JP2017515097A5 - - Google Patents

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Publication number
JP2017515097A5
JP2017515097A5 JP2016553850A JP2016553850A JP2017515097A5 JP 2017515097 A5 JP2017515097 A5 JP 2017515097A5 JP 2016553850 A JP2016553850 A JP 2016553850A JP 2016553850 A JP2016553850 A JP 2016553850A JP 2017515097 A5 JP2017515097 A5 JP 2017515097A5
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Japan
Prior art keywords
laminated wafer
edge
readable storage
transitory computer
projected image
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JP2016553850A
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Japanese (ja)
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JP2017515097A (ja
JP6618478B2 (ja
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Priority claimed from US14/630,252 external-priority patent/US9734568B2/en
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JP2016553850A 2014-02-25 2015-02-25 射影画像を用いた自動インライン検査及び計測 Active JP6618478B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461944244P 2014-02-25 2014-02-25
US61/944,244 2014-02-25
US14/630,252 2015-02-24
US14/630,252 US9734568B2 (en) 2014-02-25 2015-02-24 Automated inline inspection and metrology using shadow-gram images
PCT/US2015/017549 WO2015130803A1 (en) 2014-02-25 2015-02-25 Automated inline inspection and metrology using shadow-gram images

Publications (3)

Publication Number Publication Date
JP2017515097A JP2017515097A (ja) 2017-06-08
JP2017515097A5 true JP2017515097A5 (enExample) 2018-04-05
JP6618478B2 JP6618478B2 (ja) 2019-12-11

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JP2016553850A Active JP6618478B2 (ja) 2014-02-25 2015-02-25 射影画像を用いた自動インライン検査及び計測

Country Status (7)

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US (1) US9734568B2 (enExample)
EP (1) EP3111468A4 (enExample)
JP (1) JP6618478B2 (enExample)
KR (1) KR102201911B1 (enExample)
CN (1) CN106030775B (enExample)
TW (1) TWI664390B (enExample)
WO (1) WO2015130803A1 (enExample)

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CN113155022B (zh) * 2021-02-26 2022-12-27 深圳市磐锋精密技术有限公司 一种手机零件全自动机器人光电检测装置及检测方法
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