JP2018006758A5 - - Google Patents
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- Publication number
- JP2018006758A5 JP2018006758A5 JP2017130351A JP2017130351A JP2018006758A5 JP 2018006758 A5 JP2018006758 A5 JP 2018006758A5 JP 2017130351 A JP2017130351 A JP 2017130351A JP 2017130351 A JP2017130351 A JP 2017130351A JP 2018006758 A5 JP2018006758 A5 JP 2018006758A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plasma
- infrared radiation
- dicing
- condition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1611652.7 | 2016-07-04 | ||
| GBGB1611652.7A GB201611652D0 (en) | 2016-07-04 | 2016-07-04 | Method of detecting a condition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018006758A JP2018006758A (ja) | 2018-01-11 |
| JP2018006758A5 true JP2018006758A5 (https=) | 2020-08-13 |
| JP6837395B2 JP6837395B2 (ja) | 2021-03-03 |
Family
ID=56891252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017130351A Active JP6837395B2 (ja) | 2016-07-04 | 2017-07-03 | 状態検出方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10366899B2 (https=) |
| EP (1) | EP3267465B1 (https=) |
| JP (1) | JP6837395B2 (https=) |
| KR (1) | KR102165795B1 (https=) |
| CN (1) | CN107579044B (https=) |
| GB (1) | GB201611652D0 (https=) |
| TW (1) | TWI713757B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105719965A (zh) * | 2014-12-04 | 2016-06-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 二氧化硅基片的刻蚀方法和刻蚀设备 |
| US10636686B2 (en) | 2018-02-27 | 2020-04-28 | Lam Research Corporation | Method monitoring chamber drift |
| JP2020072141A (ja) * | 2018-10-30 | 2020-05-07 | 株式会社ディスコ | プラズマエッチング装置及びウェーハの加工方法 |
| CN110729186A (zh) * | 2019-10-24 | 2020-01-24 | 东莞记忆存储科技有限公司 | 一种晶圆切割及分离的加工工艺方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1071579A (en) * | 1976-09-13 | 1980-02-12 | Northern Telecom Limited | End point control in plasma etching |
| JPS62190728A (ja) | 1986-02-18 | 1987-08-20 | Nippon Telegr & Teleph Corp <Ntt> | エツチング終点モニタ法および装置 |
| JPH04206927A (ja) | 1990-11-30 | 1992-07-28 | Tokuda Seisakusho Ltd | エッチング装置 |
| US5200023A (en) * | 1991-08-30 | 1993-04-06 | International Business Machines Corp. | Infrared thermographic method and apparatus for etch process monitoring and control |
| DE4241045C1 (de) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
| US6174407B1 (en) * | 1998-12-03 | 2001-01-16 | Lsi Logic Corporation | Apparatus and method for detecting an endpoint of an etching process by transmitting infrared light signals through a semiconductor wafer |
| US7053994B2 (en) * | 2003-10-28 | 2006-05-30 | Lam Research Corporation | Method and apparatus for etch endpoint detection |
| US7507638B2 (en) * | 2004-06-30 | 2009-03-24 | Freescale Semiconductor, Inc. | Ultra-thin die and method of fabricating same |
| US7560007B2 (en) * | 2006-09-11 | 2009-07-14 | Lam Research Corporation | In-situ wafer temperature measurement and control |
| US7946759B2 (en) * | 2007-02-16 | 2011-05-24 | Applied Materials, Inc. | Substrate temperature measurement by infrared transmission |
| CN100475414C (zh) * | 2007-06-29 | 2009-04-08 | 华中科技大学 | 三维激光焊接和切割过程的实时监测装置 |
| CN101419996B (zh) * | 2008-12-04 | 2010-09-22 | 中国电子科技集团公司第十三研究所 | 红外—紫外多色探测器及其制备方法 |
| US8802545B2 (en) * | 2011-03-14 | 2014-08-12 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
| US8912077B2 (en) * | 2011-06-15 | 2014-12-16 | Applied Materials, Inc. | Hybrid laser and plasma etch wafer dicing using substrate carrier |
| US8557682B2 (en) * | 2011-06-15 | 2013-10-15 | Applied Materials, Inc. | Multi-layer mask for substrate dicing by laser and plasma etch |
| CN104285500B (zh) * | 2012-05-08 | 2017-11-28 | Ams传感器英国有限公司 | 红外线发射器与ndir传感器 |
| CA2918687C (en) | 2013-07-18 | 2020-04-14 | Fasetto, Inc. | System and method for multi-angle videos |
| US9299614B2 (en) * | 2013-12-10 | 2016-03-29 | Applied Materials, Inc. | Method and carrier for dicing a wafer |
| CN106068548B (zh) * | 2014-03-07 | 2020-02-28 | 等离子瑟姆有限公司 | 用于对半导体晶圆进行等离子体切片的方法和设备 |
| JP6101227B2 (ja) * | 2014-03-17 | 2017-03-22 | 株式会社東芝 | プラズマダイシング方法およびプラズマダイシング装置 |
| US9034771B1 (en) * | 2014-05-23 | 2015-05-19 | Applied Materials, Inc. | Cooling pedestal for dicing tape thermal management during plasma dicing |
| US10153204B2 (en) * | 2014-06-04 | 2018-12-11 | Flir Systems, Inc. | Wafer level packaging of reduced-height infrared detectors |
| SG10201903242QA (en) | 2014-10-13 | 2019-05-30 | Utac Headquarters Pte Ltd | Methods for singulating semiconductor wafer |
-
2016
- 2016-07-04 GB GBGB1611652.7A patent/GB201611652D0/en not_active Ceased
-
2017
- 2017-06-19 US US15/626,250 patent/US10366899B2/en active Active
- 2017-06-26 KR KR1020170080623A patent/KR102165795B1/ko active Active
- 2017-06-28 TW TW106121590A patent/TWI713757B/zh active
- 2017-07-03 JP JP2017130351A patent/JP6837395B2/ja active Active
- 2017-07-03 CN CN201710534660.1A patent/CN107579044B/zh active Active
- 2017-07-03 EP EP17179411.8A patent/EP3267465B1/en active Active
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