JP2003220556A - Polishing apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus, which polishes an object to be polished, and cleans and drys it, then transfers out the object that is clean and dry. <P>SOLUTION: The polishing apparatus comprises a robot 10 for transferring the object S in the apparatus; a loading section 11, in which the object S to be polished is placed and which is arranged within reach of the gripping arm of the robot 10; a polishing section 13 in which the object S transferred thereto from the load section 11 is polished; a cleaning section 15 in which the polished object S is cleaned and dried; and an unloading section 12 in which the object S, clean and dry after having been polished, is placed and which is arranged within reach of the gripping arm of the robot 10. The robot 10 can pick the object S to be polished out of the loading section 11 and transfer the object S, which is polished, cleaned, and dried, to the unloading section 12. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and method, and more particularly, to a polishing object such as a semiconductor wafer which is carried into a polishing section, polished, and then cleaned in a cleaning section to carry out a clean polishing object. An apparatus and a method.

[0002]

2. Description of the Related Art In recent years, as the degree of integration of semiconductor devices has increased, circuit wiring has become finer and the distance between wirings has become smaller. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the flatness of the image plane of the stepper is required. Therefore, it is necessary to flatten the surface of the semiconductor wafer. As one means of this flattening method, polishing is performed by a polishing device.

Most of conventional polishing apparatuses perform only polishing alone. Therefore, when cleaning is performed after polishing, it is necessary to transfer it from the polishing device to the cleaning device, and when polishing is performed again under different polishing conditions, it is necessary to transfer it from the polishing device to another polishing device. . These transportations have been performed manually by keeping them in water to prevent the wafers from being dried during the transportation.
However, in this way each device is provided independently,
Further, since the transportation during that time is carried out in water, there is a problem that it is difficult to install a polishing device, a cleaning device and the like in a clean room and to fully automate the process.

In order to solve these problems, a polishing apparatus has been developed in which the polishing section and the cleaning section are housed in the same package. In addition, there is a possibility that a plurality of polishing sections may be housed in the same package, if necessary.

[0005]

As described above, in the polishing apparatus in which the polishing section and the cleaning section are integrated, and the polishing apparatus in which a plurality of polishing sections are housed in the same package, the polishing apparatus is In order to increase the processing speed as a whole, as is conventionally adopted in semiconductor manufacturing processes other than polishing equipment, for example, etching and chemical vapor deposition (CVD) equipment,
It is conceivable to unitize each function and use a general-purpose transfer robot, that is, to adopt a so-called cluster structure.

However, when the cluster structure is adopted in the polishing apparatus as described above, that is, when each function is unitized and is transferred by a general-purpose transfer robot, the polishing apparatus uses the polished semiconductor wafer. Is in a dirty and wet state due to abrasive liquid or polishing debris, etc., while the loading section and the unloading section are in a clean and dry state, so it is necessary to transfer and handle semiconductor wafers in different states. Become. Therefore, a single robot and an arm like a robot in a cluster structure of another conventional semiconductor manufacturing process apparatus, or a robot in which there are only a plurality of robots and dirty and clean are not used properly because only the reach and arrangement are necessary. With the arm and arm, sufficient transport and handling in the polishing device cannot be performed, and if it is applied as it is, the cleaning and drying steps of the robot and arm must be added as necessary, and the processing capacity is increased. There is a possibility that problems such as decrease in

Further, when the robot or arm after handling a dirty semiconductor wafer in the polishing apparatus is left as it is for a long time, solid particles such as abrasive grains and polishing debris in the polishing slurry are dried and fixed, This may cause reverse contamination of the semiconductor wafer at the next polishing and contamination in the polishing apparatus.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a polishing apparatus capable of carrying out a clean and dry polishing object by cleaning and drying the object after polishing it. To do.

[0009]

In order to achieve the above-mentioned object, one embodiment of a polishing apparatus of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. And then;
A robot having a gripping arm for transporting a polishing target object in the polishing device; a load part for mounting a polishing target object to be polished, the load part being located within the reach of the gripping arm of the robot And; at least one polishing unit for polishing the polishing target conveyed from the load unit; at least one cleaning unit for cleaning and drying the polishing target after polishing; clean and dry polishing target after cleaning An unloading unit for mounting the unloading unit placed on the reach of the gripping arm of the robot; the robot picks a polishing object to be polished from the loading unit, and The polishing target that has been polished, washed and dried can be conveyed to the unloading unit. Here, a transport mechanism was provided to transport and transfer the polishing target object between two adjacent parts.
A stocker for stocking a polishing object requiring polishing and a polishing object that has been polished is arranged adjacent to the loading section and the unloading section.

One aspect of the polishing method of the present invention is a polishing method in which a polishing object is carried into a polishing apparatus, polished and then washed, and a clean polishing object is carried out from the polishing apparatus. Bring the item into the polishing device,
A placing step of placing a polishing object to be polished on a load part for placing a polishing object; a polishing object placed on the load part, from the load part to a polishing part for polishing the polishing object, A transfer step of transferring by a robot; a polishing step of polishing the polishing object transferred to the polishing section; a cleaning step of cleaning the polished polishing object; a drying step of drying the cleaned polishing object And a transport step of transporting the clean and dried polishing target object after the cleaning to the unload section on which the clean polishing target object is placed.

According to one aspect of the method for manufacturing a semiconductor device of the present invention, a semiconductor wafer is carried into a polishing apparatus, polished and then washed, and a clean semiconductor wafer is carried out from the polishing apparatus to manufacture a semiconductor device. A mounting step of loading a semiconductor wafer into a polishing apparatus and mounting the semiconductor wafer on a loading part on which a semiconductor wafer to be polished is mounted; A transfer step of transferring from a load section to a polishing section for polishing a semiconductor wafer by a robot; a polishing step for polishing the semiconductor wafer transferred to the polishing section; a cleaning step for cleaning the polished semiconductor wafer; A drying step of drying the cleaned polishing object; a clean and dried semiconductor wafer after the cleaning is cleaned by the robot. And a conveying step of conveying the unloading unit for placing a wafer.

Another aspect of the polishing apparatus of the present invention is
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing unit for polishing an object, at least one cleaning unit for cleaning and drying the polished target object after polishing, an unloading unit for placing a clean and dried polishing target object after cleaning, and an apparatus And a transfer robot for transferring a polishing object inside, and the polishing device was covered with a cover. Here, an exhaust mechanism is provided on the cover.

Another aspect of the polishing apparatus of the present invention is
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing unit for polishing an object, at least one cleaning unit for cleaning and drying the polished target object after polishing, an unloading unit for placing a clean and dried polishing target object after cleaning, and an apparatus And a transfer robot for transferring an object to be polished therein, and the loading unit and the unloading unit are integrally configured and arranged.

According to another aspect of the polishing apparatus of the present invention,
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing section for polishing the object, at least one cleaning section for cleaning and drying the polishing object after polishing, an unloading section for mounting the clean and dried polishing object after cleaning, It has a transfer robot that picks a polishing object to be polished from the load section and transfers the dried polishing object that has been polished and washed to the unload section.

Another aspect of the polishing apparatus of the present invention is
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing unit for polishing an object, at least one cleaning unit for cleaning and drying the polished target object after polishing, an unloading unit for placing a clean and dried polishing target object after cleaning, and an apparatus And a transfer robot for transferring a polishing target inside, wherein the cleaning unit is a primary cleaning station for primary cleaning of a polishing target rinsed with rinse water after polishing, and a polishing target primary cleaned at the primary cleaning station. Has a secondary cleaning station for secondary cleaning. Here, the place where the rinse cleaning is performed is different from the first cleaning station and the second cleaning station. Further, a rinse cleaning container for performing the rinse cleaning is provided.
Also, the polishing device was covered with a cover. A transport mechanism for transporting a polishing object between the polishing section and the cleaning section is provided, the transport robot transports a clean polishing object before polishing or after cleaning, and the transport mechanism is a dirty polishing object after polishing. To transport. Two transfer robots are installed, one transfer robot transfers a clean polishing target before polishing or cleaning, and the other transfer robot transfers a dirty polishing target after polishing. The transfer robot separately has an arm for holding a dirty polishing target object after polishing and an arm for holding a clean polishing target object before polishing or after cleaning. Further, the polishing object is provided with a reversing mechanism for reversing before polishing. Further, the polishing object is provided with a reversing mechanism for reversing after polishing. In addition, a thickness gauge for measuring the thickness of the object to be polished was provided. The loading section and the unloading section are integrally configured and arranged. The basket is arranged in the loading portion and the unloading portion which are integrally configured and arranged, the polishing target object is picked from the basket storing the polishing target object, and the cleaning / drying is finished after polishing to obtain a clean polishing target object. Put it back in the basket. The polishing section includes a turntable and a top ring for holding a polishing object and pressing it against the turntable. Here, it has a dressing mechanism for dressing the polishing cloth on the turntable. Further, after the top ring releases the polishing object after polishing, the polishing object is rinsed and washed. In addition, the top ring was provided with a cleaning mechanism for cleaning the top ring after releasing the object to be polished after polishing. The polishing section has a polishing cloth and a top ring for holding the polishing object and pressing it against the polishing cloth. Further, it has a dressing mechanism for dressing the polishing cloth. Further, after the top ring releases the polishing object after polishing, the polishing object is rinsed and washed. In addition, the top ring was provided with a cleaning mechanism for cleaning the top ring after releasing the object to be polished after polishing. Further, the top ring rotates about the axis and swings by the support arm.

According to another aspect of the polishing apparatus of the present invention,
A loading unit on which a polishing object to be polished is placed, at least one polishing unit for polishing the polishing target carried in from the loading unit, and at least one cleaning unit for cleaning and drying the polishing target object after polishing. When,
An unloading unit on which a clean and dried polishing target object after cleaning is placed is arranged around the transfer robot. The transfer robot has a first arm for transferring a wet polishing target object after polishing and a second arm for transferring a polishing target object in a clean and dry state after cleaning. The transfer robot includes a first robot that transfers a wet polishing target object after polishing and a second robot that transfers a clean and dry polishing target object after cleaning.

Another aspect of the polishing apparatus of the present invention is that
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing unit for polishing an object, at least one cleaning unit for cleaning and drying the polished target object after polishing, an unloading unit for placing a clean and dried polishing target object after cleaning, and an apparatus A transfer robot for transferring a polishing object inside, and a transfer mechanism for transferring the polishing object between the polishing section and the cleaning section, and covering the polishing device with a cover, the transfer robot before or after polishing. Conveys a clean polishing object, and the conveyance mechanism conveys a dirty polishing object after polishing. An exhaust mechanism is provided on the cover. Further, the polishing object is provided with a reversing mechanism for reversing before polishing. In addition, the polishing target
A reversing mechanism for reversing after polishing was provided. Further, the cleaning unit includes a primary cleaning station that performs a primary cleaning of the polishing target object that has been rinsed with a rinse cleaning water after polishing, and a secondary cleaning station that performs a secondary cleaning of the polishing target object that has been primarily cleaned by the primary cleaning station.

Another aspect of the polishing apparatus of the present invention is
A polishing apparatus for carrying in a polishing object, cleaning it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a polishing unit transported from the loading unit. At least one polishing unit for polishing an object, at least one cleaning unit for cleaning and drying the polished target object after polishing, an unloading unit for placing a clean and dried polishing target object after cleaning, and an apparatus And a transfer robot for transferring a polishing object therein, the polishing device is covered with a cover, and the polishing section has a turntable and a top ring for holding the polishing object and pressing it against the turntable. It also has a dressing mechanism for dressing the polishing cloth on the turntable. Further, after the top ring releases the polishing object after polishing, the polishing object is rinsed and washed. In addition, the top ring was provided with a cleaning mechanism for cleaning the top ring after releasing the object to be polished after polishing. Further, an exhaust mechanism is provided on the cover. Further, the polishing object is provided with a reversing mechanism for reversing before polishing. Further, the polishing object is provided with a reversing mechanism for reversing after polishing.

Another aspect of the polishing method of the present invention is:
A method of polishing after polishing an object to be polished, which is installed in a clean room by covering the polishing device with a cover, and carries the object to be polished into the polishing device from the clean room.
The object to be polished is polished, the object to be polished after polishing is washed and dried, and the clean object to be cleaned and dried is carried out from the polishing apparatus into a clean room.

Another aspect of the polishing method of the present invention is
A polishing method for cleaning after polishing an object to be polished, wherein a polishing object to be polished is picked from baskets in a loading section and an unloading section which are integrally configured and arranged, and the polishing object is polished by the polishing section. Then, the polished object to be polished is washed and dried, and the cleaned and dried object to be polished is returned to the basket.

Another aspect of the polishing method of the present invention is:
A polishing method for cleaning after polishing an object to be polished, which comprises picking a polishing object to be polished in a load part and polishing the object to be polished by a polishing part, and rinsing the object to be polished after polishing. A washing step, a step of first washing the rinse-cleaned polishing object, a step of secondarily washing the primary-cleaned polishing object, and a drying step of drying the cleaned polishing object. Return the clean, polished object to the unloading section.
Here, the dirty polishing object after polishing is handled in a polishing apparatus, the clean polishing object that has been washed and dried is handled in a polishing apparatus, and a means for handling the dirty polishing object is provided. It differs from the means for handling the clean polishing object. In addition, after polishing the object to be polished by one turntable, it is further polished by another turntable.
Further, after polishing the object to be polished with one polishing cloth, it is further polished with another polishing cloth. Also,
The polishing target is cleaned during the polishing process.
Further, the polishing object is polished by one polishing section, and another polishing object is polished by another polishing section. Also, the polishing object is inverted before polishing. Further, the object to be polished is turned over after polishing. The polishing object to be polished is picked from the baskets in the loading section and the unloading section that are integrally configured and arranged, and the clean polishing object that has been washed and dried after polishing is returned to the basket. Further, after the polishing target object after the polishing is rinsed, the polishing target object is cleaned and dried. Further, the cleaning of the polishing object includes a step of first cleaning the polishing object and a second cleaning step of secondly cleaning the polishing object cleaned in the primary cleaning step. Further, the polishing of the polishing object,
The polishing target object is held by the top ring and pressed against the turntable to clean the top ring that has released the polishing target object after polishing.
Further, the polishing object is measured with a thickness meter.

Another aspect of the semiconductor device manufacturing method of the present invention is a semiconductor device manufacturing method in which a semiconductor wafer is polished and then washed to manufacture a semiconductor device, which is installed in a clean room by covering a polishing apparatus with a cover. Then, the semiconductor wafer is loaded into the polishing machine from the clean room, the semiconductor wafer is polished, the polished semiconductor wafer is washed and dried, and the cleaned and dried clean semiconductor wafer is unloaded from the polishing machine to the clean room. To do.

Another aspect of the semiconductor device manufacturing method of the present invention is a semiconductor device manufacturing method for manufacturing a semiconductor device by polishing a semiconductor wafer and then cleaning the semiconductor wafer, wherein the loading section and the unloading section are integrally configured and arranged. Pick the semiconductor wafer to be polished from the basket in the section,
The semiconductor wafer is polished by the polishing section, the semiconductor wafer after polishing is washed and dried, and the clean semiconductor wafer after washing and drying is returned to the basket.

Another aspect of the semiconductor device manufacturing method of the present invention is a semiconductor device manufacturing method in which a semiconductor wafer is polished and then washed to manufacture a semiconductor device, and the semiconductor wafer to be polished in the load section is picked. After polishing the semiconductor wafer in the polishing section, rinse the semiconductor wafer after polishing, perform the primary cleaning of the rinsed semiconductor wafer, and perform the secondary cleaning of the primary cleaned semiconductor wafer,
The cleaned and dried semiconductor wafer is returned to the unloading section.

Another aspect of the polishing method of the present invention is:
A method of polishing after polishing an object to be polished, which is installed in a clean room by covering the polishing device with a cover, and carries the object to be polished into the polishing device from the clean room.
After polishing the polishing object with one turntable, further polishing with another turntable, the polishing object after polishing is washed and dried, and the clean polishing object that has been washed and dried is removed from the polishing device. Carry out in a clean room. Here, the polishing object is inverted before polishing. Further, the object to be polished is turned over after polishing. The polishing object to be polished is picked from the baskets in the loading section and the unloading section that are integrally configured and arranged, and the clean polishing object that has been washed and dried after polishing is returned to the basket. Further, after the polishing target object after the polishing is rinsed, the polishing target object is cleaned and dried. Further, the cleaning of the polishing object includes a step of first cleaning the polishing object and a second cleaning step of secondly cleaning the polishing object cleaned in the primary cleaning step. The polishing of the polishing target object is performed by pressing the polishing target object against the turntable while holding the polishing target object with the top ring, and washing the top ring after releasing the polishing target object after polishing. Further, the polishing object is measured with a thickness meter.

Another aspect of the polishing method of the present invention is:
A method of polishing after polishing an object to be polished, which is installed in a clean room by covering the polishing device with a cover, and carries the object to be polished into the polishing device from the clean room.
After polishing an object to be polished with one polishing cloth, further polishing with another polishing cloth, the polished object to be polished is washed and dried, and the cleaned and dried object to be polished is cleaned from the polishing apparatus to a clean room. Carry it out. Here, the polishing object is inverted before polishing. Further, the object to be polished is turned over after polishing. The polishing object to be polished is picked from the baskets in the loading section and the unloading section that are integrally configured and arranged, and the clean polishing object that has been washed and dried after polishing is returned to the basket. Further, after the polishing target object after the polishing is rinsed, the polishing target object is cleaned and dried. Further, the cleaning of the polishing object includes a step of first cleaning the polishing object and a second cleaning step of secondly cleaning the polishing object cleaned in the primary cleaning step. The polishing of the polishing target object is performed by pressing the polishing target object against a polishing cloth while holding the polishing target object with the top ring, and washing the top ring after the polishing target object is released. Further, the polishing object is measured with a thickness meter.

A preferred embodiment of the present invention is a polishing apparatus that carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object. A general-purpose transfer robot that conveys and transfers each part to each part, a load part that is arranged around the general-purpose transfer robot and that places a polishing object to be polished,
At least one polishing unit for polishing the polishing target carried in from the load unit, at least one cleaning unit for cleaning the polishing target after polishing, and unloading for mounting the clean polishing target after cleaning. And a dedicated transport mechanism for transporting and delivering a polishing object between two adjacent parts, the general-purpose transport robot transports a clean polishing object, and the dedicated transport mechanism is a dirty polishing object. It is characterized by conveying an object.

A preferred embodiment of the present invention is a polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object.
A general-purpose transport robot that has a gripping arm and transports a polishing object in the polishing apparatus and transfers it to each part.
A load unit disposed around the general-purpose transfer robot around which a polishing object to be polished is placed, at least one polishing unit that polishes the polishing object carried in from the load unit, and after polishing Of at least one cleaning unit for cleaning the polishing target object, and an unloading unit for mounting a clean polishing target object after cleaning, and the general-purpose transfer robot transfers a clean polishing target object only. And a gripping arm that conveys only a dirty polishing object.

Further, a preferred embodiment of the present invention is a polishing apparatus which carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object. A general-purpose transport robot that conveys an object and transfers it to each unit, a load unit that is arranged around the general-purpose transport robot and has a polishing object to be polished, and a polishing unit that is loaded from the load unit. At least one polishing section for polishing the object, and at least one cleaning section for cleaning the polishing object after polishing;
An unloading unit for mounting a clean polishing target after cleaning is provided, and two general-purpose transfer robots are installed, and one general-purpose transfer robot transfers only a clean polishing target and the other general-purpose transfer robot is used. The transfer robot is characterized in that it only transfers dirty polishing objects.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the loading unit is picked by one general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished after polishing is transferred to the cleaning unit by a dedicated transport mechanism installed between the polishing unit and the cleaning unit, and is cleaned in the cleaning unit. The clean object to be cleaned and dried is placed on the unload section by the general-purpose transfer robot again.

Further, according to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. The clean polishing object placed on the load unit is picked by the clean exclusive gripping arm of the general-purpose transfer robot, loaded into the polishing unit, and then polished by the polishing unit. The dirty object to be polished, which has been polished, is transferred to the cleaning section by the dirty dedicated gripping arm of the general-purpose transfer robot and is cleaned in the cleaning section. The clean object to be cleaned and dried is placed on the unloading section again by the clean exclusive gripping arm of the general-purpose transport robot.

According to the present invention, the loading section, the unloading section, the polishing section and the cleaning section are arranged around the general-purpose transfer robot. A clean polishing target object placed on the load unit is picked by a general-purpose transport robot dedicated to clean, loaded into the polishing unit, and then polished by the polishing unit. The dirty polishing target object that has been polished is transferred to a cleaning unit by a general-purpose transfer robot dedicated to dirtying, and is cleaned in the cleaning unit. The clean semiconductor wafer that has been washed and dried is placed on the unload section again by the general-purpose transfer robot dedicated to clean.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a polishing apparatus according to the present invention will be described below with reference to the drawings. In the following embodiments, a semiconductor wafer will be described as an example of an object to be polished. (First Embodiment) FIG. 1 shows a first polishing apparatus according to the present invention.
It is a figure which shows the structure of an Example. This polishing device is
A center robot 10 constituting a general-purpose transfer robot is provided in the central portion, and the arm 10 is provided around the center robot 10.
Within the reach range of -1, a loading unit 11 for mounting a semiconductor wafer S requiring polishing, an unloading unit 12 for mounting a semiconductor wafer that has been polished, polishing units 13, 14 for polishing the semiconductor wafer S, A cleaning unit 15 for cleaning the semiconductor wafer S is provided.

The polishing parts 13 and 14 have polishing head support arms 13-3 and 14-3 and turntables 13-4 and 14-4, respectively, and the polishing head support arms 13-3 and 14-3 are topped. A ring (described later) is rotatably provided. The polishing head supporting arms 13-3 and 14-3 respectively load the semiconductor wafer S onto the load positions 13-1 and 14-1 of the polishing sections.
To the turntables 13-4 and 14-4 are configured as a dedicated transport mechanism. Further, the polishing head support arms 13-3 and 14-3 respectively correspond to the semiconductor wafer S.
A dedicated transport mechanism for transporting from the polishing section 13, 14 to the cleaning section 15 is configured. In addition, 16 and 17 are polishing parts 13 and 14
Is a dressing tool mounting table on which a dressing tool (brush-shaped tool) for dressing (grinding) the polishing cloth (cloth) attached to the turntables 13-4 and 14-4 is mounted.

In the polishing apparatus arranged as described above, the semiconductor wafer S mounted on the load section 11 and requiring polishing is picked (vacuum suction) by the loading gripping arm 10-1 of the center robot 10.
Then, after the polishing surface is turned upside down, it is transferred to the load position 13-1 of the polishing section 13. The polishing head support arm 13-3 of the polishing section 13 chucks (sucks) the semiconductor wafer S with a top ring provided at its tip, and the polishing surface of the semiconductor wafer S is rotated on the upper surface of the table 13-4. And the surface of the semiconductor wafer S is polished. At this time, the top ring itself rotates around its axis and also swings on the turntable 13-4 by the polishing head support arm 13-3.

The semiconductor wafer S for which polishing has been completed is transferred to the loading position 15-1 of the cleaning section 15 by the polishing head support arm 13-3. The polishing head support arm 13-3 having released the semiconductor wafer S at the loading position 15-1 chucks the dressing tool 16-1 on the dressing tool mounting table 16 and pushes the dressing tool 16-1 on the turntable 13-4. Dress the pad polishing cloth (cloth). However, this dressing may be provided with a dedicated dressing mechanism as described later (see FIGS. 2 and 3).

The semiconductor wafer S transferred to the load position 14-1 of the polishing section 14 by the loading arm 10-1 of the center robot 10 is also chucked and rotated by the top ring of the polishing head support arm 14-3. It is pressed against the upper surface of the rotating turntable 14-4 and polished. The semiconductor wafer S after polishing is loaded at the loading position 15-2 of the cleaning unit 15.
Be transferred to. Further, the polishing head support arm 1 which has released the semiconductor wafer S at the loading position 15-2
4-3 chucks the dressing tool 17-1 on the dressing tool mounting table 17 and turns the turntable 1
The dressing tool 17-1 is pressed against 4-4 to dress the polishing cloth (cloth).

The loading position 15-1 of the cleaning unit 15,
The semiconductor wafer S transferred to 15-2 is subjected to primary cleaning and secondary cleaning in the cleaning unit 15, and then transferred to the unloading position 15-3. Unloading position 15-3
The semiconductor wafer S transferred to the
It is transferred to the unloading section 12 by the unloading dedicated gripping arm 10-2. All the above operations are performed automatically. Hereinafter, details of the polishing unit 14 and the cleaning unit 15 will be described.

FIG. 2 (a) is a partial plan view showing the structure of the polishing apparatus of the present invention, FIG. 2 (b) is a view showing the upper stage portion of the cleaning mechanism 15, and FIG. 3 is A1 of FIG. 2 (a). 2 is a view showing a cross section taken along line A2-A, FIG. 4 is a view showing a cross section taken along B1-B2 of FIG. 2 (a), FIG. 5 is a view showing a cross section taken along C1-C2-C3-D1 of FIG. 2 (a), and FIG. It is a figure which shows the D1-D2 cross section of (a). 2 to 6 are views for explaining the first embodiment similarly to FIG. 1, but in FIGS. 2 to 6, the dressing tool and the dressing tool mounting table are not provided, but the dressing mechanism 15-11 is separately provided. It shows the case. The semiconductor wafer S placed on the loading unit 11 is picked by the arm 10-1 of the center robot 10 and is inverted so that the polishing surface faces downward in the reversing mechanism 11-2. 14 load position 14-
Transferred to 1. As shown in FIG. 3, the semiconductor wafer S
Is chucked (vacuum suction) by a top ring 14-5 provided at the tip of the polishing head support arm 14-3, and is conveyed above the turntable 14-4.

Here, the top ring 14-5 descends and, as shown in FIG. 4, the turntable 14 is rotated by the motor 14-6 via the timing belt 14-7.
The semiconductor wafer S is pressed against the upper surface of -4 and polished. As shown in FIG. 5, the semiconductor wafer S for which polishing has been completed is loaded at the loading position 15-2 of the cleaning unit 15.
It is stored in the rinse cleaning container 15-4 which is waiting at the opening of, and rinsed with the rinse water. During this rinse cleaning, the opening of the loading position 15-2 is the lid 1
It will be closed at 5-5. Further, the top ring 14-5 having released the semiconductor wafer S is cleaned by a cleaning mechanism (not shown) at the loading position of the cleaning unit 15.

The rinsed semiconductor wafer S is conveyed as shown by the arrow a in FIG. 5 and reaches the reversing mechanism 15-6. Here, the surface polished by the positioning reversing mechanism 15-6 is sucked and reversed so as to face upward again, and is transferred to the primary cleaning station 15-7, where it is primarily cleaned with cleaning water (pure water). Subsequently, the semiconductor wafer S is picked up by the transfer robot 15-8 (see FIG. 6), transferred as shown by arrows b and c, and reaches the secondary cleaning station 15-9. The semiconductor wafer S is secondarily cleaned with cleaning water (pure water) at the secondary cleaning station 15-9.

The semiconductor wafer S that has been secondarily cleaned is picked up by the unload-dedicated arm 10-2 of the center robot 10 and transferred as shown by arrows d and e in FIG.
It is placed on the unload unit 12 shown in FIG. In addition, 15
-11 is a dressing mechanism for dressing the polishing cloth (cloth) on the upper surface of the turntable 14-4,
As shown in FIG. 3, a rotary brush 15-12 is provided. It should be noted that the polishing sections 13 and 14 having the configurations shown in FIGS.
The configuration of the cleaning unit and the cleaning unit is an example, and the present invention is not limited to this.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S and transferring it to each section in the polishing apparatus, and a center robot 10. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished mounted thereon, two polishing units 13 and 14 which polish the semiconductor wafer S carried in from the load unit 11, and a polishing unit A cleaning section 15 for cleaning the subsequent semiconductor wafer S, an unload section 12 for mounting the cleaned semiconductor wafer S, and a dedicated transfer mechanism for transferring and transferring the semiconductor wafer S between two adjacent sections. And the polishing head support arms 13-3 and 14-3 constituting the center robot 10 transfer the clean and dry semiconductor wafer S. , Polishing head support arm 1
3-3 and 14-3 are configured to carry a dirty and wet semiconductor wafer S.

The central robot 10 according to the present embodiment has a load-dedicated arm 10-1 and an unload-dedicated arm 10-2.
It is preferably applied when the cleanness of the semiconductor wafer S carried in from the loading unit 11 and the cleanness of the semiconductor wafer S carried out to the unloading unit 12 are different.

(Second Embodiment) Fig. 7 is a diagram showing the configuration of a second embodiment of the polishing apparatus of the present invention, in which the same reference numerals as in Fig. 1 designate the same or corresponding portions. The present polishing apparatus has a loading unit 11, an unloading unit 12, polishing units 13 and 14, and a cleaning unit 15 for cleaning / drying in a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10. Preliminary spaces 18 and 19 provided with anticipation of cases where further steps are required, and in which mechanisms and devices for performing those steps are arranged.
Is equipped with.

A thickness gauge for measuring the thickness of the semiconductor wafer is arranged in each of the preliminary spaces 18 and 19. In this case, the semiconductor wafer S is transferred to the center robot 10
Of the semiconductor wafer S before polishing by measuring the thickness of the semiconductor wafer S before polishing by grasping it by the arm 10-1 of the polishing unit 13 to the load position 13-1 of the polishing unit 13. Transfer. The semiconductor wafer S polished by the polishing unit 13 is cleaned by the cleaning unit 1 in the same manner as in the first embodiment.
After being transferred to No. 5 and washed there, it is guided again to the thickness gauge in the spare space 18 by the arm 10-1 of the center robot 10. Then, after measuring the thickness of the semiconductor wafer S after polishing with a thickness gauge, the semiconductor wafer is transferred to the unloading section 12 by the arm 10-2.

(Third Embodiment) FIG. 8 is a diagram showing the configuration of a third embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the arm of the center robot 10, and has a loading unit 11, an unloading unit 12, and two polishing units 13, 1.
Three and one polishing unit 14, cleaning units 15 and 15 are provided between the polishing unit 13 and the polishing unit 13 and between the polishing unit 14 and the unloading unit 12, respectively. In this arrangement, the polishing process of the polishing unit 13 is the same as the polishing process of the polishing unit 14.
This is a suitable arrangement when double the time is required.

The transfer from the polishing parts 13, 13 to the cleaning part 15 and the transfer from the polishing part 14 to the cleaning part 15 are not performed by the central robot 10, but another transfer means (for example, polishing head supporting arms 13-3, 14-). 3), the loading of the semiconductor wafer on the polishing parts 13, 13, 14 and the picking up of the cleaned semiconductor wafer from the cleaning parts 15, 15 are carried out by the gripping arm of the central robot 10. That is, the center robot 10 does not handle the semiconductor wafer to which the slurry has adhered by polishing in the polishing parts 13, 13, 14 and prevents the gripping arm from being contaminated. This makes it possible to reduce contamination.

(Fourth Embodiment) FIG. 9 is a diagram showing the structure of a fourth embodiment of the polishing apparatus of the present invention, in which the center robot 10 has only one gripping arm 10-1. It is a figure which shows schematic structure. Figure 9
In FIG. 2, the parts designated by the same reference numerals as those in FIGS. In the case of having only one gripping arm 10-1 in this way, as shown in the figure, dedicated transport mechanisms are installed between the polishing units 13 and 14, and between the polishing units 13 and 14 and the cleaning unit 15, respectively. The present invention can be applied when the cleanliness of the semiconductor wafer S picked from the load unit 11 and the cleanliness of the semiconductor wafer S stored in the unload unit 12 are at the same level.

(Fifth Embodiment) FIG. 10 is a diagram showing the structure of a fifth embodiment of the polishing apparatus of the present invention. The polishing apparatus has a hexagonal shape around the center robot 10 and within the reach of the gripping arm of the center robot 10, and has a loading unit 11, four polishing units 13, 14, 21, and 2.
2. The cleaning unit 15 is provided, and the unloading unit 12 is provided at the end of the cleaning unit 15. Further, the polishing apparatus includes a stocker 23 adjacent to the loading unit 11 and the unloading unit 12 for stocking the semiconductor wafers requiring polishing and the semiconductor wafers having been polished. Then, the semiconductor wafer whose polishing has been completed is carried out from the stocker 23, or the stocker 23
An automatic carrier 24 is installed for loading semiconductor wafers that require polishing.

Here, the polishing parts 13, 14, 21, 22 are
The central robot 10 is responsible for all the loading on the cleaning unit 15 and the picking from the loading unit 11 and the polishing units 13, 14, 21, 22. The center robot 10 includes a clean dedicated arm for holding a clean semiconductor wafer S and a dirty dedicated arm for holding a dirty semiconductor wafer S, and holds the clean semiconductor wafer S from the load unit 11 and polishes the polishing units 13, 14 ,. Two
Transporting to either 1 or 22 and cleaning in the cleaning unit 15,
The semiconductor wafer S, which has been dried, is transferred to the unloading section 12 by a clean-dedicated arm.
A dirty-only arm is used to carry between 21 and 22 and from the polishing section to the cleaning section 15. For example, when the center robot of FIG. 1 is used, the arm 10-1 is a clean-dedicated arm and the arm 10-2 is a dirty-dedicated arm. This makes it possible to minimize pollution.

The polishing apparatus of this embodiment comprises a central robot 10 having gripping arms 10-1 and 10-2, which constitutes a general-purpose transfer robot for transferring the semiconductor wafer S and transferring it to each section in the polishing apparatus, and a center robot 10. A load unit 11 which is arranged around the robot 10 and has a semiconductor wafer S to be polished placed thereon, and a polishing unit 1 which polishes the semiconductor wafer S carried in from the load unit 11
3, 14, 21, and 22, a cleaning unit 15 for cleaning the semiconductor wafer S after polishing, and an unloading unit 12 for mounting the clean semiconductor wafer S after cleaning. A clean dedicated arm 10-1 for carrying only the wafer S and a dirty dedicated arm 10-2 for carrying only the dirty semiconductor wafer S are provided.

The dirty dedicated arm 10-2 is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling the dirty semiconductor wafer.

(Sixth Embodiment) FIG. 11 is a diagram showing the configuration of a sixth embodiment of the polishing apparatus of the present invention. In this embodiment, a general-purpose transfer robot 10A dedicated to clean semiconductor wafers and a general-purpose transfer robot 10B dedicated to dirty semiconductor wafers are separately provided. Further, in this embodiment, two polishing parts 13 and 14 and one cleaning part 15 are provided. The specific polishing procedure is as follows. First, a general-purpose transfer robot 10A dedicated to a clean semiconductor wafer receives the semiconductor wafer S, which is an object to be polished, from the load section 11 and transfers it to the load position 13- of the polishing section 13.
Place on 1.

After the polishing in the polishing section 13 is completed, the general-purpose transfer robot 10B dedicated to the dirty semiconductor wafer receives and transfers the semiconductor wafer S and places it on the loading position 15-1 of the cleaning section 15. After the cleaning in the cleaning unit 15 is completed, the general-purpose transfer robot 10A dedicated to the clean semiconductor wafer is moved to the unloading position 15- of the cleaning unit 15.
The semiconductor wafer S is received from 3, transferred, and placed on the unload unit 12. Through the above process, a series of polishing and cleaning is performed. When polishing is performed in the polishing section 14, polishing and cleaning are performed in the same process.

According to the polishing apparatus of this embodiment, both the polishing sections 13 and 14 perform polishing, and the cleaning section 15 cleans the semiconductor wafer polished by either polishing section, thereby It is possible to deal with one polishing section with one cleaning section. In particular, when the processing interval of the semiconductor wafer in the cleaning unit, that is, the interval from the start of one cleaning process to the start of the next wafer is shorter than the polishing time for one semiconductor wafer, cleaning is performed. Since there is no restriction due to the process and no waiting time occurs in the polishing process, the process can be made compact without slowing down, which is extremely effective.

Further, it is possible to set different polishing conditions for the polishing sections 13 and 14 and select a more suitable polishing section according to the properties of the wafer to be polished. Further, with respect to the same semiconductor wafer, the polishing section 13 performs polishing, the cleaning section 15 performs cleaning, and then the polishing section 14
It is also possible to perform polishing twice on a single semiconductor wafer by performing polishing at 1 and cleaning at the cleaning unit 15. Incidentally, reference numerals 18 and 19 are spare spaces.

The polishing apparatus of this embodiment conveys a semiconductor wafer in the polishing apparatus and transfers it to each section.
General-purpose transfer robots 10A and 10B, two polishing units 13 and 14 arranged around the general-purpose transfer robots 10A and 10B for polishing the semiconductor wafer S to be polished, and the semiconductor wafer after polishing A cleaning unit 15 for cleaning S and an unloading unit 12 for mounting a clean semiconductor wafer S after cleaning are provided. One of the two general-purpose transfer robots, one general-purpose transfer robot 10A
Conveys only the clean semiconductor wafer S, while the general-purpose conveyance robot 10B conveys only the dirty semiconductor wafer S. The general-purpose transfer robot 10B is cleaned by a cleaning mechanism (not shown) provided in the cleaning unit 15 after handling a dirty semiconductor wafer.

By configuring the polishing apparatus as shown in the first to sixth embodiments, a plurality of polishing parts and cleaning parts for performing mechanical and chemical polishing of various steps on the semiconductor wafer are provided around the center robot. Because it will be placed
Since the entire device can be made compact, for example, by covering the entire device with a cover or the like and independently providing exhaust, the cleanliness does not decrease even if it is directly placed in a clean room, and the installation space is small in an expensive clean room. it can.

Although the loading section 11 and the unloading section 12 are separately arranged in the above embodiment, the loading section 11 and the unloading section 12 may be integrally arranged. For example, when the semiconductor wafers are picked from the basket that stores the semiconductor wafers that require polishing, and the semiconductor wafers are stored in the same basket after the polishing is completed (after the polishing and cleaning steps are completed), the configuration is integrated.

[0061]

As described above, the present invention has the following effects. 1) It is possible to carry a polishing object into a polishing device, polish it, and then wash and dry it, and carry out the clean and dried polishing object from the polishing device. 2) The polishing device can be installed in a clean room. 3) A polishing apparatus having a cluster structure can be configured by unitizing each function such as polishing and cleaning, and using a general-purpose transfer robot. From this,
Space saving and improvement of processing speed can be achieved in the polishing device that performs a series of polishing including a cleaning step, and an efficient combination of each device such as the polishing part and the cleaning part, that is, the polishing time is the cleaning processing interval. If it is longer than the above, one cleaning unit can handle a plurality of polishing units, and if the polishing time is shorter than the cleaning processing interval, more cleaning units than the polishing unit can be used. Furthermore, 1 or 2
The above polishing process and cleaning process can be fully automated, and the process can be easily changed.

4) Since it has a means for individually handling a clean polishing object and a dirty polishing object, it prevents contamination of other polishing objects and contamination of the polishing apparatus due to the dirty polishing object. be able to.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing the configuration of a first embodiment of a polishing apparatus of the present invention.

FIG. 2A is a partial plan view showing the configuration of the polishing apparatus of the present invention, and FIG. 2B is a view showing the upper part of the cleaning mechanism 15.

FIG. 3 is a diagram showing a cross section taken along line A1-A2 of FIG.

FIG. 4 is a diagram showing a B1-B2 cross section of FIG.

5 is a diagram showing a C1-C2-C3-D1 cross section of FIG.

FIG. 6 is a diagram showing a cross section taken along line D1-D2 of FIG.

FIG. 7 is a schematic plan view showing the configuration of a second embodiment of the polishing apparatus of the present invention.

FIG. 8 is a schematic plan view showing the configuration of a third embodiment of the polishing apparatus of the present invention.

FIG. 9 is a schematic plan view showing the configuration of a fourth embodiment of the polishing apparatus of the present invention.

FIG. 10 is a schematic plan view showing the configuration of a fifth embodiment of the polishing apparatus of the present invention.

FIG. 11 is a schematic plan view showing the configuration of a sixth embodiment of the polishing apparatus of the present invention.

[Explanation of symbols]

10 center robot 11 Road section 12 Unloading section 13 Polishing part 14 Polishing part 15 Cleaning section 16 Dressing tool table 17 Dressing tool table 18 spare space 19 spare space 21 Polishing part 22 Polishing part 23 Stocker 24 Automatic guided vehicles S semiconductor wafer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Riichiro Aoki             72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Association             Company Toshiba Horikawacho Factory (72) Inventor Hiromi Yajima             72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Association             Company Toshiba Horikawacho Factory (72) Inventor Masako Kodera             72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Association             Company Toshiba Horikawacho Factory (72) Inventor Shiro Mishima             72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Association             Company Toshiba Horikawacho Factory (72) Inventor Atsushi Shigeta             72 Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Stock Association             Company Toshiba Horikawacho Factory (72) Inventor Hirose Masayoshi             11-1 Haneda Asahi-cho, Ota-ku, Tokyo Co., Ltd.             Inside the EBARA CORPORATION (72) Inventor Norio Kimura             11-1 Haneda Asahi-cho, Ota-ku, Tokyo Co., Ltd.             Inside the EBARA CORPORATION (72) Inventor Seiji Ishikawa             11-1 Haneda Asahi-cho, Ota-ku, Tokyo Co., Ltd.             Inside the EBARA CORPORATION F term (reference) 3C058 AA07 AB03 AC05 CA01 CB03                 5F031 CA02 FA01 FA07 FA11 FA12                       FA20 GA08 GA40 GA43 GA47                       GA49 GA50 HA48 HA59 MA04                       MA22 MA23

Claims (79)

[Claims] 1. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object; a robot having a gripping arm and carrying the polishing object in the polishing apparatus. A loading unit for placing a polishing object to be polished, the loading unit being located within a reach of the gripping arm of the robot; and at least one polishing unit for polishing the polishing object conveyed from the loading unit. A polishing section; at least one cleaning section for cleaning and drying a polishing object after polishing; and an unloading section for mounting a clean and dried polishing object after cleaning, which reaches the gripping arm of the robot. An unloading section arranged in a range; the robot is configured to perform polishing from the loading section. It is possible to pick an object to be singed and convey the object to be polished, which has been polished, washed and dried, to the unloading section; 2. The polishing apparatus according to claim 1, further comprising a transfer mechanism that transfers and transfers a polishing object between two adjacent parts. 3. A stocker is provided adjacent to the loading part and the unloading part, and a stocker for stocking a polishing object requiring polishing and a polishing object having completed polishing is arranged. The polishing apparatus according to Item 1 or 2. 4. A polishing method in which a polishing object is carried into a polishing apparatus, which is polished and then washed, and a clean polishing object is carried out from the polishing apparatus; the polishing object is carried into the polishing apparatus. And a placing step of placing a polishing object to be polished on a load part, wherein the polishing object placed on the load part is removed from the load part.
A carrying step of carrying with a robot to a polishing section for polishing the polishing object; a polishing step for polishing the polishing object transferred to the polishing section; a cleaning step for cleaning the polished polishing object; A drying step of drying the cleaned polishing object; and a transfer step of transferring the clean and dried polishing object after the cleaning to the unload section on which the clean polishing object is placed by the robot. A polishing method. 5. A method for manufacturing a semiconductor device by carrying a semiconductor wafer into a polishing apparatus, polishing and cleaning the semiconductor wafer, and then carrying out a clean semiconductor wafer from the polishing apparatus; manufacturing a semiconductor wafer in the polishing apparatus. And a loading step of loading the semiconductor wafer to be polished on a loading section for loading the semiconductor wafer to be polished; and the semiconductor wafer placed on the loading section from the loading section to a polishing section for polishing the semiconductor wafer. A transfer step of transferring by a robot; a polishing step of polishing the semiconductor wafer transferred to the polishing section; a cleaning step of cleaning the polished semiconductor wafer; a drying step of drying the cleaned polishing object And; a transfer step of transferring the clean and dried semiconductor wafer after the cleaning to the unload section on which the clean semiconductor wafer is mounted by the robot. A method of manufacturing a semiconductor device. 6. A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and a loading unit. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A polishing apparatus comprising: a load unit; and a transfer robot that transfers a polishing object in the apparatus, wherein the polishing apparatus is covered with a cover. 7. The polishing apparatus according to claim 6, wherein the cover is provided with an exhaust mechanism. 8. A polishing apparatus which carries in a polishing object, polishes it after polishing, and carries out a clean polishing object, and a loading section on which a polishing object to be polished is placed and a loading section. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A polishing apparatus comprising: a loading unit; and a transfer robot that transfers a polishing object in the apparatus, wherein the loading unit and the unloading unit are integrally configured and arranged. 9. A polishing apparatus which carries in a polishing object, polishes it, and then cleans it out, and carries out a clean polishing object, and a loading section on which a polishing object to be polished is placed and a loading section. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A polishing robot, comprising: a loading unit; and a transfer robot that picks a polishing target object to be polished from the loading unit, and transfers the polishing target object that has been polished and washed and dried to the unloading unit. apparatus. 10. A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and carrying out a clean polishing object. A loading unit for mounting a polishing object to be polished, and the loading unit. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and a cleaning unit for mounting the clean and dry polishing target after cleaning. The cleaning unit includes a loading unit and a transfer robot that transfers the polishing target in the apparatus, and the cleaning unit performs a primary cleaning station that performs a primary cleaning of the polishing target that has been rinsed with rinse water after polishing and a primary cleaning at the primary cleaning station. Characterized by having a secondary cleaning station for secondary cleaning of the polished object to be polished. Polishing apparatus to be. 11. The polishing apparatus according to claim 10, wherein the rinsing cleaning is performed at a different place from the primary cleaning station and the secondary cleaning station. 12. The polishing apparatus according to claim 10, further comprising a rinse cleaning container for performing the rinse cleaning. 13. A polishing apparatus according to claim 8, 9 or 11 or 12, wherein the polishing apparatus is covered with a cover. 14. A transport mechanism for transporting a polishing object between the polishing section and the cleaning section, wherein the transport robot transports a clean polishing object before polishing or after cleaning, and the transport mechanism after polishing. The polishing apparatus according to claim 8 or 10, which conveys a dirty polishing object. 15. The two transfer robots are installed, one transfer robot transfers a clean polishing object before polishing or after cleaning, and the other transfer robot transfers a dirty polishing object after polishing. The polishing apparatus according to claim 6, wherein the polishing apparatus is a polishing apparatus. 16. The transport robot separately has an arm for holding a dirty polishing target object after polishing and an arm for holding a clean polishing target object before polishing or after cleaning. The polishing apparatus according to claim 6, wherein the polishing apparatus comprises: 17. The polishing apparatus according to claim 6, further comprising a reversing mechanism for reversing the object to be polished before polishing. 18. The polishing apparatus according to claim 6, further comprising a reversing mechanism for reversing a polishing object after polishing. 19. A thickness gauge for measuring the thickness of an object to be polished is provided.
8. The polishing apparatus according to any one of items 8. 20. The polishing apparatus according to claim 6, wherein the loading portion and the unloading portion are integrally configured and arranged. 21. Baskets are arranged in the loading portion and the unloading portion, which are integrally configured and arranged, and the polishing target object is picked from the basket storing the polishing target object, and after the polishing, the cleaning / drying is finished and the cleaning is completed. 21. The polishing apparatus according to claim 8, wherein the polishing object is returned to the basket. 22. The polishing unit has a turntable and a top ring for holding a polishing object and pressing the polishing object against the turntable, according to any one of claims 8 to 14 and 19 to 21. The polishing apparatus described in 1. 23. The polishing apparatus according to claim 22, further comprising a dressing mechanism for dressing the polishing cloth on the turntable. 24. The polishing apparatus according to claim 22, wherein the top ring releases the polishing object after the polishing and then rinses the polishing object. 25. The polishing apparatus according to claim 22, further comprising a cleaning mechanism for cleaning the top ring after the top ring releases the object to be polished after polishing. 26. The polishing according to claim 6, wherein the polishing section has a polishing cloth and a top ring for holding an object to be polished and pressing the polishing cloth against the polishing cloth. apparatus. 27. The polishing apparatus according to claim 26, further comprising a dressing mechanism for dressing the polishing cloth. 28. The polishing apparatus according to claim 26, wherein after polishing, the top ring releases the polishing object and then rinses the polishing object. 29. The polishing apparatus according to claim 26, further comprising a cleaning mechanism for cleaning the top ring after the top ring releases the object to be polished after polishing. 30. The polishing apparatus according to claim 22, wherein the top ring rotates about an axis and swings by a support arm. 31. A loading unit on which a polishing object to be polished is placed, at least one polishing unit for polishing the polishing object carried in from the loading unit, and the polishing object after polishing is washed and dried. A polishing apparatus, wherein at least one cleaning unit and an unloading unit for mounting a cleaned and dried polishing target object after cleaning are arranged around the transport robot. 32. The transport robot has a first arm for transporting a wet polishing target object after polishing and a second arm for transporting a clean and dry polishing target object after cleaning. The polishing apparatus according to claim 31, wherein the polishing apparatus is a polishing apparatus. 33. The transfer robot comprises a first robot for transferring a wet polishing target object after polishing,
32. The polishing apparatus according to claim 31, further comprising a second robot that conveys a cleaning object that is in a clean and dry state after cleaning. 34. A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and unloading a clean polishing object, comprising a loading section on which a polishing object to be polished is placed, and the loading section. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and an cleaning unit for placing the clean and dry polishing target after cleaning. A loading unit, a transfer robot that transfers a polishing target in the apparatus, and a transfer mechanism that transfers a polishing target between the polishing unit and the cleaning unit. The polishing apparatus is covered with a cover, and the transfer robot performs polishing. It conveys a clean polishing object before or after cleaning, and the conveyance mechanism uses a dirty polish after polishing. Polishing apparatus characterized by conveying the grayed object. 35. The polishing apparatus according to claim 34, wherein the cover is provided with an exhaust mechanism. 36. The polishing apparatus according to claim 34, further comprising a reversing mechanism for reversing the object to be polished before polishing. 37. The polishing apparatus according to claim 34, further comprising a reversing mechanism for reversing a polishing object after polishing. 38. The cleaning unit comprises a primary cleaning station for primary cleaning of a polishing object rinsed with rinse water after polishing, and a secondary cleaning station for secondary cleaning of the polishing object primary cleaned by the primary cleaning station. The polishing apparatus according to claim 34, further comprising: 39. A polishing apparatus for carrying in a polishing object, polishing it, and then cleaning it, and unloading a clean polishing object, the loading section having a polishing object to be polished, and a loading section. At least one polishing unit for polishing the polishing target conveyed from the cleaning unit, at least one cleaning unit for cleaning and drying the polishing target after polishing, and a cleaning unit for placing the clean and dry polishing target after cleaning. A loading unit and a transfer robot that transfers a polishing object in the apparatus, the polishing apparatus is covered with a cover, and the polishing section holds a turntable and a polishing object and a top ring for pressing the turntable. And a polishing device. 40. The polishing apparatus according to claim 39, further comprising a dressing mechanism for dressing the polishing cloth on the turntable. 41. The polishing apparatus according to claim 39, wherein after polishing, the top ring releases the polishing object and then rinses the polishing object. 42. The polishing apparatus according to claim 39, further comprising a cleaning mechanism for cleaning the top ring after the top ring releases the object to be polished after polishing. 43. The polishing apparatus according to claim 39, wherein the cover is provided with an exhaust mechanism. 44. The polishing apparatus according to claim 39, further comprising a reversing mechanism for reversing the object to be polished before polishing. 45. The polishing apparatus according to claim 39, further comprising a reversing mechanism for reversing a polishing object after polishing. 46. A polishing method for cleaning a polishing target object after polishing, which is installed in a clean room by covering a polishing device with a cover, and carries the polishing target object into the polishing device from the clean room. A polishing method comprising polishing an object, cleaning and polishing the object to be polished, and drying, and carrying out a clean object to be cleaned, which has been washed and dried, from a polishing apparatus into a clean room. 47. A polishing method for cleaning a polishing target object after polishing, wherein the polishing target object to be polished is picked from baskets in a loading portion and an unloading portion that are integrally configured and arranged, and the polishing target object is polished. Is polished by a polishing section, the polishing object after polishing is washed and dried, and the clean polishing object that has been washed and dried is returned to the basket. 48. A polishing method for cleaning after polishing an object to be polished, comprising a polishing step of picking an object to be polished in a load section and polishing the object to be polished by the polishing section; A step of rinsing and cleaning the polishing object, a step of primary cleaning of the rinse-cleaned polishing object, a step of secondary cleaning of the primary-cleaned polishing object, and a drying step of drying the cleaned polishing object. And a clean polishing object that has been washed and dried and is returned to the unloading section. 49. The dirty polishing target object after the polishing is handled in a polishing device, the clean polishing target object that has been washed and dried is handled in the polishing device, and the dirty polishing target object is handled. 49. The polishing method according to any one of claims 46 to 48, wherein the means and the means for handling the clean polishing object are different. 50. The polishing method according to claim 47, wherein the polishing object is polished by one turntable and then further polished by another turntable. 51. The polishing method according to claim 47, wherein after polishing the polishing object with one polishing cloth, the polishing object is further polished with another polishing cloth. 52. The polishing method according to claim 50, wherein the object to be polished is washed during a polishing process. 53. The polishing object according to any one of claims 46 to 48, wherein the polishing object is polished by one polishing section and another polishing object is polished by another polishing section. Polishing method. 54. The polishing method according to claim 46, wherein the polishing object is inverted before polishing. 55. The polishing method according to claim 46, wherein the polishing object is inverted after polishing. 56. The polishing object to be polished is picked from the baskets in the loading section and the unloading section that are integrally configured and arranged, and the clean polishing object that has been washed and dried after polishing is the basket. 49. The polishing method according to claim 46 or 48, further comprising: 57. The polishing method according to claim 46, wherein the polishing target after the polishing is rinsed and then washed and dried. 58. The cleaning of the polishing object includes a step of first cleaning the polishing object and a second cleaning step of second cleaning the polishing object cleaned in the primary cleaning step. Item 48. The polishing method according to Item 46 or Item 47. 59. The polishing object is polished by pressing the polishing object against the turntable while holding the polishing object by the top ring, and cleaning the top ring after the polishing object is released. The polishing method according to any one of claims 46 to 58. 60. The polishing method according to claim 46, wherein the object to be polished is measured by a thickness gauge. 61. A semiconductor device manufacturing method for manufacturing a semiconductor device by polishing a semiconductor wafer and then washing the semiconductor wafer, wherein the polishing device is installed in a clean room by covering it, and the semiconductor wafer is removed from the clean room in the polishing device. And then polish the semiconductor wafer,
A method for manufacturing a semiconductor device, which comprises cleaning and drying a semiconductor wafer after polishing, and carrying out a clean semiconductor wafer after cleaning and drying from a polishing apparatus into a clean room. 62. A semiconductor device manufacturing method for manufacturing a semiconductor device by polishing a semiconductor wafer and then cleaning the semiconductor wafer, wherein the semiconductor wafer to be polished is formed from baskets in a load section and an unload section that are integrally configured and arranged. A method for manufacturing a semiconductor device, comprising picking, polishing a semiconductor wafer in a polishing section, cleaning and drying the semiconductor wafer after polishing, and returning the cleaned and dried semiconductor wafer to the basket. 63. A semiconductor device manufacturing method for manufacturing a semiconductor device by polishing and then cleaning a semiconductor wafer, comprising picking a semiconductor wafer to be polished in a load section, polishing the semiconductor wafer in the polishing section, and polishing. Rinse cleaning the subsequent semiconductor wafer, primary cleaning the rinsed semiconductor wafer, secondary cleaning the primary cleaned semiconductor wafer, and then drying and cleaning the cleaned semiconductor wafer to the unload section. A method of manufacturing a semiconductor device, which comprises returning. 64. A polishing method for cleaning a polishing target object after polishing, which is installed in a clean room by covering a polishing device with a cover, and the polishing target object is carried into the polishing device from the clean room. After polishing an object with one turntable, it is further polished with another turntable, the polishing object after polishing is washed and dried, and a clean polishing object that has been washed and dried is removed from the polishing device in a clean room. A polishing method characterized in that the polishing is carried out. 65. The polishing method according to claim 64, wherein the polishing object is inverted before polishing. 66. The polishing method according to claim 64, wherein the polishing object is inverted after polishing. 67. The polishing object to be polished is picked from baskets in a loading portion and an unloading portion that are integrally configured and arranged, and a clean polishing object that has been washed and dried after polishing is the basket. 65. The polishing method according to claim 64, wherein the polishing is performed again. 68. The polishing method according to claim 64, wherein the polishing target is cleaned and dried after rinsing and cleaning the polished target. 69. The cleaning of the polishing target object includes a step of first cleaning the polishing target object and a second cleaning step of second cleaning the polishing target object cleaned in the primary cleaning step. Item 65. The polishing method according to Item 64. 70. The polishing target object is polished by pressing the polishing target object against a turntable while holding the polishing target object by a top ring, and cleaning the top ring after releasing the polishing target object after polishing. The polishing method according to claim 64. 71. The polishing method according to claim 64, wherein the object to be polished is measured by a thickness gauge. 72. A polishing method for cleaning a polishing target object after polishing, which is installed in a clean room by covering a polishing device with a cover, and carries the polishing target object into the polishing device from the clean room. After polishing the object with one polishing cloth, further polishing with another polishing cloth, the polishing object after polishing is washed and dried, and the cleaned polishing object that has been washed and dried is transferred from the polishing device to a clean room. A polishing method characterized by carrying out. 73. The polishing method according to claim 72, wherein the polishing object is inverted before polishing. 74. The polishing method of claim 72, wherein the polishing object is inverted after polishing. 75. The polishing object to be polished is picked from the baskets at the loading portion and the unloading portion that are integrally configured and arranged, and the clean polishing object that has been washed and dried after polishing is the basket. 73. The polishing method according to claim 72, wherein the polishing is performed again. 76. The polishing method according to claim 72, wherein the polishing object is rinsed and washed, and then the polishing object is washed and dried. 77. The cleaning of the object to be polished includes a step of first cleaning the object to be polished and a second cleaning step of secondly cleaning the object to be polished cleaned in the primary cleaning step. Item 72. The polishing method according to Item 72. 78. The polishing of the polishing object is performed by pressing the polishing object against a polishing cloth while holding the polishing object by the top ring, and washing the top ring after releasing the polishing object after polishing. The polishing method according to claim 72. 79. The polishing method according to claim 72, wherein the object to be polished is measured with a thickness gauge.