JP2017527448A5 - - Google Patents

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Publication number
JP2017527448A5
JP2017527448A5 JP2017512713A JP2017512713A JP2017527448A5 JP 2017527448 A5 JP2017527448 A5 JP 2017527448A5 JP 2017512713 A JP2017512713 A JP 2017512713A JP 2017512713 A JP2017512713 A JP 2017512713A JP 2017527448 A5 JP2017527448 A5 JP 2017527448A5
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JP
Japan
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layer
cover
cover according
beauty
upper side
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JP2017512713A
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English (en)
Japanese (ja)
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JP6704902B2 (ja
JP2017527448A (ja
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Priority claimed from DE102014112672.6A external-priority patent/DE102014112672B4/de
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Publication of JP2017527448A publication Critical patent/JP2017527448A/ja
Publication of JP2017527448A5 publication Critical patent/JP2017527448A5/ja
Application granted granted Critical
Publication of JP6704902B2 publication Critical patent/JP6704902B2/ja
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JP2017512713A 2014-09-03 2015-08-25 コンポーネント用カバー及びコンポーネント用カバーの製造方法 Active JP6704902B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014112672.6 2014-09-03
DE102014112672.6A DE102014112672B4 (de) 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement
PCT/EP2015/069453 WO2016034456A1 (de) 2014-09-03 2015-08-25 Abdeckung für ein bauelement und verfahren zur herstellung einer abdeckung für ein bauelement

Publications (3)

Publication Number Publication Date
JP2017527448A JP2017527448A (ja) 2017-09-21
JP2017527448A5 true JP2017527448A5 (enExample) 2018-09-20
JP6704902B2 JP6704902B2 (ja) 2020-06-03

Family

ID=54011027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017512713A Active JP6704902B2 (ja) 2014-09-03 2015-08-25 コンポーネント用カバー及びコンポーネント用カバーの製造方法

Country Status (11)

Country Link
US (1) US11180364B2 (enExample)
EP (1) EP3189589B1 (enExample)
JP (1) JP6704902B2 (enExample)
KR (1) KR102493250B1 (enExample)
CN (1) CN106715326B (enExample)
BR (1) BR112017004373A2 (enExample)
DE (1) DE102014112672B4 (enExample)
ES (1) ES2851385T3 (enExample)
HU (1) HUE052699T2 (enExample)
MX (1) MX2017002903A (enExample)
WO (1) WO2016034456A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013102223B4 (de) * 2013-03-06 2014-09-18 Epcos Ag Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung
US10442683B2 (en) 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device
DE102022205075A1 (de) 2022-05-20 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauteil für eine Sensor-, Mikrofon- und/oder Mikrolautsprechervorrichtung

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2418794A1 (de) * 1974-04-19 1975-11-06 Rag Domenico Tinaro Bauelement in form einer stahlbetonplatte
US4931346A (en) * 1988-12-19 1990-06-05 Book Covers Inc. Lightweight laminated paperboard
CA2092061C (en) * 1992-03-30 2001-12-25 Wolf-Henning Laves A corrugated board
DE4424775A1 (de) * 1994-07-05 1996-01-11 Grace Gmbh Antiblockingmittel und Verfahren zu dessen Herstellung
EP0867701A1 (en) 1997-03-28 1998-09-30 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of an infrared radiation detector and more particularly an infrared sensitive bolometer
US6087638A (en) * 1997-07-15 2000-07-11 Silverbrook Research Pty Ltd Corrugated MEMS heater structure
CN1265678A (zh) * 1997-08-15 2000-09-06 陶氏化学公司 高内相乳液和由其制备的多孔材料
DE10006035A1 (de) * 2000-02-10 2001-08-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement
EP1251099A3 (en) 2000-03-24 2004-07-21 Interuniversitair Microelektronica Centrum Vzw Method of improving mechanical strength in micro electro mechanical systems and devices produced thereof
US20020141712A1 (en) * 2001-03-29 2002-10-03 O'connor Lawrence Coated steel tape
CA2398033C (en) * 2002-03-19 2005-06-14 Carlo Fascio Corrugated packaging and insulation material
KR100853220B1 (ko) * 2002-04-04 2008-08-20 삼성전자주식회사 표시 장치용 박막 트랜지스터 어레이 기판의 제조 방법
US6806557B2 (en) * 2002-09-30 2004-10-19 Motorola, Inc. Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum
US7405924B2 (en) 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7417307B2 (en) * 2005-07-29 2008-08-26 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
FR2901264B1 (fr) 2006-05-22 2008-10-10 Commissariat Energie Atomique Microcomposant muni d'une cavite delimitee par un capot a resistance mecanique amelioree
JP5435199B2 (ja) 2008-01-11 2014-03-05 セイコーエプソン株式会社 機能デバイス及びその製造方法
US8592925B2 (en) 2008-01-11 2013-11-26 Seiko Epson Corporation Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
US8554579B2 (en) 2008-10-13 2013-10-08 Fht, Inc. Management, reporting and benchmarking of medication preparation
EP2349914A2 (en) 2008-10-29 2011-08-03 Nxp B.V. An integrated component and a method of manufacturing an integrated component
JP5073772B2 (ja) * 2009-09-16 2012-11-14 日本電波工業株式会社 圧電デバイス
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法
JP5204171B2 (ja) * 2010-08-25 2013-06-05 株式会社東芝 電気部品およびその製造方法
DE102011103516B4 (de) 2011-06-03 2015-01-22 Epcos Ag Verfahren zum Befüllen eines Hohlraums mit einer Atmosphäre
JP2014155980A (ja) * 2013-02-15 2014-08-28 Toshiba Corp 電気部品およびその製造方法
US10442683B2 (en) * 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device

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