JP2019046850A5 - - Google Patents

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Publication number
JP2019046850A5
JP2019046850A5 JP2017165379A JP2017165379A JP2019046850A5 JP 2019046850 A5 JP2019046850 A5 JP 2019046850A5 JP 2017165379 A JP2017165379 A JP 2017165379A JP 2017165379 A JP2017165379 A JP 2017165379A JP 2019046850 A5 JP2019046850 A5 JP 2019046850A5
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JP
Japan
Prior art keywords
rate
speed
substrate
increased
change
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JP2017165379A
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Japanese (ja)
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JP6873011B2 (en
JP2019046850A (en
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Priority claimed from JP2017165379A external-priority patent/JP6873011B2/en
Priority to JP2017165379A priority Critical patent/JP6873011B2/en
Priority to PCT/JP2018/028337 priority patent/WO2019044314A1/en
Priority to KR1020197030074A priority patent/KR102296706B1/en
Priority to CN201880025759.1A priority patent/CN110537245B/en
Priority to TW107126312A priority patent/TWI669751B/en
Publication of JP2019046850A publication Critical patent/JP2019046850A/en
Publication of JP2019046850A5 publication Critical patent/JP2019046850A5/ja
Publication of JP6873011B2 publication Critical patent/JP6873011B2/en
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Description

第２の工程では、基板Ｗの被処理面の全体に拡がったレジスト液の厚みが増加するように、基板Ｗの回転速度が第２の速度Ａ２に調整され、レジスト液の吐出レートが第２のレートｒ２に調整される。本例では、時点ｔ３ａから時点ｔ４までの期間に基板Ｗの回転速度が第１の変化率で第１の速度Ａ１から中間速度Ａ１’まで上昇された後、時点ｔ４から基板Ｗの回転速度が第２の変化率で中間速度Ａ１’から第２の速度Ａ２まで上昇される。第２の変化率は第１の変化率よりも高い。
In the second step, the rotation speed of the substrate W is adjusted to the second speed A2 so that the thickness of the resist liquid spread over the entire surface to be treated of the substrate W is increased, and the discharge rate of the resist liquid is the second. The rate is adjusted to r2. In this example, after the rotation speed of the substrate W is increased from the first speed A1 to the intermediate speed A1'at the first rate of change during the period from the time point t3a to the time point t4, the rotation speed of the substrate W is increased from the time point t4. At the second rate of change, the intermediate speed A1'is increased to the second speed A2 . The second rate of change is higher than the first rate of change.

JP2017165379A 2017-08-30 2017-08-30 Substrate processing equipment and substrate processing method Active JP6873011B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (en) 2017-08-30 2017-08-30 Substrate processing equipment and substrate processing method
PCT/JP2018/028337 WO2019044314A1 (en) 2017-08-30 2018-07-27 Substrate processing apparatus and substrate processing method
KR1020197030074A KR102296706B1 (en) 2017-08-30 2018-07-27 Substrate processing apparatus and substrate processing method
CN201880025759.1A CN110537245B (en) 2017-08-30 2018-07-27 Substrate processing apparatus and substrate processing method
TW107126312A TWI669751B (en) 2017-08-30 2018-07-30 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (en) 2017-08-30 2017-08-30 Substrate processing equipment and substrate processing method

Publications (3)

Publication Number Publication Date
JP2019046850A JP2019046850A (en) 2019-03-22
JP2019046850A5 true JP2019046850A5 (en) 2020-09-10
JP6873011B2 JP6873011B2 (en) 2021-05-19

Family

ID=65526446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017165379A Active JP6873011B2 (en) 2017-08-30 2017-08-30 Substrate processing equipment and substrate processing method

Country Status (5)

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JP (1) JP6873011B2 (en)
KR (1) KR102296706B1 (en)
CN (1) CN110537245B (en)
TW (1) TWI669751B (en)
WO (1) WO2019044314A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202116420A (en) * 2019-07-04 2021-05-01 日商東京威力科創股份有限公司 Coating method and coating device
JP2022178623A (en) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス Coating method and coating system
JP2022178694A (en) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス Coating method and coating system
KR102600411B1 (en) * 2021-08-12 2023-11-09 세메스 주식회사 Apparatus for treating substrate and method for treating substrate
KR102488391B1 (en) 2022-01-11 2023-01-13 (주)예성글로벌 Panic device with door closer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100284556B1 (en) * 1993-03-25 2001-04-02 다카시마 히로시 Coating film forming method and apparatus therefor
JP3471168B2 (en) * 1996-04-25 2003-11-25 大日本スクリーン製造株式会社 Substrate processing method and apparatus
JP3527459B2 (en) 2000-04-12 2004-05-17 東京エレクトロン株式会社 Coating film forming method and coating processing apparatus
JP5065071B2 (en) * 2007-03-15 2012-10-31 東京エレクトロン株式会社 Coating processing method, coating processing apparatus, and computer-readable storage medium
JP4745358B2 (en) * 2008-03-04 2011-08-10 株式会社東芝 Spin coating method and spin coating apparatus
JP5091722B2 (en) * 2008-03-04 2012-12-05 東京エレクトロン株式会社 Coating processing method, program, computer storage medium, and coating processing apparatus
KR101447759B1 (en) * 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 Application processing method and application processing apparatus
JP5485672B2 (en) * 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
JP5337180B2 (en) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 Coating processing method, program, computer storage medium, and coating processing apparatus
JP2014050803A (en) * 2012-09-07 2014-03-20 Toshiba Corp Rotary application equipment and rotary application method
TWI666684B (en) * 2015-11-16 2019-07-21 日商東京威力科創股份有限公司 Coating film forming method, coating film forming device and memory medium
JP6374373B2 (en) * 2015-12-04 2018-08-15 東芝メモリ株式会社 Spin coater

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