JP2018040638A5 - - Google Patents

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Publication number
JP2018040638A5
JP2018040638A5 JP2016173921A JP2016173921A JP2018040638A5 JP 2018040638 A5 JP2018040638 A5 JP 2018040638A5 JP 2016173921 A JP2016173921 A JP 2016173921A JP 2016173921 A JP2016173921 A JP 2016173921A JP 2018040638 A5 JP2018040638 A5 JP 2018040638A5
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JP
Japan
Prior art keywords
pressure
pressure medium
thin
protective film
concave portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016173921A
Other languages
English (en)
Japanese (ja)
Other versions
JP6528745B2 (ja
JP2018040638A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016173921A priority Critical patent/JP6528745B2/ja
Priority claimed from JP2016173921A external-priority patent/JP6528745B2/ja
Priority to PCT/JP2017/030222 priority patent/WO2018047626A1/ja
Priority to CN201780054013.9A priority patent/CN109690274B/zh
Publication of JP2018040638A publication Critical patent/JP2018040638A/ja
Publication of JP2018040638A5 publication Critical patent/JP2018040638A5/ja
Priority to US16/273,740 priority patent/US10983022B2/en
Application granted granted Critical
Publication of JP6528745B2 publication Critical patent/JP6528745B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016173921A 2016-09-06 2016-09-06 圧力センサ Active JP6528745B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016173921A JP6528745B2 (ja) 2016-09-06 2016-09-06 圧力センサ
PCT/JP2017/030222 WO2018047626A1 (ja) 2016-09-06 2017-08-24 圧力センサ
CN201780054013.9A CN109690274B (zh) 2016-09-06 2017-08-24 压力传感器
US16/273,740 US10983022B2 (en) 2016-09-06 2019-02-12 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016173921A JP6528745B2 (ja) 2016-09-06 2016-09-06 圧力センサ

Publications (3)

Publication Number Publication Date
JP2018040638A JP2018040638A (ja) 2018-03-15
JP2018040638A5 true JP2018040638A5 (enExample) 2018-10-04
JP6528745B2 JP6528745B2 (ja) 2019-06-12

Family

ID=61561521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016173921A Active JP6528745B2 (ja) 2016-09-06 2016-09-06 圧力センサ

Country Status (4)

Country Link
US (1) US10983022B2 (enExample)
JP (1) JP6528745B2 (enExample)
CN (1) CN109690274B (enExample)
WO (1) WO2018047626A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7073881B2 (ja) * 2018-04-20 2022-05-24 株式会社デンソー 物理量センサおよびその製造方法
JP7444628B2 (ja) * 2020-02-19 2024-03-06 アズビル株式会社 圧力センサ
DE102020205490A1 (de) * 2020-04-30 2021-11-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Drucksensoreinrichtung und Drucksensoreinrichtung
DE102020118939A1 (de) * 2020-07-17 2022-01-20 Schott Ag Glaswafer und Glaselement für Drucksensoren
JP7509065B2 (ja) * 2021-03-26 2024-07-02 株式会社デンソー センサ素子およびそれを備えたセンサ装置
WO2025154433A1 (ja) * 2024-01-16 2025-07-24 株式会社村田製作所 圧力センサ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690056B2 (ja) 1997-04-24 2005-08-31 株式会社デンソー 半導体圧力センサのセンサチップの製造方法
DE10163567A1 (de) * 2001-12-21 2003-07-17 Endress & Hauser Gmbh & Co Kg Drucksensor mit hydrophober Beschichtung
JP2005326338A (ja) 2004-05-17 2005-11-24 Denso Corp 圧力センサ
JP4175298B2 (ja) * 2004-07-07 2008-11-05 セイコーエプソン株式会社 カラーフィルタとその製造方法及び電気光学装置並びに電子機器
JP2006030068A (ja) * 2004-07-20 2006-02-02 Denso Corp 圧力センサ
US7216547B1 (en) * 2006-01-06 2007-05-15 Honeywell International Inc. Pressure sensor with silicon frit bonded cap
WO2009090851A1 (ja) * 2008-01-16 2009-07-23 Alps Electric Co., Ltd. 圧力センサ及びその製造方法
CN101738280B (zh) * 2008-11-24 2011-08-17 河南理工大学 Mems压力传感器及其制作方法
JP2012026956A (ja) 2010-07-27 2012-02-09 Fujikura Ltd 圧力センサの製造方法及び圧力センサ
CN102169038B (zh) * 2011-01-10 2012-10-10 中国电子科技集团公司第五十五研究所 用于三明治结构mems硅电容压力传感器侧墙保护方法
JP5304807B2 (ja) 2011-01-26 2013-10-02 株式会社デンソー 圧力センサ
JP5754209B2 (ja) 2011-03-31 2015-07-29 大日本印刷株式会社 半導体装置の製造方法
JP5871171B2 (ja) * 2013-06-10 2016-03-01 コニカミノルタ株式会社 パターン基板の製造方法及び部品の位置合わせ方法
JP6156233B2 (ja) * 2014-04-01 2017-07-05 株式会社デンソー 圧力センサ
JP2016118494A (ja) * 2014-12-22 2016-06-30 株式会社デンソー 圧力センサ及びその製造方法
JP6492708B2 (ja) * 2015-02-04 2019-04-03 株式会社デンソー 圧力センサ装置

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