JP2017520112A - 粒子除去デバイス、及び粒子除去デバイスを操作する方法 - Google Patents
粒子除去デバイス、及び粒子除去デバイスを操作する方法 Download PDFInfo
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- 239000002245 particle Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 238000012545 processing Methods 0.000 claims abstract description 65
- 238000012546 transfer Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 11
- 230000009977 dual effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010407 vacuum cleaning Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000011109 contamination Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010943 off-gassing Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 208000034809 Product contamination Diseases 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02096—Cleaning only mechanical cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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Abstract
Description
Claims (15)
- キャリアに支持された基板を処理するための真空処理システム用の粒子除去デバイスであって、
凹部を有する基体であって、前記キャリアの一部が前記凹部を通って移動しうるように前記凹部が構成された前記基体と、
前記凹部に備えられ、前記凹部を通って移動する時に、前記キャリアの一部と接触するように構成されているブラシと
を備える、粒子除去デバイス。 - 前記凹部を通って移動する時に前記キャリアの一部上にガスを向けるように構成された一又は複数のガス出口
を更に備える、請求項1に記載の粒子除去デバイス。 - 前記凹部の開口部と流体連結し、ポンプに接続されるように構成されている吸引ポート
を更に備える、請求項1又は2に記載の粒子除去デバイス。 - 前記一又は複数のガス出口が前記基体の上部に設けられ、特に前記凹部の下部へ下向きにガスを向けるように構成されている、請求項1から3のいずれか一項に記載の粒子除去デバイス。
- 前記一又は複数のガス出口は、第1のガス出口配置構成と第2のガス出口配置構成とを含み、前記第1のガス出口配置構成は前記基体の一方の側に設けられ、前記第2のガス出口配置構成は第1の側とは反対の前記基体の第2の側に設けられている、請求項4に記載の粒子除去デバイス。
- 前記凹部の前記開口部が前記ブラシの下にある、請求項3から5のいずれか一項に記載の粒子除去デバイス。
- 別のキャリアの一部が凹部を通って移動することができるように構成された別の凹部と、
前記別の凹部に備えられた別のブラシと
を更に備え、粒子トラップが、デュアル軌道搬送システムにおいて搬送されるキャリアの粒子を捕捉するように構成されている、請求項1から6のいずれか一項に記載の粒子除去デバイス。 - 前記別の凹部が前記基体に設けられている、請求項7に記載の粒子除去デバイス。
- キャリアに支持された基板を処理するための真空処理システム用のロードロックチャンバであって、
ロードロックチャンバの空間を形成するロードロック壁と、
前記ロードロックチャンバの中に前記キャリアをロックするように構成され、前記ロードロック壁の入口壁に設けられた入口と、
前記ロードロックチャンバを真空に引くための真空生成装置と、
キャリアに支持された基板を処理するための真空処理システム用の粒子除去デバイスと
を備え、
前記粒子除去デバイスが、
凹部を有する基体であって、前記凹部を通って前記キャリアの一部が移動できるように前記凹部が構成されている基体と、
前記凹部に備えられ、前記凹部を通って移動する時に前記キャリアの一部と接触するように構成されているブラシと
を備える、ロードロックチャンバ。 - 前記入口における第1の真空密閉バルブと、
前記ロードロック壁の出口壁において前記キャリアを前記ロードロックチャンバの外へ移送するように構成された出口と、
前記ロードロックチャンバを出る前記基板の前記出口における第2の真空密閉バルブと
を更に備える、請求項9に記載のロードロックチャンバ。 - 基板を処理するための真空処理システムであって、
前記基板を処理するように適合された真空処理チャンバと、
前記基板を大気条件から前記真空処理チャンバへ移送するように構成された、請求項9又は10に記載のロードロックチャンバと
を備える真空処理システム。 - 請求項1から8のいずれか一項に記載の第2の粒子除去デバイスであって、約1.0E−8mbar*l/(s*cm2)と約1.0E−6mbar*l/(s*cm2)の間の1時間a1h当たりのガス放出値を有する材料を含み、前記ロードロックチャンバ、前記真空処理チャンバ、又は前記真空処理システムの別の真空チャンバに設けられている前記第2の粒子除去デバイスを更に備える、請求項11に記載の真空処理システム。
- 前記真空処理チャンバの真空が、約10−7mbarと約10−5mbarの間の範囲の圧力を有する超高真空である、請求項11又は12のいずれか一項に記載の真空処理システム。
- 真空処理システムにおいてキャリアを洗浄する方法であって、
前記真空処理システムのロードロックチャンバの中に前記キャリアをロックすることと、
前記キャリアが前記ロードロックチャンバの中にロックされている間に、ブラシを用いて前記キャリアの一部を洗浄することと
を含む方法。 - 前記キャリアが前記ロードロックチャンバの中にロックされている間に、前記キャリアの一部上にガスの流れを向けることと、
前記キャリアの一部から除去された粒子を真空洗浄することと
を更に含む、請求項14に記載の方法。
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PCT/US2014/038130 WO2015174981A1 (en) | 2014-05-15 | 2014-05-15 | Particle removal device and method of operating thereof |
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KR (1) | KR20170008270A (ja) |
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CN108701630A (zh) * | 2017-01-31 | 2018-10-23 | 应用材料公司 | 基板载体和处理基板的方法 |
DE102017106373A1 (de) * | 2017-03-24 | 2018-09-27 | Nexwafe Gmbh | Prozesskammerführung, Prozesskammer und Verfahren zum Führen eines Substratträgers in eine Prozessposition |
CN110055488B (zh) * | 2019-05-28 | 2021-05-25 | 珠海长安富士金属热处理有限公司 | 一种真空热处理渗碳装置 |
CN116783694A (zh) * | 2020-12-17 | 2023-09-19 | 应用材料公司 | 用于清洁沿着输送方向移动的载体的载体清洁头、基板处理系统、维护基板处理系统的方法以及制造装置的方法 |
CN116159809A (zh) * | 2022-12-28 | 2023-05-26 | 深圳市纳设智能装备有限公司 | 晶圆传输方法 |
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JP3188935B2 (ja) * | 1995-01-19 | 2001-07-16 | 東京エレクトロン株式会社 | 検査装置 |
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- 2014-05-15 CN CN201480078899.7A patent/CN106304833A/zh active Pending
- 2014-05-15 JP JP2016567808A patent/JP2017520112A/ja active Pending
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- 2015-05-15 TW TW104115683A patent/TW201605550A/zh unknown
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TW201605550A (zh) | 2016-02-16 |
KR20170008270A (ko) | 2017-01-23 |
CN106304833A (zh) | 2017-01-04 |
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