JP2018065206A - 切削ブレード - Google Patents
切削ブレード Download PDFInfo
- Publication number
- JP2018065206A JP2018065206A JP2016204157A JP2016204157A JP2018065206A JP 2018065206 A JP2018065206 A JP 2018065206A JP 2016204157 A JP2016204157 A JP 2016204157A JP 2016204157 A JP2016204157 A JP 2016204157A JP 2018065206 A JP2018065206 A JP 2018065206A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- layer
- electroformed
- concentration
- electroformed abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006061 abrasive grain Substances 0.000 claims abstract description 61
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000011230 binding agent Substances 0.000 claims abstract description 9
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000006249 magnetic particle Substances 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 135
- 239000002356 single layer Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D35/00—Tools for shearing machines or shearing devices; Holders or chucks for shearing tools
- B23D35/001—Tools for shearing machines or shearing devices; Holders or chucks for shearing tools cutting members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D19/00—Shearing machines or shearing devices cutting by rotary discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/02—Tubes; Rings; Hollow bodies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
Abstract
Description
以下、実験例について説明する。実験例では、切削ブレードとして、ダイヤモンド砥粒の平均粒径20μmで、かつ電鋳砥粒層が集中度5、30、45、75、90、105、135、150で厚み300μmの複数の単層ブレードを用意して、各切削ブレードでインダクタを切削したときのブレード消耗量を測定した。実験では、長さ140×幅140×厚み0.9mmのダミーインダクタを用意し、集中度が異なる切削ブレード毎にスピンドル回転数20000rpm、送り速度25mm/sec、加工ライン数100ラインで切削加工を実施した。これにより、図4に示すような結果が得られた。
31 切れ刃部
32 中央電鋳砥粒層
33 外側電鋳砥粒層
I インダクタ(板状物)
Claims (4)
- 板状物を切削するための、環状の切れ刃部が砥粒をメッキで固定した電鋳砥粒層によって形成された切削ブレードであって、
該環状の切れ刃部は、中央電鋳砥粒層と該中央電鋳砥粒層の両側に形成された外側電鋳砥粒層とからなり、該外側電鋳砥粒層は該中央電鋳砥粒層よりも集中度の低い砥粒層で形成される切削ブレード。 - 該板状物は、鉄ベースの金属磁性粒子と有機系バインダーからなる圧粉材料を用いたインダクタである、請求項1記載の切削ブレード。
- 該外側電鋳砥粒層は、集中度5〜135で形成され、
該中央電鋳砥粒層は、該外側電鋳砥粒層よりも15以上高い集中度で形成されている請求項1又は2記載の切削ブレード。 - 該外側電鋳砥粒層の厚みは、10μm〜切れ刃部の厚みの1/3の厚みで形成される、請求項1乃至3記載の切削ブレード。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016204157A JP6872342B2 (ja) | 2016-10-18 | 2016-10-18 | 切削ブレード |
TW106131110A TWI743190B (zh) | 2016-10-18 | 2017-09-12 | 切削刀 |
CN201710946760.5A CN107953224B (zh) | 2016-10-18 | 2017-10-12 | 切削刀具 |
KR1020170133967A KR102294248B1 (ko) | 2016-10-18 | 2017-10-16 | 절삭 블레이드 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016204157A JP6872342B2 (ja) | 2016-10-18 | 2016-10-18 | 切削ブレード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018065206A true JP2018065206A (ja) | 2018-04-26 |
JP6872342B2 JP6872342B2 (ja) | 2021-05-19 |
Family
ID=61954635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016204157A Active JP6872342B2 (ja) | 2016-10-18 | 2016-10-18 | 切削ブレード |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6872342B2 (ja) |
KR (1) | KR102294248B1 (ja) |
CN (1) | CN107953224B (ja) |
TW (1) | TWI743190B (ja) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63174877A (ja) * | 1987-01-10 | 1988-07-19 | Mitsubishi Metal Corp | 電鋳薄刃砥石 |
JPH03294182A (ja) * | 1990-09-28 | 1991-12-25 | Mitsubishi Materials Corp | 電鋳砥石 |
JPH0730279Y2 (ja) * | 1987-03-17 | 1995-07-12 | 三菱マテリアル株式会社 | 電鋳薄刃砥石 |
JPH1110549A (ja) * | 1997-06-25 | 1999-01-19 | Sony Corp | 切削ブレード |
JP2002158135A (ja) * | 2000-11-16 | 2002-05-31 | Tdk Corp | 電子部品 |
JP2002316312A (ja) * | 2001-04-18 | 2002-10-29 | Mitsubishi Materials Corp | 粉末成形体の切断方法及び切断装置 |
US20020168929A1 (en) * | 2001-05-09 | 2002-11-14 | Seiji Fujioka | Cutting blade |
JP2003179004A (ja) * | 2001-12-12 | 2003-06-27 | Hitachi Ltd | 半導体装置の製造方法およびそれに用いられるダイシング装置 |
JP2005130341A (ja) * | 2003-10-27 | 2005-05-19 | Murata Mfg Co Ltd | 圧電部品及びその製造方法、通信装置 |
JP2005277008A (ja) * | 2004-03-24 | 2005-10-06 | Tdk Corp | 外部電極内蔵層の形成方法およびそれを使用する積層型電子部品の製造方法 |
JP2007125636A (ja) * | 2005-11-02 | 2007-05-24 | Mitsubishi Materials Corp | 電鋳薄刃砥石 |
JP2008288370A (ja) * | 2007-05-17 | 2008-11-27 | Nec Tokin Corp | 面実装インダクタおよびその製造方法 |
JP2011003761A (ja) * | 2009-06-19 | 2011-01-06 | Yoshizumi Fukui | 巻き線一体型モールドコイルおよび巻き線一体型モールドコイルの製造方法 |
US20150183131A1 (en) * | 2013-12-27 | 2015-07-02 | Chee Seng Foong | Semiconductor wafer dicing blade |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4084070B2 (ja) * | 2002-04-09 | 2008-04-30 | 株式会社リード | 多層構造ブレードの製造方法 |
US7073496B2 (en) * | 2003-03-26 | 2006-07-11 | Saint-Gobain Abrasives, Inc. | High precision multi-grit slicing blade |
KR100556189B1 (ko) * | 2004-12-30 | 2006-03-06 | 이화다이아몬드공업 주식회사 | 절삭공구용 절삭팁 및 절삭공구 |
DE102008023059B4 (de) * | 2008-05-09 | 2010-06-10 | Eto Magnetic Gmbh | Verfahren zum Herstellen eines magnetisierbaren metallischen Formkörpers |
US20100277267A1 (en) * | 2009-05-04 | 2010-11-04 | Robert James Bogert | Magnetic components and methods of manufacturing the same |
JP6456729B2 (ja) * | 2015-03-09 | 2019-01-23 | 株式会社トーキン | インダクタ素子およびその製造方法 |
-
2016
- 2016-10-18 JP JP2016204157A patent/JP6872342B2/ja active Active
-
2017
- 2017-09-12 TW TW106131110A patent/TWI743190B/zh active
- 2017-10-12 CN CN201710946760.5A patent/CN107953224B/zh active Active
- 2017-10-16 KR KR1020170133967A patent/KR102294248B1/ko active IP Right Grant
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63174877A (ja) * | 1987-01-10 | 1988-07-19 | Mitsubishi Metal Corp | 電鋳薄刃砥石 |
JPH0730279Y2 (ja) * | 1987-03-17 | 1995-07-12 | 三菱マテリアル株式会社 | 電鋳薄刃砥石 |
JPH03294182A (ja) * | 1990-09-28 | 1991-12-25 | Mitsubishi Materials Corp | 電鋳砥石 |
JPH1110549A (ja) * | 1997-06-25 | 1999-01-19 | Sony Corp | 切削ブレード |
JP2002158135A (ja) * | 2000-11-16 | 2002-05-31 | Tdk Corp | 電子部品 |
JP2002316312A (ja) * | 2001-04-18 | 2002-10-29 | Mitsubishi Materials Corp | 粉末成形体の切断方法及び切断装置 |
US20020168929A1 (en) * | 2001-05-09 | 2002-11-14 | Seiji Fujioka | Cutting blade |
JP2002331464A (ja) * | 2001-05-09 | 2002-11-19 | Disco Abrasive Syst Ltd | 切削ブレード |
JP2003179004A (ja) * | 2001-12-12 | 2003-06-27 | Hitachi Ltd | 半導体装置の製造方法およびそれに用いられるダイシング装置 |
JP2005130341A (ja) * | 2003-10-27 | 2005-05-19 | Murata Mfg Co Ltd | 圧電部品及びその製造方法、通信装置 |
JP2005277008A (ja) * | 2004-03-24 | 2005-10-06 | Tdk Corp | 外部電極内蔵層の形成方法およびそれを使用する積層型電子部品の製造方法 |
JP2007125636A (ja) * | 2005-11-02 | 2007-05-24 | Mitsubishi Materials Corp | 電鋳薄刃砥石 |
JP2008288370A (ja) * | 2007-05-17 | 2008-11-27 | Nec Tokin Corp | 面実装インダクタおよびその製造方法 |
JP2011003761A (ja) * | 2009-06-19 | 2011-01-06 | Yoshizumi Fukui | 巻き線一体型モールドコイルおよび巻き線一体型モールドコイルの製造方法 |
US20150183131A1 (en) * | 2013-12-27 | 2015-07-02 | Chee Seng Foong | Semiconductor wafer dicing blade |
Also Published As
Publication number | Publication date |
---|---|
TWI743190B (zh) | 2021-10-21 |
CN107953224A (zh) | 2018-04-24 |
KR20180042805A (ko) | 2018-04-26 |
KR102294248B1 (ko) | 2021-08-25 |
TW201827164A (zh) | 2018-08-01 |
JP6872342B2 (ja) | 2021-05-19 |
CN107953224B (zh) | 2022-02-25 |
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