TWI607577B - 用於處理管路中的氣體的設備 - Google Patents
用於處理管路中的氣體的設備 Download PDFInfo
- Publication number
- TWI607577B TWI607577B TW104116295A TW104116295A TWI607577B TW I607577 B TWI607577 B TW I607577B TW 104116295 A TW104116295 A TW 104116295A TW 104116295 A TW104116295 A TW 104116295A TW I607577 B TWI607577 B TW I607577B
- Authority
- TW
- Taiwan
- Prior art keywords
- coil
- dielectric tube
- coupled
- radio frequency
- endpoints
- Prior art date
Links
- 239000002826 coolant Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 17
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 2
- 229910052707 ruthenium Inorganic materials 0.000 claims 2
- 238000013022 venting Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 61
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
- H01J37/32844—Treating effluent gases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/2465—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated by inductive coupling, e.g. using coiled electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Fluid Mechanics (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462004857P | 2014-05-29 | 2014-05-29 | |
| US14/445,965 US9378928B2 (en) | 2014-05-29 | 2014-07-29 | Apparatus for treating a gas in a conduit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201601339A TW201601339A (zh) | 2016-01-01 |
| TWI607577B true TWI607577B (zh) | 2017-12-01 |
Family
ID=54699525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104116295A TWI607577B (zh) | 2014-05-29 | 2015-05-21 | 用於處理管路中的氣體的設備 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9378928B2 (enExample) |
| JP (1) | JP6641359B2 (enExample) |
| KR (1) | KR101805612B1 (enExample) |
| CN (1) | CN106414800B (enExample) |
| TW (1) | TWI607577B (enExample) |
| WO (1) | WO2015183479A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10187966B2 (en) * | 2015-07-24 | 2019-01-22 | Applied Materials, Inc. | Method and apparatus for gas abatement |
| US10435787B2 (en) | 2016-11-14 | 2019-10-08 | Applied Materials, Inc. | Hydrogen partial pressure control in a vacuum process chamber |
| US10777394B2 (en) | 2016-12-09 | 2020-09-15 | Applied Materials, Inc. | Virtual sensor for chamber cleaning endpoint |
| JP7042142B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| JP7042143B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| WO2021167408A1 (ko) | 2020-02-19 | 2021-08-26 | 인투코어테크놀로지 주식회사 | 안테나 구조체 및 이를 이용한 플라즈마 발생 장치 |
| KR102571335B1 (ko) * | 2020-02-19 | 2023-08-30 | 인투코어테크놀로지 주식회사 | 안테나 구조체 및 이를 이용한 플라즈마 발생 장치 |
| CN116034496A (zh) | 2020-06-25 | 2023-04-28 | 6K有限公司 | 微观复合合金结构 |
| CA3197544A1 (en) | 2021-01-11 | 2022-07-14 | 6K Inc. | Methods and systems for reclamation of li-ion cathode materials using microwave plasma processing |
| US12042861B2 (en) | 2021-03-31 | 2024-07-23 | 6K Inc. | Systems and methods for additive manufacturing of metal nitride ceramics |
| US12261023B2 (en) | 2022-05-23 | 2025-03-25 | 6K Inc. | Microwave plasma apparatus and methods for processing materials using an interior liner |
| US12040162B2 (en) | 2022-06-09 | 2024-07-16 | 6K Inc. | Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows |
| WO2024044498A1 (en) * | 2022-08-25 | 2024-02-29 | 6K Inc. | Plasma apparatus and methods for processing feed material utilizing a powder ingress preventor (pip) |
| US12195338B2 (en) | 2022-12-15 | 2025-01-14 | 6K Inc. | Systems, methods, and device for pyrolysis of methane in a microwave plasma for hydrogen and structured carbon powder production |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6287643B1 (en) * | 1999-09-30 | 2001-09-11 | Novellus Systems, Inc. | Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor |
| CN100403854C (zh) * | 2001-08-23 | 2008-07-16 | 俄勒冈州，由高等教育州委员会代表俄勒冈州立大学 | 变频自动电容射频(rf)介电加热系统 |
| CN102405512A (zh) * | 2009-04-24 | 2012-04-04 | 朗姆研究公司 | 用于高深宽比的电介质蚀刻的方法及装置 |
| TW201415956A (zh) * | 2009-01-23 | 2014-04-16 | Tokyo Electron Ltd | 電漿處理設備 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3875068A (en) | 1973-02-20 | 1975-04-01 | Tegal Corp | Gaseous plasma reaction apparatus |
| US4362632A (en) | 1974-08-02 | 1982-12-07 | Lfe Corporation | Gas discharge apparatus |
| US4278450A (en) | 1979-10-09 | 1981-07-14 | Georgia Tech Research Institute | Method for the recovery of clean pyrolysis off-gas and a rotary recycling means therefor |
| JPS6482521A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | High-frequency coil |
| TW347547B (en) * | 1994-05-17 | 1998-12-11 | Toshiba Light Technic Kk | Discharge lamp and illumination apparatus using the same |
| JP3349369B2 (ja) * | 1996-11-11 | 2002-11-25 | 三菱重工業株式会社 | ストリーマ放電排ガス処理装置及び方法 |
| US7175054B2 (en) * | 1998-12-23 | 2007-02-13 | S.I.P. Technologies, Llc | Method and apparatus for disinfecting a refrigerated water cooler reservoir |
| JP3709432B2 (ja) * | 1999-04-30 | 2005-10-26 | アプライド マテリアルズ インコーポレイテッド | 排ガス処理装置及び基板処理装置 |
| JP2002210330A (ja) | 2001-01-19 | 2002-07-30 | Pearl Kogyo Kk | 半導体プロセス用排ガス処理装置 |
| JP4567979B2 (ja) * | 2004-01-15 | 2010-10-27 | キヤノンアネルバ株式会社 | プラズマ処理システム及びプラズマ処理方法 |
| US20060081185A1 (en) * | 2004-10-15 | 2006-04-20 | Justin Mauck | Thermal management of dielectric components in a plasma discharge device |
| ITMI20050585A1 (it) * | 2005-04-07 | 2006-10-08 | Francesco Cino Matacotta | Apparato e processo per la generazione accelerazione e propagazione di fasci di elettroni e plasma |
| DE102006012100B3 (de) * | 2006-03-16 | 2007-09-20 | Maschinenfabrik Reinhausen Gmbh | Vorrichtung zur Erzeugung eines Plasma-Jets |
| US20080156264A1 (en) * | 2006-12-27 | 2008-07-03 | Novellus Systems, Inc. | Plasma Generator Apparatus |
| JP4950763B2 (ja) * | 2007-05-25 | 2012-06-13 | 大陽日酸株式会社 | プラズマ生成装置 |
| JP4952472B2 (ja) * | 2007-09-20 | 2012-06-13 | ウシオ電機株式会社 | エキシマランプおよびエキシマランプの製造方法 |
| US9591738B2 (en) * | 2008-04-03 | 2017-03-07 | Novellus Systems, Inc. | Plasma generator systems and methods of forming plasma |
| US8604697B2 (en) * | 2009-12-09 | 2013-12-10 | Jehara Corporation | Apparatus for generating plasma |
| US9867238B2 (en) | 2012-04-26 | 2018-01-09 | Applied Materials, Inc. | Apparatus for treating an exhaust gas in a foreline |
-
2014
- 2014-07-29 US US14/445,965 patent/US9378928B2/en active Active
-
2015
- 2015-05-04 WO PCT/US2015/029068 patent/WO2015183479A1/en not_active Ceased
- 2015-05-04 KR KR1020167036786A patent/KR101805612B1/ko active Active
- 2015-05-04 JP JP2017515674A patent/JP6641359B2/ja active Active
- 2015-05-04 CN CN201580026860.5A patent/CN106414800B/zh active Active
- 2015-05-21 TW TW104116295A patent/TWI607577B/zh active
-
2016
- 2016-06-21 US US15/188,504 patent/US9767990B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6287643B1 (en) * | 1999-09-30 | 2001-09-11 | Novellus Systems, Inc. | Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor |
| CN100403854C (zh) * | 2001-08-23 | 2008-07-16 | 俄勒冈州，由高等教育州委员会代表俄勒冈州立大学 | 变频自动电容射频(rf)介电加热系统 |
| TW201415956A (zh) * | 2009-01-23 | 2014-04-16 | Tokyo Electron Ltd | 電漿處理設備 |
| CN102405512A (zh) * | 2009-04-24 | 2012-04-04 | 朗姆研究公司 | 用于高深宽比的电介质蚀刻的方法及装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106414800B (zh) | 2020-06-26 |
| KR20170012460A (ko) | 2017-02-02 |
| JP6641359B2 (ja) | 2020-02-05 |
| KR101805612B1 (ko) | 2017-12-07 |
| JP2017523585A (ja) | 2017-08-17 |
| US9378928B2 (en) | 2016-06-28 |
| WO2015183479A1 (en) | 2015-12-03 |
| CN106414800A (zh) | 2017-02-15 |
| TW201601339A (zh) | 2016-01-01 |
| US9767990B2 (en) | 2017-09-19 |
| US20150348754A1 (en) | 2015-12-03 |
| US20160300692A1 (en) | 2016-10-13 |
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