JP2018081279A - 露光装置、露光方法及び記憶媒体 - Google Patents
露光装置、露光方法及び記憶媒体 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Abstract
Description
前記基板の表面の左右の互いに異なる位置に各々独立して光を照射して、前記基板の表面の一端から他端に亘る帯状の照射領域を形成する複数の光照射部と、
前記載置部に載置された基板を前記照射領域に対して相対的に回転させる回転機構と、
前記照射領域に対して前記載置部を前後に相対的に移動させる載置部用移動機構と、
前記基板の表面全体が露光されるように前記基板を、第1の照度分布が形成された前記照射領域に対して相対的に回転させる第1のステップと、前記基板の表面全体が露光されるように前記基板の回転が停止した状態で当該基板を第2の照度分布が形成された前記照射領域に対して前後方向に相対的に移動させる第2のステップと、を実行するように制御信号を出力する制御部と、
を備えることを特徴とする。
複数の光照射部により、前記基板の表面の左右の互いに異なる位置に各々独立して光を照射して、前記基板の表面の一端から他端に亘る帯状の照射領域を形成する工程と、
前記基板の表面全体が露光されるように、前記載置部に載置された基板を第1の照度分布が形成された前記照射領域に対して相対的に回転させる工程と、
前記基板の表面全体が露光されるように、当該基板の回転が停止した状態で前記載置部に載置された基板を第2の照度分布が形成された前記照射領域に対して前後方向に相対的に移動させる工程と、
を備えることを特徴とする。
前記コンピュータプログラムは、本発明の露光方法を実行するようにステップ群が組まれていることを特徴とする。
10 制御部
3 一括露光モジュール
33 載置台
34 回転機構
36 載置部用移動機構
4 セル
40 光源ユニット
47 LED
Claims (7)
- 基板を載置するための載置部と、
前記基板の表面の左右の互いに異なる位置に各々独立して光を照射して、前記基板の表面の一端から他端に亘る帯状の照射領域を形成する複数の光照射部と、
前記載置部に載置された基板を前記照射領域に対して相対的に回転させる回転機構と、
前記照射領域に対して前記載置部を前後に相対的に移動させる載置部用移動機構と、
前記基板の表面全体が露光されるように前記基板を、第1の照度分布が形成された前記照射領域に対して相対的に回転させる第1のステップと、前記基板の表面全体が露光されるように前記基板の回転が停止した状態で当該基板を第2の照度分布が形成された前記照射領域に対して前後方向に相対的に移動させる第2のステップと、を実行するように制御信号を出力する制御部と、
を備えることを特徴とする露光装置。 - 前記第1のステップは、前記照射領域に対して前記基板を前後方向に相対的に移動させながら、前記基板を当該照射領域に対して相対的に回転させることを特徴とする請求項1記載の露光装置。
- 前記載置部に載置された前記基板の向きを検出する検出部と、
前記第2のステップを行う前に前記検出部による検出結果に基づいて前記回転機構により前記基板の向きを調整する向き調整機構と、
が設けられていることを特徴とする請求項1または2記載の露光装置。 - 前記制御部は、前記第2のステップにおける前記照射領域に対する基板の向きとは異なる基板の向きとなるように当該基板の回転が停止した状態で、前記基板の表面全体が露光されるように、当該基板を第3の照度分布が形成された前記照射領域に対して、前後方向に相対的に移動させる第3のステップを実行することを特徴とする請求項1ないし3のいずれか一つに記載の露光装置。
- 前記基板においては、パターンマスクを用いてパターン露光が行われたレジスト膜が、表面に形成されていることを特徴とする請求項1ないし4のいずれか一つに記載の露光装置。
- 載置部に基板を載置する工程と、
複数の光照射部により、前記基板の表面の左右の互いに異なる位置に各々独立して光を照射して、前記基板の表面の一端から他端に亘る帯状の照射領域を形成する工程と、
前記基板の表面全体が露光されるように、前記載置部に載置された基板を第1の照度分布が形成された前記照射領域に対して相対的に回転させる工程と、
前記基板の表面全体が露光されるように、当該基板の回転が停止した状態で前記載置部に載置された基板を第2の照度分布が形成された前記照射領域に対して前後方向に相対的に移動させる工程と、
を備えることを特徴とする露光方法。 - 基板を露光するための露光装置に用いられるコンピュータプログラムを記憶した記憶媒体であって、
前記コンピュータプログラムは、請求項6記載の露光方法を実行するようにステップ群が組まれていることを特徴とする記憶媒体。
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JP2016225324A JP6885031B2 (ja) | 2016-11-18 | 2016-11-18 | 露光装置、露光方法及び記憶媒体 |
TW106138023A TWI738908B (zh) | 2016-11-18 | 2017-11-03 | 曝光裝置、曝光方法及記憶媒體 |
CN202111186912.9A CN113900359A (zh) | 2016-11-18 | 2017-11-17 | 曝光装置和曝光方法 |
EP17202291.5A EP3324239B1 (en) | 2016-11-18 | 2017-11-17 | Exposure apparatus, exposure method and storage medium |
CN201711144518.2A CN108073050B (zh) | 2016-11-18 | 2017-11-17 | 曝光装置、曝光方法和存储介质 |
US15/815,925 US10274843B2 (en) | 2016-11-18 | 2017-11-17 | Exposure apparatus, exposure method and storage medium |
KR1020170153838A KR102446581B1 (ko) | 2016-11-18 | 2017-11-17 | 노광 장치, 노광 방법 및 기억 매체 |
JP2021080569A JP7127714B2 (ja) | 2016-11-18 | 2021-05-11 | 露光装置及び露光方法 |
KR1020220115684A KR102576504B1 (ko) | 2016-11-18 | 2022-09-14 | 노광 장치, 노광 방법 및 기억 매체 |
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DE102016211511A1 (de) * | 2016-06-27 | 2017-12-28 | Carl Zeiss Smt Gmbh | Beleuchtungseinheit für die Mikrolithographie |
CN111338185B (zh) * | 2018-12-19 | 2022-05-20 | 联芯集成电路制造(厦门)有限公司 | 增进晶片曝光品质的方法 |
JP2021048322A (ja) * | 2019-09-19 | 2021-03-25 | 株式会社Screenホールディングス | 基板搬送装置および基板搬送方法 |
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TW201833672A (zh) | 2018-09-16 |
EP3324239A1 (en) | 2018-05-23 |
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CN108073050A (zh) | 2018-05-25 |
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US10274843B2 (en) | 2019-04-30 |
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