JP2018041923A - 容器収納設備 - Google Patents
容器収納設備 Download PDFInfo
- Publication number
- JP2018041923A JP2018041923A JP2016176976A JP2016176976A JP2018041923A JP 2018041923 A JP2018041923 A JP 2018041923A JP 2016176976 A JP2016176976 A JP 2016176976A JP 2016176976 A JP2016176976 A JP 2016176976A JP 2018041923 A JP2018041923 A JP 2018041923A
- Authority
- JP
- Japan
- Prior art keywords
- container
- storage
- storage unit
- purified gas
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003860 storage Methods 0.000 claims description 289
- 238000012546 transfer Methods 0.000 claims description 15
- 230000032258 transport Effects 0.000 abstract description 40
- 239000007789 gas Substances 0.000 description 140
- 238000010586 diagram Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000009423 ventilation Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 101100023111 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfc1 gene Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
【解決手段】容器収納設備は、複数の収納部を収納部群(G)として有する収納棚(2)と、各収納部に対して分岐型の供給配管(35)を介して浄化気体を供給する気体供給装置(3)と、収納部に対して容器(7)を搬送する搬送装置と、搬送装置の動作を制御する制御部とを備える。制御部は、収納部群(G)に含まれる収納部に最初に容器(7)を収納するにあたり、供給配管(35)の端部領域(Re)から浄化気体が供給される収納部に対して容器(7)を搬送するように搬送装置の動作を制御する。
【選択図】図9
Description
複数の収納部を収納部群として有する収納棚と、
前記収納部群を構成するそれぞれの前記収納部に対して、複数の分岐管を有する供給配管を介して気体供給源から浄化気体を供給する気体供給装置と、
前記収納部に対して容器を搬送する搬送装置と、
前記搬送装置の動作を制御する制御部と、を備え、
前記供給配管が、前記気体供給源に接続される接続部を含む接続領域と、前記接続領域よりも気体通流方向で下流側にある端部領域と、を含み、
前記制御部は、前記収納部群に含まれる全ての前記収納部に前記容器が収納されていない状態から最初に前記容器を収納するにあたり、前記供給配管の前記端部領域から前記浄化気体が供給される前記収納部に対して前記容器を搬送するように前記搬送装置の動作を制御する。
前記供給配管が、前記接続領域の両側に2つの前記端部領域を含み、
前記制御部は、2つの前記端部領域のうち、前記接続部からの流路長が相対的に長い方の配管部における前記端部領域から前記浄化気体が供給される前記収納部に対して最初に前記容器を搬送するように前記搬送装置の動作を制御することが好ましい。
前記制御部は、前記供給配管の下流側端部から前記浄化気体が供給される前記収納部に対して最初に前記容器を搬送するように前記搬送装置の動作を制御することが好ましい。
前記制御部は、前記供給配管の前記接続領域から前記浄化気体が供給される前記収納部に対して劣後的に前記容器を搬送するように前記搬送装置の動作を制御することが好ましい。
容器収納設備の第1実施形態について、図面を参照して説明する。本実施形態の容器収納設備1は、物品収納設備の一種であり、物品としての容器7を収容する。この容器収納設備1は、例えば工業製品の製造プロセスにおいて、工程待ち等の間に原料や中間製品等を一時的に保管したり、完成品を保管したりするために用いられる。
容器収納設備の第2実施形態について、図面を参照して説明する。本実施形態の容器収納設備1は、気体供給装置3に含まれる供給配管35の具体的構成が上記の第1実施形態とは異なっている。また、それに伴い、浄化気体の流量均一化のための物品収納制御の具体的処理内容も、上記の第1実施形態とは一部異なっている。以下、本実施形態に係る容器収納設備1について、主に第1実施形態との相違点について説明する。なお、特に明記しない点に関しては、第1実施形態と同様であり、同一の符号を付して詳細な説明は省略する。
(1)上記の各実施形態では、それぞれの収納部群Gにおいて当該収納部群Gに含まれる収納部Sに容器7を収納するにあたり、供給配管35の下流側端部35eから浄化気体が供給される収納部Sに対して最初に容器7を搬送する構成を主に想定して説明した。しかし、そのような構成に限定されることなく、例えば図14に示すように、端部領域Reのうち、下流側端部35e以外の位置に設けられた分岐管35Bから浄化気体が供給される収納部Sに対して最初に容器7を搬送しても良い。
2 収納棚
3 気体供給装置
4 搬送装置
5 制御部
7 容器
31 気体供給源
33 流量調整部
35 供給配管
35B 分岐管
35c 接続部
35e 下流側端部
S 収納部
G 収納部群
Rc 接続領域
Re 端部領域
Rep 近位側端部領域
Red 遠位側端部領域
Claims (4)
- 複数の収納部を収納部群として有する収納棚と、
前記収納部群を構成するそれぞれの前記収納部に対して、複数の分岐管を有する供給配管を介して気体供給源から浄化気体を供給する気体供給装置と、
前記収納部に対して容器を搬送する搬送装置と、
前記搬送装置の動作を制御する制御部と、を備え、
前記供給配管が、前記気体供給源に接続される接続部を含む接続領域と、前記接続領域よりも気体通流方向で下流側にある端部領域と、を含み、
前記制御部は、前記収納部群に含まれる全ての前記収納部に前記容器が収納されていない状態から最初に前記容器を収納するにあたり、前記供給配管の前記端部領域から前記浄化気体が供給される前記収納部に対して前記容器を搬送するように前記搬送装置の動作を制御する容器収納設備。 - 前記供給配管が、前記接続領域の両側に2つの前記端部領域を含み、
前記制御部は、2つの前記端部領域のうち、前記接続部からの流路長が相対的に長い方の配管部における前記端部領域から前記浄化気体が供給される前記収納部に対して最初に前記容器を搬送するように前記搬送装置の動作を制御する請求項1に記載の容器収納設備。 - 前記制御部は、前記供給配管の下流側端部から前記浄化気体が供給される前記収納部に対して最初に前記容器を搬送するように前記搬送装置の動作を制御する請求項1又は2に記載の容器収納設備。
- 前記制御部は、前記供給配管の前記接続領域から前記浄化気体が供給される前記収納部に対して劣後的に前記容器を搬送するように前記搬送装置の動作を制御する請求項1から3のいずれか一項に記載の容器収納設備。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016176976A JP6610476B2 (ja) | 2016-09-09 | 2016-09-09 | 容器収納設備 |
KR1020170113761A KR102428092B1 (ko) | 2016-09-09 | 2017-09-06 | 용기 수납 설비 |
US15/697,976 US10354898B2 (en) | 2016-09-09 | 2017-09-07 | Container storage facility |
CN201710805509.7A CN107808843B (zh) | 2016-09-09 | 2017-09-08 | 容器收纳设备 |
TW106130774A TWI738857B (zh) | 2016-09-09 | 2017-09-08 | 容器收納設備 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016176976A JP6610476B2 (ja) | 2016-09-09 | 2016-09-09 | 容器収納設備 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018041923A true JP2018041923A (ja) | 2018-03-15 |
JP6610476B2 JP6610476B2 (ja) | 2019-11-27 |
Family
ID=61560198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016176976A Active JP6610476B2 (ja) | 2016-09-09 | 2016-09-09 | 容器収納設備 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10354898B2 (ja) |
JP (1) | JP6610476B2 (ja) |
KR (1) | KR102428092B1 (ja) |
CN (1) | CN107808843B (ja) |
TW (1) | TWI738857B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110880465A (zh) * | 2018-09-06 | 2020-03-13 | 东京毅力科创株式会社 | 基片处理装置和吹扫方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6693356B2 (ja) * | 2016-09-09 | 2020-05-13 | 株式会社ダイフク | 物品搬送装置 |
US10703563B2 (en) * | 2017-11-10 | 2020-07-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker |
JP7093318B2 (ja) * | 2019-02-18 | 2022-06-29 | 台湾大福高科技設備股▲分▼有限公司 | 物品保管設備 |
KR102247041B1 (ko) * | 2019-06-12 | 2021-04-30 | 세메스 주식회사 | 크레인 어셈블리 및 이를 포함하는 스토커 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015012042A (ja) * | 2013-06-26 | 2015-01-19 | 株式会社ダイフク | 不活性気体供給設備 |
WO2015194255A1 (ja) * | 2014-06-16 | 2015-12-23 | 村田機械株式会社 | パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1719153B1 (en) * | 2004-02-05 | 2009-10-21 | Entegris, Inc. | Purging of a wafer conveyance container |
JP2009503899A (ja) * | 2005-08-03 | 2009-01-29 | インテグリス・インコーポレーテッド | 移送容器 |
WO2007149513A2 (en) * | 2006-06-19 | 2007-12-27 | Entegris, Inc. | System for purging reticle storage |
JP4670808B2 (ja) * | 2006-12-22 | 2011-04-13 | ムラテックオートメーション株式会社 | コンテナの搬送システム及び測定用コンテナ |
JP4692584B2 (ja) * | 2008-07-03 | 2011-06-01 | 村田機械株式会社 | パージ装置 |
CN102194730B (zh) * | 2010-03-15 | 2015-08-05 | 三星电子株式会社 | 衬底转移容器、气体净化监视工具及具有其的半导体制造设备 |
JP5598734B2 (ja) * | 2012-01-06 | 2014-10-01 | 株式会社ダイフク | 物品保管設備 |
JP6217854B2 (ja) * | 2014-06-16 | 2017-10-25 | 村田機械株式会社 | パージストッカ及びパージ方法 |
-
2016
- 2016-09-09 JP JP2016176976A patent/JP6610476B2/ja active Active
-
2017
- 2017-09-06 KR KR1020170113761A patent/KR102428092B1/ko active IP Right Grant
- 2017-09-07 US US15/697,976 patent/US10354898B2/en active Active
- 2017-09-08 CN CN201710805509.7A patent/CN107808843B/zh active Active
- 2017-09-08 TW TW106130774A patent/TWI738857B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015012042A (ja) * | 2013-06-26 | 2015-01-19 | 株式会社ダイフク | 不活性気体供給設備 |
WO2015194255A1 (ja) * | 2014-06-16 | 2015-12-23 | 村田機械株式会社 | パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110880465A (zh) * | 2018-09-06 | 2020-03-13 | 东京毅力科创株式会社 | 基片处理装置和吹扫方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI738857B (zh) | 2021-09-11 |
US10354898B2 (en) | 2019-07-16 |
JP6610476B2 (ja) | 2019-11-27 |
CN107808843B (zh) | 2023-08-25 |
TW201812963A (zh) | 2018-04-01 |
KR102428092B1 (ko) | 2022-08-01 |
CN107808843A (zh) | 2018-03-16 |
US20180076074A1 (en) | 2018-03-15 |
KR20180028943A (ko) | 2018-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6610476B2 (ja) | 容器収納設備 | |
US9997387B2 (en) | Purge device, purge system, purge method, and control method in purge system | |
US10410894B2 (en) | Purge stocker and purging method | |
JP6572854B2 (ja) | 容器収納設備 | |
JP5892113B2 (ja) | 物品保管設備 | |
KR102346977B1 (ko) | 용기 수납 설비 | |
EP3343597B1 (en) | Storage device and storage method | |
JP6690740B2 (ja) | パージストッカ | |
US10583983B2 (en) | Container storage facility | |
WO2023067947A1 (ja) | パージシステム | |
KR20170113389A (ko) | 용기 수납 설비 | |
JP2016054240A (ja) | ストッカ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181108 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190716 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190711 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190912 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191001 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191014 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6610476 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |