JP2017520923A5 - - Google Patents

Download PDF

Info

Publication number
JP2017520923A5
JP2017520923A5 JP2016574466A JP2016574466A JP2017520923A5 JP 2017520923 A5 JP2017520923 A5 JP 2017520923A5 JP 2016574466 A JP2016574466 A JP 2016574466A JP 2016574466 A JP2016574466 A JP 2016574466A JP 2017520923 A5 JP2017520923 A5 JP 2017520923A5
Authority
JP
Japan
Prior art keywords
coupler
conductive layer
signal line
dielectric material
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016574466A
Other languages
English (en)
Japanese (ja)
Other versions
JP6526069B2 (ja
JP2017520923A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/036891 external-priority patent/WO2015200171A1/en
Publication of JP2017520923A publication Critical patent/JP2017520923A/ja
Publication of JP2017520923A5 publication Critical patent/JP2017520923A5/ja
Application granted granted Critical
Publication of JP6526069B2 publication Critical patent/JP6526069B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016574466A 2014-06-23 2015-06-22 多層基板における信号結合 Active JP6526069B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462015604P 2014-06-23 2014-06-23
US62/015,604 2014-06-23
PCT/US2015/036891 WO2015200171A1 (en) 2014-06-23 2015-06-22 Coupling of signals on multi-layer substrates

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019036460A Division JP2019165213A (ja) 2014-06-23 2019-02-28 多層基板における信号結合

Publications (3)

Publication Number Publication Date
JP2017520923A JP2017520923A (ja) 2017-07-27
JP2017520923A5 true JP2017520923A5 (enExample) 2018-08-02
JP6526069B2 JP6526069B2 (ja) 2019-06-05

Family

ID=53541916

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016574466A Active JP6526069B2 (ja) 2014-06-23 2015-06-22 多層基板における信号結合
JP2019036460A Withdrawn JP2019165213A (ja) 2014-06-23 2019-02-28 多層基板における信号結合

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019036460A Withdrawn JP2019165213A (ja) 2014-06-23 2019-02-28 多層基板における信号結合

Country Status (6)

Country Link
US (2) US20150373837A1 (enExample)
EP (1) EP3158605A1 (enExample)
JP (2) JP6526069B2 (enExample)
KR (1) KR20170023095A (enExample)
CN (1) CN106537683B (enExample)
WO (2) WO2015200163A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180029944A (ko) 2014-06-12 2018-03-21 스카이워크스 솔루션즈, 인코포레이티드 지향성 커플러들에 관련된 디바이스들 및 방법들
US9496902B2 (en) 2014-07-24 2016-11-15 Skyworks Solutions, Inc. Apparatus and methods for reconfigurable directional couplers in an RF transceiver with selectable phase shifters
US9866244B2 (en) 2015-09-10 2018-01-09 Skyworks Solutions, Inc. Electromagnetic couplers for multi-frequency power detection
US9954564B2 (en) 2016-02-05 2018-04-24 Skyworks Solutions, Inc. Electromagnetic couplers with multi-band filtering
TWI720128B (zh) 2016-02-29 2021-03-01 美商天工方案公司 整合式濾波器及定向耦合器總成
WO2017172575A1 (en) 2016-03-30 2017-10-05 Skyworks Solutions, Inc. Tunable active silicon for coupler linearity improvement and reconfiguration
CN109314298B (zh) * 2016-04-29 2023-05-02 天工方案公司 补偿电磁耦合器
US10249930B2 (en) 2016-04-29 2019-04-02 Skyworks Solutions, Inc. Tunable electromagnetic coupler and modules and devices using same
US10284167B2 (en) 2016-05-09 2019-05-07 Skyworks Solutions, Inc. Self-adjusting electromagnetic coupler with automatic frequency detection
US10164681B2 (en) 2016-06-06 2018-12-25 Skyworks Solutions, Inc. Isolating noise sources and coupling fields in RF chips
WO2017223141A1 (en) 2016-06-22 2017-12-28 Skyworks Solutions, Inc. Electromagnetic coupler arrangements for multi-frequency power detection, and devices including same
CN107546486B (zh) * 2016-06-23 2021-06-29 康普技术有限责任公司 具有恒定反转相位的天线馈送元件
US10426023B2 (en) * 2017-02-14 2019-09-24 The Regents Of The University Of California Systematic coupling balance scheme to enhance amplitude and phase matching for long-traveling multi-phase signals
US10742189B2 (en) 2017-06-06 2020-08-11 Skyworks Solutions, Inc. Switched multi-coupler apparatus and modules and devices using same
JP7001158B2 (ja) * 2018-06-07 2022-01-19 株式会社村田製作所 多層基板、電子機器および多層基板の製造方法
US10813211B2 (en) * 2018-12-14 2020-10-20 Dell Products L.P. Printed circuit board layout for mitigating near-end crosstalk
US11057078B2 (en) * 2019-05-23 2021-07-06 Canon Kabushiki Kaisha Wireless communication system
JP7510262B2 (ja) * 2019-05-23 2024-07-03 キヤノン株式会社 無線通信システムおよび制御方法
JP2021034536A (ja) * 2019-08-23 2021-03-01 日本特殊陶業株式会社 配線基板
CN111430863A (zh) * 2019-12-16 2020-07-17 瑞声科技(新加坡)有限公司 传输线以及终端设备
CN114976550A (zh) 2021-02-23 2022-08-30 天工方案公司 带有可切换电感器的智能双向耦合器
WO2022213018A1 (en) * 2021-03-31 2022-10-06 Jabil Inc. Differential pair impedance matching for a printed circuit board
CN115377071B (zh) * 2021-05-19 2025-12-02 圣邦微电子（北京）股份有限公司 一种信号线全包裹隔离的芯片、方法及芯片制造方法
JP2022185583A (ja) 2021-06-02 2022-12-14 スカイワークス ソリューションズ，インコーポレイテッド 複数の終端構成を有する方向性結合器
US11774475B2 (en) * 2021-07-13 2023-10-03 National Instruments Corporation Dual directional asymmetric coupler with a shared through-line
CN114552155B (zh) * 2022-04-25 2022-07-05 电子科技大学成都学院 双模传输线

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3942164A (en) * 1975-01-30 1976-03-02 Semi, Inc. Sense line coupling reduction system
US5430247A (en) * 1993-08-31 1995-07-04 Motorola, Inc. Twisted-pair planar conductor line off-set structure
US5389735A (en) * 1993-08-31 1995-02-14 Motorola, Inc. Vertically twisted-pair planar conductor line structure
JP3399630B2 (ja) * 1993-09-27 2003-04-21 株式会社日立製作所 バスシステム
JP3442237B2 (ja) * 1996-10-30 2003-09-02 株式会社日立製作所 間隙結合式バスシステム
US6580335B1 (en) * 1998-12-24 2003-06-17 Kabushiki Kaisha Toyota Chuo Kenkyusho Waveguide-transmission line transition having a slit and a matching element
JP3880286B2 (ja) * 1999-05-12 2007-02-14 エルピーダメモリ株式会社 方向性結合式メモリシステム
JP2001044712A (ja) * 1999-07-28 2001-02-16 Ricoh Co Ltd ストリップ線路
US7170361B1 (en) * 2000-04-13 2007-01-30 Micron Technology, Inc. Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices
US6573801B1 (en) 2000-11-15 2003-06-03 Intel Corporation Electromagnetic coupler
TWI242132B (en) * 2002-07-01 2005-10-21 Renesas Tech Corp Equal-amplitude directional coupling bus system
US6703907B1 (en) * 2002-08-26 2004-03-09 Inphi Corporation Circuit technique for increasing effective inductance of differential transmission lines
US7307492B2 (en) * 2002-11-27 2007-12-11 Intel Corporation Design, layout and method of manufacture for a circuit that taps a differential signal
US7002430B2 (en) * 2003-05-30 2006-02-21 Intel Corporation Compact non-linear geometry electromagnetic coupler for use with digital transmission systems
US7265647B2 (en) * 2004-03-12 2007-09-04 The Regents Of The University Of California High isolation tunable MEMS capacitive switch
FI121516B (fi) * 2004-03-25 2010-12-15 Filtronic Comtek Oy Suuntakytkin
US7280808B2 (en) * 2004-04-12 2007-10-09 Sony Ericsson Mobile Communications, Ab Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
US7271985B1 (en) * 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
EP1788765B1 (en) * 2005-11-18 2012-08-01 STMicroelectronics Srl Transmission system of a digital signal
FI20065144L (fi) * 2006-02-28 2007-08-29 Filtronic Comtek Oy Suuntakytkin
DE102007021615A1 (de) * 2006-05-12 2007-11-15 Denso Corp., Kariya Dielektrisches Substrat für einen Wellenhohlleiter und einen Übertragungsleitungsübergang, die dieses verwenden
CN103209154B (zh) 2007-07-20 2016-12-28 蓝色多瑙河系统公司 利用相位同步本地载波产生多点信号的方法和系统
EP2068391A3 (de) * 2007-12-04 2010-01-20 Rohde & Schwarz GmbH & Co. KG Einrichtung mit überkreutzter Streifenleitung
US7830221B2 (en) * 2008-01-25 2010-11-09 Micron Technology, Inc. Coupling cancellation scheme
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
JP5225188B2 (ja) * 2009-04-23 2013-07-03 三菱電機株式会社 方向性結合器
US20120146860A1 (en) * 2009-09-01 2012-06-14 Koichiro Nakase Communication system and communication apparatus
WO2011044965A1 (de) * 2009-10-14 2011-04-21 Landis+Gyr Ag Antennenkoppler
EP2589108B1 (en) 2010-07-01 2018-04-18 Blue Danube Systems, Inc. Low cost, active antenna arrays
KR101375938B1 (ko) * 2012-12-27 2014-03-21 한국과학기술원 저전력, 고속 멀티-채널 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스

Similar Documents

Publication Publication Date Title
JP2017520923A5 (enExample)
CN106873835B (zh) 触控面板及其制作方法、触控显示屏
JP2016039365A5 (enExample)
JP2014082455A5 (ja) フレキシブル基板、基板接続構造及び光モジュール
JP2007517309A5 (enExample)
US9933898B2 (en) Matrix switching type touch panel
JP2016197402A5 (enExample)
CN104391610B (zh) 一种触摸屏及触摸显示装置
CN103793094A (zh) 触控面板及其制作方法
KR20140044720A (ko) 상호정전용량 터치감지 패널
TWI545491B (zh) 觸控面板及其之製造方法
JP2016109791A5 (enExample)
JP2014134658A5 (enExample)
CN104503637B (zh) 电容式触摸屏
EP2369455B1 (en) Touch screen panel
JP2017530556A5 (enExample)
TWI502426B (zh) Touch panel and its induction electrode structure
EP2829960A3 (en) Touch screen panel and fabricating method thereof
CN104461204A (zh) 电容式触摸屏
CN202956748U (zh) 共接式走线的电容式触控面板
CN106910731B (zh) 层叠基板结构
KR20220044860A (ko) 정전용량 센서 소자 및 그 제조 방법
KR101478043B1 (ko) 터치 패널 및 그 제조 방법
TWI354924B (enExample)
JP2012221532A5 (enExample)