KR102201911B1 - 섀도우 그램 이미지를 이용한 자동화 인라인 검사 및 계측 - Google Patents

섀도우 그램 이미지를 이용한 자동화 인라인 검사 및 계측 Download PDF

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KR102201911B1
KR102201911B1 KR1020167026040A KR20167026040A KR102201911B1 KR 102201911 B1 KR102201911 B1 KR 102201911B1 KR 1020167026040 A KR1020167026040 A KR 1020167026040A KR 20167026040 A KR20167026040 A KR 20167026040A KR 102201911 B1 KR102201911 B1 KR 102201911B1
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stacked wafer
edge
wafer
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shadow
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KR20160127046A (ko
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히만슈 바자리아
시나 자한빈
브래들리 리스
모한 마하데반
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/28—Determining representative reference patterns, e.g. by averaging or distorting; Generating dictionaries
    • G06K9/481—
    • G06K9/6204—
    • G06K9/6255—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/46—Descriptors for shape, contour or point-related descriptors, e.g. scale invariant feature transform [SIFT] or bags of words [BoW]; Salient regional features
    • G06V10/469—Contour-based spatial representations, e.g. vector-coding
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/752—Contour matching
    • G06K2209/19—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Computing Systems (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Databases & Information Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020167026040A 2014-02-25 2015-02-25 섀도우 그램 이미지를 이용한 자동화 인라인 검사 및 계측 Active KR102201911B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461944244P 2014-02-25 2014-02-25
US61/944,244 2014-02-25
US14/630,252 2015-02-24
US14/630,252 US9734568B2 (en) 2014-02-25 2015-02-24 Automated inline inspection and metrology using shadow-gram images
PCT/US2015/017549 WO2015130803A1 (en) 2014-02-25 2015-02-25 Automated inline inspection and metrology using shadow-gram images

Publications (2)

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KR20160127046A KR20160127046A (ko) 2016-11-02
KR102201911B1 true KR102201911B1 (ko) 2021-01-11

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US (1) US9734568B2 (enExample)
EP (1) EP3111468A4 (enExample)
JP (1) JP6618478B2 (enExample)
KR (1) KR102201911B1 (enExample)
CN (1) CN106030775B (enExample)
TW (1) TWI664390B (enExample)
WO (1) WO2015130803A1 (enExample)

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TWI733365B (zh) * 2020-03-10 2021-07-11 瑞昱半導體股份有限公司 晶圓測試機台及訓練人工智慧模型以測試晶圓的方法
CN113155022B (zh) * 2021-02-26 2022-12-27 深圳市磐锋精密技术有限公司 一种手机零件全自动机器人光电检测装置及检测方法
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US9734568B2 (en) 2017-08-15
EP3111468A4 (en) 2017-08-09
US20150243018A1 (en) 2015-08-27
TWI664390B (zh) 2019-07-01
KR20160127046A (ko) 2016-11-02
JP2017515097A (ja) 2017-06-08
CN106030775B (zh) 2019-08-20
WO2015130803A1 (en) 2015-09-03
JP6618478B2 (ja) 2019-12-11
EP3111468A1 (en) 2017-01-04
CN106030775A (zh) 2016-10-12
TW201538926A (zh) 2015-10-16

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