CN115870868A - Loading and unloading device and method and silicon wafer double-side polishing equipment - Google Patents

Loading and unloading device and method and silicon wafer double-side polishing equipment Download PDF

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Publication number
CN115870868A
CN115870868A CN202211690624.1A CN202211690624A CN115870868A CN 115870868 A CN115870868 A CN 115870868A CN 202211690624 A CN202211690624 A CN 202211690624A CN 115870868 A CN115870868 A CN 115870868A
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China
Prior art keywords
silicon wafer
loading
carrier
unloading
wafer double
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CN202211690624.1A
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Chinese (zh)
Inventor
孙介楠
王强
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Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
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Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
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Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202211690624.1A priority Critical patent/CN115870868A/en
Priority to TW112105930A priority patent/TWI839119B/en
Publication of CN115870868A publication Critical patent/CN115870868A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The embodiment of the invention discloses a loading and unloading device, a method and silicon wafer double-side polishing equipment, wherein the loading and unloading device comprises: a first loading and unloading mechanism for loading and unloading a carrier to and from the silicon wafer double-side polishing apparatus; a second loading and unloading mechanism for loading and unloading the silicon wafer to and from the carrier loaded on the silicon wafer double-side polishing apparatus; and the third loading and unloading mechanism is used for loading a dresser for dressing an upper polishing pad and a lower polishing pad of the silicon wafer double-sided polishing equipment to the silicon wafer double-sided polishing equipment and unloading the dresser from the silicon wafer double-sided polishing equipment.

Description

Loading and unloading device and method and silicon wafer double-side polishing equipment
Technical Field
The invention relates to the field of semiconductor silicon wafer production, in particular to a loading and unloading device and method and silicon wafer double-side polishing equipment.
Background
In the production process of a semiconductor silicon wafer, the silicon wafer is usually required to be polished on both sides to remove the damage on the surface of the silicon wafer during the silicon wafer molding process and form the surface of the silicon wafer into a mirror surface shape, and the process is usually completed by using silicon wafer double-side polishing equipment.
In the silicon wafer double-sided polishing equipment, the silicon wafer double-sided polishing equipment comprises an inner gear ring and an outer gear ring, a carrier for bearing a silicon wafer is loaded between the inner gear ring and the outer gear ring and is clamped by an upper polishing pad and a lower polishing pad, and an upper fixed plate and a lower fixed plate provide clamping force for clamping the carrier and the silicon wafer by the polishing pad.
In addition, in the process of polishing a silicon wafer, since the surface of the silicon wafer is not flat, it may affect a polishing pad contacting with the surface of the silicon wafer, for example, an upper polishing pad and a lower polishing pad may generate concave scratches during polishing due to protrusions of the surface of the silicon wafer, and further, for example, substances removed from the surface of the silicon wafer, polishing slurry, and the like may be accumulated on the surface of the polishing pad, and thus, in order to maintain a constant polishing performance of the polishing pad, it is necessary to dress the polishing pad using a dresser. In practice, after the dresser replaces a carrier loaded in the silicon wafer double-side polishing device and a silicon wafer carried by the carrier, the dresser is also enabled to generate relative motion relative to the polishing pad, and then the dressing of the upper polishing pad and the lower polishing pad can be achieved.
It can be seen that in the above-mentioned silicon wafer double-side polishing process, it is necessary to load a carrier into a silicon wafer double-side polishing apparatus and unload the carrier from the silicon wafer double-side polishing apparatus in the case where the carrier needs to be replaced or in the case where a polishing pad needs to be dressed, and it is also necessary to load a silicon wafer to be polished into a carrier already loaded in the silicon wafer double-side polishing apparatus and unload the polished silicon wafer from the carrier, and it is also necessary to load a dresser into the silicon wafer double-side polishing apparatus and unload the dresser from the silicon wafer double-side polishing apparatus. However, in the conventional loading and unloading methods, for example, the loading and unloading of the carrier and the loading and unloading of the dresser are performed by manual handling by an operator, which adversely affects the production efficiency and increases the labor cost.
Disclosure of Invention
In order to solve the technical problems, embodiments of the present invention desirably provide a loading and unloading device, a loading and unloading method, and a silicon wafer double-side polishing apparatus, which can implement full-automatic operation in a silicon wafer double-side polishing process, improve production efficiency, and reduce labor cost.
The technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a handling apparatus for a silicon wafer double-side polishing device, where the handling apparatus includes:
a first loading and unloading mechanism for loading and unloading a carrier to and from the silicon wafer double-side polishing apparatus;
a second loading and unloading mechanism for loading and unloading the silicon wafer to and from the carrier loaded on the silicon wafer double-side polishing apparatus;
and the third loading and unloading mechanism is used for loading a dresser for dressing an upper polishing pad and a lower polishing pad of the silicon wafer double-sided polishing equipment to the silicon wafer double-sided polishing equipment and unloading the dresser from the silicon wafer double-sided polishing equipment.
In a second aspect, an embodiment of the present invention provides a loading and unloading method for a silicon wafer double-side polishing apparatus, where the loading and unloading method includes:
loading and unloading a carrier to and from the silicon wafer double-side polishing device by using a first loading and unloading mechanism;
loading and unloading the silicon wafer to and from the carrier loaded on the silicon wafer double-side polishing equipment by using a second loading and unloading mechanism;
and loading a dresser for dressing an upper polishing pad and a lower polishing pad of the silicon wafer double-side polishing device to the silicon wafer double-side polishing device and unloading the dresser from the silicon wafer double-side polishing device by using a third loading and unloading mechanism.
In a third aspect, an embodiment of the present invention provides a silicon wafer double-side polishing apparatus, which includes the handling device according to the first aspect.
The embodiment of the invention provides a loading and unloading device, a loading and unloading method and silicon wafer double-side polishing equipment, and the loading and unloading of a silicon wafer, the loading and unloading of a carrier and the loading and unloading of a trimmer which are required by a silicon wafer double-side polishing process are completed without manual carrying by operators, and automation is realized, so that adverse effects caused by manual intervention can be effectively reduced, the production efficiency is improved, and the labor cost is reduced.
Drawings
FIG. 1 is a schematic view of a handling apparatus for a silicon wafer double-side polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a first handling mechanism of a handling device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a second handling mechanism of the handling device according to an embodiment of the invention;
FIG. 4 is a schematic view of a third handling mechanism of the handling device according to an embodiment of the present invention;
FIG. 5 is a schematic view of a catch assembly of a third attachment and detachment mechanism according to an embodiment of the present invention;
FIG. 6 is a schematic view of a loading and unloading method for a silicon wafer double-side polishing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a handling device 10 for a silicon wafer double-side polishing apparatus 1, wherein fig. 1 only shows a lower polishing pad 60, an inner gear ring 20, an outer gear ring 30, and a carrier 40 for carrying a silicon wafer W of the silicon wafer double-side polishing apparatus 1 for clarity, and does not show other components such as an upper polishing pad, an upper surface plate, and a lower surface plate which hold the carrier 40 and the silicon wafer W together with the lower polishing pad 60 to polish the silicon wafer W, the handling device 10 may include:
a first loading and unloading mechanism 100 for loading and unloading the carrier 40 to and from the silicon wafer double-side polishing apparatus 1, specifically, the carrier 40 may be loaded so as to be supported by the lower polishing pad 60 and interposed between the inner ring gear 20 and the outer ring gear 30;
a second loading and unloading mechanism 200 for loading and unloading the silicon wafer W to and from the carrier 40 loaded in the silicon wafer double-side polishing apparatus 1, specifically, a through hole 40H is formed in the carrier 40, and the silicon wafer W can be loaded in the through hole 40H;
a third loading and unloading mechanism 300, the third loading and unloading mechanism 300 being used for loading the dresser 50 dressing the lower polishing pad 60 of the silicon wafer double-side polishing apparatus 1 and the upper polishing pad not shown in the drawing to the silicon wafer double-side polishing apparatus 1 and unloading the dresser 50 from the silicon wafer double-side polishing apparatus 1, specifically, the dresser 50 may also be loaded so as to be supported by the lower polishing pad 60 and interposed between the inner ring gear 20 and the outer ring gear 30, except that the carrier 40 needs to be unloaded from the silicon wafer double-side polishing apparatus 1 in advance.
Thus, the loading and unloading of the silicon wafer W, the loading and unloading of the carrier 40 and the loading and unloading of the dresser 50 required by the silicon wafer double-side polishing process are completed without manual carrying by operators, and automation is realized, so that the adverse effect caused by human intervention can be effectively reduced, the production efficiency is improved, and the labor cost is reduced.
In a preferred embodiment of the present invention, and more particularly with reference to FIG. 2, the first loading and unloading mechanism 100 may include:
a carrier handling robot 110;
a suction assembly 120 disposed at an end of the carrier handling robot 110, the suction assembly 120 for vacuum sucking the carrier 40.
Since the surface of the carrier 40 is smooth like the surface of the silicon wafer W, the carrier 40 can be held and fixed by vacuum adsorption, so that the adsorption of the carrier 40 can be realized only by moving the adsorption assembly 120 toward the carrier 40, which is simple and easy.
In addition, as shown in fig. 2, the carriers 40 may be stored in a drawer-type carrier storage cabinet C1 having a heat retaining function, the drawer-type carrier storage cabinet C1 may have a plurality of carrier storage trays C1-T stacked on top of each other, each carrier storage tray C1-T being capable of being extended from and retracted into the cabinet, as specifically shown in fig. 2 as a carrier storage tray C1-T extended from the cabinet, at which time the first loading and unloading mechanism 100 may adsorb the carriers 40 stored on the carrier storage trays C1-T, as shown by a broken line in fig. 2 as a carrier loading and unloading robot arm 110 being in a position to adsorb the carriers 40.
Further preferably, referring to fig. 2, the adsorption assembly 120 may include three suction cups 121, and when the carrier 40 is adsorbed by the adsorption assembly 120, the three suction cups 121 may be uniformly distributed in a circumferential direction of the carrier 40. In this way, carrier 40 can be more stably held and fixed to adsorption element 120, and dropping of carrier 40 can be avoided.
Further preferably, referring to fig. 2, the first handling mechanism 100 may further include a positioning camera 130 disposed at an end of the carrier handling robot 110, the positioning camera 130 being used to determine a position of the carrier 40 sucked by the suction unit with respect to the silicon wafer double-side polishing apparatus 1 to load the carrier 40 at an appropriate position in the silicon wafer double-side polishing apparatus 1, so that it is possible to ensure that the carrier 40 is loaded correctly.
With respect to the handling of the wafers W, the second handling mechanism 200 may include a loading robot arm 210 for loading the wafers W to the carrier 40 and a discharging robot arm 220 for unloading the wafers W from the carrier 40, in a preferred embodiment of the present invention, referring to FIG. 1 and more particularly to FIG. 3, in consideration of the fact that the wafers W are in a state to be polished when loaded and the severity of the requirement of avoiding impurity contamination is low. Therefore, the silicon wafer W to be polished and the polished silicon wafer W are operated by different mechanical arms respectively, and the pressure meeting the requirements is reduced while the requirements of different pollution-proof severe grades are met.
In addition, as shown in fig. 3, the wafers W to be polished may be taken from the open wafer cassette WB, taking out of the wafers W from the open wafer cassette WB may be performed by the robot arm MA, and the polished wafers W may be stored in the open wafer cassette WB placed in the feed water tub GU.
In a preferred embodiment of the present invention, and referring more particularly to FIG. 4, the third attachment/detachment mechanism 300 may include:
a dresser-handling robot arm 310;
a catch assembly 320 provided at a tip end of the dresser-handling robot 310, the catch assembly 320 being configured to mechanically catch the dresser 50.
Since the dresser 50 is rough because the surface thereof is covered with abrasive grains such as diamond grains, the dresser 50 cannot be held and fixed by vacuum suction, and thus the holding and fixing are accomplished by mechanical snapping.
In addition, as shown in fig. 4, the finisher 50 may be stored in a drawer type finisher placing cabinet C2 having a heat retaining function, the drawer type finisher placing cabinet C2 may have a plurality of finisher placing disks C2-T stacked on each other, each of the finisher placing disks C2-T is capable of being extended from and retracted into the cabinet, as specifically shown in fig. 4, and at this time, the third handling mechanism 300 may catch the finisher 50 stored on the finisher placing disk C2-T, as shown by a broken line in fig. 4, the handling robot arm 310 in a position where the finisher 50 is being caught.
Further preferably, referring to fig. 5, the snap assembly 320 may include:
a rod body 321;
a latch 322 provided on the rod body 321, the latch 322 being configured to be able to shift between an unlocked state in which the latch 322 is retracted into the rod body 321 so that the rod body 321 can be inserted into the central hole 51 of the dresser 50, the latch 322 being shown in an unlocked state by broken lines in fig. 5, and a locked state in which the latch 322 protrudes radially from the rod body 321 to protrude into a hole wall groove 51R of the central hole 51, the latch 322 being shown in a locked state by solid lines in fig. 5. In addition, the transition between the unlocked state and the locked state of the latch 322 can be achieved in various known ways.
Referring to fig. 6 in combination with fig. 1, an embodiment of the present invention further provides a loading and unloading method for a silicon wafer double-side polishing apparatus 1, where the loading and unloading method may include:
s601: loading and unloading a carrier 40 to and from the silicon wafer double-side polishing apparatus 1 by using a first loading and unloading mechanism 100;
s602: loading and unloading the silicon wafer W to and from the carrier 40 loaded in the silicon wafer double-side polishing apparatus 1 by using the second loading and unloading mechanism 200;
s603: the dresser 50 dressing the upper and lower polishing pads 60 of the silicon wafer double-side polishing apparatus 1 is loaded to the silicon wafer double-side polishing apparatus 1 and the dresser 50 is unloaded from the silicon wafer double-side polishing apparatus 1 by a third loading and unloading mechanism 300.
Referring to fig. 1, an embodiment of the present invention further provides a silicon wafer double-side polishing apparatus 1, where the silicon wafer double-side polishing apparatus 1 may include a handling device 10 according to various embodiments of the present invention.
Preferably, referring to fig. 1, the silicon wafer double-side polishing apparatus 1 may further include:
a ring gear 20, the ring gear 20 having ring gear external teeth 20T;
an outer ring gear 30 disposed on the periphery of the inner ring gear 20, the outer ring gear 30 having outer ring gear inner teeth 30T;
a carrier 40 for carrying a silicon wafer W, wherein the carrier 40 is provided with carrier external teeth 40T, and the carrier external teeth 40T are used for being meshed with the inner gear ring external teeth 20T and the outer gear ring internal teeth 30T;
a dresser 50 for dressing a lower polishing pad 60 and an upper polishing pad not shown in the drawings, the dresser 50 having dresser external teeth 50T for meshing with the ring gear external teeth 20T and the outer ring gear internal teeth 30T.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A handling device for a silicon wafer double-side polishing apparatus, comprising:
a first loading and unloading mechanism for loading and unloading a carrier to and from the silicon wafer double-side polishing apparatus;
the second loading and unloading mechanism is used for loading and unloading the silicon wafer to and from the carrier loaded on the silicon wafer double-side polishing equipment;
and the third loading and unloading mechanism is used for loading a dresser for dressing an upper polishing pad and a lower polishing pad of the silicon wafer double-sided polishing equipment to the silicon wafer double-sided polishing equipment and unloading the dresser from the silicon wafer double-sided polishing equipment.
2. The handling device of claim 1, wherein the first handling mechanism comprises:
a carrier handling robot arm;
the adsorption component is arranged at the tail end of the carrier loading and unloading mechanical arm and used for vacuum adsorption of the carrier.
3. The handling device of claim 2, wherein the suction assembly includes three suction cups, and when the suction assembly is sucked with the carrier, the three suction cups are evenly distributed in a circumferential direction of the carrier.
4. The handling device as claimed in claim 2, wherein the first handling mechanism further comprises a positioning camera provided at an end of the carrier handling robot arm, the positioning camera being configured to determine a position of the carrier sucked by the suction unit with respect to the silicon wafer double-side polishing apparatus to load the carrier at a proper position in the silicon wafer double-side polishing apparatus.
5. The handling device according to claim 1, wherein the second handling mechanism comprises a loading robot for loading silicon wafers to the carrier and a unloading robot for unloading silicon wafers from the carrier.
6. The handling device of claim 1, wherein the third handling mechanism comprises:
the dresser loads and unloads the mechanical arm;
the buckle assembly is arranged at the tail end of the dresser assembling and disassembling mechanical arm and used for mechanically buckling the dresser.
7. The handling device of claim 6, wherein the snap assembly comprises:
a rod body;
a latch disposed on the rod body, the latch configured to be transitionable between an unlocked state in which the latch is retracted into the rod body so that the rod body is insertable into a central hole of the dresser, and a locked state in which the latch protrudes radially from the rod body to protrude into a hole wall groove of the central hole.
8. A loading and unloading method for a silicon wafer double-side polishing device is characterized by comprising the following steps:
loading and unloading a carrier to and from the silicon wafer double-side polishing device by using a first loading and unloading mechanism;
loading and unloading the silicon wafer to and from the carrier loaded on the silicon wafer double-side polishing equipment by using a second loading and unloading mechanism;
and loading a dresser for dressing an upper polishing pad and a lower polishing pad of the silicon wafer double-side polishing device to the silicon wafer double-side polishing device and unloading the dresser from the silicon wafer double-side polishing device by using a third loading and unloading mechanism.
9. A silicon wafer double-side polishing apparatus characterized by comprising the handling device according to any one of claims 1 to 7.
10. The silicon wafer double-side polishing apparatus as set forth in claim 9, further comprising:
an inner gear ring having inner gear ring external teeth;
the outer gear ring is arranged on the periphery of the inner gear ring and provided with outer gear ring inner teeth;
the carrier is used for bearing a silicon wafer and is provided with carrier external teeth, and the carrier external teeth are used for being meshed with the internal teeth of the inner gear ring and the internal teeth of the outer gear ring;
a dresser for dressing a polishing pad, the dresser having dresser external teeth for meshing with the inner ring gear external teeth and the outer ring gear internal teeth.
CN202211690624.1A 2022-12-27 2022-12-27 Loading and unloading device and method and silicon wafer double-side polishing equipment Pending CN115870868A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202211690624.1A CN115870868A (en) 2022-12-27 2022-12-27 Loading and unloading device and method and silicon wafer double-side polishing equipment
TW112105930A TWI839119B (en) 2022-12-27 2023-02-18 Loading and unloading device, method and silicon wafer double-sided polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211690624.1A CN115870868A (en) 2022-12-27 2022-12-27 Loading and unloading device and method and silicon wafer double-side polishing equipment

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