JP2002141318A - Method and device for polishing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device which can adopt a cluster structure, which integrates a plurality of functions, and has a means for handling a polishing object such as a clean semiconductor wafer and a means for handling a dirty polishing object separately, and to provide a polishing method. SOLUTION: In the polishing device after a polishing object S is carried in and polished, it is washed and a clean polishing object S is carried out. It has a load part 11 for mounting the polishing object S to be polished, at least one polishing part 13 for polishing the polishing object S carried from the load part 11, at least one washing part 15 for washing and drying the polished object S, an unload part 12 for mounting the clean and dried object S after being washed, and a carrying robot 10 for carrying the object S inside a device. The polishing part 13 has a plurality of turn tables, and polishing conditions differ in a plurality of turn tables.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and a polishing method, and more particularly to a polishing apparatus for carrying a polishing object such as a semiconductor wafer into a polishing section, polishing the object after polishing, and then cleaning the object by a cleaning section and carrying out a clean polishing object. Apparatus and method.

[0002]

2. Description of the Related Art In recent years, as the degree of integration of semiconductor devices has increased, circuit wiring has become finer, and the distance between wirings has become smaller. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the image plane of the stepper needs to be flat. Therefore, it is necessary to planarize the surface of the semiconductor wafer. As one of the planarization methods, polishing is performed by a polishing apparatus.

Many conventional polishing apparatuses only perform polishing alone. Therefore, when performing post-polishing cleaning, transportation from the polishing apparatus to the cleaning apparatus was necessary, and when performing polishing again under different polishing conditions, transportation from the polishing apparatus to another polishing apparatus was required. . These transfers have been performed manually in water storage to prevent drying of the wafers during the transfer.
However, each device is provided independently like this,
In addition, since the transportation is performed underwater during the storage, there is a problem that it is difficult to install a polishing apparatus, a cleaning apparatus, and the like in a clean room, and it is difficult to fully automate the process.

In order to solve these problems, a polishing apparatus in which a polishing section and a cleaning section are housed in the same package has been developed. Further, if necessary, there is a possibility that a polishing apparatus in which a plurality of polishing units are housed in the same package.

[0005]

As described above, in a polishing apparatus in which a polishing section and a cleaning section are integrated, and in a polishing apparatus in which a plurality of polishing sections are housed in the same package, etc. In order to increase the processing speed as a whole, as has been conventionally adopted in semiconductor manufacturing processes other than the polishing apparatus, for example, in an apparatus for etching or chemical vapor deposition (CVD),
It is conceivable to unitize each function and use a general-purpose transfer robot, that is, adopt a so-called cluster structure.

However, in the case where a cluster structure is employed in the polishing apparatus as described above, that is, when a unit is provided for each function and the transfer is performed by a general-purpose transfer robot, the polishing apparatus uses a semiconductor wafer after polishing. Is in a dirty and wet state due to abrasive liquid or polishing debris, etc., while it is in a clean and dry state in the load and unload sections, etc., to transport and handle semiconductor wafers in different states. Become. Therefore, a single robot and an arm like the robots in the cluster structure of other conventional semiconductor manufacturing process equipment, or a robot that is not used properly for dirty and clean because there are only a plurality of robots because of the need only for the reach or arrangement. In addition, the robot and the arm cannot perform sufficient transport and handling in the polishing apparatus, and if they are to be used as they are, cleaning and drying processes for the robot and the arm must be added as necessary, and the processing capacity is increased. There is a possibility that problems such as a decrease in the temperature will occur.

Further, when a robot or an arm after handling a dirty semiconductor wafer in a polishing apparatus is left for a long time as it is, solids such as abrasive grains and polishing debris in the polishing slurry are dried and fixed. This may cause reverse contamination of the semiconductor wafer during the next polishing and contamination in the polishing apparatus.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and can employ a cluster structure integrating a plurality of functions, as well as means for handling a polishing object such as a clean semiconductor wafer and dirty polishing. An object of the present invention is to provide a polishing apparatus and a polishing method which individually have means for handling an object.

[0009]

In order to achieve the above-mentioned object, a polishing apparatus according to the present invention is a polishing apparatus which carries in a polishing object, polishes the object after polishing, and carries out a clean polishing object. A loading unit for placing a polishing object to be polished, at least one polishing unit for polishing the polishing object transported from the loading unit, and at least one washing and drying the polished polishing object A cleaning unit, an unloading unit for placing a clean and dried polishing target after cleaning, and a transfer robot for transferring the polishing target in the apparatus, the polishing unit includes a plurality of turntables, The polishing conditions for a plurality of turntables are different.

One embodiment of the polishing method according to the present invention is a polishing method for polishing an object to be polished and then cleaning the object. The polishing apparatus is installed in a clean room by covering a polishing apparatus with a cover, and the object to be polished is polished from within the clean room. A step of loading the object into the apparatus, a polishing step of polishing the object to be polished, a step of washing and drying the object to be polished after polishing, and a step of carrying a clean object to be cleaned and dried from the polishing apparatus into a clean room. Wherein the polishing step is polishing on a turntable having a plurality of different polishing conditions. Here, the plurality of polishing conditions are set in advance. The plurality of polishing conditions are selected according to the properties of the object to be polished.

Another aspect of the polishing method of the present invention is as follows.
A polishing method for cleaning after polishing an object to be polished, wherein the polishing apparatus is installed in a clean room by covering the polishing apparatus with a cover, and a step of carrying the object to be polished into the polishing apparatus from within the clean room, and polishing the object to be polished. Polishing step, and a step of washing and drying the object to be polished after polishing,
Transporting a clean object to be cleaned and dried from the polishing apparatus into a clean room, wherein the polishing step is polishing with a plurality of polishing cloths having different polishing conditions. Here, the plurality of polishing conditions are set in advance. The plurality of polishing conditions are selected according to the properties of the object to be polished.

Still another aspect of the polishing method according to the present invention is a polishing method for cleaning after polishing an object to be polished, wherein the object is picked up by a robot from a load portion on which the object to be polished is mounted and inverted, and then polished. The polishing object is transferred to a load position of the unit, and the object to be polished is sucked by the top ring from the load position, the object to be polished is pressed against the upper surface of the table, and the surface of the object to be polished is polished. Here, the robot holds an object to be polished by vacuum suction. The object to be polished is a semiconductor wafer. Further, there are a plurality of the polishing units. Further, the object to be polished is cleaned during polishing in the plurality of polishing units. In addition, the polishing target is placed on an unloading unit for placing the polishing target, which has been polished, after being cleaned in a cleaning unit after polishing. After polishing the object to be polished, the polishing cloth on the turntable is dressed by a dressing mechanism. Here, the dressing mechanism is a brush.

A preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, cleans the object after polishing it, and carries out a clean polishing object. The polishing apparatus includes a gripping arm and holds the object in the polishing apparatus. A general-purpose transfer robot that conveys and transfers to each unit, and a load unit that is disposed around the general-purpose transfer robot and places an object to be polished to be polished,
At least one polishing unit for polishing the object to be polished carried in from the load unit, at least one cleaning unit for cleaning the object to be polished after polishing, and an unload for placing a clean object to be cleaned after cleaning Unit, and a dedicated transfer mechanism for transferring and transferring the object to be polished between two adjacent parts, the general-purpose transfer robot transfers a clean object to be polished, and the dedicated transfer mechanism is a dirty object to be polished. It is characterized by conveying objects.

Further, a preferred embodiment of the present invention is a polishing apparatus for carrying in an object to be polished, polishing the object after polishing it, and carrying out a clean object to be polished,
A general-purpose transport robot that has a gripping arm and transports the object to be polished in the polishing apparatus and transfers it to each unit;
A loading section disposed around the general-purpose transfer robot and on which a polishing target to be polished is placed, at least one polishing section for polishing the polishing target carried in from the loading section, and after polishing At least one cleaning unit for cleaning the object to be polished, and an unloading unit for mounting a clean object to be cleaned after cleaning, wherein the general-purpose transfer robot conveys only the clean object to be polished And a gripping arm for conveying only a dirty polishing object.

Further, a preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, cleans the object after polishing it, and carries out a clean object to be polished. A general-purpose transfer robot that conveys an object and transfers it to each unit, a load unit that is disposed around the general-purpose transfer robot and places an object to be polished to be polished, and polishing that is carried in from the load unit At least one polishing unit for polishing the object, at least one cleaning unit for cleaning the polished object after polishing,
An unloading section for placing a clean object to be polished after cleaning, two general-purpose transfer robots are installed, and one of the general-purpose transfer robots transfers only the clean object to be polished, and the other The transport robot transports only dirty polishing objects.

According to the present invention, the loading section, the unloading section, the polishing section, and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the load unit is picked by one general-purpose transfer robot, loaded onto the polishing unit, and then polished by the polishing unit. The dirty object to be polished, which has been polished, is transferred to the cleaning section by a dedicated transport mechanism provided between the polishing section and the cleaning section, and the cleaning section performs cleaning. After the cleaning and drying, the clean object to be polished is placed on the unloading section again by the general-purpose transfer robot.

Further, according to the present invention, the loading section, the unloading section, the polishing section, and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the load unit is picked by a clean dedicated gripping arm of a general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished, which has been polished, is transferred to the cleaning unit by the dirty dedicated gripping arm of the general-purpose transfer robot, and the cleaning unit performs cleaning. After the cleaning and drying, the clean object to be polished is placed on the unloading section again by the clean dedicated gripping arm of the general-purpose transfer robot.

According to the present invention, the loading section, the unloading section, the polishing section, and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the load unit is picked by a general-purpose transfer robot dedicated to clean, loaded onto the polishing unit, and then polished by the polishing unit. The dirty object to be polished, which has been polished, is transferred to the cleaning unit by a general-purpose transfer robot dedicated to dirty, and is cleaned in the cleaning unit. After cleaning and drying, the clean semiconductor wafer is placed on the unloading section again by the general-purpose transfer robot dedicated to cleaning.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a polishing apparatus according to the present invention will be described below with reference to the drawings. In the following embodiments, a semiconductor wafer will be described as an example of an object to be polished. FIG. 1 shows a first embodiment of a polishing apparatus according to the present invention.
It is a figure showing composition of an example. This polishing machine
A center robot 10 constituting a general-purpose transfer robot is provided at the center, and an arm 10 is provided around the center robot 10.
A loading unit 11 for mounting a semiconductor wafer S requiring polishing, an unloading unit 12 for mounting a semiconductor wafer that has been polished, polishing units 13 and 14 for polishing the semiconductor wafer S, A cleaning unit 15 for cleaning the semiconductor wafer S is provided.

The polishing units 13 and 14 have polishing head support arms 13-3 and 14-3 and turntables 13-4 and 14-4, respectively. A ring (described later) is rotatably provided. The polishing head support arms 13-3 and 14-3 respectively load the semiconductor wafer S into the load positions 13-1 and 14-1 of the respective polishing units.
, And a dedicated transport mechanism for transporting the paper onto the turntables 13-4 and 14-4. The polishing head support arms 13-3 and 14-3 are respectively connected to the semiconductor wafer S
A dedicated transfer mechanism for transferring the wafers from the polishing units 13 and 14 to the cleaning unit 15 is configured. In addition, 16 and 17 are polishing parts 13 and 14.
This is a dressing tool mounting table for mounting a dressing tool (brush-shaped tool) for dressing (placing) a polishing cloth (cloth) attached to the turntables 13-4 and 14-4.

In the polishing apparatus arranged as described above, the semiconductor wafer S, which needs to be polished, mounted on the load section 11 is picked (vacuum suction) by the loading gripping arm 10-1 of the center robot 10.
Then, after being polished so that the polished surface faces downward, the polished portion 13 is transferred to the load position 13-1. The polishing head support arm 13-3 of the polishing section 13 chucks (adsorbs) the semiconductor wafer S by a top ring provided at the tip thereof, and rotates the polishing surface of the semiconductor wafer S on the upper surface of the table 13-4. To polish the surface of the semiconductor wafer S. At this time, the top ring itself rotates around its axis and swings on the turntable 13-4 by the polishing head support arm 13-3.

The semiconductor wafer S that has been polished is transferred to the loading position 15-1 of the cleaning unit 15 by the polishing head support arm 13-3. The polishing head support arm 13-3 having released the semiconductor wafer S at the loading position 15-1 chucks the dressing tool 16-1 on the dressing tool mounting table 16, and pushes the dressing tool 16-1 on the turntable 13-4. Dress dressing cloth. However, this dressing may be provided with a dedicated dressing mechanism as described later (see FIGS. 2 and 3).

The semiconductor wafer S transferred to the load position 14-1 of the polishing section 14 by the loading arm 10-1 of the center robot 10 is also chucked by the top ring of the polishing head support arm 14-3 and rotated. And is polished against the upper surface of the turntable 14-4. The polished semiconductor wafer S is placed at the loading position 15-2 of the cleaning unit 15.
Is transferred to The polishing head supporting arm 1 which releases the semiconductor wafer S at the loading position 15-2.
4-3, the dressing tool 17-1 is chucked by the dressing tool mounting table 17, and the turntable 1 is turned on.
The dressing tool 17-1 is pressed against 4-4 to dress the polishing cloth (cloth).

The loading positions 15-1 and 15-1,
The semiconductor wafer S transferred to 15-2 is subjected to primary cleaning and secondary cleaning in the cleaning unit 15, and then transferred to the unloading position 15-3. Unloading position 15-3
Wafer S transferred to the central robot 10
Is transferred to the unloading section 12 by the unloading dedicated gripping arm 10-2. All of the above operations are performed automatically. Hereinafter, details of the polishing unit 14 and the cleaning unit 15 will be described.

FIG. 2A is a partial plan view showing the configuration of the polishing apparatus of the present invention, FIG. 2B is a view showing the upper part of the cleaning mechanism 15, and FIG. 3 is a view showing A1 in FIG. 2A. FIG. 4 is a diagram showing a B1-B2 cross section of FIG. 2A, FIG. 5 is a diagram showing a C1-C2-C3-D1 cross section of FIG. 2A, and FIG. It is a figure which shows the D1-D2 cross section of (a). FIGS. 2 to 6 are views for explaining the first embodiment as in FIG. 1. In FIGS. 2 to 6, a dressing mechanism and a dressing mechanism 15-11 are separately provided without providing a dressing tool and a dressing tool mounting table. Shows the case where The semiconductor wafer S placed on the load unit 11 is picked by the arm 10-1 of the center robot 10, and is inverted by the reversing mechanism 11-2 so that the polished surface faces downward. 14 road positions 14-
Transferred to 1. As shown in FIG.
Is chucked (vacuum adsorbed) by a top ring 14-5 provided at the tip of the polishing head support arm 14-3, and is conveyed above the turntable 14-4.

At this time, the top ring 14-5 descends, and as shown in FIG. 4, the turntable 14 is rotated by the motor 14-6 via the timing belt 14-7.
-4, the semiconductor wafer S is pressed against the upper surface and polished. As shown in FIG. 5, the semiconductor wafer S that has been polished is placed at the loading position 15-2 of the cleaning unit 15.
Is stored in the rinse washing container 15-4 which is waiting at the opening of the container, and is rinsed with the rinse water. At the time of this rinsing cleaning, the opening at the loading position 15-2 is the lid 1
It is closed at 5-5. The top ring 14-5 having released the semiconductor wafer S is cleaned by a cleaning mechanism (not shown) at the loading position of the cleaning unit 15.

The rinse-washed semiconductor wafer S is transported as shown by the arrow a in FIG. 5 and reaches the reversing mechanism 15-6. Here, the surface polished by the positioning reversing mechanism 15-6 is suction-reversed so as to face up again, and is transferred to the primary cleaning station 15-7, where it is primarily cleaned with cleaning water (pure water). Subsequently, the semiconductor wafer S is picked up by the transfer robot 15-8 (see FIG. 6), transferred as indicated by arrows b and c, and reaches the secondary cleaning station 15-9. The semiconductor wafer S is secondarily cleaned with cleaning water (pure water) at the second cleaning station 15-9.

The semiconductor wafer S having been subjected to the secondary cleaning is picked up by the unloading arm 10-2 of the center robot 10 and transferred as shown by arrows d and e in FIG.
It is placed on the unloading section 12 shown in FIG. Note that 15
-11 is a dressing mechanism for dressing the polishing cloth (cloth) on the upper surface of the turntable 14-4,
As shown in FIG. 3, a rotating brush 15-12 is provided. The polishing units 13 and 14 having the configuration shown in FIGS.
The configuration of the cleaning unit is an example, and is not limited to this.

The polishing apparatus according to the present embodiment includes a center robot 10 having gripping arms 10-1 and 10-2 and constituting a general-purpose transfer robot for transferring a semiconductor wafer S within the polishing apparatus and transferring it to each unit. A load unit 11 disposed around the robot 10 for mounting a semiconductor wafer S to be polished, two polishing units 13 and 14 for polishing the semiconductor wafer S loaded from the load unit 11, A cleaning unit 15 for cleaning the semiconductor wafer S after cleaning, an unloading unit 12 for mounting the clean semiconductor wafer S after cleaning, and a dedicated transfer mechanism for transferring and transferring the semiconductor wafer S between two adjacent units. The center robot 10 transports a clean and dry semiconductor wafer S. , Polishing head support arm 1
Reference numerals 3-3 and 14-3 are configured to transfer a dirty and wet semiconductor wafer S.

The center robot 10 of this embodiment includes a load-only arm 10-1 and an unload-only arm 10-2.
This is suitably applied when the cleanliness of the semiconductor wafer S carried in from the load unit 11 and the cleanliness of the semiconductor wafer S carried out to the unload unit 12 are different.

(Second Embodiment) FIG. 7 is a view showing the configuration of a polishing apparatus according to a second embodiment of the present invention. In the figure, the parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts. This polishing apparatus includes a load section 11, an unload section 12, polishing sections 13, 14 and a cleaning section 15 for cleaning / drying in a hexagonal shape around the center robot 10 and in the reach of the arm of the center robot 10. In anticipation of the necessity of further steps to be provided, spare spaces 18 and 19 where mechanisms and devices for performing those steps are arranged.
It has.

In the spare spaces 18 and 19, for example, a thickness gauge for measuring the thickness of the semiconductor wafer is arranged. In this case, the semiconductor wafer S is transferred to the center robot 10.
Of the semiconductor wafer S before polishing is measured by the arm 10-1, and the thickness of the semiconductor wafer S before polishing is measured. Transfer. The semiconductor wafer S polished by the polishing unit 13 is cleaned in the same manner as in the first embodiment.
After being transferred to 5 and washed there, the arm 10-1 of the center robot 10 is guided again to the thickness gauge in the spare space 18. After the thickness of the polished semiconductor wafer S is measured by the thickness gauge, the semiconductor wafer is transferred to the unloading section 12 by the arm 10-2.

(Third Embodiment) FIG. 8 is a view showing the configuration of a polishing apparatus according to a third embodiment of the present invention. The present polishing apparatus includes a load section 11, an unload section 12, and two polishing sections 13, 1 in a hexagonal shape around the center robot 10 and in the reach of the arm of the center robot 10.
3 and one polishing unit 14, cleaning units 15 and 15 are provided between the polishing unit 13 and the polishing unit 13 and between the polishing unit 14 and the unloading unit 12. In this arrangement, the polishing process of the polishing unit 13 is the same as the polishing process of the polishing unit 14.
This arrangement is suitable when double the time is required.

The transfer from the polishing units 13, 13 to the cleaning unit 15 and the transfer from the polishing unit 14 to the cleaning unit 15 are not performed by the center robot 10, but are performed by another transfer means (for example, polishing head support arms 13-3, 14-). 3), the loading of the semiconductor wafer into the polishing units 13, 13, 14 and the pick-up of the cleaned semiconductor wafer from the cleaning units 15, 15 are performed by the gripping arm of the center robot 10. That is, the center robot 10 does not handle the semiconductor wafer to which the slurry has adhered by the polishing in the polishing units 13, 13, and 14 so that the gripping arm is not contaminated. This makes it possible to reduce contamination.

(Fourth Embodiment) FIG. 9 is a view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention. The polishing apparatus in the case where the center robot 10 has only one gripping arm 10-1 is shown. It is a figure showing a schematic structure. FIG.
In FIG. 7, the portions denoted by the same reference numerals as those in FIGS. When only one gripping arm 10-1 is provided in this way, as shown in the figure, dedicated transfer mechanisms are provided between the polishing units 13 and 14, and between the polishing units 13, 14 and the cleaning unit 15, respectively. The present invention can be applied when the cleanliness of the semiconductor wafer S picked from the load unit 11 and the cleanliness of the semiconductor wafer S stored in the unload unit 12 are at the same level.

(Fifth Embodiment) FIG. 10 is a diagram showing the configuration of a polishing apparatus according to a fifth embodiment of the present invention. The present polishing apparatus has a load section 11, four polishing sections 13, 14, 21, and 2 in a hexagonal shape around the center robot 10 and within the reach of the gripping arm of the center robot 10.
2. The cleaning unit 15 is provided, and the unloading unit 12 is provided at an end of the cleaning unit 15. Further, the polishing apparatus is provided with a stocker 23 adjacent to the loading unit 11 and the unloading unit 12 for storing semiconductor wafers requiring polishing and semiconductor wafers having been subjected to polishing. The unpolished semiconductor wafer is unloaded from the stocker 23, or the stocker 23
An automatic transfer vehicle 24 is installed to carry in a semiconductor wafer requiring polishing.

Here, the polishing units 13, 14, 21, 22
The loading to the cleaning unit 15 and the picking from the loading unit 11 and the polishing units 13, 14, 21, 22 are all performed by the center robot 10. The center robot 10 includes a clean dedicated arm for holding the clean semiconductor wafer S and a dirty dedicated arm for holding the dirty semiconductor wafer S. 2
Transporting to any one of 1 and 22, and cleaning in the cleaning unit 15,
The transfer of the dried semiconductor wafer S to the unloading section 12 is performed by the clean dedicated arm, and the polishing sections 13, 14, and 14.
The transfer between 21 and 22 and the transfer from the polishing section to the cleaning section 15 are performed by a dirty dedicated arm. For example, when the center robot of FIG. 1 is used, the arm 10-1 is an arm dedicated to clean and the arm 10-2 is an arm dedicated to dirty. This makes it possible to minimize contamination.

The polishing apparatus of the present embodiment includes a center robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring a semiconductor wafer S within the polishing apparatus and transferring it to various parts. A loading unit 11 arranged around the robot 10 for mounting a semiconductor wafer S to be polished and a polishing unit 1 for polishing the semiconductor wafer S loaded from the loading unit 11
3, 14, 21 and 22, a cleaning unit 15 for cleaning the polished semiconductor wafer S, and an unloading unit 12 for placing the cleaned semiconductor wafer S thereon. It has a clean dedicated arm 10-1 for transferring only the wafer S and a dirty dedicated arm 10-2 for transferring only the dirty semiconductor wafer S.

The dirty dedicated arm 10-2 is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling the dirty semiconductor wafer.

(Sixth Embodiment) FIG. 11 is a view showing a configuration of a polishing apparatus according to a sixth embodiment of the present invention. In this embodiment, a general-purpose transfer robot 10A dedicated to a clean semiconductor wafer and a general-purpose transfer robot 10B dedicated to a dirty semiconductor wafer are separately provided. In this embodiment, two polishing units 13 and 14 and one cleaning unit 15 are provided. The specific polishing procedure is as follows. First, the general-purpose transfer robot 10A dedicated to a clean semiconductor wafer receives the semiconductor wafer S to be polished from the load unit 11 and conveys it.
Place on 1.

After the polishing by the polishing section 13 is completed, the general-purpose transfer robot 10B dedicated to dirty semiconductor wafers receives the semiconductor wafer S, transfers it, and places it at the loading position 15-1 of the cleaning section 15. After the cleaning in the cleaning unit 15 is completed, the general-purpose transfer robot 10 </ b> A dedicated to the clean semiconductor wafer is moved to the unloading position 15-of the cleaning unit 15.
The semiconductor wafer S is received from 3, transported, and placed on the unload unit 12. Through the above steps, a series of polishing and cleaning are performed. When polishing is performed in the polishing section 14, polishing and cleaning are performed in the same process.

According to the polishing apparatus shown in this embodiment, polishing is performed in both polishing units 13 and 14, and the semiconductor wafer polished in either polishing unit is cleaned in the cleaning unit 15. One polishing section can be used for one polishing section. In particular, when the processing interval of the semiconductor wafer in the cleaning unit, that is, the interval between the start of a cleaning step for one wafer and the start of the cleaning step for the next wafer is shorter than the polishing time of one semiconductor wafer, the cleaning is performed. Since there is no waiting time in the polishing process due to the restriction of the process, the process can be made compact without reducing the processing speed, which is extremely effective.

Further, it is possible to set different polishing conditions in the polishing units 13 and 14 and select a more suitable polishing unit according to the properties of the wafer to be polished. Further, the same semiconductor wafer is polished by the polishing unit 13 and cleaned by the cleaning unit 15, and then the polishing unit 14 is polished.
It is also possible to carry out polishing twice for one semiconductor wafer by performing polishing in the cleaning section 15. Reference numerals 18 and 19 are spare spaces.

The polishing apparatus according to the present embodiment transports a semiconductor wafer within the polishing apparatus and transfers it to each unit.
Two general-purpose transfer robots 10A and 10B, two polishing units 13 and 14 arranged around the general-purpose transfer robots 10A and 10B and polishing the semiconductor wafer S to be polished, and the polished semiconductor wafer A cleaning unit 15 for cleaning S and an unloading unit 12 for mounting a clean semiconductor wafer S after cleaning are provided. And one of the two general-purpose transfer robots 10A
Transports only the clean semiconductor wafer S, and the other general-purpose transport robot 10B transports only the dirty semiconductor wafer S. The general-purpose transfer robot 10B is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling the dirty semiconductor wafer.

By constructing a polishing apparatus as shown in the first to sixth embodiments, a plurality of polishing units and cleaning units for performing mechanical and chemical polishing of semiconductor wafers in various processes are provided around the center robot. To place
Since the entire device can be made compact, for example, by covering the entire device with a cover or the like and independently providing exhaust, even if it is directly disposed in a clean room, the cleanness is not reduced, and the installation space in an expensive clean room is small. it can.

In the above embodiment, the loading unit 11 and the unloading unit 12 are arranged separately. However, the loading unit 11 and the unloading unit 12 may be configured integrally. For example, in the case where semiconductor wafers are picked from a basket containing semiconductor wafers requiring polishing and are stored in the same basket after polishing is completed (after the polishing and cleaning steps are completed), an integrated configuration is adopted.

[0047]

As described above, according to the present invention, a polishing apparatus having a cluster structure using a general-purpose transfer robot can be constructed by unitizing each function such as polishing and cleaning. From this, it is possible to achieve a space saving and an improvement in processing speed in a polishing apparatus that performs a series of polishing including a cleaning step, and to efficiently combine each device such as a polishing unit and a cleaning unit, that is, a polishing time. If the cleaning interval is longer than the cleaning interval, a single cleaning unit corresponds to a plurality of polishing units. If the polishing time is shorter than the cleaning processing interval, the cleaning unit must handle more polishing units. And the like, and one or more polishing steps and cleaning steps can be fully automated, and the process can be easily changed.

Further, according to the present invention, since there is provided means for individually handling a clean polishing object and a dirty polishing object, contamination of another polishing object due to the dirty polishing object and a polishing apparatus are provided. Inside can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing the configuration of a first embodiment of a polishing apparatus according to the present invention.

FIG. 2A is a partial plan view illustrating a configuration of a polishing apparatus according to the present invention, and FIG. 2B is a diagram illustrating an upper portion of a cleaning mechanism 15.

FIG. 3 is a diagram showing a cross section taken along line A1-A2 of FIG.

FIG. 4 is a view showing a B1-B2 cross section of FIG.

FIG. 5 is a view showing a cross section taken along line C1-C2-C3-D1 of FIG.

FIG. 6 is a diagram showing a cross section taken along line D1-D2 of FIG.

FIG. 7 is a schematic plan view showing the configuration of a polishing apparatus according to a second embodiment of the present invention.

FIG. 8 is a schematic plan view showing the configuration of a third embodiment of the polishing apparatus of the present invention.

FIG. 9 is a schematic plan view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention.

FIG. 10 is a schematic plan view showing a configuration of a polishing apparatus according to a fifth embodiment of the present invention.

FIG. 11 is a schematic plan view showing a configuration of a polishing apparatus according to a sixth embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 center robot 11 loading unit 12 unloading unit 13 polishing unit 14 polishing unit 15 cleaning unit 16 dressing tool mounting table 17 dressing tool mounting table 18 spare space 19 spare space 21 polishing unit 22 polishing unit 23 stocker 24 automatic carrier S semiconductor wafer

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B24B 37/04 B24B 37/04 Z (72) Inventor Riichiro Aoki 72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Inside the Toshiba Horikawa-cho Plant (72) Inventor Yajima Hiromi 72 Horikawa-cho, Kochi-ku, Kawasaki City, Kanagawa Prefecture Inside the Toshiba Horikawa-cho Plant (72) Inventor Masako Kodera 72 Horikawa-cho, Sachi-ku, Kawasaki City, Kanagawa Prefecture Inside the Toshiba Horikawacho Plant (72) Inventor Shiro Mishima 72 at Horikawacho, Saiwai-ku, Kawasaki-shi, Kanagawa Prefecture Inside the Toshiba Horikawacho Plant (72) Inventor Atsushi Shigeta 72, Horikawacho, Sachi-ku, Kawasaki-shi, Kanagawa Prefecture Toshiba Horikawacho Plant (72) Inventor Masayoshi Hirose 11-1 Haneda Asahimachi, Ota-ku, Tokyo Ebara Corporation (72) Inventor Norio Kimura Tokyo Univ. Subdivision Hanedaasahi Town, 11th in the No. 1 Ebara Corporation (72) inventor Seiji Ishikawa Ota-ku, Tokyo Hanedaasahi-cho, No. 11 No. 1 Ebara Corporation in the F-term (reference) 3C058 AA07 AB01 AB03 AB06 AB08 CB03 DA17

Claims (15)

[Claims] 1. A polishing apparatus for carrying in a polishing object, polishing and cleaning the object after carrying in the polishing object, and carrying out a clean polishing object, comprising: a load section for mounting a polishing object to be polished; At least one polishing section for polishing the object to be polished transferred from the polishing apparatus; at least one cleaning section for cleaning and drying the object to be polished after polishing; A polishing apparatus, comprising: a load unit; and a transfer robot that transfers an object to be polished in the apparatus. The polishing unit includes a plurality of turntables, and polishing conditions in the plurality of turntables are different. 2. A polishing method for cleaning after polishing an object to be polished, wherein the polishing apparatus is set in a clean room by covering the polishing apparatus with a cover, and the polishing object is carried into the polishing apparatus from within the clean room. A polishing step of polishing the object to be polished; a step of washing and drying the object to be polished after polishing; and a step of carrying out the cleaned and dried object to be cleaned from the polishing apparatus into a clean room. The polishing method is characterized in that the step is polishing with a turntable having a plurality of different polishing conditions. 3. The polishing method according to claim 2, wherein said plurality of polishing conditions are set in advance. 4. The polishing method according to claim 2, wherein said plurality of polishing conditions are selected according to the properties of an object to be polished. 5. A polishing method for cleaning after polishing an object to be polished, wherein the polishing object is placed in a clean room by covering the polishing device with a cover, and the polishing object is carried into the polishing device from the clean room. A polishing step of polishing the object to be polished; a step of washing and drying the object to be polished after polishing; and a step of carrying out the cleaned and dried object to be cleaned from the polishing apparatus into a clean room. The polishing method is characterized in that the step is polishing with a plurality of polishing cloths having different polishing conditions. 6. The polishing method according to claim 5, wherein said plurality of polishing conditions are set in advance. 7. The polishing method according to claim 5, wherein said plurality of polishing conditions are selected according to the properties of an object to be polished. 8. A polishing method for cleaning after polishing an object to be polished, wherein the object is picked up and inverted by a robot from a load section on which the object to be polished is placed, and then transferred to a load position of the polishing section. A polishing method, wherein an object to be polished is sucked by a top ring from a position, the object to be polished is pressed against the upper surface of a table, and the surface of the object to be polished is polished. 9. The polishing method according to claim 8, wherein the robot holds the object to be polished by vacuum suction. 10. The polishing method according to claim 8, wherein the object to be polished is a semiconductor wafer. 11. The polishing method according to claim 8, wherein a plurality of said polishing units are provided. 12. The polishing object is cleaned during polishing in the plurality of polishing units.
2. The polishing method according to 1. 13. The polishing object, after being polished, cleaned in a cleaning unit, and then placed on an unloading unit for placing the polished polishing object. Item 10. The polishing method according to Item 8. 14. The polishing method according to claim 8, wherein after polishing the object to be polished, the polishing cloth on the turntable is dressed by a dressing mechanism. 15. The polishing method according to claim 14, wherein said dressing mechanism is a brush.