JP2017516428A5 - - Google Patents

Download PDF

Info

Publication number
JP2017516428A5
JP2017516428A5 JP2017506631A JP2017506631A JP2017516428A5 JP 2017516428 A5 JP2017516428 A5 JP 2017516428A5 JP 2017506631 A JP2017506631 A JP 2017506631A JP 2017506631 A JP2017506631 A JP 2017506631A JP 2017516428 A5 JP2017516428 A5 JP 2017516428A5
Authority
JP
Japan
Prior art keywords
cavity
ultrasonic transducer
semiconductor substrate
electrode
metallization layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017506631A
Other languages
English (en)
Japanese (ja)
Other versions
JP6636502B2 (ja
JP2017516428A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/026290 external-priority patent/WO2015161147A1/en
Publication of JP2017516428A publication Critical patent/JP2017516428A/ja
Publication of JP2017516428A5 publication Critical patent/JP2017516428A5/ja
Application granted granted Critical
Publication of JP6636502B2 publication Critical patent/JP6636502B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017506631A 2014-04-18 2015-04-17 相補型金属酸化膜半導体(cmos)ウェーハにおける超音波トランスデューサ並びに関連装置及び方法 Expired - Fee Related JP6636502B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461981464P 2014-04-18 2014-04-18
US61/981,464 2014-04-18
PCT/US2015/026290 WO2015161147A1 (en) 2014-04-18 2015-04-17 Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods

Publications (3)

Publication Number Publication Date
JP2017516428A JP2017516428A (ja) 2017-06-15
JP2017516428A5 true JP2017516428A5 (OSRAM) 2018-05-24
JP6636502B2 JP6636502B2 (ja) 2020-01-29

Family

ID=53059421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017506631A Expired - Fee Related JP6636502B2 (ja) 2014-04-18 2015-04-17 相補型金属酸化膜半導体(cmos)ウェーハにおける超音波トランスデューサ並びに関連装置及び方法

Country Status (9)

Country Link
US (4) US9505030B2 (OSRAM)
EP (1) EP3132470B1 (OSRAM)
JP (1) JP6636502B2 (OSRAM)
KR (1) KR102237662B1 (OSRAM)
CN (1) CN106659464B (OSRAM)
AU (1) AU2015247484B2 (OSRAM)
CA (1) CA2946133A1 (OSRAM)
TW (2) TWI661534B (OSRAM)
WO (1) WO2015161147A1 (OSRAM)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體(cmos)超音波換能器以及用於形成其之方法
JP6221582B2 (ja) * 2013-09-30 2017-11-01 セイコーエプソン株式会社 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
TWI562224B (en) * 2016-01-30 2016-12-11 Univ Nat Tsing Hua Cmos-mems resonant transducer and method for fabricating the same
TWI594384B (zh) * 2016-02-26 2017-08-01 世界先進積體電路股份有限公司 半導體裝置結構
US10771043B2 (en) 2016-03-17 2020-09-08 Cornell University Transmit-receive delay element apparatus, method, and applications
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US10497856B2 (en) * 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
CN105997146A (zh) * 2016-06-27 2016-10-12 麦克思商务咨询(深圳)有限公司 超声波传感器
US10381303B2 (en) 2016-07-01 2019-08-13 Vanguard International Semiconductor Corporation Semiconductor device structures
US9796582B1 (en) 2016-11-29 2017-10-24 Taiwan Semiconductor Manufacturing Co., Ltd. Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
CA3066100A1 (en) 2017-06-20 2018-12-27 Butterfly Network, Inc. Amplifier with built in time gain compensation for ultrasound applications
KR20200020798A (ko) 2017-06-20 2020-02-26 버터플라이 네트워크, 인크. 초음파 디바이스를 위한 멀티-스테이지 트랜스-임피던스 증폭기(tia)
EP3642960A4 (en) * 2017-06-20 2021-03-17 Butterfly Network, Inc. ANALOGUE-DIGITAL SIGNAL CONVERSION IN AN ULTRASONIC DEVICE
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
WO2018237267A1 (en) 2017-06-23 2018-12-27 Butterfly Network, Inc. Differential ultrasonic transducer element for ultrasound devices
CN110958916B (zh) 2017-06-30 2022-03-29 皇家飞利浦有限公司 用于管腔内超声成像换能器的埋入式沟槽以及相关的设备、系统和方法
US10966683B2 (en) * 2018-03-22 2021-04-06 Exo Imaging Inc. Integrated ultrasonic transducers
TW201946700A (zh) * 2018-05-03 2019-12-16 美商蝴蝶網路公司 超音波裝置
JP2021522734A (ja) 2018-05-03 2021-08-30 バタフライ ネットワーク,インコーポレイテッド Cmosセンサ上の超音波トランスデューサ用の圧力ポート
US11465177B2 (en) * 2018-05-21 2022-10-11 Fujifilm Sonosite, Inc. PMUT ultrasound transducer with damping layer
JP2021529459A (ja) 2018-07-06 2021-10-28 バタフライ ネットワーク,インコーポレイテッド 超音波オンチップをパッケージングする方法及び装置
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
TW202033959A (zh) 2018-11-15 2020-09-16 美商蝴蝶網路公司 用於微加工超音波換能器裝置的抗黏著底部空腔表面
CN113453807B (zh) * 2019-02-25 2022-09-20 蝴蝶网络有限公司 微加工超声换能器器件的自适应腔体厚度控制
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
FR3097091B1 (fr) * 2019-06-07 2021-07-23 Commissariat Energie Atomique dispositif pourvu d’une pluralité de résonateurs présentant collectivement un facteur de qualité amélioré
WO2020251915A1 (en) 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
CN110510573B (zh) * 2019-08-30 2023-01-10 中国科学院深圳先进技术研究院 一种电容式微机械超声换能器及其制备方法和应用
JP2022550129A (ja) 2019-09-27 2022-11-30 ビーエフエルワイ オペレーションズ,インコーポレイテッド 胎児心音及び子宮収縮信号を監視するための方法及び装置
US11289377B2 (en) * 2019-10-01 2022-03-29 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US11939212B2 (en) * 2019-12-23 2024-03-26 Industrial Technology Research Institute MEMS device, manufacturing method of the same, and integrated MEMS module using the same
US11365117B2 (en) * 2019-12-23 2022-06-21 Industrial Technology Research Institute MEMS device and manufacturing method of the same
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
WO2021211822A1 (en) 2020-04-16 2021-10-21 Bfly Operations, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
US11923459B2 (en) * 2020-06-23 2024-03-05 Taiwan Semiconductor Manufacturing Company Limited Transistor including hydrogen diffusion barrier film and methods of forming same
US11808897B2 (en) 2020-10-05 2023-11-07 Bfly Operations, Inc. Methods and apparatuses for azimuthal summing of ultrasound data
CN112517361B (zh) * 2020-11-30 2022-06-03 国网山西省电力公司朔州供电公司 一种高灵敏多频段复合式空耦超声换能器及其制备方法
TW202239483A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有不均勻柱腳的電容式微加工超音波換能器
US12172188B2 (en) 2021-03-04 2024-12-24 Bfly Operations, Inc. Micromachined ultrasound transducer with pedestal
US12156762B2 (en) 2021-04-01 2024-12-03 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
CN113993048B (zh) * 2021-10-18 2023-07-21 上海交通大学 超声换能器及其形成方法、控制方法
CN114955979B (zh) * 2022-05-15 2025-03-14 中北大学 差分电容式纤毛水听器及其制造方法
WO2024044853A1 (en) * 2022-08-30 2024-03-07 The University Of British Columbia Capacitive micromachined ultrasonic transducer arrays on printed circuit boards
TWI814593B (zh) * 2022-09-28 2023-09-01 國立清華大學 電容式超聲波傳感裝置、其製造方法及傳感陣列
TWI835661B (zh) * 2023-05-29 2024-03-11 友達光電股份有限公司 換能器及其製造方法

Family Cites Families (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001883B1 (ko) * 1992-12-30 1997-02-18 삼성전자 주식회사 반도체장치 및 그 제조방법
US5286671A (en) 1993-05-07 1994-02-15 Kulite Semiconductor Products, Inc. Fusion bonding technique for use in fabricating semiconductor devices
US6645145B1 (en) 1998-11-19 2003-11-11 Siemens Medical Solutions Usa, Inc. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US7541214B2 (en) 1999-12-15 2009-06-02 Chang-Feng Wan Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
US6443901B1 (en) 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6694817B2 (en) 2001-08-21 2004-02-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6779387B2 (en) 2001-08-21 2004-08-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6795374B2 (en) 2001-09-07 2004-09-21 Siemens Medical Solutions Usa, Inc. Bias control of electrostatic transducers
US6659954B2 (en) 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7429495B2 (en) 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7208727B2 (en) 2003-01-14 2007-04-24 Georgia Tech Research Corporation Electrospray systems and methods
US7312440B2 (en) 2003-01-14 2007-12-25 Georgia Tech Research Corporation Integrated micro fuel processor and flow delivery infrastructure
US7313053B2 (en) 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US6865140B2 (en) 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
JP4294376B2 (ja) * 2003-05-26 2009-07-08 オリンパス株式会社 超音波診断プローブ装置
US7081647B2 (en) * 2003-09-29 2006-07-25 Matsushita Electric Industrial Co., Ltd. Microelectromechanical system and method for fabricating the same
US7247246B2 (en) 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
WO2005046443A2 (en) * 2003-11-07 2005-05-26 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7125383B2 (en) 2003-12-30 2006-10-24 General Electric Company Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
US7104129B2 (en) 2004-02-02 2006-09-12 Invensense Inc. Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
WO2005077012A2 (en) 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US8008835B2 (en) 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7612483B2 (en) 2004-02-27 2009-11-03 Georgia Tech Research Corporation Harmonic cMUT devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
JP4280198B2 (ja) 2004-04-30 2009-06-17 株式会社東芝 薄膜圧電共振器
US8309428B2 (en) * 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7888709B2 (en) * 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US8658453B2 (en) * 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US7375420B2 (en) 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7518251B2 (en) 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7037746B1 (en) 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7250353B2 (en) 2005-03-29 2007-07-31 Invensense, Inc. Method and system of releasing a MEMS structure
US7704743B2 (en) 2005-03-30 2010-04-27 Georgia Tech Research Corporation Electrosonic cell manipulation device and method of use thereof
CA2607918A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
EP1883956A4 (en) 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
CN101558552B (zh) 2005-06-17 2017-05-31 科隆科技公司 具有绝缘延伸部的微机电换能器
US7637149B2 (en) 2005-06-17 2009-12-29 Georgia Tech Research Corporation Integrated displacement sensors for probe microscopy and force spectroscopy
US7612635B2 (en) 2005-08-03 2009-11-03 Kolo Technologies, Inc. MEMS acoustic filter and fabrication of the same
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7442637B2 (en) * 2005-08-15 2008-10-28 Chartered Semiconductor Manufacturing, Ltd Method for processing IC designs for different metal BEOL processes
US7878977B2 (en) 2005-09-30 2011-02-01 Siemens Medical Solutions Usa, Inc. Flexible ultrasound transducer array
US7441447B2 (en) 2005-10-07 2008-10-28 Georgia Tech Research Corporation Methods of imaging in probe microscopy
US7622848B2 (en) 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US20070180916A1 (en) 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
JP2007210083A (ja) * 2006-02-13 2007-08-23 Hitachi Ltd Mems素子及びその製造方法
US7615834B2 (en) 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
WO2007115283A2 (en) 2006-04-04 2007-10-11 Kolo Technologies, Inc. Modulation in micromachined ultrasonic transducers
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
JP4885779B2 (ja) * 2007-03-29 2012-02-29 オリンパスメディカルシステムズ株式会社 静電容量型トランスデューサ装置及び体腔内超音波診断システム
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US7829462B2 (en) * 2007-05-03 2010-11-09 Teledyne Licensing, Llc Through-wafer vias
US20080296708A1 (en) 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
US8203912B2 (en) 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US8277380B2 (en) 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
WO2009037655A2 (en) 2007-09-17 2009-03-26 Koninklijke Philips Electronics, N.V. Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof
JP4569683B2 (ja) * 2007-10-16 2010-10-27 東芝ライテック株式会社 発光素子ランプ及び照明器具
US7843022B2 (en) 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7786584B2 (en) 2007-11-26 2010-08-31 Infineon Technologies Ag Through substrate via semiconductor components
EP2215854A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Stacked transducing devices
CN101874287B (zh) 2007-12-03 2012-08-29 科隆科技公司 静电换能器及阵列中的贯穿晶片互连
EP2227835A1 (en) 2007-12-03 2010-09-15 Kolo Technologies, Inc. Variable operating voltage in micromachined ultrasonic transducer
US8483014B2 (en) 2007-12-03 2013-07-09 Kolo Technologies, Inc. Micromachined ultrasonic transducers
CN101868982B (zh) 2007-12-03 2013-10-16 科隆科技公司 带有电压反馈的电容式微机械超声换能器
JP5337813B2 (ja) 2007-12-03 2013-11-06 コロ テクノロジーズ インコーポレイテッド デュアルモード動作マイクロマシン超音波トランスデューサ
US7781238B2 (en) 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8614151B2 (en) 2008-01-04 2013-12-24 Micron Technology, Inc. Method of etching a high aspect ratio contact
US8592925B2 (en) * 2008-01-11 2013-11-26 Seiko Epson Corporation Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
KR100878454B1 (ko) * 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
AU2009243918A1 (en) 2008-05-07 2009-11-12 Signostics Limited Docking system for medical diagnostic scanning using a handheld device
JP2009291514A (ja) 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
EP2230497A1 (de) 2008-06-09 2010-09-22 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Diodenbolometer und ein Verfahren zur Herstellung eines Diodenbolometers
US8796746B2 (en) 2008-07-08 2014-08-05 MCube Inc. Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
US7812418B2 (en) 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
WO2010082519A1 (ja) 2009-01-16 2010-07-22 株式会社日立メディコ 超音波探触子の製造方法および超音波探触子
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
US8315125B2 (en) 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
WO2010109205A2 (en) 2009-03-26 2010-09-30 Ntnu Technology Transfer As Cmut array
EP2271129A1 (en) * 2009-07-02 2011-01-05 Nxp B.V. Transducer with resonant cavity
US8451693B2 (en) 2009-08-25 2013-05-28 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducer having compliant post structure
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8563345B2 (en) 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8222065B1 (en) 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
US8241931B1 (en) 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate
JP5404335B2 (ja) 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8587078B2 (en) 2010-04-06 2013-11-19 United Microelectronics Corp. Integrated circuit and fabricating method thereof
US8471304B2 (en) * 2010-06-04 2013-06-25 Carnegie Mellon University Method, apparatus, and system for micromechanical gas chemical sensing capacitor
US8647279B2 (en) 2010-06-10 2014-02-11 Siemens Medical Solutions Usa, Inc. Volume mechanical transducer for medical diagnostic ultrasound
US8957564B1 (en) 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5702966B2 (ja) 2010-08-02 2015-04-15 キヤノン株式会社 電気機械変換装置及びその作製方法
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US8852103B2 (en) 2011-10-17 2014-10-07 Butterfly Network, Inc. Transmissive imaging and related apparatus and methods
US20130096433A1 (en) * 2011-10-18 2013-04-18 The Regents Of The University Of Michigan System and Method for Unattended Monitoring of Blood Flow
KR101813183B1 (ko) * 2011-12-19 2017-12-29 삼성전자주식회사 초음파 변환기의 셀, 소자, 이를 포함하는 초음파 변환기 및 그 제조 방법
US20130161702A1 (en) * 2011-12-25 2013-06-27 Kun-Lung Chen Integrated mems device
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
KR101388141B1 (ko) * 2012-05-31 2014-04-23 전자부품연구원 Cmos 회로가 집적된 마이크로폰 및 그 제조방법
US10217045B2 (en) * 2012-07-16 2019-02-26 Cornell University Computation devices and artificial neurons based on nanoelectromechanical systems
US8735199B2 (en) 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體(cmos)超音波換能器以及用於形成其之方法
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

Similar Documents

Publication Publication Date Title
JP2017516428A5 (OSRAM)
JP2016518739A5 (OSRAM)
JP2020019135A5 (OSRAM)
JP2019522449A5 (OSRAM)
JP2014523689A5 (OSRAM)
JP2013168419A5 (OSRAM)
WO2016192373A1 (zh) Mems麦克风、压力传感器集成结构及其制造方法
JP2011004395A5 (OSRAM)
JP2016192568A5 (OSRAM)
JP2018014717A5 (OSRAM)
JP2012085239A5 (OSRAM)
JP2014176089A5 (ja) 弾性波デバイス
JP2017200175A5 (ja) 電子部品と電子装置
JP2016511607A5 (OSRAM)
CN108366330A (zh) 微机电封装结构
WO2012143784A8 (en) Semiconductor device and manufacturing method thereof
JP2011009514A5 (OSRAM)
TW201605248A (zh) 具有立體基板的微機電麥克風封裝結構
JP2010530644A5 (OSRAM)
JP2010205849A5 (OSRAM)
JP2011045040A5 (OSRAM)
JP2017073683A5 (OSRAM)
JP2011023528A5 (OSRAM)
JP2015133388A5 (OSRAM)
US20170374474A1 (en) Mems transducer package