KR101805612B1 - 도관 내의 가스를 처리하기 위한 장치 - Google Patents
도관 내의 가스를 처리하기 위한 장치 Download PDFInfo
- Publication number
- KR101805612B1 KR101805612B1 KR1020167036786A KR20167036786A KR101805612B1 KR 101805612 B1 KR101805612 B1 KR 101805612B1 KR 1020167036786 A KR1020167036786 A KR 1020167036786A KR 20167036786 A KR20167036786 A KR 20167036786A KR 101805612 B1 KR101805612 B1 KR 101805612B1
- Authority
- KR
- South Korea
- Prior art keywords
- coil
- dielectric tube
- conduit
- processing system
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007789 gas Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000002826 coolant Substances 0.000 claims abstract description 20
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 44
- 239000004519 grease Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
- H01J37/32844—Treating effluent gases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/2465—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated by inductive coupling, e.g. using coiled electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H05H2001/2468—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Fluid Mechanics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462004857P | 2014-05-29 | 2014-05-29 | |
| US62/004,857 | 2014-05-29 | ||
| US14/445,965 | 2014-07-29 | ||
| US14/445,965 US9378928B2 (en) | 2014-05-29 | 2014-07-29 | Apparatus for treating a gas in a conduit |
| PCT/US2015/029068 WO2015183479A1 (en) | 2014-05-29 | 2015-05-04 | Apparatus for treating a gas in a conduit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170012460A KR20170012460A (ko) | 2017-02-02 |
| KR101805612B1 true KR101805612B1 (ko) | 2017-12-07 |
Family
ID=54699525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167036786A Active KR101805612B1 (ko) | 2014-05-29 | 2015-05-04 | 도관 내의 가스를 처리하기 위한 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9378928B2 (enExample) |
| JP (1) | JP6641359B2 (enExample) |
| KR (1) | KR101805612B1 (enExample) |
| CN (1) | CN106414800B (enExample) |
| TW (1) | TWI607577B (enExample) |
| WO (1) | WO2015183479A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10187966B2 (en) * | 2015-07-24 | 2019-01-22 | Applied Materials, Inc. | Method and apparatus for gas abatement |
| US10435787B2 (en) | 2016-11-14 | 2019-10-08 | Applied Materials, Inc. | Hydrogen partial pressure control in a vacuum process chamber |
| US10777394B2 (en) | 2016-12-09 | 2020-09-15 | Applied Materials, Inc. | Virtual sensor for chamber cleaning endpoint |
| JP7042142B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| JP7042143B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| KR102571335B1 (ko) * | 2020-02-19 | 2023-08-30 | 인투코어테크놀로지 주식회사 | 안테나 구조체 및 이를 이용한 플라즈마 발생 장치 |
| TWI876490B (zh) | 2020-02-19 | 2025-03-11 | 南韓商源多可股份有限公司 | 天線結構以及使用其之電感耦合電漿產生裝置 |
| AU2021297476A1 (en) | 2020-06-25 | 2022-12-15 | 6K Inc. | Microcomposite alloy structure |
| AU2022206483A1 (en) | 2021-01-11 | 2023-08-31 | 6K Inc. | Methods and systems for reclamation of li-ion cathode materials using microwave plasma processing |
| EP4313449A1 (en) | 2021-03-31 | 2024-02-07 | 6K Inc. | Systems and methods for additive manufacturing of metal nitride ceramics |
| WO2023229928A1 (en) | 2022-05-23 | 2023-11-30 | 6K Inc. | Microwave plasma apparatus and methods for processing materials using an interior liner |
| US12040162B2 (en) | 2022-06-09 | 2024-07-16 | 6K Inc. | Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows |
| WO2024044498A1 (en) * | 2022-08-25 | 2024-02-29 | 6K Inc. | Plasma apparatus and methods for processing feed material utilizing a powder ingress preventor (pip) |
| US12195338B2 (en) | 2022-12-15 | 2025-01-14 | 6K Inc. | Systems, methods, and device for pyrolysis of methane in a microwave plasma for hydrogen and structured carbon powder production |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002210330A (ja) | 2001-01-19 | 2002-07-30 | Pearl Kogyo Kk | 半導体プロセス用排ガス処理装置 |
| US20130284724A1 (en) * | 2012-04-26 | 2013-10-31 | Applied Materials, Inc. | Apparatus for treating an exhaust gas in a foreline |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3875068A (en) | 1973-02-20 | 1975-04-01 | Tegal Corp | Gaseous plasma reaction apparatus |
| US4362632A (en) | 1974-08-02 | 1982-12-07 | Lfe Corporation | Gas discharge apparatus |
| US4278450A (en) | 1979-10-09 | 1981-07-14 | Georgia Tech Research Institute | Method for the recovery of clean pyrolysis off-gas and a rotary recycling means therefor |
| JPS6482521A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | High-frequency coil |
| TW347547B (en) * | 1994-05-17 | 1998-12-11 | Toshiba Light Technic Kk | Discharge lamp and illumination apparatus using the same |
| JP3349369B2 (ja) * | 1996-11-11 | 2002-11-25 | 三菱重工業株式会社 | ストリーマ放電排ガス処理装置及び方法 |
| US6657173B2 (en) * | 1998-04-21 | 2003-12-02 | State Board Of Higher Education On Behalf Of Oregon State University | Variable frequency automated capacitive radio frequency (RF) dielectric heating system |
| US7175054B2 (en) * | 1998-12-23 | 2007-02-13 | S.I.P. Technologies, Llc | Method and apparatus for disinfecting a refrigerated water cooler reservoir |
| JP3709432B2 (ja) * | 1999-04-30 | 2005-10-26 | アプライド マテリアルズ インコーポレイテッド | 排ガス処理装置及び基板処理装置 |
| US6287643B1 (en) * | 1999-09-30 | 2001-09-11 | Novellus Systems, Inc. | Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor |
| JP4567979B2 (ja) * | 2004-01-15 | 2010-10-27 | キヤノンアネルバ株式会社 | プラズマ処理システム及びプラズマ処理方法 |
| US20060081185A1 (en) * | 2004-10-15 | 2006-04-20 | Justin Mauck | Thermal management of dielectric components in a plasma discharge device |
| ITMI20050585A1 (it) * | 2005-04-07 | 2006-10-08 | Francesco Cino Matacotta | Apparato e processo per la generazione accelerazione e propagazione di fasci di elettroni e plasma |
| DE102006012100B3 (de) * | 2006-03-16 | 2007-09-20 | Maschinenfabrik Reinhausen Gmbh | Vorrichtung zur Erzeugung eines Plasma-Jets |
| US20080156264A1 (en) * | 2006-12-27 | 2008-07-03 | Novellus Systems, Inc. | Plasma Generator Apparatus |
| JP4950763B2 (ja) * | 2007-05-25 | 2012-06-13 | 大陽日酸株式会社 | プラズマ生成装置 |
| JP4952472B2 (ja) * | 2007-09-20 | 2012-06-13 | ウシオ電機株式会社 | エキシマランプおよびエキシマランプの製造方法 |
| US9591738B2 (en) * | 2008-04-03 | 2017-03-07 | Novellus Systems, Inc. | Plasma generator systems and methods of forming plasma |
| JP5099101B2 (ja) | 2009-01-23 | 2012-12-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US8475673B2 (en) * | 2009-04-24 | 2013-07-02 | Lam Research Company | Method and apparatus for high aspect ratio dielectric etch |
| US8604697B2 (en) * | 2009-12-09 | 2013-12-10 | Jehara Corporation | Apparatus for generating plasma |
-
2014
- 2014-07-29 US US14/445,965 patent/US9378928B2/en active Active
-
2015
- 2015-05-04 KR KR1020167036786A patent/KR101805612B1/ko active Active
- 2015-05-04 WO PCT/US2015/029068 patent/WO2015183479A1/en not_active Ceased
- 2015-05-04 CN CN201580026860.5A patent/CN106414800B/zh active Active
- 2015-05-04 JP JP2017515674A patent/JP6641359B2/ja active Active
- 2015-05-21 TW TW104116295A patent/TWI607577B/zh active
-
2016
- 2016-06-21 US US15/188,504 patent/US9767990B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002210330A (ja) | 2001-01-19 | 2002-07-30 | Pearl Kogyo Kk | 半導体プロセス用排ガス処理装置 |
| US20130284724A1 (en) * | 2012-04-26 | 2013-10-31 | Applied Materials, Inc. | Apparatus for treating an exhaust gas in a foreline |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI607577B (zh) | 2017-12-01 |
| US20150348754A1 (en) | 2015-12-03 |
| JP2017523585A (ja) | 2017-08-17 |
| CN106414800A (zh) | 2017-02-15 |
| CN106414800B (zh) | 2020-06-26 |
| JP6641359B2 (ja) | 2020-02-05 |
| TW201601339A (zh) | 2016-01-01 |
| US9378928B2 (en) | 2016-06-28 |
| US9767990B2 (en) | 2017-09-19 |
| KR20170012460A (ko) | 2017-02-02 |
| US20160300692A1 (en) | 2016-10-13 |
| WO2015183479A1 (en) | 2015-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101805612B1 (ko) | 도관 내의 가스를 처리하기 위한 장치 | |
| KR102104243B1 (ko) | 포어라인에서 배기 가스를 처리하기 위한 장치 | |
| US10757797B2 (en) | Method and apparatus for gas abatement | |
| JP2017523585A5 (enExample) | ||
| US10625277B2 (en) | Showerhead having a detachable gas distribution plate | |
| CN101720500B (zh) | 具有单一平面天线的电感耦合双区域处理室 | |
| KR20070104701A (ko) | 마그네틱 코어 블록에 매설된 플라즈마 방전 튜브를 구비한유도 결합 플라즈마 소스 | |
| KR20120073884A (ko) | 유도 결합 플라즈마 공정 장치 | |
| CN104080947B (zh) | 分段式天线组件 | |
| KR101446554B1 (ko) | 다중 방전관 어셈블리를 갖는 플라즈마 챔버 | |
| KR100805558B1 (ko) | 마그네틱 코어에 결합된 다중 방전 튜브를 구비한 유도 결합 플라즈마 소스 | |
| CN103165383B (zh) | 电感耦合等离子体线圈及等离子体注入装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20161228 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20170224 Comment text: Request for Examination of Application |
|
| PA0302 | Request for accelerated examination |
Patent event date: 20170224 Patent event code: PA03022R01D Comment text: Request for Accelerated Examination |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170619 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20170901 |
|
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20171130 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20171201 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20201102 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20211026 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20221025 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20231023 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20241029 Start annual number: 8 End annual number: 8 |