JP7296536B2 - SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE SUPPORTING METHOD - Google Patents

Description

The present invention relates to a substrate supporting device, a substrate processing device, and a substrate supporting method.

2. Description of the Related Art In a substrate processing apparatus for performing a predetermined process on a substrate, a substrate supporting device is used that rotates the substrate by sucking it on a substrate supporting surface during processing. In this substrate support device, if the substrate to be sucked on the substrate support surface is warped, a gap is formed between the substrate and the substrate support surface, creating a vacuum (negative pressure) between the substrate and the substrate support surface. It may be destroyed and the substrate may not be able to be adsorbed. On the other hand, a suction unit having a concentric first groove provided on the substrate mounting surface and a second groove intersecting the first groove, and a ratio of the suction force of the suction unit to the mass of the substrate is set to a predetermined value. A configuration has been proposed in which even a warped substrate can be adsorbed by providing an air exhaust portion set within the range of (see, for example, Patent Document 1).

JP 2011-82457 A

In the configuration disclosed in Patent Document 1, even when the suction force to the substrate is set, the warp may not be eliminated depending on the stress generated in the substrate, and as a result, the vacuum between the substrate and the substrate support surface may be reduced. There is a possibility that it will be destroyed and will not be able to adsorb the substrate. Further, if a strong attraction force is set to eliminate the warp of the substrate and the warp of the substrate is corrected and held on the substrate supporting surface, the substrate may be damaged.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate supporting apparatus, a substrate processing apparatus, and a substrate supporting method that can easily and reliably hold even a warped substrate.

According to the aspect of the present invention, a substrate supporting portion having a support surface for supporting a substrate on the top surface thereof; and a substrate suction unit that is provided so as to be retractable upward from the support surface and that suctions the lower surface of the substrate placed on the support surface, wherein the substrate suction unit is attached to the support surface. It further comprises an elastically deformable suction pad arranged in a submerged state, and a negative pressure supply unit applying a negative pressure for suctioning the suction pad to the lower surface of the substrate, wherein the suction pad is arranged so that the warped substrate is supported by the substrate. Provided is a substrate supporting device that sticks to a substrate by being pressed downward, and protrudes from a support surface while holding the substrate by suction due to elastic deformation due to warping of the substrate after the pressing of the substrate is released.
According to the first aspect of the present invention, a substrate supporting portion having a support surface for supporting a substrate on a top surface thereof; a substrate holding portion that holds the substrate from above; and a substrate suction portion that is provided so as to be able to protrude upward from the support surface and sucks the lower surface of the substrate placed on the support surface, A substrate support apparatus is provided.

According to a second aspect of the present invention, a substrate processing apparatus includes the substrate support device of the first aspect described above, and a substrate processing section that processes the substrate placed on the substrate support portion of the substrate support device. is provided.

According to the aspect of the present invention, the warped substrate is placed on the supporting surface of the substrate supporting portion and pressed from above, and the elastically deformable suction pad is placed in the supporting surface and is placed in the supporting surface. releasing the substrate from above, elastically deforming the suction pad according to the warpage of the substrate, and protruding upward from the support surface while holding the substrate by suction; A method of supporting a substrate is provided, comprising:
According to the third aspect of the present invention, the substrate placed on the support surface of the substrate supporting portion is pressed from above, the substrate adsorption portion is attracted to the lower surface of the substrate, and the substrate is pressed from above. is released so that the substrate suction part protrudes upward from the support surface in accordance with the warpage of the substrate.

According to the aspect of the present invention, when the substrate placed on the support surface is pressed from above by the substrate holding portion and the lower surface of the substrate is adsorbed by the substrate adsorption portion, the substrate is warped. , the substrate attracting portion protrudes upward from the supporting surface according to the amount of warping of the substrate and maintains a state of being attracted to the lower surface of the substrate. Therefore, even if the substrate is warped, the substrate adsorption portion maintains the substrate adsorption state, so that the substrate can be easily and reliably held.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective sectional view which shows an example of the substrate supporting apparatus (substrate processing apparatus) which concerns on embodiment. It is a front view which shows the principal part of a board|substrate support apparatus. It is a top view which shows a board|substrate support apparatus. 3 is a cross-sectional view showing a schematic configuration of a substrate lift section of the substrate supporting device; FIG. 4 is a cross-sectional view showing a schematic configuration of a substrate suction portion of the substrate supporting device; FIG. 4 is a diagram showing the correlation between the degree of vacuum (negative pressure) applied to a suction pad and the suction force exerted by the suction pad; FIG. FIG. 3 is a cross-sectional view showing the configuration of a substrate holding portion; 3 is a cross-sectional view showing a substrate supporting device and a substrate processing section; FIG. It is a figure which shows an example of the functional block structure of a controller. 1 is a flow chart showing an example of a substrate processing method including a substrate supporting method according to an embodiment; FIG. 5 is a diagram showing a state in which lift pins are projected upward in the substrate supporting device; FIG. 10 is a diagram showing a state in which a substrate carried in from a previous process is received on lift pins projecting upward in the substrate supporting device. FIG. 4 is a diagram showing a state in which a substrate is placed on lift pins projecting upward in the substrate supporting device; FIG. 10 is a diagram showing a state in which the lift pins are lowered and the substrate is placed on the support surface of the substrate support table in the substrate support device. FIG. 4 is a diagram showing a state in which a substrate holding portion presses a substrate placed on a substrate supporting table in the substrate supporting device; FIG. 4 is a diagram showing a state in which a substrate is sucked by a suction pad in a state where the substrate is placed along the support surface of the substrate support table in the substrate support device. FIG. 6 is a diagram showing a state in which a suction pad holds a substrate with its outer peripheral portion upward on the support surface of the substrate support table in the substrate support device. FIG. 10 is a diagram showing a state in which a suction pad holds a substrate with its central portion upward on the support surface of the substrate support table in the substrate support device; FIG. 4 is a cross-sectional view showing a state in which a support member laminated on a substrate is removed when the substrate subjected to a predetermined process is carried out to a post-process in the substrate processing method;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the invention is not limited to this embodiment. In addition, in the drawings, in order to make each configuration of the embodiment easier to understand, a part is enlarged or emphasized, or a part is simplified, and the actual structure, shape, scale, etc. may differ. There is

FIG. 1 is a perspective cross-sectional view showing an example of a substrate supporting device and a substrate processing device according to an embodiment. FIG. 2 is a front view showing the main parts of the substrate support device 2. FIG. FIG. 3 is a plan view showing the substrate support device 2. FIG. As shown in FIGS. 1 to 3, the substrate processing apparatus 1 mainly includes a substrate supporting device 2, a substrate processing section 3 (see FIG. 7), and a controller 9 (see FIG. 9). In this embodiment, the substrate processing apparatus 1 processes the substrate 100 using, for example, a laser beam. The processing performed on the substrate 100 by the substrate processing apparatus 1 is not limited to processing using laser light, and may be other processing such as cleaning processing of the substrate 100 .

The substrate support device 2 mainly includes a substrate support table (substrate support section) 4 , a substrate lift section 5 , a substrate suction section 6 and a substrate holding section 7 . The substrate support table 4 has a rectangular shape in plan view and has a predetermined thickness in the vertical direction. As shown in FIGS. 1 and 3, the substrate support table 4 is provided movably in two directions orthogonal to each other in a horizontal plane along guide members 44X and 44Y provided below the substrate support table 4. there is The substrate support table 4 is driven forward and backward along the respective guide members 44X and 44Y by a drive section (for example, a drive cylinder) (not shown).

FIG. 4 is a cross-sectional view showing a schematic configuration of the substrate lift section 5 of the substrate support device 2. As shown in FIG. FIG. 5 is a cross-sectional view showing a schematic configuration of the substrate adsorption section 6 of the substrate support device 2. As shown in FIG. As shown in FIGS. 2, 4, and 5, the top surface 4t of the substrate support table 4 that faces upward is used as a support surface 41 that supports the substrate 100. As shown in FIGS. A plurality of pin holes 42 and a plurality of pad accommodation holes 43 are formed in the substrate support table 4 . Each pin hole 42 and each pad accommodation hole 43 are circular in plan view, and penetrate the substrate support table 4 in the vertical direction.

As shown in FIG. 4 , the substrate lift section 5 is provided on the substrate support table 4 . The substrate lift section 5 includes a plurality of lift pins 51, brackets 52, and lift cylinders (not shown). A plurality of lift pins 51 are provided at intervals in the horizontal direction. Each lift pin 51 extends vertically. Each lift pin 51 is inserted into the pin hole 42 of the substrate support table 4 . Guide bushes 55 are provided on the lower surface of the substrate support table 4 to support the lift pins 51 so as to be vertically movable.

The bracket 52 extends horizontally and integrally connects the lower ends of the plurality of lift pins 51 . A lift cylinder (not shown) drives the bracket 52 up and down. The plurality of lift pins 51 move up and down by moving the bracket 52 up and down with a lift cylinder (not shown). The plurality of lift pins 51 has a position where the upper end 51t is lower than the support surface 41 of the substrate support table 4 and does not protrude upward from the support surface 41 (recessed position), and a position where the upper end 51t protrudes upward from the support surface 41. It can appear and disappear between the position (projection position).

As shown in FIGS. 1 to 3 , the substrate adsorption section 6 is provided on the substrate support table 4 . A plurality of substrate suction units 6 are arranged on the substrate support table 4 . A plurality of substrate suction units 6 are arranged corresponding to substrates 100 placed on the substrate support table 4 . Specifically, the plurality of substrate suction units 6 are arranged at positions facing the lower surface 100b of the substrate 100 placed on the substrate support table 4 from below.

As shown in FIGS. 1 and 3, the plurality of substrate suction units 6 are arranged at a central portion 100c of the substrate 100 placed on the substrate support table 4 and an outer peripheral portion 100d of the substrate 100. As shown in FIGS. A plurality of substrate suction portions 6 are arranged at predetermined intervals along the inside of the outer edge 100g of the rectangular substrate 100 . The plurality of substrate suction portions 6 are arranged at a central portion 100c of the substrate 100 placed on the substrate support table 4 and at a plurality of positions 100e along the radial direction from the central portion 100c. A plurality of substrate adsorption portions 6 are arranged at a central portion 100c of the substrate 100 placed on the substrate support table 4 and four corner portions 101 of the substrate 100, respectively.

As shown in FIG. 5 , each substrate suction unit 6 is provided so as to be retractable upward from the support surface 41 , and suctions the lower surface 100 b of the substrate 100 placed on the support surface 41 . The substrate adsorption section 6 includes a pad body 61 , an elastic section 62 and a negative pressure supply section 63 . The pad body 61 extends vertically and is inserted into the pad housing hole 43 of the substrate support table 4 . The pad body 61 is fixed to a support bracket 66 provided on the lower surface of the substrate support table 4 by nuts 67A and 67B. The nuts 67A and 67B are provided so as to sandwich the support bracket 66 from above and below.

A suction pad 64 that can be suctioned to the lower surface 100 b of the substrate 100 is provided on the upper end of the pad main body 61 . Through holes 61h and 64h are formed through the pad main body 61 and the suction pad 64 in the vertical direction. The suction pad 64 is made of an elastic material such as a rubber-based material. The suction pad 64 has, as the elastic portion 62, a bellows portion 65 that can be expanded and contracted in the vertical direction. The suction pad 64 has its tip 64s provided at the same position as the support surface 41 of the substrate support table 4 in the vertical direction. The suction pad 64 adheres to the bottom surface 100 b of the substrate 100 .

As indicated by the chain double-dashed line in FIG. 5, when the suction pad 64 sticks to the bottom surface 100b of the substrate 100 and the bottom surface 100b of the substrate 100 is displaced upward from the support surface 41, the suction pad 64 extends upward. and the tip 64 s protrudes upward from the support surface 41 . A downward elastic force is applied to the suction pad 64 by the bellows portion 65 as the elastic portion 62 in a state where the tip 64s of the suction pad 64 protrudes above the support surface 41 .

The negative pressure supply part 63 is a channel for applying a negative pressure for causing the suction pad 64 to adhere to the lower surface of the substrate 100 . The negative pressure supply part 63 is the through holes 61 h and 64 h of the pad main body 61 and the suction pad 64 . A negative pressure source (not shown) such as a vacuum pump is connected to the pad body 61 through a pipe (not shown). The negative pressure generated by the negative pressure generating source is applied to the suction pad 64 via a pipe (not shown), the pad main body 61 and the through holes 61 h and 64 h of the suction pad 64 . While the suction pad 64 is in contact with the lower surface 100b of the substrate 100, the suction pad 64 sucks and holds the substrate 100 by applying the negative pressure generated by the negative pressure generation source through the negative pressure supply unit 63. .

Here, FIG. 6 is a diagram showing the correlation between the degree of vacuum (negative pressure) applied to the suction pad 64 and the suction force exerted by the suction pad 64. As shown in FIG. As shown in FIG. 6 , the higher the degree of vacuum applied to the suction pad 64 via the negative pressure supply unit 63 , the higher the suction force exerted on the substrate 100 by the suction pad 64 . Note that the graph shown in FIG. 6 shows an example of the correlation between the degree of vacuum and the suction force, and the slope and the like change depending on the shape of the suction pad 64, for example.

As shown in FIGS. 1 and 2 , the substrate pressing portion 7 is provided above the substrate support table 4 . The substrate holding portion 7 is provided so as to be vertically movable (up and down). The substrate pressing part 7 operates to press the substrate 100 placed on the support surface 41 from above. The substrate pressing part 7 presses the substrate 100 placed on the substrate supporting table 4 at a plurality of points. The substrate holding portion 7 has a frame 71 , a plurality of holding members 72 and an actuator 73 .

FIG. 7 is a cross-sectional view showing the configuration of the board holding portion 7. As shown in FIG. As shown in FIG. 7, the frame 71 has a rectangular shape in a plan view and has approximately the same size as the substrate support table 4 . A plurality of pressing members 72 are fixed to the frame 71 by nuts 75A and 75B. The plurality of pressing members 72 have pads (suction portions) 74 at their lower ends. The pad 74 is connected to a negative pressure source (not shown) and can be adsorbed onto the upper surface 100t of the substrate 100 (laminated body 103).

The substrate pressing portion 7 presses the pads 74 of the plurality of pressing members 72 against the upper surface 100 t of the substrate 100 from above to press the substrate 100 along the supporting surface 41 of the substrate supporting table 4 . Further, the substrate pressing portion 7 applies a negative pressure to the pads 74 by a negative pressure source (not shown) while pressing the pads 74 of the plurality of pressing members 72 against the upper surface 100t of the substrate 100, so that the upper surface of the substrate 100 is lifted. 100t is held by suction at multiple locations.

The actuator 73 moves the frame 71 at least vertically. The actuator 73 conveys the substrate 100 by moving the frame 71 at least in the vertical direction while holding the substrate 100 by suction with the plurality of pressing members 72 . Such a substrate pressing part 7 carries the substrate 100 in and out of the support surface 41 of the substrate support table 4 .

FIG. 8 is a cross-sectional view showing the substrate supporting device 2 and the substrate processing section 3. As shown in FIG. The substrate processing section 3 performs predetermined processing on the substrate 100 placed on the support surface 41 of the substrate support table 4 . In this embodiment, the substrate processing section 3 irradiates the substrate 100 with laser light. The substrate processing unit 3 includes an irradiation nozzle 31 that irradiates the substrate 100 with laser light, a laser light source (not shown) that emits the laser light, and a laser optical system (not shown) that guides the laser light from the laser light source to the irradiation nozzle 31. there is

In the substrate processing section 3, the substrate processing apparatus 1 irradiates the substrate 100 on the support surface 41 of the substrate support table 4 with laser light from the irradiation nozzle 31, and moves the substrate support table 4 along the guide members 44X and 44Y (see FIG. 1). ) in two directions perpendicular to each other in a horizontal plane, the substrate 100 (laminated body 103) is subjected to predetermined laser processing.

In the present embodiment, a support member 102 made of, for example, glass and having a plate shape is laminated on the upper surface of the substrate 100 . Support member 102 is provided to cover upper surface 100 t of substrate 100 . The upper surface 100t of the substrate 100 and the support member 102 are bonded by a bonding material (not shown) film. A film (layer) of the bonding material is sometimes referred to as a reaction layer or a separation layer. The substrate processing section 3 irradiates a layered body 103 of the substrate 100 and the support member 102 with a laser beam to release the bonding by the bonding material (not shown). It should be noted that the substrate 100 may be subjected to other treatments than those described above. For example, the processing performed by the substrate processing section 3 may be cleaning processing for the substrate 100 .

FIG. 9 is a diagram showing an example of the functional block configuration of the controller 9. As shown in FIG. As shown in FIG. 9 , the controller 9 controls the substrate pressing section 7 , the substrate lifting section 5 , the substrate suction section 6 and the substrate processing section 3 . The controller 9 is a computer system that includes, for example, a CPU, a main memory, a storage device, a communication device, and the like, and performs various information processing, information storage, information input/output, information communication (transmission/reception), and the like. The controller 9 includes a carry-in reception section 91 , a lift instruction section 92 , a press instruction section 93 , a suction instruction section 94 , a processing instruction section 95 , and a carry-out instruction section 96 .

The carrying-in reception unit 91 receives the carrying-in of the substrate 100 (laminated body 103 ) transported from the previous process of the substrate processing apparatus 1 . The carry-in reception unit 91 receives that the substrate 100 is transported from the previous process based on a signal output from the previous process, a signal from a sensor provided in the transport process from the previous process, or the like.

When the carry-in reception section 91 receives that the substrate 100 is transferred from the previous process, the lift instruction section 92 outputs an instruction signal to the substrate lift section 5 to project the lift pins 51 upward. Based on the instruction signal, the lift instruction unit 92 causes the substrate lift unit 5 to lift the bracket 52 using a lift cylinder (not shown) and cause the upper ends 51t of the plurality of lift pins 51 to protrude upward from the support surface 41. .

When the substrate 100 transported from the previous process is placed on the plurality of lift pins 51 projecting upward from the support surface 41 , the lift instruction unit 92 sends an instruction signal to the substrate lift unit 5 to lower the lift pins 51 . to output The lift instruction unit 92 lowers the bracket 52 to the substrate lift unit 5 by using a lift cylinder (not shown), and the upper ends 51t of the plurality of lift pins 51 become lower than the support surface 41 of the substrate support table 4. to prevent it from protruding upwards. By this operation, the substrate 100 (laminate 103 ) placed on the plurality of lift pins 51 is placed on the support surface 41 of the substrate support table 4 .

When the substrate 100 (laminate 103 ) is placed on the support surface 41 , the pressing instruction unit 93 outputs an instruction signal to the substrate pressing unit 7 to press the substrate 100 from above. The pressing instruction part 93 performs an operation of lowering the frame 71 to the substrate pressing part 7 by the actuator 73 and pressing the plurality of pressing members 72 against the upper surface 100t of the substrate 100 (laminated body 103) on the supporting surface 41 from above. Let By this operation, the substrate 100 on the support surface 41 is pressed from above by the plurality of pressing members 72 .

The suction instruction unit 94 outputs an instruction signal to the substrate suction unit 6 to suction the lower surface 100 b of the substrate 100 while the substrate 100 on the support surface 41 is pressed from above by the substrate pressing unit 7 . . The suction instruction unit 94 causes the substrate suction unit 6 to apply a negative pressure generated by a negative pressure generation source (not shown) to the suction pad 64 that abuts the lower surface 100 b of the substrate 100 via the negative pressure supply unit 63 . let it run. By this operation, each of the suction pads 64 holds the substrate 100 by suction.

The processing instruction unit 95 outputs an instruction signal to the substrate processing unit 3 so that the substrate processing unit 3 performs a predetermined process on the substrate 100 (laminate 103 ) sucked and held by the substrate suction unit 6 . The processing instruction unit 95 causes the substrate processing unit 3 to irradiate the substrate 100 on the support surface 41 of the substrate support table 4 with a laser beam from the irradiation nozzle 31 while moving the substrate support table 4 along the guide members 44X and 44Y. By moving in two directions perpendicular to each other in the horizontal plane, the substrate 100 (laminated body 103) is subjected to predetermined laser processing.

The unloading instruction unit 96 outputs an instruction signal to the substrate holding unit 7 to unload the substrate 100, which has been subjected to the predetermined processing by the substrate processing unit 3, to the subsequent process. The carry-out instruction unit 96 causes the substrate holding unit 7 to lower the frame 71 by the actuator 73 and press the plurality of holding members 72 against the upper surface 100t of the substrate 100 on the support surface 41 from above. The carry-out instructing unit 96 further performs an operation of sucking the lower surface 100b of the substrate 100 with the plurality of suction pads 64 in the substrate sucking unit 6 and sucking the support member 102 of the laminate 103 with the plurality of pressing members 72 in the substrate holding unit 7. to cause the action to be performed.

Further, the carry-out instruction section 96 causes the substrate holding section 7 to perform an operation of raising the frame 71 by the actuator 73 . By these operations, the support member 102 sucked by the plurality of pressing members 72 is separated from the substrate 100 on the support surface 41 . That is, the support member 102 is separated from the substrate 100 sucked by the substrate suction unit 6 by lifting the support member 102 by the plurality of pressing members 72 .

Next, a method for processing the substrate 100 in the substrate processing apparatus 1 as described above will be described. The processing method of the substrate 100 described below includes a method of supporting the substrate 100 by the substrate supporting device 2 . FIG. 10 is a flow chart showing an example of a substrate processing method including the substrate supporting method according to the embodiment.

As shown in FIG. 10, in the method for processing the substrate 100 in this embodiment, the following steps S1 to S8 are performed. First, in step S<b>1 , the carry-in reception unit 91 of the substrate processing apparatus 1 receives the carry-in of the substrate 100 (stacked body 103 ) transported from the previous process of the substrate processing apparatus 1 . The carry-in reception unit 91 receives that the substrate 100 is transported from the previous process based on a signal output from the previous process, a signal from a sensor provided in the transport process from the previous process, or the like.

FIG. 11 is a diagram showing a state in which the lift pins 51 are projected upward in the substrate support device 2. As shown in FIG. In step S<b>2 , the lift instruction section 92 outputs an instruction signal for causing the substrate lift section 5 to protrude the lift pins 51 upward. As shown in FIG. 11, when the substrate lift section 5 receives an instruction signal output from the lift instruction section 92, the lift cylinder (not shown) raises the bracket 52 to lift the upper ends 51t of the plurality of lift pins 51. It protrudes upward from the support surface 41 .

FIG. 12 is a diagram showing a state in which the substrate 100 carried in from the previous process is received on the lift pins 51 projecting upward in the substrate supporting device 2 . FIG. 13 is a diagram showing a state in which the substrate 100 is placed on the lift pins 51 projecting upward in the substrate supporting device 2 . In step S3, the substrate processing apparatus 1 receives the substrate 100 carried in from the previous process. As shown in FIG. 12, the substrate 100 (stacked body 103) is carried in while being supported on a plurality of support arms 201 of a transfer device 200 provided outside the substrate processing apparatus 1, for example. As shown in FIG. 13 , the substrate 100 (laminated body 103 ) is placed on a plurality of lift pins 51 projecting upward from the support surface 41 .

FIG. 14 is a diagram showing a state in which the lift pins 51 are lowered and the substrate 100 is placed on the support surface 41 of the substrate support table 4 in the substrate support device 2 . In step S<b>4 , the lift instruction section 92 outputs an instruction signal for lowering the lift pins 51 to the substrate lift section 5 . As shown in FIG. 14, when the substrate lift section 5 receives an instruction signal output from the lift instruction section 92, the lift cylinder (not shown) lowers the bracket 52 so that the upper ends 51t of the plurality of lift pins 51 support the substrate. The height is lower than the support surface 41 of the table 4 and does not protrude upward from the support surface 41. - 特許庁By this operation, the substrate 100 (laminate 103 ) placed on the plurality of lift pins 51 is placed on the support surface 41 of the substrate support table 4 .

FIG. 15 is a diagram showing a state in which the substrate holding portion 7 holds down the substrate 100 placed on the substrate supporting table 4 in the substrate supporting device 2 . In step S5, the pressing instruction section 93 outputs an instruction signal to the substrate pressing section 7 to press the substrate 100 (laminated body 103) from above. As shown in FIG. 15 , when receiving an instruction signal from the pressing instruction section 93 , the substrate holding section 7 lowers the frame 71 by the actuator 73 and stacks the pads 74 of the plurality of holding members 72 on the support surface 41 . It is pressed against the support member 102 of the body 103 from above.

By this operation, the substrate 100 on the support surface 41 is pressed from above by the plurality of pressing members 72 . At this time, the plurality of pressing members 72 may be pressed against the support member 102 of the laminate 103 from above without being adsorbed thereon. The pad 74 may hold the upper surface 100t of the substrate 100 by suction so as not to shift. In step S5, a plurality of pressing members 72 may be used to press the warped substrate 100 in close or almost close contact with the support surface 41, or a predetermined gap between the substrate 100 and the support surface 41 may be provided. You may press down to such an extent that a gap occurs.

In step S5, when the plurality of pressing members 72 press a part of the substrate 100 to such an extent that a gap is formed between the substrate 100 and the supporting surface 41, the predetermined gap is, for example, sucked by the substrate suction unit 6 in the next step S6. When starting, it is not necessary to bring the substrate 100 into close or almost close contact with the support surface 41 as long as the suction pad 64 is extended upward to the lower surface 100b of the substrate 100 by the suction force.

In step S<b>6 , an instruction signal is output to the substrate chucking section 6 so as to chuck the lower surface 100 b of the substrate 100 . Upon receiving the instruction signal from the suction instruction unit 94 , the substrate suction unit 6 applies negative pressure generated by a negative pressure generation source (not shown) via the negative pressure supply unit 63 to the suction pad that hits the lower surface 100 b of the substrate 100 . 64. By this operation, the substrate 100 on the support surface 41 pressed from above by the substrate pressing portion 7 is sucked and held by each of the plurality of suction pads 64 .

FIG. 16 is a diagram showing a state in which the substrate 100 is sucked by the suction pads 64 in the substrate support device 2 while the substrate 100 is placed along the support surface 41 of the substrate support table 4 . As shown in FIG. 16 , if the substrate 100 (laminated body 103 ) is not warped, the lower surface 100 b of the substrate 100 is entirely in contact or almost in close contact with the support surface 41 and is held by the plurality of suction pads. 64 is held by suction. Further, when the substrate 100 (laminated body 103) is warped, the stress (force to return to the original state) generated in the substrate 100 by correcting the warp is the downward elastic force of the suction pad 64. , the lower surface 100 b of the substrate 100 is sucked and held by the plurality of suction pads 64 in a state in which the entire bottom surface 100 b is in close contact with the support surface 41 .

FIG. 17 shows a state in which the suction pad 64 holds the substrate 100 whose outer peripheral portion 100d warps upward on the support surface 41 of the substrate support table 4 in the substrate support device 2 . FIG. 18 is a diagram showing a state in which the suction pad 64 sucks and holds the substrate 100 with the central portion 100 c warped upward on the support surface 41 of the substrate support table 4 in the substrate support device 2 .

As shown in FIGS. 17 and 18 , when the substrate 100 (laminate 103 ) is warped, the stress generated in the substrate 100 by correcting the warp is greater than the downward elastic force of the suction pad 64 . If it is large, the lower surface 100b is lifted from the support surface 41 at the portion where the warpage of the substrate 100 is corrected. In the portion where the lower surface 100 b is lifted from the support surface 41 , the suction pad 64 is in a state of being extended so as to protrude upward from the support surface 41 while being adhered to the lower surface 100 b.

Specifically, for example, as shown in FIG. 17, when the lower surface 100b of the outer peripheral portion 100d of the substrate 100 is lifted from the support surface 41 due to warpage, the suction pads 64 positioned on the outer peripheral portion 100d of the substrate support table 4 are not bent. While maintaining the state of being sucked to 100b, it is in a state of being stretched so as to protrude upward from the support surface 41. As shown in FIG. In this case, the tip 64s of the suction pad 64 located in the central portion of the substrate support table 4 does not protrude above the support surface 41, but suctions the lower surface 100b.

The suction pads 64 of the plurality of substrate suction portions 6 are arranged at an outer peripheral portion 100d of the substrate 100, a plurality of positions 100e along the radial direction from the central portion 100c, four corners 101 of the substrate 100, and the outer edge of the rectangular substrate 100. It is arranged inside 100g. Therefore, when the outer peripheral portion 100d of the substrate 100 is lifted, the suction pads 64 located at the lifted portion protrude upward while maintaining suction. That is, even when the outer peripheral portion 100d of the substrate 100 is lifted, the suction by the plurality of suction pads 64 is maintained, so that the substrate 100 can be reliably held by suction.

Further, as shown in FIG. 18, when the center portion 100c of the substrate 100 is lifted from the support surface 41 due to the warp, the suction pad 64 positioned at the center portion of the substrate support table 4 is moved while maintaining the state of being adhered to the lower surface 100b. , the tip 64s is extended to protrude above the support surface 41. As shown in FIG. That is, even when the central portion 100c of the substrate 100 is lifted, the suction by the plurality of suction pads 64 is maintained, so the substrate 100 can be reliably held by suction.

In step S<b>7 , the processing instruction section 95 outputs an instruction signal to the substrate processing section 3 so that the substrate processing section 3 performs a predetermined process on the substrate 100 sucked and held by the substrate suction section 6 . As shown in FIG. 8 , upon receiving an instruction signal from the processing instruction unit 95 , the substrate processing unit 3 irradiates the substrate 100 on the support surface 41 of the substrate support table 4 with a laser beam from the irradiation nozzle 31 . The support table 4 is moved along the guide members 44X and 44Y (see FIGS. 1 and 3) in two directions orthogonal to each other in the horizontal plane. By this operation, the bonding by the bonding material (not shown) is released in the laminate 103 of the substrate 100 and the support member 102 .

FIG. 19 is a cross-sectional view showing a state in which the support member 102 laminated on the substrate 100 is removed when the substrate 100 subjected to a predetermined process is carried out to a post-process in the substrate processing method according to the embodiment. is.

In step S8, the unloading instruction unit 96 outputs an instruction signal to the substrate holding unit 7 to unload the substrate 100 (laminated body 103) that has been subjected to the predetermined processing by the substrate processing unit 3 to the subsequent process. As shown in FIG. 15 , when receiving an instruction signal from the unloading instruction section 96 , the substrate pressing section 7 lowers the frame 71 by the actuator 73 and supports the stack 103 on the support surface 41 by the plurality of pressing members 72 . It is pressed against the member 102 from above.

Next, in the substrate suction unit 6 , the plurality of suction pads 64 suction the lower surface 100 b of the substrate 100 while the pads 74 of the plurality of pressing members 72 of the substrate pressing portion 7 suction the support member 102 of the laminate 103 . In this state, the actuator 73 raises the frame 71 as shown in FIG. As a result, the support member 102 sucked by the plurality of pressing members 72 is separated from the substrate 100 on the support surface 41 . After that, the support member 102 sucked and held by the substrate holding portion 7 is carried out to a predetermined position. Furthermore, the substrate 100 on the support surface 41 is held by the substrate holding portion 7 or another substrate transfer mechanism, and is unloaded from the substrate processing apparatus 1 (substrate support apparatus 2) toward a subsequent process.

As described above, according to the substrate support device 2 and the substrate processing device 1 according to the present embodiment, the substrate 100 placed on the support surface 41 of the substrate support table 4 is pressed from above by the substrate pressing portion 7 . Since the lower surface of the substrate 100 is sucked by the substrate sucking portion 6, the substrate 100 is sucked and held by the substrate sucking portion 6. As shown in FIG. Further, when the substrate 100 is warped, the substrate suction unit 6 protrudes upward from the support surface 41 while sucking the lower surface of the substrate 100 according to the warp amount of the substrate 100 . As a result, the substrate 100 can be sucked and held in a warped state without forcibly correcting the warp of the substrate 100 . Therefore, according to this embodiment, the warped substrate 100 can be easily and reliably held.

Although the embodiment has been described above, the present invention is not limited to the above description, and various modifications are possible without departing from the gist of the present invention. For example, in the above-described embodiment, the suction pad 64 has a configuration in which the elastic portion 62 includes the bellows portion 65 that can be expanded and contracted in the vertical direction, but the configuration is not limited to this. For example, a coil spring or the like may be used as the elastic portion as long as it imparts downward elastic force to the pad body.

Further, in the above-described embodiment, the configuration in which the substrate support table 4 is provided with the substrate lift section 5 has been described as an example, but the configuration is not limited to this configuration. For example, the substrate lift section 5 may be omitted. In this case, a device for loading the substrate 100 onto the substrate support table 4 or a device for carrying the substrate 100 out from the substrate support table 4 is appropriately used. The configuration of this loading/unloading device is arbitrary.

Further, in the above-described embodiment, the laminate 103 in which the support member 102 is laminated on the substrate 100 has been described as an example of a configuration in which the substrate support apparatus 2 or the substrate processing apparatus 1 handles the laminate 103, but the configuration is limited to this configuration. not. For example, the substrate 100 alone may be handled by the substrate supporting apparatus 2 or the substrate processing apparatus 1 without providing the support member 102 (without using the laminate 103).

DESCRIPTION OF SYMBOLS 1... Substrate processing apparatus, 2... Substrate support apparatus, 3... Substrate process part, 4... Substrate support table (substrate support part), 4t... Top surface, 6... Substrate adsorption|suction Part 7... Substrate holding part 9... Controller 41... Support surface 61... Pad main body 62... Elastic part 63... Negative pressure supply part 64... Suction pad 74 Pad (suction portion) 93 Pressing instruction portion 94 Suction instruction portion 100 Substrate 100b Lower surface 100c Central portion 100e A plurality of positions along the radial direction, 100g outer edge, 100t upper surface, 101 corner

Claims (11)

a substrate support having a support surface for supporting the substrate on the top surface;
a substrate holding portion provided above the substrate supporting portion, which advances and retreats in the vertical direction to hold the substrate placed on the supporting surface from above;
a substrate suction unit that is provided so as to be able to protrude upward from the support surface and that suctions the lower surface of the substrate placed on the support surface;
The substrate adsorption part is
an elastically deformable adsorption pad disposed in a state of being immersed in the support surface;
a negative pressure supply unit that applies a negative pressure for causing the suction pad to adhere to the lower surface of the substrate;
The suction pad adheres to the substrate when the warped substrate is pressed downward, and elastically deforms due to the warpage of the substrate after the substrate is released from being pressed, thereby sucking and holding the substrate. A substrate support device protruding from above the support surface . 2. The substrate support device according to claim 1, wherein a plurality of said substrate adsorption portions are arranged. 3. The substrate support device according to claim 2, wherein the plurality of substrate suction units are arranged corresponding to the substrates placed on the substrate support unit. 4. The substrate according to claim 3, wherein the plurality of substrate suction portions are arranged at a central portion of the substrate placed on the substrate support portion and at a plurality of positions along the radial direction from the central portion. support device. The substrate has a rectangular shape,
4. The substrate support device according to claim 3, wherein the plurality of substrate suction portions are arranged at a central portion of the substrate placed on the substrate support portion and at four corner portions of the substrate, respectively. 6. The substrate support device according to claim 5, wherein the plurality of substrate suction portions are arranged at predetermined intervals along the inside of the outer edge of the rectangular substrate. 7. The substrate supporting device according to claim 1, wherein said substrate pressing portion presses said substrate placed on said substrate supporting portion at a plurality of points. The substrate holding portion includes an adsorption portion capable of adsorbing the upper surface of the substrate, and the substrate is carried in or out of the substrate support portion by adsorbing the substrate with the adsorption portion. 8. The substrate supporting device according to any one of items 7 . A controller that controls the substrate holding portion and the substrate suction portion,
The controller is
a pressing instruction section for instructing the substrate holding section to press the substrate placed on the support surface from above;
9. The substrate supporting apparatus according to claim 1, further comprising a suction instruction section for instructing the substrate suction section to suction the lower surface of the substrate. A substrate support device according to any one of claims 1 to 9 ;
and a substrate processing section that processes the substrate placed on the substrate support section of the substrate support device. placing the warped substrate on the supporting surface of the substrate supporting portion and pressing it from above;
making an elastically deformable suction pad, which is arranged in a state of being submerged in the support surface, adhere to the lower surface of the substrate;
releasing the pressing of the substrate from above, elastically deforming the suction pad in accordance with the warpage of the substrate, and protruding upward from the support surface while holding the substrate by suction. Substrate support method.

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