JP2017521797A - カバーガラス中の高分解能電界センサ - Google Patents

カバーガラス中の高分解能電界センサ Download PDF

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Publication number
JP2017521797A
JP2017521797A JP2017503482A JP2017503482A JP2017521797A JP 2017521797 A JP2017521797 A JP 2017521797A JP 2017503482 A JP2017503482 A JP 2017503482A JP 2017503482 A JP2017503482 A JP 2017503482A JP 2017521797 A JP2017521797 A JP 2017521797A
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Japan
Prior art keywords
layer
glass
sensor
assembly
fingerprint
Prior art date
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Pending
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JP2017503482A
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English (en)
Japanese (ja)
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JP2017521797A5 (enExample
Inventor
リチャード・エス・ウィザーズ
ロナルド・ビー・クー
スティーヴン・シー・ガーバー
アルカディ・ヴイ・サモイロフ
デイヴィッド・ジョンソン
Original Assignee
クアルコム，インコーポレイテッド
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Publication of JP2017521797A publication Critical patent/JP2017521797A/ja
Publication of JP2017521797A5 publication Critical patent/JP2017521797A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/017—Gesture based interaction, e.g. based on a set of recognized hand gestures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
JP2017503482A 2014-07-25 2015-07-22 カバーガラス中の高分解能電界センサ Pending JP2017521797A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462028887P 2014-07-25 2014-07-25
US62/028,887 2014-07-25
US14/496,073 2014-09-25
US14/496,073 US9558390B2 (en) 2014-07-25 2014-09-25 High-resolution electric field sensor in cover glass
PCT/US2015/041522 WO2016014660A1 (en) 2014-07-25 2015-07-22 High-resolution electric field sensor in cover glass

Publications (2)

Publication Number Publication Date
JP2017521797A true JP2017521797A (ja) 2017-08-03
JP2017521797A5 JP2017521797A5 (enExample) 2018-08-09

Family

ID=53773564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017503482A Pending JP2017521797A (ja) 2014-07-25 2015-07-22 カバーガラス中の高分解能電界センサ

Country Status (6)

Country Link
US (2) US9558390B2 (enExample)
EP (1) EP3172694B1 (enExample)
JP (1) JP2017521797A (enExample)
KR (1) KR20170036687A (enExample)
CN (1) CN106663194B (enExample)
WO (1) WO2016014660A1 (enExample)

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JP2020187752A (ja) * 2019-05-15 2020-11-19 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 指紋センサ及び指紋センサアレイ並びにこれらを含む装置

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US9558390B2 (en) 2014-07-25 2017-01-31 Qualcomm Incorporated High-resolution electric field sensor in cover glass
CN104766053B (zh) * 2015-03-26 2018-10-30 业成光电（深圳）有限公司 指纹识别装置及其制造方法
US20170103249A1 (en) 2015-10-09 2017-04-13 Corning Incorporated Glass-based substrate with vias and process of forming the same
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US9639734B1 (en) 2015-11-13 2017-05-02 Cypress Semiconductor Corporation Fingerprint sensor-compatible overlay material
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CN106095211B (zh) * 2016-06-30 2019-06-18 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
JP6651420B2 (ja) 2016-07-11 2020-02-19 株式会社ジャパンディスプレイ カバー部材及び表示装置
CN106354351B (zh) * 2016-08-30 2019-04-05 京东方科技集团股份有限公司 触控基板及制作方法、显示装置、指纹识别装置和方法
CN106127195B (zh) * 2016-08-30 2017-11-17 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
TW201815710A (zh) * 2016-08-31 2018-05-01 美商康寧公司 具有經填充之孔洞的經強化玻璃系物件及製造其之方法
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
TWI633480B (zh) * 2017-08-07 2018-08-21 致伸科技股份有限公司 指紋辨識觸控屏
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
KR20210064266A (ko) 2018-09-20 2021-06-02 재단법인 공업기술연구원 얇은 유리 상의 유리-관통 비아를 위한 구리 금속화
CN112070018B (zh) * 2018-12-14 2023-12-01 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
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CN117030599A (zh) * 2023-08-11 2023-11-10 吉林大学 一种便捷式模具毛刺锐角识别防划伤装置

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JP2001111233A (ja) * 1999-10-07 2001-04-20 Mitsubishi Gas Chem Co Inc フリップチップ搭載用高密度多層プリント配線板
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JP2006517023A (ja) * 2003-01-22 2006-07-13 ノキア コーポレイション 人物を認証する装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020187752A (ja) * 2019-05-15 2020-11-19 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 指紋センサ及び指紋センサアレイ並びにこれらを含む装置
JP7510276B2 (ja) 2019-05-15 2024-07-03 三星電子株式会社 指紋センサ及び指紋センサアレイ並びにこれらを含む装置

Also Published As

Publication number Publication date
KR20170036687A (ko) 2017-04-03
US9558390B2 (en) 2017-01-31
CN106663194B (zh) 2019-06-18
EP3172694A1 (en) 2017-05-31
EP3172694B1 (en) 2021-06-02
US20170091513A1 (en) 2017-03-30
CN106663194A (zh) 2017-05-10
WO2016014660A1 (en) 2016-01-28
US10268864B2 (en) 2019-04-23
US20160026842A1 (en) 2016-01-28

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