EP3973273A4 - Sensors having an active surface - Google Patents

Sensors having an active surface Download PDF

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Publication number
EP3973273A4
EP3973273A4 EP20808877.3A EP20808877A EP3973273A4 EP 3973273 A4 EP3973273 A4 EP 3973273A4 EP 20808877 A EP20808877 A EP 20808877A EP 3973273 A4 EP3973273 A4 EP 3973273A4
Authority
EP
European Patent Office
Prior art keywords
sensors
active surface
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20808877.3A
Other languages
German (de)
French (fr)
Other versions
EP3973273A1 (en
Inventor
Arvin Emadi
Arnaud Rival
Ali Agah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illumina Inc
Original Assignee
Illumina Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumina Inc filed Critical Illumina Inc
Publication of EP3973273A1 publication Critical patent/EP3973273A1/en
Publication of EP3973273A4 publication Critical patent/EP3973273A4/en
Pending legal-status Critical Current

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    • HELECTRICITY
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B01L3/502707Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • GPHYSICS
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    • G01N21/6428Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
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    • G01N21/645Specially adapted constructive features of fluorimeters
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    • G01N21/6456Spatial resolved fluorescence measurements; Imaging
    • G01N21/6458Fluorescence microscopy
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • GPHYSICS
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039817B2 (en) 2008-05-05 2011-10-18 Illumina, Inc. Compensator for multiple surface imaging
NL2021377B1 (en) * 2018-07-03 2020-01-08 Illumina Inc Interposer with first and second adhesive layers
WO2021061474A1 (en) * 2019-09-26 2021-04-01 Illumina, Inc. Fabricating wafers with electrical contacts on a surface parallel to an active surface
US11188778B1 (en) 2020-05-05 2021-11-30 Illumina, Inc. Equalization-based image processing and spatial crosstalk attenuator
TW202231156A (en) * 2021-01-15 2022-08-01 美商伊路米納有限公司 Enabling sensor top side wirebonding
KR20240031968A (en) 2021-07-19 2024-03-08 일루미나, 인코포레이티드 Intensity extraction with interpolation and adaptation to base calling
US11455487B1 (en) 2021-10-26 2022-09-27 Illumina Software, Inc. Intensity extraction and crosstalk attenuation using interpolation and adaptation for base calling
US20230146020A1 (en) * 2021-11-05 2023-05-11 Illumina, Inc. Sensor having an active surface
CN116417352B (en) * 2023-04-07 2023-10-13 江苏中科智芯集成科技有限公司 Preparation method of semiconductor packaging structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140077315A1 (en) * 2012-09-17 2014-03-20 Robert Bosch Gmbh Electronic sensor apparatus for detecting chemical or biological species, microfluidic apparatus comprising such a sensor apparatus, and method for producing the sensor apparatus and method for producing the microfluidic apparatus
US9670445B1 (en) * 2013-03-11 2017-06-06 Amkor Technology, Inc. Microfluidics sensor package fabrication method and structure
US20190070606A1 (en) * 2017-09-01 2019-03-07 Complete Genomics, Inc. Injection molded microfluidic/fluidic cartridge integrated with silicon-based sensor
US20190088463A1 (en) * 2017-09-19 2019-03-21 Complete Genomics, Inc. Wafer level sequencing flow cell fabrication

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1322951A2 (en) * 2000-09-20 2003-07-02 Molecular Reflections Microfabricated ultrasound array for use as resonant sensors
AU2002216618A1 (en) * 2000-10-06 2002-04-15 Protasis Corporation Fluid separation conduit cartridge with encryption capability
US7437912B2 (en) * 2004-07-19 2008-10-21 Integrated Sensing Systems, Inc. Device and method for sensing rheological properties of a fluid
WO2010119380A1 (en) * 2009-04-15 2010-10-21 Koninklijke Philips Electronics N.V. Microfluidic device comprising sensor
TWI508273B (en) 2010-03-19 2015-11-11 Xintec Inc Image sensor package and fabrication method thereof
US9387476B2 (en) * 2010-10-27 2016-07-12 Illumina, Inc. Flow cells for biological or chemical analysis
US8906320B1 (en) * 2012-04-16 2014-12-09 Illumina, Inc. Biosensors for biological or chemical analysis and systems and methods for same
JP5599012B1 (en) 2014-06-23 2014-10-01 国立大学法人 東京大学 Collection unit and biosensor
NL2020612B1 (en) 2017-12-22 2019-07-02 Illumina Inc Light detection devices with protective liner and methods of manufacturing same
TWI685960B (en) 2018-02-03 2020-02-21 美商伊路米納有限公司 Structure and method to use active surface of a sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140077315A1 (en) * 2012-09-17 2014-03-20 Robert Bosch Gmbh Electronic sensor apparatus for detecting chemical or biological species, microfluidic apparatus comprising such a sensor apparatus, and method for producing the sensor apparatus and method for producing the microfluidic apparatus
US9670445B1 (en) * 2013-03-11 2017-06-06 Amkor Technology, Inc. Microfluidics sensor package fabrication method and structure
US20190070606A1 (en) * 2017-09-01 2019-03-07 Complete Genomics, Inc. Injection molded microfluidic/fluidic cartridge integrated with silicon-based sensor
US20190088463A1 (en) * 2017-09-19 2019-03-21 Complete Genomics, Inc. Wafer level sequencing flow cell fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020236945A1 *

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US20240145505A1 (en) 2024-05-02
AU2020279254A1 (en) 2021-01-14
PH12020552301A1 (en) 2021-10-04
CA3103534A1 (en) 2020-11-26
TW202102106A (en) 2021-01-01
JP2022532811A (en) 2022-07-20
US20200373340A1 (en) 2020-11-26
US11387269B2 (en) 2022-07-12
MX2020014079A (en) 2021-05-27
EP3973273A1 (en) 2022-03-30
CN111987113A (en) 2020-11-24
IL279427A (en) 2021-01-31
CN212571001U (en) 2021-02-19
KR20210158299A (en) 2021-12-30
SG11202012495YA (en) 2021-01-28
WO2020236945A1 (en) 2020-11-26
ZA202007851B (en) 2024-04-24
IL279427B1 (en) 2024-03-01
US20220367547A1 (en) 2022-11-17

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