JP6837395B2 - 状態検出方法 - Google Patents
状態検出方法 Download PDFInfo
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- JP6837395B2 JP6837395B2 JP2017130351A JP2017130351A JP6837395B2 JP 6837395 B2 JP6837395 B2 JP 6837395B2 JP 2017130351 A JP2017130351 A JP 2017130351A JP 2017130351 A JP2017130351 A JP 2017130351A JP 6837395 B2 JP6837395 B2 JP 6837395B2
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- 238000001514 detection method Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 100
- 230000008569 process Effects 0.000 claims description 79
- 238000005530 etching Methods 0.000 claims description 49
- 230000005855 radiation Effects 0.000 claims description 44
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 239000010703 silicon Substances 0.000 claims description 27
- 238000001020 plasma etching Methods 0.000 claims description 24
- 238000013459 approach Methods 0.000 claims description 11
- 230000000737 periodic effect Effects 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 8
- 238000012544 monitoring process Methods 0.000 claims description 8
- 238000005137 deposition process Methods 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 239000000463 material Substances 0.000 description 19
- 239000007789 gas Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000009623 Bosch process Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- OEYOHULQRFXULB-UHFFFAOYSA-N arsenic trichloride Chemical compound Cl[As](Cl)Cl OEYOHULQRFXULB-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32963—End-point detection
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32972—Spectral analysis
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67063—Apparatus for fluid treatment for etching
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0203—Etching
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
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Description
非金属基板であって、当該基板上に画定された複数のダイシングレーンを有する非金属基板を用意するステップ;
ダイシングレーンに沿って基板をプラズマエッチングするステップであって、プラズマエッチング中に、ダイシングレーンの少なくとも一部から発せされた赤外線放射を監視して、ダイシングレーンからの赤外線放射の増加を、プラズマダイシング作業の最終段階に入ったとして観測するステップ;及び
監視した赤外線放射からプラズマダイシングの最終段階に関連する状態を検出するステップ;
を含む方法が提供される。
この状態は、終点のアプローチであってもよい。
基板は、GaAs、GaN、InP又はSiCであってもよい。
チャンバ;
ダイシングレーンを有する種類の非金属基板を支持するための基板支持部;
ダイシングレーンに沿って基板をエッチングするのに適した、チャンバ内にプラズマを生成させるためのプラズマ発生器;
ダイシングレーンの少なくとも一部から発せられた赤外線放射を監視するための赤外線検出器;及び
監視した赤外線放射からプラズマダイシングプロセスの最終段階に関連する状態を検出するように構成された状態検出器;
を備えるプラズマダイシング装置が提供される。
Claims (20)
- プラズマダイシングプロセスの制御方法であって、
複数の指定されたダイシングレーンを有する非金属基板を用意するステップと、
前記ダイシングレーンに沿って前記基板をプラズマエッチングするステップと、
前記プラズマエッチング中に、前記基板の前記ダイシングレーンの少なくとも一部による赤外線放射の発光を監視して、前記ダイシングレーンによる赤外線放射による赤外線放射の増加を検出するステップと、
前記ダイシングレーンに沿った前記基板のシンギュレーションに先立ち、前記赤外線放射の増加が検出されると、前記プラズマダイシングプロセスの最終段階に関連する状態が存在すると判断するステップと、
を含む、方法。 - 少なくとも1つのプロセス変数が、前記ダイシングレーンに沿った前記基板のシンギュレーションに先立ち、前記状態が存在するとの判断に応じて変更される、請求項1に記載の方法。
- 前記プロセス変数を変更して前記プラズマエッチングを調整する、請求項2に記載の方法。
- 前記プラズマエッチングを調整して前記基板のエッチング速度を減少させる、請求項3に記載の方法。
- 前記プロセス変数を変更して前記プラズマダイシングプロセスに関連する温度を制御する、請求項2に記載の方法。
- 前記状態が存在するとの判断に応じて前記プラズマエッチングを停止する、請求項2に記載の方法。
- 前記状態が前記プラズマダイシングプロセスの終点のアプローチである、請求項1に記載の方法。
- 前記状態が前記プラズマダイシングプロセスの終点である、請求項1に記載の方法。
- 前記終点は、前記監視した赤外線放射の発光から直接判断される、請求項8に記載の方法。
- 前記監視するステップが、前記赤外線放射の増加の検出後に、前記ダイシングレーンによる赤外線放射の発光による、赤外線放射の減少を検出して、前記プラズマダイシングプロセスの終点を直接判断することを含む、請求項9に記載の方法。
- 前記プラズマダイシングプロセスの終点が、前記ダイシングレーンから発光した前記赤外線放射の増加の検出に基づいて事前に予測される、請求項1に記載の方法。
- 前記終点が、前記検出された赤外線放射の増加を数値モデルと比較することによって予測される、請求項11に記載の方法。
- 前記基板がテープによりフレームに取り付けられる、請求項1に記載の方法。
- 前記プラズマダイシングプロセスの終点に関連する状態が存在するとの前記判断に応答して少なくとも1つのプロセス変数を変更して前記テープの温度を制御する、請求項13に記載の方法。
- 前記基板が半導体基板である、請求項1に記載の方法。
- 前記基板が、シリコン、GaAs、GaN、InPまたはSiCである、請求項15に記載の方法。
- 前記プラズマエッチングプロセスが、周期的なエッチングと堆積のプロセスである、請求項1に記載の方法。
- 前記方法が、前記基板から発光する赤外線放射を生成するための専用の放射源で基板を照射することなく実行されるとともに、監視されて前記プラズマダイシングプロセスを制御する、請求項1に記載の方法。
- 前記プラズマエッチングが、前記基板の第1の表面から対向する前記基板の第2の表面に向かって前記基板を通過して進行し、前記基板の前記第2の表面にテープが貼付され、赤外線放射の前記増加が検出されることで前記プラズマエッチングの実行中に前記テープが暴露される前に前記状態が存在すると判断され、前記状態が存在するとの前記判断に応答して、前記プラズマエッチングの実行中に前記テープが暴露する前に、少なくとも1つのプロセス変数が変更される、請求項1に記載の方法。
- 前記プラズマエッチングが、前記基板の第1の表面から対向する前記基板の第2の表面に向かって前記基板を通過して進行し、赤外線放射の前記増加が検出されることで前記プラズマエッチングの実行中に前記基板の前記第2の表面に到達する前に前記状態が存在すると判断され、前記状態が存在するとの前記判断に応答して、前記プラズマエッチングの実行中に前記基板の前記第2の表面に到達する前に、少なくとも1つのプロセス変数が変更される、請求項1に記載の方法。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1071579A (en) * | 1976-09-13 | 1980-02-12 | Northern Telecom Limited | End point control in plasma etching |
JPS62190728A (ja) | 1986-02-18 | 1987-08-20 | Nippon Telegr & Teleph Corp <Ntt> | エツチング終点モニタ法および装置 |
JPH04206927A (ja) | 1990-11-30 | 1992-07-28 | Tokuda Seisakusho Ltd | エッチング装置 |
US5200023A (en) * | 1991-08-30 | 1993-04-06 | International Business Machines Corp. | Infrared thermographic method and apparatus for etch process monitoring and control |
DE4241045C1 (de) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
US6174407B1 (en) * | 1998-12-03 | 2001-01-16 | Lsi Logic Corporation | Apparatus and method for detecting an endpoint of an etching process by transmitting infrared light signals through a semiconductor wafer |
US7053994B2 (en) * | 2003-10-28 | 2006-05-30 | Lam Research Corporation | Method and apparatus for etch endpoint detection |
US7507638B2 (en) * | 2004-06-30 | 2009-03-24 | Freescale Semiconductor, Inc. | Ultra-thin die and method of fabricating same |
US7560007B2 (en) * | 2006-09-11 | 2009-07-14 | Lam Research Corporation | In-situ wafer temperature measurement and control |
US7946759B2 (en) * | 2007-02-16 | 2011-05-24 | Applied Materials, Inc. | Substrate temperature measurement by infrared transmission |
CN100475414C (zh) * | 2007-06-29 | 2009-04-08 | 华中科技大学 | 三维激光焊接和切割过程的实时监测装置 |
CN101419996B (zh) * | 2008-12-04 | 2010-09-22 | 中国电子科技集团公司第十三研究所 | 红外—紫外多色探测器及其制备方法 |
US8802545B2 (en) * | 2011-03-14 | 2014-08-12 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
US8557682B2 (en) * | 2011-06-15 | 2013-10-15 | Applied Materials, Inc. | Multi-layer mask for substrate dicing by laser and plasma etch |
US8912077B2 (en) * | 2011-06-15 | 2014-12-16 | Applied Materials, Inc. | Hybrid laser and plasma etch wafer dicing using substrate carrier |
EP2848087B1 (en) * | 2012-05-08 | 2017-11-15 | AMS Sensors UK Limited | Ir emitter and ndir sensor |
EP3022638B1 (en) | 2013-07-18 | 2018-04-04 | Fasetto, L.L.C. | System and method for multi-angle videos |
US9299614B2 (en) * | 2013-12-10 | 2016-03-29 | Applied Materials, Inc. | Method and carrier for dicing a wafer |
WO2015134111A1 (en) | 2014-03-07 | 2015-09-11 | Plasma-Therm, Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
JP6101227B2 (ja) * | 2014-03-17 | 2017-03-22 | 株式会社東芝 | プラズマダイシング方法およびプラズマダイシング装置 |
US9034771B1 (en) * | 2014-05-23 | 2015-05-19 | Applied Materials, Inc. | Cooling pedestal for dicing tape thermal management during plasma dicing |
US10153204B2 (en) * | 2014-06-04 | 2018-12-11 | Flir Systems, Inc. | Wafer level packaging of reduced-height infrared detectors |
SG10201903242QA (en) | 2014-10-13 | 2019-05-30 | Utac Headquarters Pte Ltd | Methods for singulating semiconductor wafer |
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