JP2018064091A - インプリント材料の拡がりを制御する方法 - Google Patents

インプリント材料の拡がりを制御する方法 Download PDF

Info

Publication number
JP2018064091A
JP2018064091A JP2017188984A JP2017188984A JP2018064091A JP 2018064091 A JP2018064091 A JP 2018064091A JP 2017188984 A JP2017188984 A JP 2017188984A JP 2017188984 A JP2017188984 A JP 2017188984A JP 2018064091 A JP2018064091 A JP 2018064091A
Authority
JP
Japan
Prior art keywords
substrate
fluid control
template
imprint
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2017188984A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018064091A5 (enExample
Inventor
イェ ツェンマオ
Zhengmao Ye
イェ ツェンマオ
クスナトディノフ ニャーズ
Khusnatdinov Niyaz
クスナトディノフ ニャーズ
ブライアン フレッチャー エドワード
Brian Fletcher Edward
ブライアン フレッチャー エドワード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of JP2018064091A publication Critical patent/JP2018064091A/ja
Publication of JP2018064091A5 publication Critical patent/JP2018064091A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017188984A 2016-10-13 2017-09-28 インプリント材料の拡がりを制御する方法 Withdrawn JP2018064091A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/292,645 US10035296B2 (en) 2016-10-13 2016-10-13 Methods for controlling spread of imprint material
US15/292,645 2016-10-13

Publications (2)

Publication Number Publication Date
JP2018064091A true JP2018064091A (ja) 2018-04-19
JP2018064091A5 JP2018064091A5 (enExample) 2020-11-12

Family

ID=61902562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017188984A Withdrawn JP2018064091A (ja) 2016-10-13 2017-09-28 インプリント材料の拡がりを制御する方法

Country Status (6)

Country Link
US (1) US10035296B2 (enExample)
JP (1) JP2018064091A (enExample)
KR (1) KR102196382B1 (enExample)
CN (1) CN107942617A (enExample)
SG (1) SG10201707435QA (enExample)
TW (1) TWI710858B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212862A (ja) * 2018-06-08 2019-12-12 キヤノン株式会社 モールド、平面プレート、インプリント方法、および物品製造方法
JP2020043315A (ja) * 2018-09-13 2020-03-19 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP2020127008A (ja) * 2019-01-31 2020-08-20 キヤノン株式会社 質量速度変動フィーチャを有するテンプレート、テンプレートを使用するナノインプリントリソグラフィ装置、およびテンプレートを使用する方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10549313B2 (en) 2016-10-31 2020-02-04 Canon Kabushiki Kaisha Edge field imprint lithography
JP7086758B2 (ja) * 2018-07-06 2022-06-20 キオクシア株式会社 パターン形成方法および半導体装置の製造方法
US11294277B2 (en) * 2018-07-25 2022-04-05 Canon Kabushiki Kaisha Process of imprinting a substrate with fluid control features
CN109445247B (zh) * 2018-11-16 2020-06-19 京东方科技集团股份有限公司 压印模板及其制备方法和压印方法
CN116149133A (zh) * 2021-11-23 2023-05-23 歌尔股份有限公司 压印母板和压印母板的制作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3066930A (en) 1959-04-20 1962-12-04 Walter I Chinnick Holding tongs
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
KR101293059B1 (ko) * 2005-12-08 2013-08-05 몰레큘러 임프린츠 인코퍼레이티드 기판과 몰드 사이에 위치되는 기체를 축출하기 위한 방법
WO2008082650A1 (en) * 2006-12-29 2008-07-10 Molecular Imprints, Inc. Imprint fluid control
US8361371B2 (en) 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
JP5460541B2 (ja) * 2010-03-30 2014-04-02 富士フイルム株式会社 ナノインプリント方法、液滴配置パターン作成方法および基板の加工方法
JP2012015324A (ja) * 2010-06-30 2012-01-19 Fujifilm Corp 液体塗布装置及び液体塗布方法並びにナノインプリントシステム
JP5759195B2 (ja) * 2011-02-07 2015-08-05 キヤノン株式会社 型、インプリント方法及び物品製造方法
WO2015006695A1 (en) * 2013-07-12 2015-01-15 Canon Nanotechnologies, Inc. Drop pattern generation for imprint lithography with directionally-patterned templates
TWI665078B (zh) * 2013-07-22 2019-07-11 皇家飛利浦有限公司 製造圖案化印模以圖案化輪廓表面之方法、供在壓印微影製程中使用之圖案化印模、壓印微影方法、包括圖案化輪廓表面之物件及圖案化印模用於壓印微影之用法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212862A (ja) * 2018-06-08 2019-12-12 キヤノン株式会社 モールド、平面プレート、インプリント方法、および物品製造方法
JP2020043315A (ja) * 2018-09-13 2020-03-19 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP7150535B2 (ja) 2018-09-13 2022-10-11 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP2020127008A (ja) * 2019-01-31 2020-08-20 キヤノン株式会社 質量速度変動フィーチャを有するテンプレート、テンプレートを使用するナノインプリントリソグラフィ装置、およびテンプレートを使用する方法

Also Published As

Publication number Publication date
KR102196382B1 (ko) 2020-12-30
TW201833666A (zh) 2018-09-16
SG10201707435QA (en) 2018-05-30
TWI710858B (zh) 2020-11-21
KR20180041059A (ko) 2018-04-23
US10035296B2 (en) 2018-07-31
CN107942617A (zh) 2018-04-20
US20180104888A1 (en) 2018-04-19

Similar Documents

Publication Publication Date Title
JP2018064091A (ja) インプリント材料の拡がりを制御する方法
KR102379626B1 (ko) 차광 재료를 구비한 나노임프린트 템플릿 및 제작 방법
JP6701286B2 (ja) 平坦化プロセスおよび装置
TWI380895B (zh) 控制殘餘層厚度之技術
CN106707686B (zh) 反转色调图案化的方法
JP5728478B2 (ja) 隣接するフィールドのアラインメント方法
CN101939704A (zh) 在刻印光刻技术中减少突出物
KR20160103988A (ko) 20ｎｍ 이하 특징부의 균일한 임프린트 패턴 전사 방법
US11562924B2 (en) Planarization apparatus, planarization process, and method of manufacturing an article
KR20180071971A (ko) 임프린트 템플레이트 복제 프로세스 중에 압출을 제어하기 위한 방법
KR102547578B1 (ko) 임프린트 필드의 에지를 구배 선량으로 조명하기 위한 시스템 및 방법
KR102247865B1 (ko) 임프린트 리소그래피를 위한 유체 액적 방법 및 장치
JP6727354B2 (ja) 毛管力低減による押し出し制御
US11249405B2 (en) System and method for improving the performance of a nanoimprint system
JP2020127008A (ja) 質量速度変動フィーチャを有するテンプレート、テンプレートを使用するナノインプリントリソグラフィ装置、およびテンプレートを使用する方法
JP7057844B2 (ja) メサ側壁をクリーニングするためのシステムおよび方法
KR20230161886A (ko) 평탄화 공정, 장치 및 물품 제조 방법
US11294277B2 (en) Process of imprinting a substrate with fluid control features
JP2023097334A (ja) テンプレート、テンプレートを形成する方法、装置及び物品を製造する方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200924

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200924

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20210103

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210113

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20210409