JP2017522726A5 - - Google Patents

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Publication number
JP2017522726A5
JP2017522726A5 JP2016573865A JP2016573865A JP2017522726A5 JP 2017522726 A5 JP2017522726 A5 JP 2017522726A5 JP 2016573865 A JP2016573865 A JP 2016573865A JP 2016573865 A JP2016573865 A JP 2016573865A JP 2017522726 A5 JP2017522726 A5 JP 2017522726A5
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JP
Japan
Prior art keywords
cleaning article
substrate
particulate matter
matter cleaning
support surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016573865A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017522726A (ja
JP6573918B2 (ja
Filing date
Publication date
Priority claimed from US14/476,398 external-priority patent/US9815091B2/en
Application filed filed Critical
Publication of JP2017522726A publication Critical patent/JP2017522726A/ja
Publication of JP2017522726A5 publication Critical patent/JP2017522726A5/ja
Application granted granted Critical
Publication of JP6573918B2 publication Critical patent/JP6573918B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016573865A 2014-06-19 2015-05-28 ロールツーロールウエハ裏側粒子及び汚染の除去 Expired - Fee Related JP6573918B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462014278P 2014-06-19 2014-06-19
US62/014,278 2014-06-19
US14/476,398 2014-09-03
US14/476,398 US9815091B2 (en) 2014-06-19 2014-09-03 Roll to roll wafer backside particle and contamination removal
PCT/US2015/033005 WO2015195292A1 (en) 2014-06-19 2015-05-28 Roll to roll wafer backside particle and contamination removal

Publications (3)

Publication Number Publication Date
JP2017522726A JP2017522726A (ja) 2017-08-10
JP2017522726A5 true JP2017522726A5 (enExample) 2018-07-12
JP6573918B2 JP6573918B2 (ja) 2019-09-11

Family

ID=54870310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016573865A Expired - Fee Related JP6573918B2 (ja) 2014-06-19 2015-05-28 ロールツーロールウエハ裏側粒子及び汚染の除去

Country Status (6)

Country Link
US (1) US9815091B2 (enExample)
JP (1) JP6573918B2 (enExample)
KR (1) KR20170018069A (enExample)
CN (1) CN106463385B (enExample)
TW (1) TWI663629B (enExample)
WO (1) WO2015195292A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
CN111250481B (zh) * 2020-01-17 2021-07-13 哈尔滨工业大学 一种利用可移动式静电电场吸附颗粒污染物的装置
JP7482657B2 (ja) * 2020-03-17 2024-05-14 東京エレクトロン株式会社 クリーニング方法及び半導体装置の製造方法
US12009227B2 (en) 2021-05-07 2024-06-11 Kla Corporation Electrostatic substrate cleaning system and method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232108A (ja) * 1993-01-29 1994-08-19 Hitachi Ltd 異物除去方法
US5456758A (en) 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
US5972051A (en) 1993-06-17 1999-10-26 Vlsi Technology, Inc Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
JPH07275805A (ja) * 1994-04-05 1995-10-24 Nitto Seiki Kk 薄板状体の表面清掃装置
JPH08148461A (ja) * 1994-11-18 1996-06-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JPH1098090A (ja) * 1996-09-25 1998-04-14 Canon Inc 基板保持装置及び露光装置
JP3809503B2 (ja) * 1997-02-28 2006-08-16 野村マイクロ・サイエンス株式会社 半導体基板内部の洗浄方法および洗浄装置
US5753563A (en) 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
JP3616725B2 (ja) 1998-12-07 2005-02-02 信越半導体株式会社 基板の処理方法及び処理装置
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6523208B1 (en) 2000-03-24 2003-02-25 Xerox Corporation Flexible web cleaning system
JP2002083795A (ja) * 2000-09-07 2002-03-22 Toshiba Corp 半導体基板の洗浄方法およびその洗浄装置
JP4414116B2 (ja) * 2001-08-21 2010-02-10 芝浦メカトロニクス株式会社 基板清掃装置および基板清掃方法
US6695917B2 (en) * 2001-11-14 2004-02-24 Nordson Corporation Flow through felt dispenser
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20050210610A1 (en) * 2004-03-26 2005-09-29 Zih Corp. Apparatus and methods for cleaning the components of a feed device
TWI420579B (zh) * 2005-07-12 2013-12-21 Creative Tech Corp And a foreign matter removing method for a substrate
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
JP4607748B2 (ja) * 2005-12-02 2011-01-05 東京エレクトロン株式会社 基板のパーティクル除去方法、その装置及び塗布、現像装置
US7784146B2 (en) * 2006-01-09 2010-08-31 International Business Machines Corporation Probe tip cleaning apparatus and method of use
JP2011093113A (ja) * 2009-10-27 2011-05-12 Fujifilm Corp 積層基板の製造装置及び製造方法
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

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