MY174348A - Carrier and substrate manufacturing method using this carrier - Google Patents

Carrier and substrate manufacturing method using this carrier

Info

Publication number
MY174348A
MY174348A MYPI2018701106A MYPI2018701106A MY174348A MY 174348 A MY174348 A MY 174348A MY PI2018701106 A MYPI2018701106 A MY PI2018701106A MY PI2018701106 A MYPI2018701106 A MY PI2018701106A MY 174348 A MY174348 A MY 174348A
Authority
MY
Malaysia
Prior art keywords
carrier
substrate manufacturing
substrate
present
holding
Prior art date
Application number
MYPI2018701106A
Inventor
Promchai Jaknarin
Original Assignee
Hoya Corp
Hoya Lamphun Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp, Hoya Lamphun Ltd filed Critical Hoya Corp
Publication of MY174348A publication Critical patent/MY174348A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

[Object] Provided are a carrier with which high-quality substrates can be obtained at a higher yield than with a conventional method, and a method for manufacturing a substrate using this carrier. [Solution] A carrier (104) according to the present invention is a carrier for polishing or grinding having a holding hole (122) for holding a substrate (for example, a glass substrate (102)). A plurality of protrusions (136) containing glass as a main component are present in at least one portion of a region of at least one surface of the carrier.
MYPI2018701106A 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier MY174348A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073512 2016-03-31
JP2016073513 2016-03-31

Publications (1)

Publication Number Publication Date
MY174348A true MY174348A (en) 2020-04-09

Family

ID=59966122

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701106A MY174348A (en) 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier

Country Status (5)

Country Link
JP (2) JP6236191B1 (en)
CN (2) CN112091811B (en)
MY (1) MY174348A (en)
SG (2) SG11201802381PA (en)
WO (1) WO2017171052A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108705421A (en) * 2018-08-21 2018-10-26 德清明宇电子科技有限公司 A kind of E-type magnetic core grinding device
CN115870868A (en) * 2022-12-27 2023-03-31 西安奕斯伟材料科技有限公司 Loading and unloading device and method and silicon wafer double-side polishing equipment

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478412A (en) * 1990-12-20 1995-12-26 Monsanto Company Plastic sheet for a laminated glazing and method for controlling adhesion and reducing blocking thereof
JPH1110530A (en) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd Carrier for both-sided polishing
WO2000035630A1 (en) * 1998-12-14 2000-06-22 Seiko Epson Corporation Polishing carrier, surface polishing device, and surface polishing method
JP2001179615A (en) * 1999-12-27 2001-07-03 Seiko Epson Corp Polishing carrier, surface polishing device and surface polishing method
JP4034056B2 (en) * 2000-09-13 2008-01-16 日本板硝子株式会社 Method for processing amorphous material
IE20020146A1 (en) * 2001-02-26 2002-09-18 Shin Kobe Electric Machinery Polished-piece holder and manufacturing method thereof
JP2003236742A (en) * 2002-02-20 2003-08-26 Toshiba Ceramics Co Ltd Carrier for lapping
AU2003275575A1 (en) * 2002-10-23 2004-06-07 Hoya Corporation Glass substrate for information recording medium and method for manufacturing same
DE102005034119B3 (en) 2005-07-21 2006-12-07 Siltronic Ag Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection
JP2008000823A (en) * 2006-06-20 2008-01-10 Konica Minolta Opto Inc Polishing carrier
JP2008093746A (en) * 2006-10-06 2008-04-24 Shin Kobe Electric Mach Co Ltd Manufacturing method of plate-like body for holding polishing object
JP2009166228A (en) * 2008-01-16 2009-07-30 Kazumasa Onishi Carrier plate for wafer polishing
JP2009178806A (en) * 2008-01-31 2009-08-13 Seiko Epson Corp Polishing carrier, and polishing device
CN101579837A (en) * 2008-05-13 2009-11-18 中芯国际集成电路制造(上海)有限公司 Polishing pad adjusting device for chemical-mechanical polishing
TWI550705B (en) * 2008-06-04 2016-09-21 荏原製作所股份有限公司 Polishing apparatus and polishing method
CN101637888B (en) * 2008-08-01 2013-09-18 智胜科技股份有限公司 Grinding pad and method for manufacturing same
SG193897A1 (en) * 2011-04-27 2013-11-29 Hoya Corp Method for producing glass blank for magnetic disc, method for producing glass substrate for magnetic disc, and glass blank for magnetic disc
JP6039698B2 (en) * 2013-02-08 2016-12-07 Hoya株式会社 Manufacturing method of magnetic disk substrate and polishing pad used for manufacturing magnetic disk substrate
JP5422767B1 (en) * 2013-05-09 2014-02-19 信越エンジニアリング株式会社 Bonding separation method and separation apparatus
JP2015035245A (en) * 2013-08-09 2015-02-19 旭硝子株式会社 Glass substrate carrier, polishing method of glass substrate for magnetic recording medium, and manufacturing method of glass substrate for magnetic recording medium
JP6152340B2 (en) * 2013-12-26 2017-06-21 Hoya株式会社 Manufacturing method of disk-shaped substrate and carrier for grinding or polishing
JP6312554B2 (en) * 2014-08-13 2018-04-18 株式会社ディスコ Processing method of package substrate

Also Published As

Publication number Publication date
JPWO2017171052A1 (en) 2018-04-05
CN112091811A (en) 2020-12-18
CN108349063A (en) 2018-07-31
CN108349063B (en) 2020-10-27
SG10202004819TA (en) 2020-06-29
JP6236191B1 (en) 2017-11-22
JP2018022549A (en) 2018-02-08
SG11201802381PA (en) 2018-04-27
WO2017171052A1 (en) 2017-10-05
JP7018292B2 (en) 2022-02-10
CN112091811B (en) 2022-09-06

Similar Documents

Publication Publication Date Title
MX2023003048A (en) Blank for forming an article carrier.
EP4011843A3 (en) Deep non-frangible stress profiles and methods of making
TW201612285A (en) Tungsten chemical-mechanical polishing composition
PH12014000029A1 (en) Polishing apparatus, and method for polishing and manufacturing glass substrate
MY174610A (en) Process for preparing a surface-modified material
MY185237A (en) Semiconductor wafer with a layer of al:ga1-zn and process for producing it
EP3591101A4 (en) Silicon carbide substrate production method and silicon carbide substrate
TWD179095S (en) Substrate retaining ring
EP3128535A4 (en) SURFACE TREATMENT METHOD FOR SiC SUBSTRATES, SiC SUBSTRATE, AND SEMICONDUCTOR PRODUCTION METHOD
TW201614724A (en) Substrate processing method
TW201613028A (en) Supporting glass substrate and laminate using same
EP4253338A3 (en) Hydrogen-containing glass-based articles with high indentation cracking threshold
MY154989A (en) Method of glass surface fine processing
NZ744470A (en) Solvent application in bottle wash using amidine based formulas
MY156911A (en) Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
MY180533A (en) Methods for working synthetic quartz glass substrate having a mirror-like surface and method for sensing synthetic quartz glass substrate
MY174348A (en) Carrier and substrate manufacturing method using this carrier
TW201612967A (en) Polishing method and polishing apparatus
SG11201901593TA (en) Composition for surface treatment, and method for surface treatment and method for producing semiconductor substrate using the same
MY173574A (en) Method for manufacturing glass substrate and method for manufacturing magnetic disk
MY189253A (en) Semiconductor wafer comprising a monocrystalline group-iiia nitride layer
MY162994A (en) Composition and method for polishing bulk silicon
TW201614114A (en) Ga2O3-BASED SINGLE CRYSTAL SUBSTRATE
EP3993951A4 (en) Temperature controlled substrate carrier and polishing components
TW201613114A (en) Method and apparatus for structuring the topside and underside of a semiconductor substrate