CN106663194B - 盖玻璃中的高分辨率电场传感器 - Google Patents

盖玻璃中的高分辨率电场传感器 Download PDF

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Publication number
CN106663194B
CN106663194B CN201580038985.XA CN201580038985A CN106663194B CN 106663194 B CN106663194 B CN 106663194B CN 201580038985 A CN201580038985 A CN 201580038985A CN 106663194 B CN106663194 B CN 106663194B
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CN
China
Prior art keywords
layer
glass
sensor
assembly
fingerprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580038985.XA
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English (en)
Chinese (zh)
Other versions
CN106663194A (zh
Inventor
R·S·威瑟斯
R·B·库
S·C·格贝尔
A·V·萨莫伊洛夫
D·约翰逊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
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Qualcomm Inc
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Publication date
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Publication of CN106663194A publication Critical patent/CN106663194A/zh
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Publication of CN106663194B publication Critical patent/CN106663194B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/017—Gesture based interaction, e.g. based on a set of recognized hand gestures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
CN201580038985.XA 2014-07-25 2015-07-22 盖玻璃中的高分辨率电场传感器 Expired - Fee Related CN106663194B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462028887P 2014-07-25 2014-07-25
US62/028,887 2014-07-25
US14/496,073 2014-09-25
US14/496,073 US9558390B2 (en) 2014-07-25 2014-09-25 High-resolution electric field sensor in cover glass
PCT/US2015/041522 WO2016014660A1 (en) 2014-07-25 2015-07-22 High-resolution electric field sensor in cover glass

Publications (2)

Publication Number Publication Date
CN106663194A CN106663194A (zh) 2017-05-10
CN106663194B true CN106663194B (zh) 2019-06-18

Family

ID=53773564

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580038985.XA Expired - Fee Related CN106663194B (zh) 2014-07-25 2015-07-22 盖玻璃中的高分辨率电场传感器

Country Status (6)

Country Link
US (2) US9558390B2 (enExample)
EP (1) EP3172694B1 (enExample)
JP (1) JP2017521797A (enExample)
KR (1) KR20170036687A (enExample)
CN (1) CN106663194B (enExample)
WO (1) WO2016014660A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5884764B2 (ja) * 2013-03-29 2016-03-15 ブラザー工業株式会社 通信装置、およびプログラム
US20140355387A1 (en) 2013-06-03 2014-12-04 Qualcomm Incorporated Ultrasonic receiver with coated piezoelectric layer
US10036734B2 (en) 2013-06-03 2018-07-31 Snaptrack, Inc. Ultrasonic sensor with bonded piezoelectric layer
US9558390B2 (en) 2014-07-25 2017-01-31 Qualcomm Incorporated High-resolution electric field sensor in cover glass
CN104766053B (zh) * 2015-03-26 2018-10-30 业成光电（深圳）有限公司 指纹识别装置及其制造方法
US20170103249A1 (en) 2015-10-09 2017-04-13 Corning Incorporated Glass-based substrate with vias and process of forming the same
US9639734B1 (en) 2015-11-13 2017-05-02 Cypress Semiconductor Corporation Fingerprint sensor-compatible overlay material
US10832029B2 (en) 2015-11-13 2020-11-10 Cypress Semiconductor Corporation Sensor-compatible overlay
US10282585B2 (en) 2015-11-13 2019-05-07 Cypress Semiconductor Corporation Sensor-compatible overlay
US9773153B1 (en) * 2016-03-24 2017-09-26 Fingerprint Cards Ab Fingerprint sensor module
US20170285778A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Electronic device with fingerprint sensor
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US11003884B2 (en) 2016-06-16 2021-05-11 Qualcomm Incorporated Fingerprint sensor device and methods thereof
JP6684167B2 (ja) 2016-06-27 2020-04-22 株式会社ジャパンディスプレイ 表示装置
JP6934079B2 (ja) * 2016-06-27 2021-09-08 株式会社ジャパンディスプレイ 表示装置
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
CN106095211B (zh) * 2016-06-30 2019-06-18 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
JP6651420B2 (ja) 2016-07-11 2020-02-19 株式会社ジャパンディスプレイ カバー部材及び表示装置
CN106127195B (zh) * 2016-08-30 2017-11-17 广东欧珀移动通信有限公司 指纹模组、指纹模组制作方法及移动终端
CN106354351B (zh) * 2016-08-30 2019-04-05 京东方科技集团股份有限公司 触控基板及制作方法、显示装置、指纹识别装置和方法
TW201815710A (zh) * 2016-08-31 2018-05-01 美商康寧公司 具有經填充之孔洞的經強化玻璃系物件及製造其之方法
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
TWI633480B (zh) * 2017-08-07 2018-08-21 致伸科技股份有限公司 指紋辨識觸控屏
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
JP2022502567A (ja) 2018-09-20 2022-01-11 財團法人工業技術研究院Industrial Technology Research Institute 薄いガラスのガラス貫通ビアのための銅による金属化
CN109690567B (zh) 2018-12-14 2020-10-02 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
KR20250083587A (ko) 2019-02-21 2025-06-10 코닝 인코포레이티드 구리-금속화된 쓰루 홀을 갖는 유리 또는 유리 세라믹 물품 및 이를 제조하기 위한 공정
KR102697765B1 (ko) * 2019-05-15 2024-08-21 삼성전자주식회사 지문 센서, 지문 센서 어레이 및 장치
WO2021041037A1 (en) * 2019-08-30 2021-03-04 Corning Incorporated Display protector assemblies having vias
CN117030599A (zh) * 2023-08-11 2023-11-10 吉林大学 一种便捷式模具毛刺锐角识别防划伤装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102105955A (zh) * 2008-07-28 2011-06-22 凯米特电子公司 具有嵌入式图案化电容的基板
US8466882B2 (en) * 2007-07-27 2013-06-18 Tpk Touch Solutions Inc. Touch sensor and method for manufacturing same
CN103168283A (zh) * 2010-10-18 2013-06-19 高通Mems科技公司 组合触摸、手写及指纹传感器

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368180A (en) * 1976-11-30 1978-06-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device
JP2001111233A (ja) * 1999-10-07 2001-04-20 Mitsubishi Gas Chem Co Inc フリップチップ搭載用高密度多層プリント配線板
NO316796B1 (no) * 2002-03-01 2004-05-10 Idex Asa Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate
JPWO2003102974A1 (ja) * 2002-06-03 2005-10-06 三菱電機株式会社 白金薄膜および熱式センサ
FI20030102A0 (fi) * 2003-01-22 2003-01-22 Nokia Corp Henkilön varmennusjärjestely
JP2006061630A (ja) * 2004-08-30 2006-03-09 Glory Ltd 指紋検出装置および指紋検出装置の製造方法
TWI310521B (en) * 2005-06-29 2009-06-01 Egis Technology Inc Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (esd) and method of fabricating the same
US7714882B2 (en) * 2006-09-15 2010-05-11 Ricoh Company, Ltd. Image forming apparatus and image forming process
JP5230533B2 (ja) * 2009-05-29 2013-07-10 三菱電機株式会社 タッチパネルおよびそれを備えた表示装置
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
NO20093601A1 (no) * 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US8564314B2 (en) * 2010-11-02 2013-10-22 Atmel Corporation Capacitive touch sensor for identifying a fingerprint
US9310940B2 (en) 2011-01-17 2016-04-12 Pixart Imaging Inc. Capacitive touchscreen or touch panel with fingerprint reader
US8884502B2 (en) * 2011-07-25 2014-11-11 General Electric Company OLED assembly and luminaire with removable diffuser
JP5849344B2 (ja) * 2011-08-09 2016-01-27 日本電気株式会社 位置検出装置
US20130265137A1 (en) 2012-04-02 2013-10-10 Validity Sensors, Inc. Integratable fingerprint sensor packagings
US20130287274A1 (en) 2012-04-29 2013-10-31 Weidong Shi Methods and Apparatuses of Unified Capacitive Based Sensing of Touch and Fingerprint
US20140062875A1 (en) * 2012-09-06 2014-03-06 Panasonic Corporation Mobile device with an inertial measurement unit to adjust state of graphical user interface or a natural language processing unit, and including a hover sensing function
US9250753B2 (en) * 2013-01-07 2016-02-02 Microsoft Technology Licensing, Llc Capacitive touch surface in close proximity to display
US20150009118A1 (en) * 2013-07-03 2015-01-08 Nvidia Corporation Intelligent page turner and scroller
US9177831B2 (en) * 2013-09-30 2015-11-03 Intel Corporation Die assembly on thin dielectric sheet
US9342727B2 (en) * 2014-03-04 2016-05-17 Apple Inc. Field shaping channels in a substrate above a biometric sensing device
US9558390B2 (en) 2014-07-25 2017-01-31 Qualcomm Incorporated High-resolution electric field sensor in cover glass

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8466882B2 (en) * 2007-07-27 2013-06-18 Tpk Touch Solutions Inc. Touch sensor and method for manufacturing same
CN102105955A (zh) * 2008-07-28 2011-06-22 凯米特电子公司 具有嵌入式图案化电容的基板
CN103168283A (zh) * 2010-10-18 2013-06-19 高通Mems科技公司 组合触摸、手写及指纹传感器

Also Published As

Publication number Publication date
US20170091513A1 (en) 2017-03-30
KR20170036687A (ko) 2017-04-03
US20160026842A1 (en) 2016-01-28
CN106663194A (zh) 2017-05-10
EP3172694B1 (en) 2021-06-02
US10268864B2 (en) 2019-04-23
US9558390B2 (en) 2017-01-31
JP2017521797A (ja) 2017-08-03
WO2016014660A1 (en) 2016-01-28
EP3172694A1 (en) 2017-05-31

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