JP2017510535A - レーザ切断済みガラスを機械的に加工することによる縁部面取り - Google Patents
レーザ切断済みガラスを機械的に加工することによる縁部面取り Download PDFInfo
- Publication number
- JP2017510535A JP2017510535A JP2016548296A JP2016548296A JP2017510535A JP 2017510535 A JP2017510535 A JP 2017510535A JP 2016548296 A JP2016548296 A JP 2016548296A JP 2016548296 A JP2016548296 A JP 2016548296A JP 2017510535 A JP2017510535 A JP 2017510535A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- edge
- workpiece
- wheel
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/18—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor with cooling provisions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
- B24D9/02—Expansible drums for carrying flexible material in tubular form, e.g. expanded by centrifugal force
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Ceramic Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461932030P | 2014-01-27 | 2014-01-27 | |
| US61/932,030 | 2014-01-27 | ||
| US201462022885P | 2014-07-10 | 2014-07-10 | |
| US62/022,885 | 2014-07-10 | ||
| US14/530,410 US10442719B2 (en) | 2013-12-17 | 2014-10-31 | Edge chamfering methods |
| US14/530,410 | 2014-10-31 | ||
| PCT/US2015/013026 WO2015113026A2 (en) | 2014-01-27 | 2015-01-27 | Edge chamfering by mechanically processing laser cut glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017510535A true JP2017510535A (ja) | 2017-04-13 |
| JP2017510535A5 JP2017510535A5 (enExample) | 2018-03-01 |
Family
ID=53682139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016548296A Pending JP2017510535A (ja) | 2014-01-27 | 2015-01-27 | レーザ切断済みガラスを機械的に加工することによる縁部面取り |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3099640B1 (enExample) |
| JP (1) | JP2017510535A (enExample) |
| KR (1) | KR102432658B1 (enExample) |
| CN (1) | CN106102983B (enExample) |
| TW (1) | TWI673128B (enExample) |
| WO (1) | WO2015113026A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112008505A (zh) * | 2020-09-01 | 2020-12-01 | 芜湖长信科技股份有限公司 | 一种超薄柔性玻璃切割及边缘处理方法 |
| WO2023100957A1 (ja) * | 2021-12-03 | 2023-06-08 | 日本電気硝子株式会社 | ガラス板の製造方法 |
| JP2024504843A (ja) * | 2021-02-02 | 2024-02-01 | トルンプフ レーザー- ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | ワークピースをレーザ加工するための装置及び方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016010943A2 (en) * | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| JP6724643B2 (ja) * | 2015-09-04 | 2020-07-15 | Agc株式会社 | ガラス板の製造方法、ガラス物品の製造方法、ガラス板、ガラス物品、およびガラス物品の製造装置 |
| CN107922259B (zh) | 2015-09-04 | 2021-05-07 | Agc株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
| DE102016102768A1 (de) * | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
| WO2018043016A1 (ja) * | 2016-09-01 | 2018-03-08 | 旭硝子株式会社 | ガラス物品の製造方法およびガラス物品 |
| DE102017100015A1 (de) | 2017-01-02 | 2018-07-05 | Schott Ag | Verfahren zum Trennen von Substraten |
| DE102017100755A1 (de) | 2017-01-16 | 2018-07-19 | Schott Ag | Vorrichtung und Verfahren zur Bearbeitung von Glas- oder Glaskeramikelementen mittels eines Lasers |
| JP6531877B2 (ja) | 2017-02-21 | 2019-06-19 | Agc株式会社 | ガラス板およびガラス板の製造方法 |
| CN110291050B (zh) | 2017-02-21 | 2022-04-29 | Agc株式会社 | 玻璃板和玻璃板的制造方法 |
| JP6890885B2 (ja) * | 2017-04-04 | 2021-06-18 | 株式会社ディスコ | 加工方法 |
| KR20200059282A (ko) * | 2017-10-04 | 2020-05-28 | 쌩-고벵 글래스 프랑스 | 모따기된 관통 구멍을 갖는 복합 유리판 |
| CN107775198B (zh) * | 2017-10-30 | 2019-05-17 | 杨进明 | 一种卫浴玻璃的切边装置 |
| CN107852982A (zh) * | 2017-11-28 | 2018-03-30 | 镇江市高等专科学校 | 一种秸秆切割装置 |
| JP7230650B2 (ja) | 2019-04-05 | 2023-03-01 | Tdk株式会社 | 無機材料基板の加工方法、デバイス、およびデバイスの製造方法 |
| CN109926723A (zh) * | 2019-04-22 | 2019-06-25 | 恩利克(上海)智能装备有限公司 | 一种激光修整玻璃盖板印刷边框的系统 |
| DE102020206670A1 (de) * | 2020-05-28 | 2021-12-02 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserschneidverfahren und Laserschneidanlage |
| US12011781B2 (en) * | 2020-06-10 | 2024-06-18 | Corning Incorporated | Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces |
| KR102345239B1 (ko) * | 2020-07-06 | 2021-12-30 | 주식회사 도우인시스 | 레이저를 이용한 박막 글라스 커팅 및 커팅면 형상 가공 방법 |
| CN116348238A (zh) * | 2020-10-06 | 2023-06-27 | 日本电气硝子株式会社 | 具有贯通孔的玻璃基板 |
| DE102020134198A1 (de) | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
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| DE102020134197A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
| CN116867748A (zh) * | 2020-12-21 | 2023-10-10 | 康宁公司 | 基板切割和分离系统及方法 |
| JP2024501225A (ja) | 2020-12-21 | 2024-01-11 | コーニング インコーポレイテッド | 基板切断分離システムおよび方法 |
| CN112828474B (zh) * | 2020-12-31 | 2022-07-05 | 武汉华工激光工程有限责任公司 | 用于透明脆性材料的斜向切割补偿方法及系统 |
| CN113714659B (zh) * | 2021-08-31 | 2023-10-24 | 东莞光韵达光电科技有限公司 | 一种用于smt模板的飞秒激光切割装置 |
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- 2015-01-27 CN CN201580015565.XA patent/CN106102983B/zh active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112008505A (zh) * | 2020-09-01 | 2020-12-01 | 芜湖长信科技股份有限公司 | 一种超薄柔性玻璃切割及边缘处理方法 |
| JP2024504843A (ja) * | 2021-02-02 | 2024-02-01 | トルンプフ レーザー- ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | ワークピースをレーザ加工するための装置及び方法 |
| JP7644828B2 (ja) | 2021-02-02 | 2025-03-12 | トルンプフ レーザー- ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | ワークピースをレーザ加工するための装置及び方法 |
| WO2023100957A1 (ja) * | 2021-12-03 | 2023-06-08 | 日本電気硝子株式会社 | ガラス板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI673128B (zh) | 2019-10-01 |
| WO2015113026A2 (en) | 2015-07-30 |
| CN106102983B (zh) | 2018-06-22 |
| EP3099640B1 (en) | 2022-01-12 |
| TW201540410A (zh) | 2015-11-01 |
| CN106102983A (zh) | 2016-11-09 |
| KR20160113694A (ko) | 2016-09-30 |
| WO2015113026A3 (en) | 2015-10-01 |
| KR102432658B1 (ko) | 2022-08-16 |
| EP3099640A2 (en) | 2016-12-07 |
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