SG10202004819TA - Carrier and substrate manufacturing method using this carrier - Google Patents

Carrier and substrate manufacturing method using this carrier

Info

Publication number
SG10202004819TA
SG10202004819TA SG10202004819TA SG10202004819TA SG10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA SG 10202004819T A SG10202004819T A SG 10202004819TA
Authority
SG
Singapore
Prior art keywords
carrier
substrate manufacturing
substrate
manufacturing
Prior art date
Application number
SG10202004819TA
Inventor
Jaknarin Promchai
Original Assignee
Hoya Corp
Hoya Glass Disk Thailand Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp, Hoya Glass Disk Thailand Ltd filed Critical Hoya Corp
Publication of SG10202004819TA publication Critical patent/SG10202004819TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/28Work carriers for double side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG10202004819TA 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier SG10202004819TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073512 2016-03-31
JP2016073513 2016-03-31

Publications (1)

Publication Number Publication Date
SG10202004819TA true SG10202004819TA (en) 2020-06-29

Family

ID=59966122

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201802381PA SG11201802381PA (en) 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier
SG10202004819TA SG10202004819TA (en) 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201802381PA SG11201802381PA (en) 2016-03-31 2017-03-31 Carrier and substrate manufacturing method using this carrier

Country Status (5)

Country Link
JP (2) JP6236191B1 (en)
CN (2) CN112091811B (en)
MY (1) MY174348A (en)
SG (2) SG11201802381PA (en)
WO (1) WO2017171052A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108705421A (en) * 2018-08-21 2018-10-26 德清明宇电子科技有限公司 A kind of E-type magnetic core grinding device
CN115870868A (en) * 2022-12-27 2023-03-31 西安奕斯伟材料科技有限公司 Loading and unloading device and method and silicon wafer double-side polishing equipment

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478412A (en) * 1990-12-20 1995-12-26 Monsanto Company Plastic sheet for a laminated glazing and method for controlling adhesion and reducing blocking thereof
JPH1110530A (en) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd Carrier for both-sided polishing
WO2000035630A1 (en) * 1998-12-14 2000-06-22 Seiko Epson Corporation Polishing carrier, surface polishing device, and surface polishing method
JP2001179615A (en) * 1999-12-27 2001-07-03 Seiko Epson Corp Polishing carrier, surface polishing device and surface polishing method
JP4034056B2 (en) * 2000-09-13 2008-01-16 日本板硝子株式会社 Method for processing amorphous material
IE20020146A1 (en) * 2001-02-26 2002-09-18 Shin Kobe Electric Machinery Polished-piece holder and manufacturing method thereof
JP2003236742A (en) * 2002-02-20 2003-08-26 Toshiba Ceramics Co Ltd Carrier for lapping
AU2003275575A1 (en) * 2002-10-23 2004-06-07 Hoya Corporation Glass substrate for information recording medium and method for manufacturing same
DE102005034119B3 (en) 2005-07-21 2006-12-07 Siltronic Ag Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection
JP2008000823A (en) * 2006-06-20 2008-01-10 Konica Minolta Opto Inc Polishing carrier
JP2008093746A (en) * 2006-10-06 2008-04-24 Shin Kobe Electric Mach Co Ltd Manufacturing method of plate-like body for holding polishing object
JP2009166228A (en) * 2008-01-16 2009-07-30 Kazumasa Onishi Carrier plate for wafer polishing
JP2009178806A (en) * 2008-01-31 2009-08-13 Seiko Epson Corp Polishing carrier, and polishing device
CN101579837A (en) * 2008-05-13 2009-11-18 中芯国际集成电路制造(上海)有限公司 Polishing pad adjusting device for chemical-mechanical polishing
TWI550705B (en) * 2008-06-04 2016-09-21 荏原製作所股份有限公司 Polishing apparatus and polishing method
CN101637888B (en) * 2008-08-01 2013-09-18 智胜科技股份有限公司 Grinding pad and method for manufacturing same
SG193897A1 (en) * 2011-04-27 2013-11-29 Hoya Corp Method for producing glass blank for magnetic disc, method for producing glass substrate for magnetic disc, and glass blank for magnetic disc
JP6039698B2 (en) * 2013-02-08 2016-12-07 Hoya株式会社 Manufacturing method of magnetic disk substrate and polishing pad used for manufacturing magnetic disk substrate
JP5422767B1 (en) * 2013-05-09 2014-02-19 信越エンジニアリング株式会社 Bonding separation method and separation apparatus
JP2015035245A (en) * 2013-08-09 2015-02-19 旭硝子株式会社 Glass substrate carrier, polishing method of glass substrate for magnetic recording medium, and manufacturing method of glass substrate for magnetic recording medium
JP6152340B2 (en) * 2013-12-26 2017-06-21 Hoya株式会社 Manufacturing method of disk-shaped substrate and carrier for grinding or polishing
JP6312554B2 (en) * 2014-08-13 2018-04-18 株式会社ディスコ Processing method of package substrate

Also Published As

Publication number Publication date
JPWO2017171052A1 (en) 2018-04-05
CN112091811A (en) 2020-12-18
CN108349063A (en) 2018-07-31
CN108349063B (en) 2020-10-27
JP6236191B1 (en) 2017-11-22
MY174348A (en) 2020-04-09
JP2018022549A (en) 2018-02-08
SG11201802381PA (en) 2018-04-27
WO2017171052A1 (en) 2017-10-05
JP7018292B2 (en) 2022-02-10
CN112091811B (en) 2022-09-06

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