JP3420849B2 - Polishing apparatus and method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus, and more particularly, to a polishing apparatus which carries a polishing object such as a semiconductor wafer into a polishing section, polishes it and then cleans it in a cleaning section, and carries out a clean polishing object. Regarding the method.

[0002]

2. Description of the Related Art In recent years, as the degree of integration of semiconductor devices has increased, circuit wiring has become finer and the distance between wirings has become smaller. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the flatness of the image plane of the stepper is required. Therefore, it is necessary to flatten the surface of the semiconductor wafer. As one means of this flattening method, polishing is performed by a polishing device.

Most of conventional polishing apparatuses perform only polishing alone. Therefore, when cleaning is performed after polishing, it is necessary to transfer it from the polishing device to the cleaning device, and when polishing is performed again under different polishing conditions, it is necessary to transfer it from the polishing device to another polishing device. . These transportations have been performed manually by keeping them in water to prevent the wafers from being dried during the transportation.
However, in this way each device is provided independently,
Further, since the transportation during that time is carried out in water, there is a problem that it is difficult to install a polishing device, a cleaning device and the like in a clean room and to fully automate the process.

In order to solve these problems, a polishing apparatus has been developed in which the polishing section and the cleaning section are housed in the same package. In addition, there is a possibility that a plurality of polishing sections may be housed in the same package, if necessary.

[0005]

As described above, in the polishing apparatus in which the polishing section and the cleaning section are integrated, and the polishing apparatus in which a plurality of polishing sections are housed in the same package, the polishing apparatus is In order to increase the processing speed as a whole, as is conventionally adopted in semiconductor manufacturing processes other than polishing equipment, for example, etching and chemical vapor deposition (CVD) equipment,
It is conceivable to unitize each function and use a general-purpose transfer robot, that is, to adopt a so-called cluster structure.

However, when the cluster structure is adopted in the polishing apparatus as described above, that is, when each function is unitized and is transferred by a general-purpose transfer robot, the polishing apparatus uses the polished semiconductor wafer. Is in a dirty and wet state due to abrasive liquid or polishing debris, etc., while the loading section and the unloading section are in a clean and dry state, so it is necessary to transfer and handle semiconductor wafers in different states. Become. Therefore, a single robot and an arm like a robot in a cluster structure of another conventional semiconductor manufacturing process apparatus, or a robot in which there are only a plurality of robots and dirty and clean are not used properly because only the reach and arrangement are necessary. With the arm and arm, sufficient transport and handling in the polishing device cannot be performed, and if it is applied as it is, the cleaning and drying steps of the robot and arm must be added as necessary, and the processing capacity is increased. There is a possibility that problems such as decrease in

Further, when the robot or arm after handling a dirty semiconductor wafer in the polishing apparatus is left as it is for a long time, solid particles such as abrasive grains and polishing debris in the polishing slurry are dried and fixed, This may cause reverse contamination of the semiconductor wafer at the next polishing and contamination in the polishing apparatus.

The present invention has been made in view of the above circumstances, and can adopt a cluster structure in which a plurality of functions are integrated, and a means for handling a polishing object such as a clean semiconductor wafer and a dirty polishing. It is an object of the present invention to provide a polishing apparatus which has a means for handling an object and a polishing apparatus, respectively.

[0009]

In order to achieve the above-mentioned object, one embodiment of a polishing apparatus of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. And then;
A robot having a gripping arm for transporting a polishing target object in the polishing device; a load part for mounting a polishing target object to be polished, the load part being located within the reach of the gripping arm of the robot And; at least one polishing unit for polishing the polishing target conveyed from the load unit; at least one cleaning unit for cleaning and drying the polishing target after polishing; clean and dry polishing target after cleaning An unloading unit for mounting the unloading unit placed on the reach of the gripping arm of the robot; the robot picks a polishing object to be polished from the loading unit, and the polishing to unloading unit, washing and transportable der Ri a polishing object drying is completed; adjacent Polishing between the two parts that
Equipped with a transport mechanism that transports and transfers objects;
The transport mechanism that transports the polishing target
A cleaning mechanism for cleaning was provided . One aspect of the polishing method of the present invention is a polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out from the polishing apparatus; A placing step of loading the polishing object into a polishing apparatus and placing the polishing object on which polishing is to be performed; a polishing object placed on the loading part from the loading section, and a polishing object And a cleaning step for cleaning the polished object transferred to the polishing section; a cleaning step for polishing the polishing object transferred to the polishing section; a cleaning step for cleaning the polished polishing object; A drying step of drying the polishing object; the clean and dried polishing object after the washing is In Tsu DOO, conveying step and for conveying the unloading section for placing a clean polishing object; the polished Porisshi
The object to be cleaned is washed by a transfer mechanism other than the robot.
And a transportation step of transporting to . A transport mechanism cleaning step of cleaning the transport mechanism is provided. Another aspect of the polishing method of the present invention is a polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out from the polishing apparatus. A step of loading the polishing target object into the polishing apparatus and mounting it on a load part on which a polishing target object to be polished is mounted; and the polishing target object placed on the load part from the polishing part. A transfer step of transferring the object to be polished to a polishing section by a robot; a polishing step of polishing the polishing object transferred to the polishing section; a cleaning of the polished object to be polished by a transfer mechanism different from the robot And a cleaning step of cleaning the polished object to be polished; The polishing object, in the robot, and a conveying step of conveying the unloading unit for placing a clean polishing object; the polishing process, the polishing object,
A step of transporting the clean polishing target object from the load part to the load position through which the robot is placed; and a step of transferring the polishing target object from the load position to a position adjacent to the load position. And a step of transporting the polishing object onto the table by a polishing head supporting arm different from the robot, and a step of holding the polishing object by a top ring provided on the polishing head supporting arm and pressing it against the turntable; The cleaning step includes a primary cleaning step for primary cleaning of the polished polishing object, a secondary cleaning step for secondary cleaning of the polishing object cleaned in the primary cleaning step, and a secondary cleaning object for the secondary cleaning. A drying step for drying the object; Process, by the robot, comprising the step of conveying the clean polishing object in the unloading unit after the drying step. One aspect of a method for manufacturing a semiconductor device of the present invention is a method for manufacturing a semiconductor device by carrying a semiconductor wafer into a polishing apparatus, polishing and then cleaning, and carrying out a clean semiconductor wafer from the polishing apparatus. A mounting step of loading a semiconductor wafer into a polishing apparatus and mounting it on a load part for mounting a semiconductor wafer to be polished; and a step of mounting the semiconductor wafer on the load part from the load part. ,
A carrying step of carrying by a robot to a polishing section for polishing the semiconductor wafer; a polishing step for polishing the semiconductor wafer transferred to the polishing section; a cleaning step for cleaning the polished semiconductor wafer; the cleaned A drying step of drying an object to be polished; a transportation step of transporting the clean and dried semiconductor wafer after the cleaning to an unload section on which a clean semiconductor wafer is placed by the robot ; the polishing
A transfer mechanism that separates the separated semiconductor wafer from the robot.
And a transfer step of transferring to the cleaning unit . Another aspect of the polishing apparatus of the present invention is a polishing apparatus which carries in a polishing target object, polishes it, and then cleans it, and carries out a clean polishing target object, and a load for mounting a polishing target object to be polished. Section, at least one polishing section for polishing the polishing object conveyed from the loading section, at least one cleaning section for cleaning and drying the polished object after polishing, and a clean and dry polishing object after cleaning An unloading section for placing an object, picking a polishing object to be polished from the loading section, and a transfer robot for transferring the dried polishing object to the unloading section after completion of polishing and cleaning, A transfer mechanism for transferring a polishing object between the polishing section and the cleaning section, Carries the clean polishing object after cleaning, the transport mechanism transports the dirty polishing object after polishing. The polishing device is covered with a cover, and an exhaust mechanism is provided on the cover. An inversion mechanism was provided to invert the object to be polished before polishing.
The polishing object was equipped with a reversing mechanism for reversing after polishing. The cleaning unit includes a primary cleaning station that performs a primary cleaning of the polishing target object that has been rinsed and rinsed with rinse cleaning water after polishing, and a secondary cleaning station that performs a secondary cleaning of the polishing target object that has been primarily cleaned by the primary cleaning station. Another aspect of the polishing apparatus of the present invention is a polishing apparatus which carries in a polishing target object, polishes it, and then cleans it, and carries out a clean polishing target object, and a load for mounting a polishing target object to be polished. Section, at least one polishing section for polishing the polishing object conveyed from the loading section, at least one cleaning section for cleaning and drying the polished object after polishing, and a clean and dry polishing object after cleaning An unloading unit for placing an object and a transfer robot for transferring a polishing target in the apparatus are provided, the polishing device is covered with a cover, and the polishing unit holds a turntable and the polishing target to turntable. possess a top ring for pressing and transporting the polishing object between the cleaning unit and the grinding unit Comprising a feed mechanism, the conveying robot conveys a clean polishing object after polishing before or cleaning, the transport mechanism transports the dirty polishing object after polishing. The port of the present invention
Another aspect of the polishing apparatus is that it carries a polishing object.
Clean and polish objects by putting them in, polishing them, and then cleaning
Polishing equipment to carry out
A loading unit on which a polishing object is placed and the loading unit
Polishing the polishing object conveyed from at least
Also cleans one polishing part and polishing target after polishing
At least one cleaning section for drying and drying, and cleaning after cleaning
The unloading section for placing the object to be dried that has been dried by
And a transport robot that transports the polishing target in the machine.
And a cover for covering the polishing device.
The polishing section keeps the turntable and polishing object.
With a top ring for holding and pressing on the turntable
A, the transfer robot are installed two, one of the transfer robot carries the clean polishing object after polishing before or cleaning, while the other conveying robot for conveying the dirty polishing object after polishing. The present invention
Another aspect of the polishing apparatus is to carry in a polishing object and polish it.
Carry out after polishing and carry out clean polishing object
Polishing device that is to be polished.
Load unit for placing the object to be loaded and transfer from the load unit
At least one of polishing the polished object
Clean and dry the polishing part and the polished object after polishing.
At least one cleaning part and a clean and dry after cleaning
Unloading unit for placing a polished object and a device
Equipped with a transfer robot that transfers polishing objects inside
, Cover the polishing device with a cover,
Holds the turntable and polishing object
The transfer robot has a top ring for pressing the table and a separate arm for holding a dirty polishing object after polishing and an arm for holding a clean polishing object before polishing or after cleaning. Have . A preferred embodiment of the present invention is a polishing apparatus that carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object, which is equipped with a gripping arm and conveys the polishing object in the polishing apparatus. Then, the general-purpose transfer robot for delivering to each part, a load part arranged around the general-purpose transfer robot as a center, on which a polishing object to be polished is placed, and a polishing object carried in from the load part. At least one polishing section for polishing, at least one cleaning section for cleaning the polishing object after polishing, an unloading section for mounting a clean polishing object after cleaning, and polishing between two adjacent sections. The general-purpose transport robot is equipped with a dedicated transport mechanism for transporting and delivering an object, and the general-purpose transport robot performs clean polishing. Conveying the elephant was the only transport mechanism is characterized by conveying the dirty polishing object.

A preferred embodiment of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object.
A general-purpose transport robot that has a gripping arm and transports a polishing object in the polishing apparatus and transfers it to each part.
A load unit disposed around the general-purpose transfer robot around which a polishing object to be polished is placed, at least one polishing unit that polishes the polishing object carried in from the load unit, and after polishing Of at least one cleaning unit for cleaning the polishing target object, and an unloading unit for mounting a clean polishing target object after cleaning, and the general-purpose transfer robot transfers a clean polishing target object only. And a gripping arm that conveys only a dirty polishing object.

Further, a preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object. A general-purpose transport robot that conveys an object and transfers it to each unit, a load unit that is arranged around the general-purpose transport robot and has a polishing object to be polished, and a polishing unit that is loaded from the load unit. At least one polishing section for polishing the object, and at least one cleaning section for cleaning the polishing object after polishing;
An unloading unit for mounting a clean polishing target after cleaning is provided, and two general-purpose transfer robots are installed, and one general-purpose transfer robot transfers only a clean polishing target and the other general-purpose transfer robot is used. The transfer robot is characterized in that it only transfers dirty polishing objects.

[0012]

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the loading unit is picked by one general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished after polishing is transferred to the cleaning unit by a dedicated transport mechanism installed between the polishing unit and the cleaning unit, and is cleaned in the cleaning unit. The clean object to be cleaned and dried is placed on the unload section by the general-purpose transfer robot again.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the loading part is picked by the clean exclusive gripping arm of the general-purpose transfer robot and loaded on the polishing part.
It is polished in the polishing section. The dirty object to be polished, which has been polished, is transferred to the cleaning section by the dirty dedicated gripping arm of the general-purpose transfer robot and is cleaned in the cleaning section. The clean object to be cleaned and dried is placed on the unloading section again by the clean exclusive gripping arm of the general-purpose transport robot.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. A clean polishing target object placed on the load unit is picked by a general-purpose transport robot dedicated to clean, loaded into the polishing unit, and then polished by the polishing unit. The dirty polishing target object that has been polished is transferred to a cleaning unit by a general-purpose transfer robot dedicated to dirtying, and is cleaned in the cleaning unit. The clean semiconductor wafer that has been washed and dried is placed on the unload section again by the general-purpose transfer robot dedicated to clean.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a polishing apparatus according to the present invention will be described below with reference to the drawings. In the following embodiments, a semiconductor wafer will be described as an example of an object to be polished. [First Embodiment] FIG. 1 shows a first polishing apparatus according to the present invention.
It is a figure which shows the structure of an Example. This polishing device is
A center robot 10 constituting a general-purpose transfer robot is provided in the central portion, and the arm 10 is provided around the center robot 10.
Within the reach range of -1, a loading unit 11 for mounting a semiconductor wafer S requiring polishing, an unloading unit 12 for mounting a semiconductor wafer that has been polished, polishing units 13, 14 for polishing the semiconductor wafer S, A cleaning unit 15 for cleaning the semiconductor wafer S is provided.

The polishing sections 13 and 14 have polishing head support arms 13-3 and 14-3 and turntables 13-4 and 14-4, respectively, and the polishing head support arms 13-3 and 14-3 are topped. A ring (described later) is rotatably provided. The polishing head supporting arms 13-3 and 14-3 respectively load the semiconductor wafer S onto the load positions 13-1 and 14-1 of the polishing sections.
To the turntables 13-4 and 14-4 are configured as a dedicated transport mechanism. Further, the polishing head support arms 13-3 and 14-3 respectively correspond to the semiconductor wafer S.
A dedicated transport mechanism for transporting from the polishing section 13, 14 to the cleaning section 15 is configured. In addition, 16 and 17 are polishing parts 13 and 14
Is a dressing tool mounting table on which a dressing tool (brush-shaped tool) for dressing (grinding) the polishing cloth (cloth) attached to the turntables 13-4 and 14-4 is mounted.

In the polishing apparatus arranged as described above, the semiconductor wafer S mounted on the load section 11 and requiring polishing is picked (vacuum suction) by the loading gripping arm 10-1 of the center robot 10.
Then, after the polishing surface is turned upside down, it is transferred to the load position 13-1 of the polishing section 13. The polishing head support arm 13-3 of the polishing section 13 chucks (sucks) the semiconductor wafer S with a top ring provided at its tip, and the polishing surface of the semiconductor wafer S is rotated on the upper surface of the table 13-4. And the surface of the semiconductor wafer S is polished. At this time, the top ring itself rotates around its axis and also swings on the turntable 13-4 by the polishing head support arm 13-3.

The semiconductor wafer S for which polishing has been completed is transferred to the loading position 15-1 of the cleaning section 15 by the polishing head support arm 13-3. The polishing head support arm 13-3 having released the semiconductor wafer S at the loading position 15-1 chucks the dressing tool 16-1 on the dressing tool mounting table 16 and pushes the dressing tool 16-1 on the turntable 13-4. Dress the pad polishing cloth (cloth). However, this dressing may be provided with a dedicated dressing mechanism as described later (see FIGS. 2 and 3).

The semiconductor wafer S transferred to the load position 14-1 of the polishing section 14 by the loading dedicated arm 10-1 of the center robot 10 is also chucked and rotated by the top ring of the polishing head support arm 14-3. It is pressed against the upper surface of the rotating turntable 14-4 and polished. The semiconductor wafer S after polishing is loaded at the loading position 15-2 of the cleaning unit 15.
Be transferred to. Further, the polishing head support arm 1 which has released the semiconductor wafer S at the loading position 15-2
4-3 chucks the dressing tool 17-1 on the dressing tool mounting table 17 and turns the turntable 1
The dressing tool 17-1 is pressed against 4-4 to dress the polishing cloth (cloth).

The loading position 15-1 of the cleaning unit 15,
The semiconductor wafer S transferred to 15-2 is subjected to primary cleaning and secondary cleaning in the cleaning unit 15, and then transferred to the unloading position 15-3. Unloading position 15-3
The semiconductor wafer S transferred to the
It is transferred to the unloading section 12 by the unloading dedicated gripping arm 10-2. All the above operations are performed automatically. Hereinafter, details of the polishing unit 14 and the cleaning unit 15 will be described.

FIG. 2 (a) is a partial plan view showing the structure of the polishing apparatus of the present invention, FIG. 2 (b) is a view showing the upper stage portion of the cleaning mechanism 15, and FIG. 3 is A1 of FIG. 2 (a). 2 is a view showing a cross section taken along line A2-A, FIG. 4 is a view showing a cross section taken along B1-B2 of FIG. 2 (a), FIG. 5 is a view showing a cross section taken along C1-C2-C3-D1 of FIG. 2 (a), and FIG. It is a figure which shows the D1-D2 cross section of (a). 2 to 6 are views for explaining the first embodiment similarly to FIG. 1, but in FIGS. 2 to 6, the dressing tool and the dressing tool mounting table are not provided, but the dressing mechanism 15-11 is separately provided. It shows the case. The semiconductor wafer S placed on the loading unit 11 is picked by the arm 10-1 of the center robot 10 and is inverted so that the polishing surface faces downward in the reversing mechanism 11-2. 14 load position 14-
Transferred to 1. As shown in FIG. 3, the semiconductor wafer S
Is chucked (vacuum suction) by a top ring 14-5 provided at the tip of the polishing head support arm 14-3, and is conveyed above the turntable 14-4.

Here, the top ring 14-5 descends and, as shown in FIG. 4, the turntable 14 is rotated by the motor 14-6 via the timing belt 14-7.
The semiconductor wafer S is pressed against the upper surface of -4 and polished. As shown in FIG. 5, the semiconductor wafer S for which polishing has been completed is loaded at the loading position 15-2 of the cleaning unit 15.
It is stored in the rinse cleaning container 15-4 which is waiting at the opening of, and rinsed with the rinse water. During this rinse cleaning, the opening of the loading position 15-2 is the lid 1
It will be closed at 5-5. Further, the top ring 14-5 having released the semiconductor wafer S is cleaned by a cleaning mechanism (not shown) at the loading position of the cleaning unit 15.

The rinsed semiconductor wafer S is conveyed as shown by the arrow a in FIG. 5 and reaches the reversing mechanism 15-6. Here, the surface polished by the positioning reversing mechanism 15-6 is sucked and reversed so as to face upward again, and is transferred to the primary cleaning station 15-7, where it is primarily cleaned with cleaning water (pure water). Subsequently, the semiconductor wafer S is picked up by the transfer robot 15-8 (see FIG. 6), transferred as shown by arrows b and c, and reaches the secondary cleaning station 15-9. The semiconductor wafer S is secondarily cleaned with cleaning water (pure water) at the secondary cleaning station 15-9.

The second-cleaned semiconductor wafer S is picked up by the unload-dedicated arm 10-2 of the center robot 10 and transferred as shown by arrows d and e in FIG.
It is placed on the unload unit 12 shown in FIG. In addition, 15
-11 is a dressing mechanism for dressing the polishing cloth (cloth) on the upper surface of the turntable 14-4,
As shown in FIG. 3, a rotary brush 15-12 is provided. It should be noted that the polishing sections 13 and 14 having the configurations shown in FIGS.
The configuration of the cleaning unit and the cleaning unit is an example, and the present invention is not limited to this.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S and transferring it to each section in the polishing apparatus, and a center robot 10. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished mounted thereon, two polishing units 13 and 14 which polish the semiconductor wafer S carried in from the load unit 11, and a polishing unit A cleaning section 15 for cleaning the subsequent semiconductor wafer S, an unload section 12 for mounting the cleaned semiconductor wafer S, and a dedicated transfer mechanism for transferring and transferring the semiconductor wafer S between two adjacent sections. And the polishing head support arms 13-3 and 14-3 constituting the center robot 10 transfer the clean and dry semiconductor wafer S. , Polishing head support arm 1
3-3 and 14-3 are configured to carry a dirty and wet semiconductor wafer S.

The central robot 10 of the present embodiment has a load-dedicated arm 10-1 and an unload-dedicated arm 10-2.
It is preferably applied when the cleanness of the semiconductor wafer S carried in from the loading unit 11 and the cleanness of the semiconductor wafer S carried out to the unloading unit 12 are different.

[Second Embodiment] FIG. 7 is a diagram showing the configuration of a second embodiment of the polishing apparatus of the present invention. In the figure, the parts denoted by the same reference numerals as in FIG. 1 indicate the same or corresponding parts. The present polishing apparatus has a loading unit 11, an unloading unit 12, polishing units 13 and 14, and a cleaning unit 15 for cleaning / drying in a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10. Preliminary spaces 18 and 19 provided with anticipation of cases where further steps are required, and in which mechanisms and devices for performing those steps are arranged.
Is equipped with.

A thickness gauge for measuring the thickness of the semiconductor wafer is arranged in each of the preliminary spaces 18 and 19. In this case, the semiconductor wafer S is transferred to the center robot 10
Of the semiconductor wafer S before polishing by measuring the thickness of the semiconductor wafer S before polishing by grasping it by the arm 10-1 of the polishing unit 13 to the load position 13-1 of the polishing unit 13. Transfer. The semiconductor wafer S polished by the polishing unit 13 is cleaned by the cleaning unit 1 in the same manner as in the first embodiment.
After being transferred to No. 5 and washed there, it is guided again to the thickness gauge in the spare space 18 by the arm 10-1 of the center robot 10. Then, after measuring the thickness of the semiconductor wafer S after polishing with a thickness gauge, the semiconductor wafer is transferred to the unloading section 12 by the arm 10-2.

[Third Embodiment] FIG. 8 is a diagram showing the configuration of a third embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10, and has a loading unit 11, an unloading unit 12, and two polishing units 13, 1.
Three and one polishing unit 14, cleaning units 15 and 15 are provided between the polishing unit 13 and the polishing unit 13 and between the polishing unit 14 and the unloading unit 12, respectively. In this arrangement, the polishing process of the polishing unit 13 is the same as the polishing process of the polishing unit 14.
This is a suitable arrangement when double the time is required.

The transfer from the polishing parts 13, 13 to the cleaning part 15 and the transfer from the polishing part 14 to the cleaning part 15 are not performed by the central robot 10, but another transfer means (for example, polishing head support arms 13-3, 14-) is used. 3), the loading of the semiconductor wafer on the polishing parts 13, 13, 14 and the picking up of the cleaned semiconductor wafer from the cleaning parts 15, 15 are carried out by the gripping arm of the central robot 10. That is, the center robot 10 does not handle the semiconductor wafer to which the slurry has adhered by polishing in the polishing parts 13, 13, 14 and prevents the gripping arm from being contaminated. This makes it possible to reduce contamination.

[Fourth Embodiment] FIG. 9 is a view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention. In the polishing apparatus in the case where the center robot 10 has only one gripping arm 10-1. It is a figure which shows schematic structure. Figure 9
In FIG. 2, the parts designated by the same reference numerals as those in FIGS. In the case of having only one gripping arm 10-1 in this way, as shown in the figure, dedicated transport mechanisms are installed between the polishing units 13 and 14, and between the polishing units 13 and 14 and the cleaning unit 15, respectively. The present invention can be applied when the cleanliness of the semiconductor wafer S picked from the load unit 11 and the cleanliness of the semiconductor wafer S stored in the unload unit 12 are at the same level.

[Fifth Embodiment] FIG. 10 is a view showing the arrangement of a fifth embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the gripping arm of the center robot 10, and has a loading unit 11, four polishing units 13, 14, 21, and 2.
2. The cleaning unit 15 is provided, and the unloading unit 12 is provided at the end of the cleaning unit 15. Further, the polishing apparatus includes a stocker 23 adjacent to the loading unit 11 and the unloading unit 12 for stocking the semiconductor wafers requiring polishing and the semiconductor wafers having been polished. Then, the semiconductor wafer whose polishing has been completed is carried out from the stocker 23, or the stocker 23
An automatic carrier 24 is installed for loading semiconductor wafers that require polishing.

Here, the polishing parts 13, 14, 21, 22 are
The central robot 10 is responsible for all the loading on the cleaning unit 15 and the picking from the loading unit 11 and the polishing units 13, 14, 21, 22. The center robot 10 includes a clean dedicated arm for holding a clean semiconductor wafer S and a dirty dedicated arm for holding a dirty semiconductor wafer S, and holds the clean semiconductor wafer S from the load unit 11 and polishes the polishing units 13, 14 ,. Two
Transporting to either 1 or 22 and cleaning in the cleaning unit 15,
The semiconductor wafer S, which has been dried, is transferred to the unloading section 12 by a clean-dedicated arm.
A dirty-only arm is used to carry between 21 and 22 and from the polishing section to the cleaning section 15. For example, when the center robot of FIG. 1 is used, the arm 10-1 is a clean-dedicated arm and the arm 10-2 is a dirty-dedicated arm. This makes it possible to minimize pollution.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S to the respective parts within the polishing apparatus, and a center robot 10. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished placed thereon, and a polishing unit 1 which polishes the semiconductor wafer S carried in from the load unit 11
3, 14, 21, and 22, a cleaning unit 15 for cleaning the semiconductor wafer S after polishing, and an unloading unit 12 for mounting the clean semiconductor wafer S after cleaning. A clean dedicated arm 10-1 for carrying only the wafer S and a dirty dedicated arm 10-2 for carrying only the dirty semiconductor wafer S are provided.

The dirty dedicated arm 10-2 is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling the dirty semiconductor wafer.

[Sixth Embodiment] FIG. 11 is a diagram showing the configuration of a sixth embodiment of the polishing apparatus of the present invention. In this embodiment, a general-purpose transfer robot 10A dedicated to clean semiconductor wafers and a general-purpose transfer robot 10B dedicated to dirty semiconductor wafers are separately provided. Further, in this embodiment, two polishing parts 13 and 14 and one cleaning part 15 are provided. The specific polishing procedure is as follows. First, a general-purpose transfer robot 10A dedicated to a clean semiconductor wafer receives the semiconductor wafer S, which is an object to be polished, from the load section 11 and transfers it to the load position 13- of the polishing section 13.
Place on 1.

After the polishing by the polishing section 13 is completed, the general-purpose transfer robot 10B dedicated to the dirty semiconductor wafer receives and transfers the semiconductor wafer S and places it at the loading position 15-1 of the cleaning section 15. After the cleaning in the cleaning unit 15 is completed, the general-purpose transfer robot 10A dedicated to the clean semiconductor wafer is moved to the unloading position 15- of the cleaning unit 15.
The semiconductor wafer S is received from 3, transferred, and placed on the unload unit 12. Through the above process, a series of polishing and cleaning is performed. When polishing is performed in the polishing section 14, polishing and cleaning are performed in the same process.

According to the polishing apparatus of this embodiment, both the polishing sections 13 and 14 perform polishing, and the cleaning section 15 cleans the semiconductor wafer polished by either polishing section. It is possible to deal with one polishing section with one cleaning section. In particular, when the processing interval of the semiconductor wafer in the cleaning unit, that is, the interval from the start of one cleaning process to the start of the next wafer is shorter than the polishing time for one semiconductor wafer, cleaning is performed. Since there is no restriction due to the process and no waiting time occurs in the polishing process, the process can be made compact without slowing down, which is extremely effective.

Further, it is possible to set different polishing conditions for the polishing sections 13 and 14 and select a more suitable polishing section according to the properties of the wafer to be polished. Further, with respect to the same semiconductor wafer, the polishing section 13 performs polishing, the cleaning section 15 performs cleaning, and then the polishing section 14
It is also possible to perform polishing twice on a single semiconductor wafer by performing polishing at 1 and cleaning at the cleaning unit 15. Incidentally, reference numerals 18 and 19 are spare spaces.

In the polishing apparatus of this embodiment, the semiconductor wafer is conveyed in the polishing apparatus and delivered to each section.
General-purpose transfer robots 10A and 10B, two polishing units 13 and 14 arranged around the general-purpose transfer robots 10A and 10B for polishing the semiconductor wafer S to be polished, and the semiconductor wafer after polishing A cleaning unit 15 for cleaning S and an unloading unit 12 for mounting a clean semiconductor wafer S after cleaning are provided. One of the two general-purpose transfer robots, one general-purpose transfer robot 10A
Conveys only the clean semiconductor wafer S, while the general-purpose conveyance robot 10B conveys only the dirty semiconductor wafer S. The general-purpose transfer robot 10B is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling a dirty semiconductor wafer.

By constructing the polishing apparatus as shown in the first to sixth embodiments, a plurality of polishing parts and cleaning parts for performing mechanical and chemical polishing of various steps on the semiconductor wafer are provided around the center robot. Because it will be placed
Since the entire device can be made compact, for example, by covering the entire device with a cover or the like and independently providing exhaust, the cleanliness does not decrease even if it is directly placed in a clean room, and the installation space is small in an expensive clean room. it can.

Although the loading section 11 and the unloading section 12 are separately arranged in the above embodiment, the loading section 11 and the unloading section 12 may be integrally arranged. For example, when the semiconductor wafers are picked from the basket that stores the semiconductor wafers that require polishing, and the semiconductor wafers are stored in the same basket after the polishing is completed (after the polishing and cleaning steps are completed), the configuration is integrated.

[0043]

As described above, according to the present invention, it is possible to construct a polishing device having a cluster structure, which is made into a unit for each function such as polishing and cleaning, and which uses a general-purpose transfer robot. From this, it is possible to achieve space saving and improvement in processing speed in a polishing device that performs a series of polishing including a cleaning step, and to make an efficient combination of each device such as a polishing unit and a cleaning unit, that is, polishing time. If the cleaning interval is longer than one cleaning part, one cleaning part should be used for multiple polishing parts, and if the polishing time is shorter than the cleaning interval, more cleaning parts should be used than the polishing part. Moreover, one or more polishing steps and cleaning steps can be fully automated, and changes in the steps can be easily dealt with.

Further, according to the present invention, since there is a means for separately handling a clean polishing target and a dirty polishing target, contamination of another polishing target caused by the dirty polishing target and a polishing apparatus. It is possible to prevent contamination inside.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing the configuration of a first embodiment of a polishing apparatus of the present invention.

FIG. 2A is a partial plan view showing the configuration of the polishing apparatus of the present invention, and FIG. 2B is a view showing the upper part of the cleaning mechanism 15.

FIG. 3 is a diagram showing a cross section taken along line A1-A2 of FIG.

FIG. 4 is a diagram showing a B1-B2 cross section of FIG.

5 is a diagram showing a C1-C2-C3-D1 cross section of FIG.

FIG. 6 is a diagram showing a cross section taken along line D1-D2 of FIG.

FIG. 7 is a schematic plan view showing the configuration of a second embodiment of the polishing apparatus of the present invention.

FIG. 8 is a schematic plan view showing the configuration of a third embodiment of the polishing apparatus of the present invention.

FIG. 9 is a schematic plan view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention.

FIG. 10 is a schematic plan view showing the configuration of a fifth embodiment of the polishing apparatus of the present invention.

FIG. 11 is a schematic plan view showing the configuration of a sixth embodiment of the polishing apparatus of the present invention.

[Explanation of symbols]

10 center robot 11 Road section 12 Unloading section 13 Polishing part 14 Polishing part 15 Cleaning section 16 Dressing tool table 17 Dressing tool table 18 spare space 19 spare space 21 Polishing part 22 Polishing part 23 Stocker 24 Automatic guided vehicles S semiconductor wafer

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Hiromi Yajima, 72 Horikawa-cho, Sachi-ku, Kawasaki-shi, Kanagawa Stock, Toshiba Horikawa-cho factory (72) Inventor Masako Kodera 72, Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Company Toshiba Horikawa-cho Factory (72) Inventor Shiro Mishima 72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Company Toshiba Horikawa-cho Factory (72) Inventor Atsushi Shigeta 72 Horikawa-cho, Kawasaki-shi, Kanagawa Prefecture Stock Company Toshiba Corporation Horikawa-cho Plant (72) Inventor Masayoshi Hirose 11-1 Haneda-Asahi-cho, Ota-ku, Tokyo Ebara Corporation (72) Inventor Norio Kimura 11-11 Haneda-Asahi-cho, Ota-ku, Tokyo Ebara Corporation In-house (72) Inventor Seiji Ishikawa 11-1 Haneda Asahi-cho, Ota-ku, Tokyo Incorporated EBARA CORPORATION (56) Reference JP-A-4-334025 (JP, A) Open Akira 64-71657 (JP, A) (58 ) investigated the field (Int.Cl. ^7, DB name) B24B 37/04 H01L 21/304

Claims (13)

(57) [Claims] 1. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object; and a robot having a gripping arm, which conveys the polishing object in the polishing apparatus. A loading unit for placing a polishing object to be polished, the loading unit being located within a reach of the gripping arm of the robot; and at least one polishing unit for polishing the polishing object conveyed from the loading unit. A polishing unit; at least one cleaning unit for cleaning and drying a polishing target object after polishing; an unloading unit for placing a clean and dry polishing target object after cleaning, which reaches the gripping arm of the robot An unloading unit arranged in a range; the robot is configured to perform polishing from the loading unit. And picking Risshingu object, and the polishing the unloading unit, Ri transportable der cleaning and polishing objects drying is completed; conveys the polishing object between two adjacent parts
A transfer mechanism for handing over; transferring a dirty polishing object after polishing
A cleaning mechanism was provided for cleaning the transport mechanism; a polishing device. 2. A polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out of the polishing apparatus; the polishing object is carried into the polishing apparatus. And a placing step of placing a polishing object to be polished on a load section; a polishing section for polishing the polishing object placed on the load section from the load section To
A transfer step of transferring by a robot; a polishing step of polishing the polishing object transferred to the polishing section; a cleaning step of cleaning the polished polishing object; a drying step of drying the cleaned polishing object A step of transporting the cleaned and dried polishing object after the cleaning to an unloading section on which the clean polishing object is placed by the robot ; and the robot polishing the polished object. When
And a transfer step of transferring to the cleaning section by another transfer mechanism ; a polishing method. 3. The polishing method according to claim 2 , further comprising a transport mechanism cleaning step of cleaning the transport mechanism. 4. A polishing method in which a polishing object is carried into a polishing apparatus, which is polished and then washed, and a clean polishing object is carried out from the polishing apparatus; the polishing object is carried into the polishing apparatus. A step of placing the polishing object to be polished on a load part on which the polishing object is to be mounted; and the polishing object placed on the load part from the load part to a polishing part for polishing the polishing object,
A transfer step of transferring by a robot; a polishing step of polishing the polishing object transferred to the polishing section; a transfer step of transferring the polished polishing object to a cleaning section by a transfer mechanism different from the robot A cleaning step of cleaning the polished polishing object; and a transportation step of transporting the cleaned and clean polishing object to an unloading unit on which the clean polishing object is placed. The polishing step includes a step of transporting the polishing object from the load section to a load position where a clean polishing object is placed via the robot, and the polishing object is the load position. From the robot on the turntable installed adjacent to the load position. A polishing head supporting arm, and a step of holding the polishing object by a top ring provided on the polishing head supporting arm and pressing it against the turntable; the cleaning step includes a polished polishing object. A primary cleaning step for primary cleaning, a secondary cleaning step for secondary cleaning the polishing target object cleaned in the primary cleaning step, and a drying step for drying the secondary cleaning target object; The transporting step of transporting to the unloading section includes a step of transporting the clean polishing object to the unloading section after the drying step by the robot. 5. A method for manufacturing a semiconductor device by carrying a semiconductor wafer into a polishing apparatus, polishing and then cleaning, and carrying out a clean semiconductor wafer from the polishing apparatus to manufacture a semiconductor device. And a loading step of loading the semiconductor wafer to be polished on a loading section for loading a semiconductor wafer to be polished; and the semiconductor wafer placed on the loading section from the loading section to a polishing section for polishing the semiconductor wafer. A transfer step of transferring by a robot; a polishing step of polishing the semiconductor wafer transferred to the polishing section; a cleaning step of cleaning the polished semiconductor wafer; a drying step of drying the cleaned polishing object. And a transport for transporting the clean and dried semiconductor wafer after the cleaning to the unloading section on which the clean semiconductor wafer is mounted by the robot. A step of separating the polished semiconductor wafer from the robot
A transportation step of transporting to a cleaning section by a transportation mechanism ; a method of manufacturing a semiconductor device. 6. A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a loading unit. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A loading unit, a transfer robot that picks a polishing object to be polished from the loading unit, and transfers the polishing object that has been polished and washed to the unloading unit, and the polishing unit and the cleaning unit And a transfer mechanism for transferring an object to be polished between Polishing apparatus transports the polished object, the transport mechanism, characterized in that for conveying the dirty polishing object after polishing. 7. A cover covering the polishing device,
Claim and providing a pumping mechanism to the cover 6
The polishing apparatus described in 1. 8. The polishing object is polished before polishing.
The polishing apparatus according to claim 6 , further comprising a reversing mechanism for reversing. 9. A polishing object after polishing, claim and further comprising a reversing mechanism for reversing 6
The polishing apparatus described in 1. 10. The cleaning unit includes a primary cleaning station for primary cleaning of a polishing target object rinsed with rinse cleaning water after polishing, and a secondary cleaning station for secondary cleaning of a polishing target object primary cleaned at the primary cleaning station. The polishing apparatus according to claim 6 , further comprising: 11. A polishing device for carrying in a polishing object, polishing it, and then cleaning it, and unloading a clean polishing object, comprising a loading part on which a polishing object to be polished is placed, and the loading part. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A loading unit and a transfer robot that transfers a polishing object inside the apparatus, the polishing apparatus is covered with a cover, and the polishing section holds a turntable and a polishing object and a top ring for pressing the turntable. possess the door, carrying the polishing object between the cleaning unit and the grinding unit
Equipped with a transfer mechanism, the transfer robot can be used before
Transports clean polishing objects from
The structure is a polishing device that conveys a dirty polishing target object . 12. A polishing object is carried in and polished.
After cleaning, remove the
A loading unit for placing a polishing object to be polished on the polishing apparatus
And polish the polishing object conveyed from the load section.
At least one polishing part, and cleaning and drying the polishing object after polishing
Place one cleaning unit and the clean and dry polishing target after cleaning.
An unloading unit and a transfer robot that transfers the polishing target in the device
And covering the polishing device with a cover, and the polishing unit includes a turntable and a polishing object.
With a top ring for holding and pressing on the turntable
Has the transfer robot are installed two, that one of the transfer robot carries the clean polishing object after polishing before or cleaning, the other conveying robot for conveying the dirty polishing object after polishing features and to Lupo Orimoto <br/> grayed device. 13. A polishing object is carried in and polished.
After cleaning, remove the
A loading unit for placing a polishing object to be polished on the polishing apparatus
And polish the polishing object conveyed from the load section.
At least one polishing part, and cleaning and drying the polishing object after polishing
Place one cleaning unit and the clean and dry polishing target after cleaning.
An unloading unit and a transfer robot that transfers the polishing target in the device
And covering the polishing device with a cover, and the polishing unit includes a turntable and a polishing object.
With a top ring for holding and pressing on the turntable
The transfer robot has an arm for holding a dirty polishing object after polishing and an arm for holding a clean polishing object before polishing or after cleaning separately. Lupo Risshingu apparatus.