lowering drive part 29, and the pressing part 31 are the same as those in the first embodiment, and a description thereof will be omitted.

  Each clamp mechanism 10Ba-10Bd is attached to the stage 4 by a support portion 25B. For example, as shown in FIGS. 20A and 20B, the support portion 25B supports the arm support portion 27B on the stage 4 so as to be movable in the direction. For example, the support portion 25B includes a pair of guides 38. The pair of guides 38 is disposed below the arm support portion 27B, and guides the arm support portion 27B toward the stage 4 in a direction toward and away from the stage 4. For example, the pair of guides 38 of the clamp mechanism 10Bc are arranged in a direction parallel to the Y direction. The arm support portion 27B of the clamp mechanism 10Bc is supported by a pair of guides 38 so as to be movable in the Y direction.

  The arm support portion 27B supports the pair of arms 28 so as to be movable in the vertical direction. The arm support portion 27 </ b> B moves in the Y direction by driving the slide drive portion 37, for example.

  The slide drive unit 37 drives the arm support unit 27B. For example, the slide drive unit 37 is communicably connected to the control unit 3 and drives the arm support unit 27 under the control of the control unit 3. The arm support 27B may be driven manually by the user.

  Next, the operation of the clamp mechanism 10B will be described. When the clamp mechanism 10B moves forward with respect to the stage 4, for example, when the slide drive unit 37 is driven by the control of the control unit 3, the arm support unit 27B moves in the + Y direction (direction approaching the stage 4). Then, the pressing portion 31 advances above the stage 4 (indicated by a dotted line in FIGS. 20A and 20B). Further, when the clamp mechanism 10B is retracted with respect to the stage 4, for example, when the slide drive unit 37 is driven by the control of the control unit 3, the arm support unit 27B is in the -Y direction (a direction away from the stage 4). And the pressing portion 31 is retracted from above the stage 4 (shown by a solid line in FIGS. 20A and 20B). The clamp mechanism 10 </ b> B presses the substrate S against the stage 4 when the lifting / lowering drive unit 29 (see FIG. 1) is driven by the control unit 3. In the coating method of the first embodiment and the second embodiment, the advancement of the clamp mechanism in step S3 and the withdrawal of the clamp mechanism in step S6 may be performed instead of the operation of the clamp mechanism 10B described above.

  As described above, the coating apparatus 1 </ b> B of the present embodiment can apply the liquid L with high accuracy by reliably holding the substrate S on the stage 4.

  In addition, the number and position of the clamp mechanism 10B are not limited to the above-mentioned example, and are arbitrary. For example, the number of the clamp mechanisms 10B may be 1 to 3. In this case, the position where the clamp mechanism 10B is disposed is arbitrary, and may be disposed, for example, in any one of the four directions of the stage 4. The clamp mechanism 10B may include a positioning unit 34 shown in FIG.

[Fourth Embodiment]
A fourth embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  FIG. 21 is a top view showing an example of a coating apparatus 1C according to the fourth embodiment. The coating apparatus 1C of this embodiment includes, for example, a frame 2, a control unit 3, a stage 4C, a stage driving unit 5 (driving unit) (see FIG. 1), a coating unit 6 (see FIG. 1), and a liquid. The body supply part 7 (refer FIG. 1), the raising / lowering drive part 8 (refer FIG. 1), the adsorption | suction part 9 (refer FIG. 1), and the clamp mechanism 10C are provided. This coating apparatus 1C is different from the above-described coating apparatuses 1, 1A, 1B in terms of the stage 4C and the clamp mechanism 10C. The frame 2, the control unit 3, the stage drive unit 5, the application unit 6, the liquid material supply unit 7, the elevating drive unit 8, and the suction unit 9 are the same as those in the first embodiment, and description thereof is omitted. . Hereinafter, the difference from the first embodiment to the third embodiment will be mainly described.

  The stage 4C includes a cutout portion 33 in the side portion 4c. For example, a plurality of cutout portions 33 are provided. For example, there are two notches 33 at the + Y side end of the stage 4C, one at the −Y side end of the stage 4C, and the + X side end and the −X side end of the stage 4C. And one each. Each notch 33 is formed such that, for example, when a first clamp mechanism CA to a fourth clamp mechanism CD described later advance to the stage 4C, the positioning portions 43C and 54C enter the notch 33, respectively. The positioning portions 43C and 54C are arranged at predetermined positions. For example, the two cutout portions 33 at the + Y side end of the stage 4C are provided corresponding to the two positioning portions 43C of the first clamp mechanism CA, and the two positioning portions 43C of the first clamp mechanism CA are set in a predetermined manner. Place in position. The notch 33 at the −Y side end of the stage 4 </ b> C is provided corresponding to the positioning part 43 </ b> C of the second clamp mechanism CB, and arranges the positioning part 43 </ b> C of the second clamp mechanism CB at a predetermined position. The notch 33 at the −X side end of the stage 4C is provided corresponding to the positioning part 43C of the third clamp mechanism CC, and arranges the positioning part 43C of the third clamp mechanism CC at a predetermined position. The notch 33 at the + X side end of the stage 4C is arranged corresponding to the positioning part 43C of the fourth clamp mechanism CD, and the positioning part 43C of the fourth clamp mechanism CD is arranged at a predetermined position. The stage 4C is the same as the stage 4 of the first embodiment except for the above points.

  A plurality of clamp mechanisms 10C are provided, for example. For example, the clamp mechanism 10C includes a first clamp mechanism CA, a second clamp mechanism CB, a third clamp mechanism CC, and a fourth clamp mechanism CD.

  Each clamp mechanism 10C (the first clamp mechanism CA, the second clamp mechanism CB, the third clamp mechanism CC, and the fourth clamp mechanism CD) is provided on each side of the substrate S. Each clamp mechanism 10C is provided on any one of four sides of the stage 4C. Each of the clamp mechanisms 10C is provided at a central portion of any one of the stages 4C. For example, the first clamp mechanism CA is provided on the + Y side of the stage 4C. The second clamp mechanism CB is provided on the −Y side of the stage 4C. The third clamp mechanism CC is provided on the −X side of the stage 4C. The fourth clamp mechanism CD is provided on the + X side of the stage 4C.

  Next, the configuration and operation of each clamp mechanism 10C will be described. In the present embodiment, the first clamp mechanism CA and the third clamp mechanism CC have the same configuration, and press a part of the substrate S in the vertical direction, as will be described later. Also, the second clamp mechanism and the fourth clamp mechanism have the same configuration, and as will be described later, the pressing portion 31 moves downward and away from the stage 4C, and a part of the substrate S is moved. Press against stage 4C. In the present embodiment, the clamp mechanism 10C is provided with two different types of clamp mechanisms facing each other. In the present embodiment, the first clamp mechanism CA and the second clamp mechanism CB are provided to face each other, and the third clamp mechanism CC and the fourth clamp mechanism CD are provided to face each other.

  First, the first clamp mechanism CA will be described. FIGS. 22A, 22B, 23A, and 23B are diagrams showing examples of the configuration and operation of the first clamp mechanism, respectively. As shown in FIG. 21 or 22A, the first clamp mechanism CA includes an arm support part 42C, an arm 28, a pressing part 31, a positioning part 43C, and a drive part 44C. The third clamp mechanism CC is configured in the same manner as the first clamp mechanism CA as described above except that there is only one positioning portion 43C, and thus the description thereof is omitted.

  In the first clamp mechanism CA, the arm support portion 42C is disposed in the vicinity of the stage 4C. The arm support portion 42C supports a pair of arms 28 arranged at a predetermined interval along the X direction. The arm support portion 42C supports the pair of arms 28 so as to be movable in the vertical direction by a guide (not shown). The arm support portion 42C supports the pair of arms 28 by a guide (not shown) so as to be movable in the approaching direction and the separating direction (X direction) with respect to the stage 4C.

  The pair of arms 28 is configured in the same manner as in the first embodiment, and supports the pressing portion 31 from below. The pair of arms 28 are driven in the vertical direction and the X direction by the drive of the drive unit 44C.

  The pressing portion 31 is configured in the same manner as in the first embodiment, has a flat surface 31a (see FIG. 7A), and is formed so that the substrate S can be pressed against the stage 4C.

  Two positioning portions 43 </ b> C are provided below the pressing portion 31 side by side in the X direction. The positioning unit 43C positions (aligns) the substrate S. The positioning unit 43C is, for example, a roller. The positioning portion 43C can rotate around an axis parallel to the vertical direction. The positioning portion 43C is disposed in the notch portion 33 so as to face the side surface of the substrate S when the first clamp mechanism CA advances above the stage 4C. Thus, when the positioning part 43C is a roller, the positioning part 43C regulates the movement of the substrate S in the direction (Y direction) in which the substrate S and the positioning part 43C face the substrate S. Since the movement of the substrate S in the direction (X direction) orthogonal to the direction in which S and the positioning portion 43C face each other is not restricted, the substrate S is moved and positioned smoothly during positioning. Further, when a plurality of positioning portions 43C are provided in a direction (eg, the X direction) orthogonal to the direction in which the substrate S is positioned, the substrate S can be positioned reliably.

  The drive unit 44C drives the pair of arms 28. The drive unit 44C includes a lift drive unit 44Ca that drives the pair of arms 28 in the vertical direction, and a slide drive unit 44Cb that drives the pair of arms 28 in a direction toward and away from the stage 4C (Y direction). Is provided. The elevating drive unit 44Ca and the slide drive unit 44Cb are each configured by a drive source that supplies a drive force and a drive force transmission mechanism that transmits the drive force. For example, the elevation drive unit 44Ca and the slide drive unit 44Cb are each configured by an air cylinder. The elevating drive unit and the slide drive unit are each communicably connected to the control unit 3 (see FIG. 21) and are driven by the control of the control unit 3. Accordingly, the pair of arms 28 are driven (moved) in the vertical direction or the Y direction. The configuration of the drive unit 44C is not limited to the configuration described above, and is arbitrary. For example, one of the lift drive unit 44Ca and the slide drive unit 44Cb may be other than an air cylinder, for example, an actuator such as an electric motor. Further, the drive unit 44C may not have a drive source, and the arm 28 may be driven manually by the user.

  Next, the operation of the first clamp mechanism CA will be described. Before the first clamping mechanism CA presses a part of the substrate S placed on the stage 4C against the stage 4C, the first clamping mechanism CA is retracted above the stage 4C as shown in FIG. State). At this time, the pair of arms 28 is disposed below the upper surface 4a of the stage 4C.

  When the first clamp mechanism CA presses a part of the substrate S against the stage 4C, first, as shown in FIG. 22 (B), the lift drive unit 44Ca is driven by the control of the control unit 3, whereby the pair of arms 28 rises vertically upward. At this time, the pressing portion 31 is disposed above the upper surface 4 a of the stage 4 </ b> C, and the lower end of the positioning portion 43 </ b> C is disposed above the lower end of the notch portion 33.

  Subsequently, as shown in FIG. 23A, the first clamp mechanism CA is driven by the slide drive unit 44Cb under the control of the control unit 3, so that the pair of arms 28 comes close to the stage 4C. Move to a predetermined position in the direction (-Y direction). At this time, the positioning portion 43 </ b> C is disposed in the notch portion 33. Thereby, the substrate S comes into contact with the positioning portion 43C and moves in the direction of the central portion of the stage 4C (−Y direction), and the + Y side of the substrate S is positioned.

  Subsequently, as shown in FIG. 23B, the first clamp mechanism CA is driven by the lifting / lowering drive unit 44Ca under the control of the control unit 3, so that the pair of arms 28 moves vertically downward, The side part Sa of the substrate S is pressed against the stage 4C by the surface 31a of the part 31. At this time, since the pressing portion 31 (the pair of arms 28) moves vertically downward, the position on the −Y side of the positioning portion 43C moves without changing. As a result, the + Y side of the substrate S is kept positioned. Further, since the positioning portion 43C is configured by a roller, the contact area with the substrate S is small compared to the case of surface contact, so the positioning portion 43C easily moves in the vertical direction in contact with the substrate S. can do. As described above, the first clamping mechanism CA presses the side portion Sa of the substrate S against the stage 4C in a state where the + Y side of the substrate S is positioned. Thus, the first clamp mechanism CA can securely bring the side portion Sa of the substrate S into close contact with the stage 4C in a positioned state.

  The first clamp mechanism CA returns to the retracted state after pressing the substrate S against the stage 4C. At this time, the first clamp mechanism CA returns to the retracted state by performing the operation opposite to the above.

  Next, the second clamp mechanism CB will be described. As shown in FIG. 21, the second clamp mechanism CB is provided on the side facing the first clamp mechanism CA. FIGS. 24A and 24B and FIGS. 25A and 25B are diagrams showing examples of the configuration and operation of the second clamp mechanism, respectively. As described above, the second clamp mechanism CB moves the pressing portion 31 downward and away from the stage 4C, and presses a part of the substrate S against the stage 4C. As shown in FIG. 21 or FIG. 24A, the second clamp mechanism CB includes an arm support portion 52C, an arm 28C, a pressing portion 31, a positioning portion 43C, and a drive portion 55C. Since the fourth clamp mechanism CD is configured in the same manner as the second clamp mechanism CB as described above, the description thereof is omitted.

  In the second clamp mechanism CB, the arm support 52C is disposed in the vicinity of the stage 4C. The arm support portion 52C supports a pair of arms 28C arranged at a predetermined interval along the X direction. The arm support portion 52C is configured to guide a pair of arms 28C upward from the arm support portion 52C and close to the stage 4C by a guide (not shown), and downward from the stage 4C and to the stage 4C. Are supported in such a way that they can move forward and backward (Z direction and Y direction, YZ direction, hereinafter, this direction may be simply referred to as “YZ direction”). That is, the arm support portion 52C supports the pair of arms 28C so as to be movable in an oblique direction with respect to the horizontal plane. At this time, the inclination of the pair of arms 28C with respect to the horizontal plane is not particularly limited and can be arbitrarily set. Further, the arm support portion 52C supports the pair of arms 28C by a guide (not shown) so as to be movable in a direction approaching and separating from the stage 4C (Y direction).

  The pair of arms 28C extends obliquely upward and in a direction close to the stage (YZ direction) starting from the arm support portion 52C. The pair of arms 28C support the pressing portion 31 from below. The pair of arms 28C are driven in the YZ direction and the Y direction by the drive of the drive unit 55C. The pair of arms 28C is configured in the same manner as the arm 28 of the first embodiment except for the above points.

  The pressing portion 31 is the same as the first clamping mechanism CA, is attached to the pair of arms 28C, has a flat surface 31a (see FIG. 7A), and can press the substrate S against the stage 4C. Is formed.

  One positioning portion 43C of the second clamp mechanism CB is provided in the central portion of the lower portion of the pressing portion 31 (see FIG. 21). Except for this point, the positioning part 43C of the second clamp mechanism CB is configured in the same manner as the positioning part 43C of the first clamp mechanism CA, and is disposed in the notch part 33 when advancing above the stage 4C. The substrate S is positioned so as to face and contact the side surface of S (alignment).

  The drive unit 55C drives the pair of arms 28C. The drive unit 55C is a lift drive unit 55Ca that drives the pair of arms 28C in the YZ direction described above, and a slide drive that drives the pair of arms 28C in a direction toward and away from the stage 4C (Y direction). Part 55Cb. The elevating drive unit 55Ca and the slide drive unit 55Cb are each configured by a drive source that supplies a drive force and a drive force transmission mechanism that transmits the drive force. For example, the elevation drive unit 55Ca and the slide drive unit 55Cb are each configured by an air cylinder. The elevating drive unit 55Ca and the slide drive unit 55Cb are connected to the control unit 3 (see FIG. 21) so as to communicate with each other, and are driven by the control of the control unit 3. Thus, the pair of arms 28C are driven in the YZ direction or the Y direction.

  The configuration of the drive unit 55C is not limited to the configuration described above, and is arbitrary. For example, at least one of the lift drive unit 55Ca and the slide drive unit 55Cb may be other than an air cylinder or an actuator such as an electric motor. Further, the drive unit 55C may be a mechanism that shares one drive source. Further, the drive unit 55C may not have a drive source (in this example, an air cylinder). For example, the arm 28C may be configured to be driven (moved) by a user's manual driving force.

  Next, the operation of the second clamp mechanism CB will be described. The second clamp mechanism CB is driven after the operation of the first clamp mechanism CA described above. That is, the second clamp mechanism CB has positioned the -Y side end of the substrate S after being pressed against the stage 4C in a state where the + Y side end of the substrate S is positioned by the first clamp mechanism CA. Then, press the stage 4C. Thereby, the both ends of the substrate S in the Y direction are positioned and pressed against the stage 4C.

  Before the second clamp mechanism CB presses a portion of the substrate S against the stage 4, as shown in FIG. At this time, the pair of arms 28C is disposed below the upper surface 4a of the stage 4C.

  When the second clamp mechanism CB presses a part of the substrate S against the stage 4C, first, as shown in FIG. 24B, the lifting drive unit 55Ca is driven by the control of the control unit 3, thereby the pair of arms. 28C rises upward and in a direction close to the stage 4C (+ Y direction and + Z direction). At this time, the pressing portion 31 is arranged to be above the upper surface of the substrate S.

  Subsequently, as shown in FIG. 25A, the second clamp mechanism CB is driven by the slide drive unit 55Cb under the control of the control unit 3, so that the pair of arms 28C come close to the stage 4C. Move to a predetermined position in the direction (+ Y direction). At this time, the pressing portion 31 moves above the substrate S and toward the center side (+ Y side) from the end portion on the −Y side of the substrate S.

  Subsequently, as shown in FIG. 25 (B), the second clamp mechanism CB is separated from the stage 4C by moving the lifting and lowering drive unit 55Cb under the control of the control unit 3, so that the pair of arms 28C are separated from the stage 4C. (Y direction and -Z direction, hereinafter, this direction movement may be referred to as “obliquely backward”), and the side portion Sa of the substrate S is moved to the stage 4C by the surface 31a of the pressing portion 31. Press.

  The second clamp mechanism CB returns to the retracted state after pressing the substrate S against the stage 4C. At this time, the second clamp mechanism CB returns to the retracted state by performing the operation opposite to the above.

  Here, operations of the first clamp mechanism CA and the second clamp mechanism CB will be described. FIGS. 26A to 26D are explanatory diagrams of operations of the first clamp mechanism CA and the second clamp mechanism CB.

  As described above, both ends of the substrate S may warp upward. In the coating apparatus 1C of the present embodiment, first, as shown in FIG. 26B, one end of the substrate S is pressed against the stage 4C by the first clamp mechanism CA. When one end portion of the substrate S whose both end portions are greatly warped is pressed against the stage 4C, the position of the other end portion further rises as shown in FIG. The position of the part may shift with respect to the horizontal plane. In this case, for example, as shown in FIG. 26 (C), if the second clamp mechanism CB presses the substrate S against the stage 4C vertically downward, the force acting on the substrate S from the pressing portion 31 increases. The substrate S may be displaced, deformed, or damaged. In the present embodiment, as shown in FIG. 26D, the second clamp mechanism CB moves the side portion Sa of the substrate S to the stage by moving the pressing portion 31 downward and away from the stage 4C. Since it presses against 4C, the force which acts on the board | substrate S from the holding | suppressing part 31 can be made small, As a result, position shift, a deformation | transformation, and damage of the above-mentioned board | substrate S can be suppressed.

  As described above, in this embodiment, the second clamp mechanism CB (fourth clamp mechanism CD) suppresses the force acting on the substrate S from the pressing portion 31, and presses the side portion Sa of the substrate S against the stage 4C. Therefore, even if the distortion (deformation amount) of the substrate S is large, the end portion (side portion Sa) of the substrate S can be prevented from being displaced, deformed, or damaged, and can be securely brought into close contact with the stage 4C. Further, in the present embodiment, the substrate S is moved in a direction that is not opposed to each other in the four directions of the substrate S (the X direction and the Y direction) in the downward direction and away from the stage 4C. Since a clamp mechanism (eg, second clamp mechanism CB, fourth clamp mechanism CD) that presses Sa against the stage 4C is provided, the four end portions of the substrate S are reliably prevented from being displaced, deformed, and damaged. It can be brought into close contact with the stage 4C.

  Each clamp mechanism 10C operates in the same manner as the clamp mechanism 10 of the first embodiment except for the above points.

  Next, a coating method according to the fourth embodiment will be described based on the operation of the coating apparatus 1C of the present embodiment. FIG. 27 is a flowchart illustrating an example of a coating method according to the fourth embodiment. In describing FIG. 27, FIGS. 21 to 26 are referred to as appropriate.

  The coating method of this embodiment raises 1st clamp mechanism CA-4th clamp mechanism CD in step S21 following step S2 of FIG. The operations of the first clamp mechanism CA to the fourth clamp mechanism CD at this time are as described above. Accordingly, the first clamp mechanism CA to the fourth clamp mechanism CD are lifted from the retracted state, the respective pressing portions 31 are disposed above the upper surface 4a of the stage 4C, and the lower ends of the respective positioning portions 43C. Is disposed above the lower end of the notch 33 (see FIGS. 22A and 24A).

  Subsequently, in step S22, the first clamp mechanism CA is advanced above the stage 4C, and the substrate S is abutted against the positioning portion 43C for positioning. The operation of the first clamp mechanism CA and the like is as described above. As a result, the substrate S contacts the positioning portion 43C and moves in the direction of the central portion of the stage 4C (−Y direction), and the + Y side of the substrate S is positioned (see FIG. 23A).

  Subsequently, in step S23, the first clamp mechanism CA is lowered to press a part of the substrate S against the stage 4C. The operation of the first clamp mechanism CA and the like at this time is as described above. Accordingly, the first clamp mechanism CA presses the side portion Sa of the substrate S against the stage 4C in a state where the + Y side of the substrate S is positioned. As a result, the end portion of the substrate S is deformed horizontally along the upper surface 4a of the stage 4C, so that the end portion of the substrate S is securely attached to the stage 4C in a positioned state (see FIG. 23B). .

  Subsequently, in step S24, the second clamp mechanism CB is advanced above the stage 4C, and the substrate S is abutted against the positioning portion 43C for positioning. The operation of the second clamp mechanism CB and the like at this time is as described above. As a result, the substrate S comes into contact with the positioning portion 43C and moves in the center direction (+ Y direction) of the stage 4C, and the −Y side of the substrate S is positioned (see FIG. 25A).

  Subsequently, in step S25, the second clamp mechanism CB moves downward and in a direction away from the stage 4C, and presses a part of the substrate S against the stage 4C. The operation of the second clamp mechanism CB and the like at this time is as described above. Thereby, the second clamp mechanism CB presses the side portion Sa of the substrate S downward and away from the stage 4C in a state where the −Y side of the substrate S is positioned (FIG. 25B )reference). As described above, the second clamp mechanism CB suppresses the force acting on the substrate S from the pressing portion 31 and presses the substrate S against the stage 4C. Therefore, even if the substrate S has a large amount of distortion (deformation amount). The end portion of the substrate S can be securely attached to the stage 4C while suppressing displacement, deformation and breakage.

  Subsequently, in step S26, the third clamp mechanism CC is advanced above the stage 4C, and the substrate S is abutted against the positioning portion 43C for positioning. The operations of the third clamp mechanism CC and the like are the same as those of the first clamp mechanism CA described above. As a result, the substrate S contacts the positioning portion 43C and moves in the direction of the central portion of the stage 4C (+ X direction), and the −X side of the substrate S is positioned.

  Subsequently, in step S27, the third clamp mechanism CC is lowered to press the side portion Sa of the substrate S against the stage 4C. The operation of the third clamp mechanism CC and the like at this time is the same as that of the first clamp mechanism CA described above. Accordingly, the third clamp mechanism CC presses the side portion Sa of the substrate S against the stage 4C in a state where the −X side of the substrate S is positioned. As a result, the end portion of the substrate S is deformed horizontally along the upper surface 4a of the stage 4, so that the side portion Sa of the substrate S is securely attached to the stage 4C in a positioned state.

  Subsequently, in step S28, the fourth clamp mechanism CD is advanced above the stage 4C, and the substrate S is abutted against the positioning portion 43C for positioning. The operation of the fourth clamp mechanism CD and the like at this time is the same as that of the above-described second clamp mechanism CB. Thereby, the substrate S comes into contact with the positioning portion 43C and moves in the direction of the central portion of the stage 4C (−X direction), and the + X side of the substrate S is positioned.

  Subsequently, in step S29, the fourth clamp mechanism CD moves downward and in a direction away from the stage 4C, and presses the side portion Sa of the substrate S against the stage 4C. The operation of the fourth clamp mechanism CD and the like at this time is the same as that of the above-described second clamp mechanism CB. As a result, the fourth clamp mechanism CD presses the side portion Sa of the substrate S downward and away from the stage 4C with the + X side of the substrate S positioned. As described above, the fourth clamp mechanism CD suppresses the force acting on the substrate S from the pressing portion 31 and presses the substrate S against the stage 4C. Therefore, even if the substrate S has a large amount of distortion (deformation amount). Further, the side portion Sa of the substrate S can be prevented from being displaced, deformed, and damaged, and can be securely adhered to the stage 4C.

  Subsequently, in step S30, the first clamp mechanism CA to the fourth clamp mechanism CD are raised. The operations of the first clamp mechanism CA to the fourth clamp mechanism CD at this time are as described above.

  Subsequently, in step S31, the first clamp mechanism CA to the fourth clamp mechanism CD are retracted from above the stage 4C. The operations of the first clamp mechanism CA to the fourth clamp mechanism CD at this time are as described above. Thereby, 1st clamp mechanism CA-4th clamp mechanism CD will be in a retracted state.

  Subsequently, steps S7 to S9 shown in FIG. 6 are performed, and the substrate S is unloaded from the stage 4C after the liquid L is applied in a state of being securely held on the stage 4C.

  As described above, the first clamp mechanism CA and the third clamp mechanism CC are the same, and the second clamp mechanism CB and the fourth clamp mechanism CD are the same. Therefore, Steps S26 to S29 were performed. Later, step S22 to step 25 may be performed.

  As described above, the coating apparatus 1C of the present embodiment suppresses the force acting on the substrate S from the pressing portion 31 and presses the side portion Sa of the substrate S against the stage 4C as described above. Even if the distortion (deformation amount) of S is large, the side portion Sa of the substrate S can be securely adhered to the stage 4 while suppressing displacement, deformation, and breakage. As a result, the liquid L can be applied with high accuracy by securely holding the substrate S on the stage 4.

  Note that at least one of the first clamp mechanism CA and the third clamp mechanism CC may have the same configuration as the second clamp mechanism CB. The number and position of the clamp mechanisms 10C are not limited to the above-described example, and are arbitrary. For example, the number of the clamp mechanisms 10C may be 1 to 3. In this case, the position where the clamp mechanism 10C is disposed is arbitrary, and may be disposed, for example, in any one of the four directions of the stage 4C.

[Fifth Embodiment]
A fifth embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  28 and 29 are diagrams illustrating an example of the configuration and operation of the coating apparatus according to the fifth embodiment of the coating apparatus 1D according to the fifth embodiment. The coating apparatus 1D of the present embodiment includes, for example, a frame 2 (see FIG. 1), a control unit 3, a stage 4C, a stage driving unit 5 (driving unit), a coating unit 6 (see FIG. 1), and a liquid. The body supply part 7 (refer FIG. 1), the raising / lowering drive part 8 (refer FIG. 1), the adsorption | suction part 9 (refer FIG. 1), and the clamp mechanism 10D are provided. The coating apparatus 1D of this embodiment includes a clamp mechanism 10D instead of the clamp mechanism 10C of the fourth embodiment. Hereinafter, the difference from the first embodiment to the fourth embodiment will be mainly described.

  The clamp mechanism 10D includes a first clamp mechanism CA (see FIG. 21), a second clamp mechanism DB (see FIG. 28A), a third clamp mechanism CC (see FIG. 21), and a fourth clamp mechanism DD (not shown). ). The first clamp mechanism CA and the third clamp mechanism CC are the same as in the fourth embodiment. The second clamp mechanism DB is provided in place of the second clamp mechanism CB shown in FIG. The fourth clamp mechanism DD is provided in place of the fourth clamp mechanism CD shown in FIG.

  The second clamp mechanism DB will be described. FIGS. 28A and 28B and FIGS. 29A and 29B are diagrams showing an example of the configuration and operation of the second clamp mechanism DB, respectively. The second clamp mechanism DB moves the pressing portion 31D downward and away from the stage 4C, and presses a part of the substrate S against the stage 4C. As shown in FIG. 28A, the second clamp mechanism DB includes an arm support portion 52D, an arm 28C, a pressing portion 31D, a positioning portion support portion 53D, a positioning portion 54D, a driving portion 55C, and a driving portion 56D. Note that the fourth clamp mechanism DD is configured in the same manner as the second clamp mechanism DB, and thus the description thereof is omitted.

  In the second clamp mechanism DB, the arm support 52D is disposed in the vicinity of the stage 4C. Similarly to the arm support portion 52C of the fourth embodiment, the arm support portion 52D moves the pair of arms 28C upward from the arm support portion 52D and close to the stage 4C, and downward from the stage 4C. The stage 4C is supported so as to be able to move forward and backward in a direction away from the stage 4C. Further, the arm support portion 52D is configured so that the pair of arms 28C are moved toward and away from the stage 4C (Y direction) by a guide (not shown), similarly to the arm support portion 52C of the fourth embodiment. ) Movably supported.

  The arm support portion 52D supports the positioning portion support portion 53D by a guide (not shown) so as to be movable in the vertical direction. Further, the arm support portion 52D supports the positioning portion support portion 53D by a guide (not shown) so as to be movable in a direction approaching the stage 4C and a direction away from the stage 4C (Y direction).

  The positioning part support part 53D supports the positioning part 54D from below. The positioning portion support portion 53 </ b> D includes a shaft portion 57 extending in the vertical direction and a connection portion 58 connected to the upper portion of the shaft portion 57. The shaft portion 57 is supported by the arm support portion 52D. The connection portion 58 has one end connected to the shaft portion 57 and the other end connected to the positioning portion 54D. The shaft portion 57 is connected to a drive portion 56D described later. The positioning portion support portion 53D is driven in the vertical direction and the X direction by the drive of the drive portion 56D.

  The pressing portion 31D has a flat surface 31a (see FIG. 7A), and is formed so that the substrate S can be pressed against the stage 4C (see FIG. 21). The pressing portion 31D is provided with a recess 31Da that is recessed upward from below in the central portion in the X direction. The concave portion 31Da is formed so that a part of the upper portion of the positioning portion 54D can be accommodated. The recess 31Da is provided so that the pressing portion 31D and the positioning portion 54D do not interfere with each other. The mechanism in which the positioning portion 54D is accommodated in the recess 31Da will be described in the operation part of the second clamp mechanism DB.

  The positioning unit 54D positions (aligns) the substrate S. The positioning part 54D is a roller, like the positioning part 43C of the fourth embodiment. The positioning portion 54D can rotate around an axis parallel to the vertical direction. The positioning portion 54D is disposed in the notch portion 33 (see FIG. 21) when the second clamp mechanism DB advances above the stage 4C, and is provided so as to be opposed to the side surface of the substrate S. Yes.

  The drive unit 55C is the same as in the fourth embodiment, and drives the pair of arms 28C.

  The drive unit 56D drives the positioning unit support unit 53D. The drive unit 56D is a slide drive unit that drives the elevating drive unit 56Da and the positioning unit support unit 53D that drive the positioning unit support unit 53D in the vertical direction in a direction toward and away from the stage 4C (Y direction). 56Db (see FIG. 28B). The elevating drive unit 56Da and the slide drive unit 56Db each include a drive source that supplies a drive force and a drive force transmission mechanism that transmits the drive force. For example, the elevation drive unit 56Da and the slide drive unit 56Db are each configured by an air cylinder. The elevating drive unit 56Da and the slide drive unit 56Db are connected to the control unit 3 (see FIG. 21) so as to communicate with each other, and are driven by the control of the control unit 3. Thereby, the positioning part support part 53D is driven in the vertical direction or the Y direction.

  Note that the configuration of the drive unit 56D is not limited to the configuration described above, and is arbitrary. For example, at least one of the lift drive unit 56Da and the slide drive unit 56Db may be other than an air cylinder, or an actuator such as an electric motor. The drive unit 55C and the drive unit 56D may be a mechanism that shares one drive source. Further, the drive unit 56D may not have a drive source (in this example, an air cylinder). For example, the positioning unit support unit 53D may be configured to be driven by a user's manual driving force.

  Next, the operation of the second clamp mechanism DB will be described. The second clamp mechanism DB is driven after the operation of the first clamp mechanism CA (see FIG. 21). That is, the second clamp mechanism DB is in a state in which the + Y side end of the substrate S is positioned after being pressed against the stage 4C while the + Y side end of the substrate S is positioned by the first clamp mechanism CA. Then, press the stage 4C. Thereby, the both ends of the substrate S in the Y direction are positioned and pressed against the stage 4C.

  Before the second clamp mechanism DB is pressed against the stage 4C, a part of the substrate S is retracted above the stage 4C (retracted state) as shown in FIG. At this time, the pair of arms 28C and the positioning portion 54D are respectively disposed below the upper surface 4a of the stage 4C. At this time, a part of the positioning portion 54D is accommodated in the recess 31Da. In this case, the size of the pressing portion 31D can be made more compact.

  When the second clamping mechanism DB presses a part of the substrate S against the stage 4C, first, as shown in FIG. 28 (B), the lifting drive unit 55Ca is driven by the control of the control unit 3, thereby the pair of arms. 28C rises vertically upward and in a direction close to the stage 4C (+ Y direction and + Z direction). At this time, the pressing portion 31 </ b> D is disposed so as to be above the upper surface of the substrate S.

  Further, in the second clamp mechanism DB, the positioning unit support unit 53D moves vertically upward when the elevation drive unit 56Da is driven by the control of the control unit 3. At this time, the lower end of the positioning portion 54 </ b> D is disposed above the lower end of the notch 33.

  Subsequently, as shown in FIG. 29A, the second clamp mechanism DB is driven by the slide drive unit 55Cb under the control of the control unit 3, so that the pair of arms 28C comes close to the stage 4C. Move to a predetermined position in the direction (+ Y direction). At this time, the pressing portion 31 </ b> D moves above the substrate S and toward the center side of the −Y side end of the substrate S.

  Further, the second clamp mechanism DB is driven by the slide drive unit 56Db under the control of the control unit 3, so that the positioning unit support unit 53D moves so that the positioning unit 54D is disposed in the notch 33. As a result, the substrate S contacts the positioning portion 53D and moves in the direction of the central portion of the stage 4C (+ Y direction), and the −Y side of the substrate S is positioned.

  Subsequently, as shown in FIG. 29 (B), the second clamp mechanism DB moves the pair of arms 28C downward and away from the stage 4C when the lifting drive unit 55Cb is driven by the control of the control unit 3. In the direction (−Y direction and −Z direction), the side portion Sa of the substrate S is pressed against the stage 4C by the surface 31a of the pressing portion 31D. At this time, since the positioning portion 53D does not move, the positioned state is maintained on the −X side of the substrate S. At this time, a part of the upper portion of the positioning portion 54D is accommodated in the recess 31Da. In this case, in a state where the positioning unit 54D positions the substrate S, the pressing unit 31D can reliably press the substrate S against the stage 4C without interfering with the positioning unit 53C. Thus, the second clamping mechanism DB presses the side portion Sa of the substrate S downward and away from the stage 4C with the −Y side end of the substrate S positioned. . Thereby, 2nd clamp mechanism DB can be made to contact | adhere to the stage 4C reliably in the state which positioned the side part Sa of the board | substrate S. As shown in FIG.

  The second clamp mechanism DB returns to the retracted state after pressing the substrate S against the stage 4C. At this time, the second clamp mechanism CB returns to the retracted state by performing the operation opposite to the above. The fourth clamp mechanism DD operates in the same manner as the second clamp mechanism DB.

  The operation of the coating apparatus 1D of the present embodiment is the same as the operation of the coating apparatus 1C of the fourth embodiment except for the operations of the second clamp mechanism DB and the fourth clamp mechanism DD described above, and operates in the same manner as FIG. To do.

  As described above, in the coating apparatus 1D of the present embodiment, in the state where the positioning unit 54D positions the substrate S, the side portion Sa of the substrate S is moved downward and away from the stage 4C. Press on. Thereby, 2nd clamp mechanism DB can be made to contact | adhere to the stage 4C reliably in the state which positioned the side part Sa of the board | substrate S. As shown in FIG.

  Note that at least one of the first clamp mechanism CA and the third clamp mechanism CC may have the same configuration as the second clamp mechanism DB. The number and position of the clamp mechanisms 10D are not limited to the above-described example, and are arbitrary. For example, the number of clamp mechanisms 10D may be one to three. In this case, the position where the clamp mechanism 10D is disposed is arbitrary, and may be disposed, for example, in any one of the four directions of the stage 4C.

  The technical scope of the present invention is not limited to the aspects described in the above-described embodiments. One or more of the requirements described in the above embodiments and the like may be omitted. In addition, the requirements described in the above-described embodiments and the like can be combined as appropriate. In addition, as long as it is permitted by law, the disclosure of all documents cited in the above-described embodiments and the like is incorporated as a part of the description of the text.

  For example, in the above-described embodiment, the application apparatus 1, 1 </ b> A to 1 </ b> D has been described with respect to the configuration in which the stages 4, 4 </ b> A, and 4 </ b> C move with respect to the application unit 6. Is not limited to this. For example, the coating apparatus 1, 1 </ b> A to 1 </ b> D may be configured such that the coating unit 6 moves with respect to the stages 4, 4 </ b> A, 4 </ b> C.

  Further, for example, in the above-described embodiment, the configuration in which the clamp mechanisms 10, 10A, and 10B are attached to the stages 4 and 4A has been described as an example. However, the clamp mechanisms 10, 10A and 10B are attached to the stages 4 and 4A. It may not be attached. For example, the clamp mechanisms 10, 10A, 10B may be attached to the base 11 (frame). In this case, for example, by moving the stages 4, 4A to a predetermined position, the substrate S can be pressed against the stages 4, 4A by the clamp mechanisms 10, 10A, 10B.

  Further, for example, the coating apparatuses 1, 1 </ b> A to 1 </ b> D may include a maintenance unit that maintains the coating unit 6. For example, the maintenance section performs nozzle dip, preliminary discharge of a liquid material from the nozzle, and the like. For example, in the coating apparatuses 1, 1 </ b> A to 1 </ b> D, a maintenance unit is disposed on the + X side or −X side of the stages 4, 4 </ b> A, 4 </ b> C, and the coating unit 6 is moved to the maintenance unit by driving the stage driving unit 5. The maintenance of the application unit 6 may be performed by moving the gantry 12 when the gantry 12 is movable. Further, for example, the coating apparatuses 1, 1 </ b> A to 1 </ b> D may include a maintenance unit that can move in the vicinity of the coating unit 6.

1, 1A, 1B, 1C, 1D ... coating device 4, 4A, 4C ... stage 4c ... side (stage)
5 ... Stage drive unit (drive unit)
6 ... Application part 9 ... Adsorption part 10 (10a-10d), 10A (10Ab, 10Ac), 10B (10Ba-10Bd), 10C (CA-CD), 10D (CA, DB, CC, DD) ... Clamp mechanism 18 ... Vacuum groove (adsorption part)
19 ... Suction pad (Suction part)
33 ... Notches 34, 43C, 53D ... Positioning part L ... Liquid S ... Substrate Sa ... Side (substrate)

Claims (17)

A stage on which a substrate is placed;
An application unit for applying a liquid material to the substrate on the stage;
An adsorbing portion that is provided on the stage and adsorbs the mounted substrate;
A clamp mechanism that is capable of advancing and retreating above the stage and pressing a part of the substrate placed on the stage at the advanced position;
A coating apparatus, comprising: a drive unit that relatively moves the stage and the coating unit.   The coating apparatus according to claim 1, wherein the coating unit includes a slit nozzle that ejects a liquid material.   The said adsorption | suction part is a coating device of Claim 1 or Claim 2 which is a vacuum groove formed in the said stage.   The said adsorption | suction part is a coating device of any one of Claims 1-3 which are the several suction pad formed in the said stage.   The coating device according to claim 4, wherein the suction pad is formed so as to protrude and immerse from the stage, and immerses when the substrate is sucked.   6. The plurality of suction pads are arranged so that the number of arrangement per unit area is larger in the outer region outside the central region than in the central region of the substrate. The coating apparatus as described in.   The coating apparatus according to claim 1, wherein the clamp mechanism is formed so as to sandwich at least one side portion of the rectangular substrate between the stage and the stage.   The coating apparatus according to any one of claims 1 to 7, wherein the clamp mechanism includes a positioning unit that positions the substrate by abutting the substrate on the stage. The stage includes a notch on the side,
The coating apparatus according to claim 8, wherein the positioning unit is arranged at a predetermined position by entering the notch when the clamp mechanism has advanced.   The coating apparatus according to claim 1, wherein a plurality of the clamp mechanisms are provided.   The coating apparatus according to claim 10, wherein at least one of the plurality of clamp mechanisms presses the substrate against the stage in a direction downward and away from the stage.   The coating apparatus according to claim 1, wherein the driving unit moves the stage with respect to the coating unit. A method of applying a liquid material to a substrate,
Placing the substrate on a stage;
Advancing a clamp mechanism above the stage, pressing a part of the substrate placed on the stage against the stage by a clamp mechanism;
Adsorbing the substrate to the stage by an adsorption unit;
Retreating the clamp mechanism above the stage and applying the liquid material to the substrate adsorbed on the stage by applying the liquid material while relatively moving the stage and the application unit. Application method.   The coating method according to claim 13, further comprising: adsorbing the substrate to the stage by the adsorption unit after pressing a part of the substrate against the stage by the clamp mechanism.   The coating method according to claim 13, further comprising positioning the substrate by abutting the substrate placed on the stage against a part of the clamp mechanism.   The coating method according to claim 13, comprising applying a liquid material to the substrate by moving the stage relative to the application unit.   17. The device according to claim 13, wherein at least one of the plurality of clamp mechanisms includes pressing the substrate against the stage in a direction downward and away from the stage. Application method.

Images