KR102196382B1 - 임프린트 물질의 확산을 제어하기 위한 방법 - Google Patents

임프린트 물질의 확산을 제어하기 위한 방법 Download PDF

Info

Publication number
KR102196382B1
KR102196382B1 KR1020170123839A KR20170123839A KR102196382B1 KR 102196382 B1 KR102196382 B1 KR 102196382B1 KR 1020170123839 A KR1020170123839 A KR 1020170123839A KR 20170123839 A KR20170123839 A KR 20170123839A KR 102196382 B1 KR102196382 B1 KR 102196382B1
Authority
KR
South Korea
Prior art keywords
substrate
fluid control
template
imprint
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020170123839A
Other languages
English (en)
Korean (ko)
Other versions
KR20180041059A (ko
Inventor
쩡마오 예
니야즈 쿠스낫디노프
브라이언 에드워드 플렛처
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180041059A publication Critical patent/KR20180041059A/ko
Application granted granted Critical
Publication of KR102196382B1 publication Critical patent/KR102196382B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170123839A 2016-10-13 2017-09-26 임프린트 물질의 확산을 제어하기 위한 방법 Expired - Fee Related KR102196382B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/292,645 US10035296B2 (en) 2016-10-13 2016-10-13 Methods for controlling spread of imprint material
US15/292,645 2016-10-13

Publications (2)

Publication Number Publication Date
KR20180041059A KR20180041059A (ko) 2018-04-23
KR102196382B1 true KR102196382B1 (ko) 2020-12-30

Family

ID=61902562

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170123839A Expired - Fee Related KR102196382B1 (ko) 2016-10-13 2017-09-26 임프린트 물질의 확산을 제어하기 위한 방법

Country Status (6)

Country Link
US (1) US10035296B2 (enExample)
JP (1) JP2018064091A (enExample)
KR (1) KR102196382B1 (enExample)
CN (1) CN107942617A (enExample)
SG (1) SG10201707435QA (enExample)
TW (1) TWI710858B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10549313B2 (en) 2016-10-31 2020-02-04 Canon Kabushiki Kaisha Edge field imprint lithography
JP2019212862A (ja) * 2018-06-08 2019-12-12 キヤノン株式会社 モールド、平面プレート、インプリント方法、および物品製造方法
JP7086758B2 (ja) * 2018-07-06 2022-06-20 キオクシア株式会社 パターン形成方法および半導体装置の製造方法
US11294277B2 (en) * 2018-07-25 2022-04-05 Canon Kabushiki Kaisha Process of imprinting a substrate with fluid control features
JP7150535B2 (ja) * 2018-09-13 2022-10-11 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
CN109445247B (zh) * 2018-11-16 2020-06-19 京东方科技集团股份有限公司 压印模板及其制备方法和压印方法
US11243466B2 (en) * 2019-01-31 2022-02-08 Canon Kabushiki Kaisha Template with mass velocity variation features, nanoimprint lithography apparatus that uses the template, and methods that use the template
CN116149133A (zh) * 2021-11-23 2023-05-23 歌尔股份有限公司 压印母板和压印母板的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130020281A1 (en) 2010-03-30 2013-01-24 Fujifilm Corporation Nanoimprinting method, method for producing a droplet arrangement pattern, and method for fabricating substrates
US20130120485A1 (en) 2010-06-30 2013-05-16 Fujifilm Corporation Liquid application device, liquid application method, and nanoimprint system
US20150017329A1 (en) 2013-07-12 2015-01-15 Toshiba Corporation Drop pattern generation for imprint lithography with directionally-patterned templates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3066930A (en) 1959-04-20 1962-12-04 Walter I Chinnick Holding tongs
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
KR101293059B1 (ko) * 2005-12-08 2013-08-05 몰레큘러 임프린츠 인코퍼레이티드 기판과 몰드 사이에 위치되는 기체를 축출하기 위한 방법
WO2008082650A1 (en) * 2006-12-29 2008-07-10 Molecular Imprints, Inc. Imprint fluid control
US8361371B2 (en) 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
JP5759195B2 (ja) * 2011-02-07 2015-08-05 キヤノン株式会社 型、インプリント方法及び物品製造方法
TWI665078B (zh) * 2013-07-22 2019-07-11 皇家飛利浦有限公司 製造圖案化印模以圖案化輪廓表面之方法、供在壓印微影製程中使用之圖案化印模、壓印微影方法、包括圖案化輪廓表面之物件及圖案化印模用於壓印微影之用法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130020281A1 (en) 2010-03-30 2013-01-24 Fujifilm Corporation Nanoimprinting method, method for producing a droplet arrangement pattern, and method for fabricating substrates
US20130120485A1 (en) 2010-06-30 2013-05-16 Fujifilm Corporation Liquid application device, liquid application method, and nanoimprint system
US20150017329A1 (en) 2013-07-12 2015-01-15 Toshiba Corporation Drop pattern generation for imprint lithography with directionally-patterned templates

Also Published As

Publication number Publication date
JP2018064091A (ja) 2018-04-19
TW201833666A (zh) 2018-09-16
SG10201707435QA (en) 2018-05-30
TWI710858B (zh) 2020-11-21
KR20180041059A (ko) 2018-04-23
US10035296B2 (en) 2018-07-31
CN107942617A (zh) 2018-04-20
US20180104888A1 (en) 2018-04-19

Similar Documents

Publication Publication Date Title
KR102196382B1 (ko) 임프린트 물질의 확산을 제어하기 위한 방법
JP7148598B2 (ja) インプリント方法および装置
US8641958B2 (en) Extrusion reduction in imprint lithography
US10935883B2 (en) Nanoimprint template with light blocking material and method of fabrication
KR20120123300A (ko) 임프린트 리소그래피 주형
KR102247829B1 (ko) 임프린트 템플레이트 복제 프로세스 중에 압출을 제어하기 위한 방법
KR20120044362A (ko) 인접 필드 얼라인먼트
KR102547578B1 (ko) 임프린트 필드의 에지를 구배 선량으로 조명하기 위한 시스템 및 방법
US20210242073A1 (en) Planarization apparatus, planarization process, and method of manufacturing an article
KR102202849B1 (ko) 에지 필드 임프린트 리소그래피
US11194247B2 (en) Extrusion control by capillary force reduction
KR20150131976A (ko) 임프린트 장치 및 물품의 제조 방법
JP2020127008A (ja) 質量速度変動フィーチャを有するテンプレート、テンプレートを使用するナノインプリントリソグラフィ装置、およびテンプレートを使用する方法
US11294277B2 (en) Process of imprinting a substrate with fluid control features
US11387098B2 (en) Dispenser guard and method of manufacturing an article
JP7057844B2 (ja) メサ側壁をクリーニングするためのシステムおよび方法
JP2023097334A (ja) テンプレート、テンプレートを形成する方法、装置及び物品を製造する方法
KR20230161886A (ko) 평탄화 공정, 장치 및 물품 제조 방법

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231223

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231223