JP2018022549A5 - - Google Patents
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- Publication number
- JP2018022549A5 JP2018022549A5 JP2017207796A JP2017207796A JP2018022549A5 JP 2018022549 A5 JP2018022549 A5 JP 2018022549A5 JP 2017207796 A JP2017207796 A JP 2017207796A JP 2017207796 A JP2017207796 A JP 2017207796A JP 2018022549 A5 JP2018022549 A5 JP 2018022549A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- deformation
- concave portion
- area
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000969 carrier Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
Description
また領域１２６に形成された凹部１２８を形成する輪郭が、自由曲線からなり、キャリア１０４のギア部１１５に接触しないように形成されていることが好ましい。よって、ガラス基板１０２表面を研磨する際、凹部１２８に研磨液を確実に溜めることができるため、張り付きを防止する効果が高い。 Moreover, it is preferable that the outline which forms the recessed part 128 formed in the area | region 126 consists of a free curve, and is formed so that the gear part 115 of the carrier 104 may not be contacted. Therefore, when the surface of the glass substrate 102 is polished, the polishing liquid can be reliably accumulated in the recess 128, so that the effect of preventing sticking is high.
表５では、キャリアの表面に凹部が存在しないものを比較例２とし、凹部が存在していて凹部の深さの異なるものを各実施例１５〜２１とした。なお表５での、張り付き発生回数の比とは、比較例２を「１．０」としたときの相対値である。また各実施例の凹部は、キャリアのギア部に接触しないように形成されている。さらに各実施形態の凹部は、キャリアの一方の表面の保持孔を除いた全表面に占める面積の割合を３０％とし、全ての凹部の面積は１ｃｍ２以上とした。 In Table 5 , the example in which the concave portion does not exist on the surface of the carrier is referred to as Comparative Example 2, and the case in which the concave portion is present and the depth of the concave portion is different is referred to as Examples 15 to 21. The ratio of the number of occurrences of sticking in Table 5 is a relative value when Comparative Example 2 is set to “1.0”. Moreover, the recessed part of each Example is formed so that it may not contact the gear part of a carrier. Furthermore, in the recesses of each embodiment, the ratio of the area occupied on the entire surface excluding the holding holes on one surface of the carrier was 30%, and the area of all the recesses was 1 cm 2 or more.
さらに、表５でのキャリアの変形等とは、１００バッチ終了後、両面研磨装置からキャリアを取り外して反りや変形、表面状態を観察した結果である。なおキャリアの反りなどの変形がある場合、使用し続けると研磨処理中に基板が保持孔から外れる可能性があるため、好ましくない。
Furthermore, the carrier deformation or the like in Table 5 is a result of observing warpage, deformation, and surface state after removing the carrier from the double-side polishing apparatus after 100 batches. In the case where there is a deformation such as a warp of the carrier, it is not preferable to continue using it because the substrate may be detached from the holding hole during the polishing process.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016073512 | 2016-03-31 | ||
| JP2016073512 | 2016-03-31 | ||
| JP2016073513 | 2016-03-31 | ||
| JP2016073513 | 2016-03-31 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017541416A Division JP6236191B1 (en) | 2016-03-31 | 2017-03-31 | Carrier and method of manufacturing substrate using the carrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018022549A JP2018022549A (en) | 2018-02-08 |
| JP2018022549A5 true JP2018022549A5 (en) | 2018-04-26 |
| JP7018292B2 JP7018292B2 (en) | 2022-02-10 |
Family
ID=59966122
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017541416A Active JP6236191B1 (en) | 2016-03-31 | 2017-03-31 | Carrier and method of manufacturing substrate using the carrier |
| JP2017207796A Active JP7018292B2 (en) | 2016-03-31 | 2017-10-27 | Carrier and method of manufacturing a substrate using the carrier |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017541416A Active JP6236191B1 (en) | 2016-03-31 | 2017-03-31 | Carrier and method of manufacturing substrate using the carrier |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6236191B1 (en) |
| CN (2) | CN112091811B (en) |
| MY (1) | MY174348A (en) |
| SG (2) | SG10202004819TA (en) |
| WO (1) | WO2017171052A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108705421A (en) * | 2018-08-21 | 2018-10-26 | 德清明宇电子科技有限公司 | A kind of E-type magnetic core grinding device |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0563040B1 (en) * | 1990-12-20 | 1995-06-14 | Monsanto Company | Plastic sheet for a laminated glazing and method for controlling adhesion and reducing blocking thereof |
| JPH1110530A (en) * | 1997-06-25 | 1999-01-19 | Shin Etsu Handotai Co Ltd | Carrier for both-sided polishing |
| WO2000035630A1 (en) * | 1998-12-14 | 2000-06-22 | Seiko Epson Corporation | Polishing carrier, surface polishing device, and surface polishing method |
| JP2001179615A (en) * | 1999-12-27 | 2001-07-03 | Seiko Epson Corp | Polishing carrier, surface polishing device and surface polishing method |
| JP4034056B2 (en) * | 2000-09-13 | 2008-01-16 | 日本板硝子株式会社 | Method for processing amorphous material |
| IE20020146A1 (en) * | 2001-02-26 | 2002-09-18 | Shin Kobe Electric Machinery | Polished-piece holder and manufacturing method thereof |
| JP2003236742A (en) * | 2002-02-20 | 2003-08-26 | Toshiba Ceramics Co Ltd | Carrier for lapping |
| US7611639B2 (en) * | 2002-10-23 | 2009-11-03 | Hoya Corporation | Glass substrate for information recording medium and method for manufacturing same |
| DE102005034119B3 (en) | 2005-07-21 | 2006-12-07 | Siltronic Ag | Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
| JP2008000823A (en) * | 2006-06-20 | 2008-01-10 | Konica Minolta Opto Inc | Polishing carrier |
| JP2008093746A (en) * | 2006-10-06 | 2008-04-24 | Shin Kobe Electric Mach Co Ltd | Manufacturing method of plate-like body for holding polishing object |
| JP2009166228A (en) * | 2008-01-16 | 2009-07-30 | Kazumasa Onishi | Carrier plate for wafer polishing |
| JP2009178806A (en) * | 2008-01-31 | 2009-08-13 | Seiko Epson Corp | Polishing carrier, and polishing device |
| CN101579837A (en) * | 2008-05-13 | 2009-11-18 | 中芯国际集成电路制造(上海)有限公司 | Polishing pad adjusting device for chemical-mechanical polishing |
| CN103839857B (en) * | 2008-06-04 | 2017-09-19 | 株式会社荏原制作所 | Substrate board treatment and method, substrate grasping mechanism and substrate grasping method |
| CN101637888B (en) * | 2008-08-01 | 2013-09-18 | 智胜科技股份有限公司 | Grinding pad and method for manufacturing same |
| US9409809B2 (en) * | 2011-04-27 | 2016-08-09 | Hoya Corporation | Method for manufacturing glass blank for magnetic disk, method for manufacturing glass substrate for magnetic disk, glass blank for magnetic disk |
| JP6039698B2 (en) * | 2013-02-08 | 2016-12-07 | Hoya株式会社 | Manufacturing method of magnetic disk substrate and polishing pad used for manufacturing magnetic disk substrate |
| JP5422767B1 (en) * | 2013-05-09 | 2014-02-19 | 信越エンジニアリング株式会社 | Bonding separation method and separation apparatus |
| JP2015035245A (en) * | 2013-08-09 | 2015-02-19 | 旭硝子株式会社 | Glass substrate carrier, polishing method of glass substrate for magnetic recording medium, and manufacturing method of glass substrate for magnetic recording medium |
| JP6152340B2 (en) * | 2013-12-26 | 2017-06-21 | Hoya株式会社 | Manufacturing method of disk-shaped substrate and carrier for grinding or polishing |
| JP6312554B2 (en) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | Processing method of package substrate |
-
2017
- 2017-03-31 CN CN202011023491.3A patent/CN112091811B/en active Active
- 2017-03-31 JP JP2017541416A patent/JP6236191B1/en active Active
- 2017-03-31 CN CN201780003634.4A patent/CN108349063B/en active Active
- 2017-03-31 MY MYPI2018701106A patent/MY174348A/en unknown
- 2017-03-31 SG SG10202004819TA patent/SG10202004819TA/en unknown
- 2017-03-31 SG SG11201802381PA patent/SG11201802381PA/en unknown
- 2017-03-31 WO PCT/JP2017/013739 patent/WO2017171052A1/en active Application Filing
- 2017-10-27 JP JP2017207796A patent/JP7018292B2/en active Active
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