SG10202004819TA - Carrier and substrate manufacturing method using this carrier - Google Patents
Carrier and substrate manufacturing method using this carrierInfo
- Publication number
- SG10202004819TA SG10202004819TA SG10202004819TA SG10202004819TA SG10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- substrate manufacturing
- substrate
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016073512 | 2016-03-31 | ||
JP2016073513 | 2016-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202004819TA true SG10202004819TA (en) | 2020-06-29 |
Family
ID=59966122
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201802381PA SG11201802381PA (en) | 2016-03-31 | 2017-03-31 | Carrier and substrate manufacturing method using this carrier |
SG10202004819TA SG10202004819TA (en) | 2016-03-31 | 2017-03-31 | Carrier and substrate manufacturing method using this carrier |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201802381PA SG11201802381PA (en) | 2016-03-31 | 2017-03-31 | Carrier and substrate manufacturing method using this carrier |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6236191B1 (en) |
CN (2) | CN112091811B (en) |
MY (1) | MY174348A (en) |
SG (2) | SG11201802381PA (en) |
WO (1) | WO2017171052A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108705421A (en) * | 2018-08-21 | 2018-10-26 | 德清明宇电子科技有限公司 | A kind of E-type magnetic core grinding device |
CN115870868A (en) * | 2022-12-27 | 2023-03-31 | 西安奕斯伟材料科技有限公司 | Loading and unloading device and method and silicon wafer double-side polishing equipment |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478412A (en) * | 1990-12-20 | 1995-12-26 | Monsanto Company | Plastic sheet for a laminated glazing and method for controlling adhesion and reducing blocking thereof |
JPH1110530A (en) * | 1997-06-25 | 1999-01-19 | Shin Etsu Handotai Co Ltd | Carrier for both-sided polishing |
WO2000035630A1 (en) * | 1998-12-14 | 2000-06-22 | Seiko Epson Corporation | Polishing carrier, surface polishing device, and surface polishing method |
JP2001179615A (en) * | 1999-12-27 | 2001-07-03 | Seiko Epson Corp | Polishing carrier, surface polishing device and surface polishing method |
JP4034056B2 (en) * | 2000-09-13 | 2008-01-16 | 日本板硝子株式会社 | Method for processing amorphous material |
IE20020146A1 (en) * | 2001-02-26 | 2002-09-18 | Shin Kobe Electric Machinery | Polished-piece holder and manufacturing method thereof |
JP2003236742A (en) * | 2002-02-20 | 2003-08-26 | Toshiba Ceramics Co Ltd | Carrier for lapping |
AU2003275575A1 (en) * | 2002-10-23 | 2004-06-07 | Hoya Corporation | Glass substrate for information recording medium and method for manufacturing same |
DE102005034119B3 (en) | 2005-07-21 | 2006-12-07 | Siltronic Ag | Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
JP2008000823A (en) * | 2006-06-20 | 2008-01-10 | Konica Minolta Opto Inc | Polishing carrier |
JP2008093746A (en) * | 2006-10-06 | 2008-04-24 | Shin Kobe Electric Mach Co Ltd | Manufacturing method of plate-like body for holding polishing object |
JP2009166228A (en) * | 2008-01-16 | 2009-07-30 | Kazumasa Onishi | Carrier plate for wafer polishing |
JP2009178806A (en) * | 2008-01-31 | 2009-08-13 | Seiko Epson Corp | Polishing carrier, and polishing device |
CN101579837A (en) * | 2008-05-13 | 2009-11-18 | 中芯国际集成电路制造(上海)有限公司 | Polishing pad adjusting device for chemical-mechanical polishing |
TWI550705B (en) * | 2008-06-04 | 2016-09-21 | 荏原製作所股份有限公司 | Polishing apparatus and polishing method |
CN101637888B (en) * | 2008-08-01 | 2013-09-18 | 智胜科技股份有限公司 | Grinding pad and method for manufacturing same |
SG193897A1 (en) * | 2011-04-27 | 2013-11-29 | Hoya Corp | Method for producing glass blank for magnetic disc, method for producing glass substrate for magnetic disc, and glass blank for magnetic disc |
JP6039698B2 (en) * | 2013-02-08 | 2016-12-07 | Hoya株式会社 | Manufacturing method of magnetic disk substrate and polishing pad used for manufacturing magnetic disk substrate |
JP5422767B1 (en) * | 2013-05-09 | 2014-02-19 | 信越エンジニアリング株式会社 | Bonding separation method and separation apparatus |
JP2015035245A (en) * | 2013-08-09 | 2015-02-19 | 旭硝子株式会社 | Glass substrate carrier, polishing method of glass substrate for magnetic recording medium, and manufacturing method of glass substrate for magnetic recording medium |
JP6152340B2 (en) * | 2013-12-26 | 2017-06-21 | Hoya株式会社 | Manufacturing method of disk-shaped substrate and carrier for grinding or polishing |
JP6312554B2 (en) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | Processing method of package substrate |
-
2017
- 2017-03-31 SG SG11201802381PA patent/SG11201802381PA/en unknown
- 2017-03-31 CN CN202011023491.3A patent/CN112091811B/en active Active
- 2017-03-31 SG SG10202004819TA patent/SG10202004819TA/en unknown
- 2017-03-31 WO PCT/JP2017/013739 patent/WO2017171052A1/en active Application Filing
- 2017-03-31 MY MYPI2018701106A patent/MY174348A/en unknown
- 2017-03-31 JP JP2017541416A patent/JP6236191B1/en active Active
- 2017-03-31 CN CN201780003634.4A patent/CN108349063B/en active Active
- 2017-10-27 JP JP2017207796A patent/JP7018292B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2017171052A1 (en) | 2018-04-05 |
CN112091811A (en) | 2020-12-18 |
CN108349063A (en) | 2018-07-31 |
CN108349063B (en) | 2020-10-27 |
JP6236191B1 (en) | 2017-11-22 |
MY174348A (en) | 2020-04-09 |
JP2018022549A (en) | 2018-02-08 |
SG11201802381PA (en) | 2018-04-27 |
WO2017171052A1 (en) | 2017-10-05 |
JP7018292B2 (en) | 2022-02-10 |
CN112091811B (en) | 2022-09-06 |
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