JP2017520938A5 - - Google Patents
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- Publication number
- JP2017520938A5 JP2017520938A5 JP2017521053A JP2017521053A JP2017520938A5 JP 2017520938 A5 JP2017520938 A5 JP 2017520938A5 JP 2017521053 A JP2017521053 A JP 2017521053A JP 2017521053 A JP2017521053 A JP 2017521053A JP 2017520938 A5 JP2017520938 A5 JP 2017520938A5
- Authority
- JP
- Japan
- Prior art keywords
- containing layer
- gas
- processing chamber
- plasma processing
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims 24
- 238000000034 method Methods 0.000 claims 21
- 150000001875 compounds Chemical class 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 9
- 238000002161 passivation Methods 0.000 claims 8
- 238000005530 etching Methods 0.000 claims 6
- 238000001020 plasma etching Methods 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 2
- 229930195733 hydrocarbon Natural products 0.000 claims 2
- 150000002430 hydrocarbons Chemical class 0.000 claims 2
- 150000002500 ions Chemical class 0.000 claims 2
- 238000005086 pumping Methods 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims 1
- 230000007935 neutral effect Effects 0.000 claims 1
- 230000002269 spontaneous effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/320,058 US9290848B2 (en) | 2014-06-30 | 2014-06-30 | Anisotropic etch of copper using passivation |
| US14/320058 | 2014-06-30 | ||
| PCT/US2015/034259 WO2016003596A1 (en) | 2014-06-30 | 2015-06-04 | Anisotropic etch of copper using passivation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017520938A JP2017520938A (ja) | 2017-07-27 |
| JP2017520938A5 true JP2017520938A5 (enExample) | 2018-08-09 |
| JP6584022B2 JP6584022B2 (ja) | 2019-10-02 |
Family
ID=54929895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017521053A Expired - Fee Related JP6584022B2 (ja) | 2014-06-30 | 2015-06-04 | 不動態化を使用する銅の異方性エッチング |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9290848B2 (enExample) |
| EP (1) | EP3161861A4 (enExample) |
| JP (1) | JP6584022B2 (enExample) |
| KR (1) | KR102457878B1 (enExample) |
| SG (1) | SG11201610893WA (enExample) |
| TW (1) | TWI588892B (enExample) |
| WO (1) | WO2016003596A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017045849A (ja) * | 2015-08-26 | 2017-03-02 | 東京エレクトロン株式会社 | シーズニング方法およびエッチング方法 |
| JP6745199B2 (ja) * | 2016-06-10 | 2020-08-26 | 東京エレクトロン株式会社 | 銅層をエッチングする方法 |
| WO2017213193A1 (ja) * | 2016-06-10 | 2017-12-14 | 東京エレクトロン株式会社 | 銅層をエッチングする方法 |
| KR102355416B1 (ko) * | 2017-06-22 | 2022-01-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 구리 패터닝을 위한 플라즈마 에칭 |
| JP7066263B2 (ja) * | 2018-01-23 | 2022-05-13 | 株式会社ディスコ | 加工方法、エッチング装置、及びレーザ加工装置 |
| US11104988B2 (en) | 2018-02-22 | 2021-08-31 | Universal Display Corporation | Modular confined organic print head and system |
| KR102081614B1 (ko) * | 2018-03-29 | 2020-02-26 | 인하대학교 산학협력단 | 구리 박막의 건식 식각방법 |
| CN112041966B (zh) * | 2018-03-30 | 2025-04-15 | 朗姆研究公司 | 使用碳氟化合物阻止层的形貌选择性和区域选择性ald |
| US11688586B2 (en) * | 2018-08-30 | 2023-06-27 | Tokyo Electron Limited | Method and apparatus for plasma processing |
| KR102030548B1 (ko) * | 2018-11-15 | 2019-10-10 | 인하대학교 산학협력단 | 구리 박막의 건식 식각방법 |
| US11955318B2 (en) * | 2021-03-12 | 2024-04-09 | Applied Materials, Inc. | Ash rate recovery method in plasma strip chamber |
| US11557487B2 (en) * | 2021-06-04 | 2023-01-17 | Tokyo Electron Limited | Etching metal during processing of a semiconductor structure |
| WO2024215408A1 (en) * | 2023-04-14 | 2024-10-17 | Versum Materials Us, Llc | Vapor-phase etch of metal-containing materials |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2926864B2 (ja) * | 1990-04-12 | 1999-07-28 | ソニー株式会社 | 銅系金属膜のエッチング方法 |
| JPH04243134A (ja) * | 1991-01-18 | 1992-08-31 | Sony Corp | 銅系金属配線の形成方法 |
| US5350484A (en) | 1992-09-08 | 1994-09-27 | Intel Corporation | Method for the anisotropic etching of metal films in the fabrication of interconnects |
| US6010966A (en) * | 1998-08-07 | 2000-01-04 | Applied Materials, Inc. | Hydrocarbon gases for anisotropic etching of metal-containing layers |
| US6284052B2 (en) * | 1998-08-19 | 2001-09-04 | Sharp Laboratories Of America, Inc. | In-situ method of cleaning a metal-organic chemical vapor deposition chamber |
| US6692903B2 (en) | 2000-12-13 | 2004-02-17 | Applied Materials, Inc | Substrate cleaning apparatus and method |
| WO2004003256A1 (en) * | 2002-06-28 | 2004-01-08 | Tokyo Electron Limited | Anisotropic dry etching of cu-containing layers |
| WO2008153674A1 (en) | 2007-06-09 | 2008-12-18 | Boris Kobrin | Method and apparatus for anisotropic etching |
| JP2012054304A (ja) | 2010-08-31 | 2012-03-15 | Tokyo Electron Ltd | エッチング方法及びエッチング装置 |
-
2014
- 2014-06-30 US US14/320,058 patent/US9290848B2/en active Active
-
2015
- 2015-06-04 SG SG11201610893WA patent/SG11201610893WA/en unknown
- 2015-06-04 WO PCT/US2015/034259 patent/WO2016003596A1/en not_active Ceased
- 2015-06-04 JP JP2017521053A patent/JP6584022B2/ja not_active Expired - Fee Related
- 2015-06-04 EP EP15815902.0A patent/EP3161861A4/en not_active Withdrawn
- 2015-06-04 KR KR1020177002491A patent/KR102457878B1/ko active Active
- 2015-06-26 TW TW104120667A patent/TWI588892B/zh not_active IP Right Cessation
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