JP2017523585A5 - - Google Patents

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Publication number
JP2017523585A5
JP2017523585A5 JP2017515674A JP2017515674A JP2017523585A5 JP 2017523585 A5 JP2017523585 A5 JP 2017523585A5 JP 2017515674 A JP2017515674 A JP 2017515674A JP 2017515674 A JP2017515674 A JP 2017515674A JP 2017523585 A5 JP2017523585 A5 JP 2017523585A5
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JP
Japan
Prior art keywords
dielectric tube
coil
coupled
terminals
conduit
Prior art date
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JP2017515674A
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English (en)
Japanese (ja)
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JP2017523585A (ja
JP6641359B2 (ja
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Priority claimed from US14/445,965 external-priority patent/US9378928B2/en
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Publication of JP2017523585A publication Critical patent/JP2017523585A/ja
Publication of JP2017523585A5 publication Critical patent/JP2017523585A5/ja
Application granted granted Critical
Publication of JP6641359B2 publication Critical patent/JP6641359B2/ja
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JP2017515674A 2014-05-29 2015-05-04 導管内でガスを処置するための装置 Active JP6641359B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462004857P 2014-05-29 2014-05-29
US62/004,857 2014-05-29
US14/445,965 2014-07-29
US14/445,965 US9378928B2 (en) 2014-05-29 2014-07-29 Apparatus for treating a gas in a conduit
PCT/US2015/029068 WO2015183479A1 (en) 2014-05-29 2015-05-04 Apparatus for treating a gas in a conduit

Publications (3)

Publication Number Publication Date
JP2017523585A JP2017523585A (ja) 2017-08-17
JP2017523585A5 true JP2017523585A5 (enExample) 2018-06-14
JP6641359B2 JP6641359B2 (ja) 2020-02-05

Family

ID=54699525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017515674A Active JP6641359B2 (ja) 2014-05-29 2015-05-04 導管内でガスを処置するための装置

Country Status (6)

Country Link
US (2) US9378928B2 (enExample)
JP (1) JP6641359B2 (enExample)
KR (1) KR101805612B1 (enExample)
CN (1) CN106414800B (enExample)
TW (1) TWI607577B (enExample)
WO (1) WO2015183479A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10187966B2 (en) * 2015-07-24 2019-01-22 Applied Materials, Inc. Method and apparatus for gas abatement
US10435787B2 (en) 2016-11-14 2019-10-08 Applied Materials, Inc. Hydrogen partial pressure control in a vacuum process chamber
US10777394B2 (en) 2016-12-09 2020-09-15 Applied Materials, Inc. Virtual sensor for chamber cleaning endpoint
JP7042142B2 (ja) * 2018-03-30 2022-03-25 株式会社ダイヘン プラズマ発生装置
JP7042143B2 (ja) * 2018-03-30 2022-03-25 株式会社ダイヘン プラズマ発生装置
KR102571335B1 (ko) * 2020-02-19 2023-08-30 인투코어테크놀로지 주식회사 안테나 구조체 및 이를 이용한 플라즈마 발생 장치
TWI816087B (zh) 2020-02-19 2023-09-21 南韓商源多可股份有限公司 天線結構
CN116034496A (zh) 2020-06-25 2023-04-28 6K有限公司 微观复合合金结构
JP2024504091A (ja) 2021-01-11 2024-01-30 シックスケー インコーポレイテッド マイクロ波プラズマ処理を用いたLiイオンカソード物質の再生利用のための方法及びシステム
AU2022246797A1 (en) 2021-03-31 2023-10-05 6K Inc. Systems and methods for additive manufacturing of metal nitride ceramics
WO2023229928A1 (en) 2022-05-23 2023-11-30 6K Inc. Microwave plasma apparatus and methods for processing materials using an interior liner
US12040162B2 (en) 2022-06-09 2024-07-16 6K Inc. Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows
WO2024044498A1 (en) * 2022-08-25 2024-02-29 6K Inc. Plasma apparatus and methods for processing feed material utilizing a powder ingress preventor (pip)
US12195338B2 (en) 2022-12-15 2025-01-14 6K Inc. Systems, methods, and device for pyrolysis of methane in a microwave plasma for hydrogen and structured carbon powder production

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875068A (en) 1973-02-20 1975-04-01 Tegal Corp Gaseous plasma reaction apparatus
US4362632A (en) 1974-08-02 1982-12-07 Lfe Corporation Gas discharge apparatus
US4278450A (en) 1979-10-09 1981-07-14 Georgia Tech Research Institute Method for the recovery of clean pyrolysis off-gas and a rotary recycling means therefor
JPS6482521A (en) * 1987-09-25 1989-03-28 Toshiba Corp High-frequency coil
TW347547B (en) * 1994-05-17 1998-12-11 Toshiba Light Technic Kk Discharge lamp and illumination apparatus using the same
JP3349369B2 (ja) * 1996-11-11 2002-11-25 三菱重工業株式会社 ストリーマ放電排ガス処理装置及び方法
US6657173B2 (en) * 1998-04-21 2003-12-02 State Board Of Higher Education On Behalf Of Oregon State University Variable frequency automated capacitive radio frequency (RF) dielectric heating system
US7175054B2 (en) * 1998-12-23 2007-02-13 S.I.P. Technologies, Llc Method and apparatus for disinfecting a refrigerated water cooler reservoir
JP3709432B2 (ja) * 1999-04-30 2005-10-26 アプライド マテリアルズ インコーポレイテッド 排ガス処理装置及び基板処理装置
US6287643B1 (en) * 1999-09-30 2001-09-11 Novellus Systems, Inc. Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor
JP2002210330A (ja) 2001-01-19 2002-07-30 Pearl Kogyo Kk 半導体プロセス用排ガス処理装置
JP4567979B2 (ja) * 2004-01-15 2010-10-27 キヤノンアネルバ株式会社 プラズマ処理システム及びプラズマ処理方法
US20060081185A1 (en) * 2004-10-15 2006-04-20 Justin Mauck Thermal management of dielectric components in a plasma discharge device
ITMI20050585A1 (it) * 2005-04-07 2006-10-08 Francesco Cino Matacotta Apparato e processo per la generazione accelerazione e propagazione di fasci di elettroni e plasma
DE102006012100B3 (de) * 2006-03-16 2007-09-20 Maschinenfabrik Reinhausen Gmbh Vorrichtung zur Erzeugung eines Plasma-Jets
US20080156264A1 (en) * 2006-12-27 2008-07-03 Novellus Systems, Inc. Plasma Generator Apparatus
JP4950763B2 (ja) * 2007-05-25 2012-06-13 大陽日酸株式会社 プラズマ生成装置
JP4952472B2 (ja) * 2007-09-20 2012-06-13 ウシオ電機株式会社 エキシマランプおよびエキシマランプの製造方法
US9591738B2 (en) * 2008-04-03 2017-03-07 Novellus Systems, Inc. Plasma generator systems and methods of forming plasma
JP5099101B2 (ja) * 2009-01-23 2012-12-12 東京エレクトロン株式会社 プラズマ処理装置
US8475673B2 (en) 2009-04-24 2013-07-02 Lam Research Company Method and apparatus for high aspect ratio dielectric etch
US8604697B2 (en) * 2009-12-09 2013-12-10 Jehara Corporation Apparatus for generating plasma
US9867238B2 (en) 2012-04-26 2018-01-09 Applied Materials, Inc. Apparatus for treating an exhaust gas in a foreline

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