CN109690274B - 压力传感器 - Google Patents
压力传感器 Download PDFInfo
- Publication number
- CN109690274B CN109690274B CN201780054013.9A CN201780054013A CN109690274B CN 109690274 B CN109690274 B CN 109690274B CN 201780054013 A CN201780054013 A CN 201780054013A CN 109690274 B CN109690274 B CN 109690274B
- Authority
- CN
- China
- Prior art keywords
- pressure
- protective film
- pressure sensor
- pressure medium
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-173921 | 2016-09-06 | ||
| JP2016173921A JP6528745B2 (ja) | 2016-09-06 | 2016-09-06 | 圧力センサ |
| PCT/JP2017/030222 WO2018047626A1 (ja) | 2016-09-06 | 2017-08-24 | 圧力センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109690274A CN109690274A (zh) | 2019-04-26 |
| CN109690274B true CN109690274B (zh) | 2021-04-20 |
Family
ID=61561521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780054013.9A Active CN109690274B (zh) | 2016-09-06 | 2017-08-24 | 压力传感器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10983022B2 (enExample) |
| JP (1) | JP6528745B2 (enExample) |
| CN (1) | CN109690274B (enExample) |
| WO (1) | WO2018047626A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7073881B2 (ja) * | 2018-04-20 | 2022-05-24 | 株式会社デンソー | 物理量センサおよびその製造方法 |
| JP7444628B2 (ja) * | 2020-02-19 | 2024-03-06 | アズビル株式会社 | 圧力センサ |
| DE102020205490A1 (de) * | 2020-04-30 | 2021-11-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Drucksensoreinrichtung und Drucksensoreinrichtung |
| DE102020118939A1 (de) * | 2020-07-17 | 2022-01-20 | Schott Ag | Glaswafer und Glaselement für Drucksensoren |
| JP7509065B2 (ja) * | 2021-03-26 | 2024-07-02 | 株式会社デンソー | センサ素子およびそれを備えたセンサ装置 |
| WO2025154433A1 (ja) * | 2024-01-16 | 2025-07-24 | 株式会社村田製作所 | 圧力センサ |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3690056B2 (ja) | 1997-04-24 | 2005-08-31 | 株式会社デンソー | 半導体圧力センサのセンサチップの製造方法 |
| DE10163567A1 (de) * | 2001-12-21 | 2003-07-17 | Endress & Hauser Gmbh & Co Kg | Drucksensor mit hydrophober Beschichtung |
| JP2005326338A (ja) | 2004-05-17 | 2005-11-24 | Denso Corp | 圧力センサ |
| JP4175298B2 (ja) * | 2004-07-07 | 2008-11-05 | セイコーエプソン株式会社 | カラーフィルタとその製造方法及び電気光学装置並びに電子機器 |
| JP2006030068A (ja) * | 2004-07-20 | 2006-02-02 | Denso Corp | 圧力センサ |
| US7216547B1 (en) * | 2006-01-06 | 2007-05-15 | Honeywell International Inc. | Pressure sensor with silicon frit bonded cap |
| WO2009090851A1 (ja) * | 2008-01-16 | 2009-07-23 | Alps Electric Co., Ltd. | 圧力センサ及びその製造方法 |
| CN101738280B (zh) * | 2008-11-24 | 2011-08-17 | 河南理工大学 | Mems压力传感器及其制作方法 |
| JP2012026956A (ja) | 2010-07-27 | 2012-02-09 | Fujikura Ltd | 圧力センサの製造方法及び圧力センサ |
| CN102169038B (zh) * | 2011-01-10 | 2012-10-10 | 中国电子科技集团公司第五十五研究所 | 用于三明治结构mems硅电容压力传感器侧墙保护方法 |
| JP5304807B2 (ja) | 2011-01-26 | 2013-10-02 | 株式会社デンソー | 圧力センサ |
| JP5754209B2 (ja) | 2011-03-31 | 2015-07-29 | 大日本印刷株式会社 | 半導体装置の製造方法 |
| JP5871171B2 (ja) * | 2013-06-10 | 2016-03-01 | コニカミノルタ株式会社 | パターン基板の製造方法及び部品の位置合わせ方法 |
| JP6156233B2 (ja) * | 2014-04-01 | 2017-07-05 | 株式会社デンソー | 圧力センサ |
| JP2016118494A (ja) * | 2014-12-22 | 2016-06-30 | 株式会社デンソー | 圧力センサ及びその製造方法 |
| JP6492708B2 (ja) * | 2015-02-04 | 2019-04-03 | 株式会社デンソー | 圧力センサ装置 |
-
2016
- 2016-09-06 JP JP2016173921A patent/JP6528745B2/ja active Active
-
2017
- 2017-08-24 WO PCT/JP2017/030222 patent/WO2018047626A1/ja not_active Ceased
- 2017-08-24 CN CN201780054013.9A patent/CN109690274B/zh active Active
-
2019
- 2019-02-12 US US16/273,740 patent/US10983022B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10983022B2 (en) | 2021-04-20 |
| JP6528745B2 (ja) | 2019-06-12 |
| US20190178738A1 (en) | 2019-06-13 |
| JP2018040638A (ja) | 2018-03-15 |
| CN109690274A (zh) | 2019-04-26 |
| WO2018047626A1 (ja) | 2018-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109690274B (zh) | 压力传感器 | |
| US11401157B2 (en) | Micromechanical sensor device with improved liquid tightness protection | |
| US5900554A (en) | Pressure sensor | |
| CN1947278B (zh) | 用于有机电子元件的封装及其制造方法和用途 | |
| US8733175B2 (en) | Pressure sensor | |
| US20030179805A1 (en) | Capacitance type humidity sensor with passivation layer | |
| US11699672B2 (en) | Semiconductor device and method for manufacturing same | |
| JP2006329929A (ja) | 半導体圧力センサ | |
| KR102696081B1 (ko) | 마이크로전자기계 시스템 | |
| US12125813B2 (en) | Semiconductor device and method for manufacturing same | |
| US7284435B2 (en) | Pressure sensor | |
| JP6156233B2 (ja) | 圧力センサ | |
| US10921205B2 (en) | Pressure sensor including protective film to avoid adhesion of foreign material | |
| CN118633363A (zh) | 用于形成包括石墨烯的器件的方法 | |
| JP7392135B2 (ja) | リセスによって開口された分析流体の濃度測定のための膜を備えたセンサ | |
| JP2005505764A (ja) | 防食圧力変換器 | |
| JP4474308B2 (ja) | 流量センサ | |
| JP2005326338A (ja) | 圧力センサ | |
| JP4893529B2 (ja) | 圧力センサ | |
| WO2022202726A1 (ja) | センサ素子およびそれを備えたセンサ装置 | |
| KR20070026201A (ko) | 가혹한 화학적 및 열적 환경에 노출되는 반도체계 압력센서의 금속 접점 시스템 | |
| US11307110B2 (en) | Pressure-sensor assembly having a carrier substrate | |
| JP7073881B2 (ja) | 物理量センサおよびその製造方法 | |
| JP2008111787A (ja) | 圧力センサ | |
| US20140151885A1 (en) | Semiconductor device and method for manufacturing a semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |