TWI673128B - 藉由機械處理雷射切割玻璃的邊緣去角及/或切斜之玻璃物件及方法 - Google Patents

藉由機械處理雷射切割玻璃的邊緣去角及/或切斜之玻璃物件及方法 Download PDF

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Publication number
TWI673128B
TWI673128B TW104102741A TW104102741A TWI673128B TW I673128 B TWI673128 B TW I673128B TW 104102741 A TW104102741 A TW 104102741A TW 104102741 A TW104102741 A TW 104102741A TW I673128 B TWI673128 B TW I673128B
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Taiwan
Prior art keywords
laser
edge
workpiece
wheel
laser beam
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TW104102741A
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English (en)
Chinese (zh)
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TW201540410A (zh
Inventor
班可蒂斯喬那斯
烏立格凱文威廉
Original Assignee
美商康寧公司
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Priority claimed from US14/530,410 external-priority patent/US10442719B2/en
Application filed by 美商康寧公司 filed Critical 美商康寧公司
Publication of TW201540410A publication Critical patent/TW201540410A/zh
Application granted granted Critical
Publication of TWI673128B publication Critical patent/TWI673128B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/18Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor with cooling provisions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/02Expansible drums for carrying flexible material in tubular form, e.g. expanded by centrifugal force
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Surface Treatment Of Glass (AREA)
TW104102741A 2014-01-27 2015-01-27 藉由機械處理雷射切割玻璃的邊緣去角及/或切斜之玻璃物件及方法 TWI673128B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201461932030P 2014-01-27 2014-01-27
US61/932,030 2014-01-27
US201462022885P 2014-07-10 2014-07-10
US62/022,885 2014-07-10
US14/530,410 US10442719B2 (en) 2013-12-17 2014-10-31 Edge chamfering methods
US14/530,410 2014-10-31

Publications (2)

Publication Number Publication Date
TW201540410A TW201540410A (zh) 2015-11-01
TWI673128B true TWI673128B (zh) 2019-10-01

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TW104102741A TWI673128B (zh) 2014-01-27 2015-01-27 藉由機械處理雷射切割玻璃的邊緣去角及/或切斜之玻璃物件及方法

Country Status (6)

Country Link
EP (1) EP3099640B1 (enExample)
JP (1) JP2017510535A (enExample)
KR (1) KR102432658B1 (enExample)
CN (1) CN106102983B (enExample)
TW (1) TWI673128B (enExample)
WO (1) WO2015113026A2 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016010943A2 (en) * 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
JP6724643B2 (ja) * 2015-09-04 2020-07-15 Agc株式会社 ガラス板の製造方法、ガラス物品の製造方法、ガラス板、ガラス物品、およびガラス物品の製造装置
CN107922259B (zh) 2015-09-04 2021-05-07 Agc株式会社 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置
DE102016102768A1 (de) * 2016-02-17 2017-08-17 Schott Ag Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement
WO2018043016A1 (ja) * 2016-09-01 2018-03-08 旭硝子株式会社 ガラス物品の製造方法およびガラス物品
DE102017100015A1 (de) 2017-01-02 2018-07-05 Schott Ag Verfahren zum Trennen von Substraten
DE102017100755A1 (de) 2017-01-16 2018-07-19 Schott Ag Vorrichtung und Verfahren zur Bearbeitung von Glas- oder Glaskeramikelementen mittels eines Lasers
JP6531877B2 (ja) 2017-02-21 2019-06-19 Agc株式会社 ガラス板およびガラス板の製造方法
CN110291050B (zh) 2017-02-21 2022-04-29 Agc株式会社 玻璃板和玻璃板的制造方法
JP6890885B2 (ja) * 2017-04-04 2021-06-18 株式会社ディスコ 加工方法
KR20200059282A (ko) * 2017-10-04 2020-05-28 쌩-고벵 글래스 프랑스 모따기된 관통 구멍을 갖는 복합 유리판
CN107775198B (zh) * 2017-10-30 2019-05-17 杨进明 一种卫浴玻璃的切边装置
CN107852982A (zh) * 2017-11-28 2018-03-30 镇江市高等专科学校 一种秸秆切割装置
JP7230650B2 (ja) 2019-04-05 2023-03-01 Tdk株式会社 無機材料基板の加工方法、デバイス、およびデバイスの製造方法
CN109926723A (zh) * 2019-04-22 2019-06-25 恩利克(上海)智能装备有限公司 一种激光修整玻璃盖板印刷边框的系统
DE102020206670A1 (de) * 2020-05-28 2021-12-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserschneidverfahren und Laserschneidanlage
US12011781B2 (en) * 2020-06-10 2024-06-18 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces
KR102345239B1 (ko) * 2020-07-06 2021-12-30 주식회사 도우인시스 레이저를 이용한 박막 글라스 커팅 및 커팅면 형상 가공 방법
CN112008505B (zh) * 2020-09-01 2022-09-16 芜湖东信光电科技有限公司 一种超薄柔性玻璃切割及边缘处理方法
CN116348238A (zh) * 2020-10-06 2023-06-27 日本电气硝子株式会社 具有贯通孔的玻璃基板
DE102020134198A1 (de) 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
CN112775563B (zh) * 2020-12-18 2023-05-05 西安晟光硅研半导体科技有限公司 一种碳化硅晶片单向四层双向八级台阶切割工艺
DE102020134197A1 (de) * 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
CN116867748A (zh) * 2020-12-21 2023-10-10 康宁公司 基板切割和分离系统及方法
JP2024501225A (ja) 2020-12-21 2024-01-11 コーニング インコーポレイテッド 基板切断分離システムおよび方法
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
JP7644828B2 (ja) * 2021-02-02 2025-03-12 トルンプフ レーザー- ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング ワークピースをレーザ加工するための装置及び方法
CN113714659B (zh) * 2021-08-31 2023-10-24 东莞光韵达光电科技有限公司 一种用于smt模板的飞秒激光切割装置
WO2023100957A1 (ja) * 2021-12-03 2023-06-08 日本電気硝子株式会社 ガラス板の製造方法
CN116230127B (zh) * 2022-12-26 2025-12-05 西南科技大学 抛光垫磨损导致材料去除率不稳定的快速补偿方法
CN115846880B (zh) * 2022-12-26 2024-11-26 西安中科微精光子科技股份有限公司 一种半球工件的激光抛光方法、系统及计算机存储介质
CN118246527B (zh) * 2024-02-26 2024-11-15 吉林工程技术师范学院 一种磨料射流冷切割质量预测方法及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259978A (ja) * 2000-03-07 2001-09-25 Three M Innovative Properties Co ガラス板の端部を面取りする方法
CN1573364A (zh) * 2003-05-22 2005-02-02 液体空气乔治洛德方法利用和研究的具有监督和管理委员会的有限公司 用于激光切割的聚焦光学元件
JP2008018547A (ja) * 2006-07-11 2008-01-31 Seiko Epson Corp 基体の製造方法、tft基板の製造方法、多層構造基板の製造方法、表示装置の製造方法
US20120196071A1 (en) * 2011-02-01 2012-08-02 Cornejo Ivan A Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US20130126573A1 (en) * 2010-07-12 2013-05-23 Filaser Inc. Method of material processing by laser filamentation
US20130224439A1 (en) * 2012-02-28 2013-08-29 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763508A (ja) * 1993-08-31 1995-03-10 Ishikawajima Harima Heavy Ind Co Ltd レーザ顕微鏡
JPH0964444A (ja) * 1995-08-22 1997-03-07 Sharp Corp 長焦点レーザビーム発生装置
JP3646828B2 (ja) * 1996-05-20 2005-05-11 シャープ株式会社 レーザビーム発生用光学素子及びこのレーザビーム発生用光学素子を用いたバーコード読み取り装置
JPH10186115A (ja) * 1996-12-20 1998-07-14 Sharp Corp レーザビーム発生用光学素子及びレーザビーム発生装置
JPH1145456A (ja) * 1997-05-30 1999-02-16 Fuji Electric Co Ltd 光学ヘッド
JP3795778B2 (ja) * 2001-08-24 2006-07-12 株式会社ノリタケカンパニーリミテド 水添ビスフェノールa型エポキシ樹脂を用いたレジノイド研削砥石
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
JP4692717B2 (ja) * 2004-11-02 2011-06-01 澁谷工業株式会社 脆性材料の割断装置
JP2006248885A (ja) * 2005-02-08 2006-09-21 Takeji Arai 超短パルスレーザによる石英の切断方法
GB0720484D0 (en) * 2007-10-19 2007-11-28 Seereal Technologies Sa Cells
JP2009280452A (ja) * 2008-05-23 2009-12-03 Central Glass Co Ltd ガラス基板及び製造方法
JP5155774B2 (ja) * 2008-08-21 2013-03-06 株式会社ノリタケカンパニーリミテド プラトー面加工用レジノイド超砥粒砥石ホイール
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US20100279067A1 (en) * 2009-04-30 2010-11-04 Robert Sabia Glass sheet having enhanced edge strength
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
JP5772827B2 (ja) * 2010-07-12 2015-09-02 旭硝子株式会社 インプリントモールド用TiO2含有石英ガラス基材およびその製造方法
JP2012076949A (ja) * 2010-09-30 2012-04-19 Seiko Epson Corp ガラスチップの製造方法
US9259594B2 (en) * 2010-10-18 2016-02-16 Bwt Property, Inc. Apparatus and methods for deep tissue laser therapy
US8986072B2 (en) * 2011-05-26 2015-03-24 Corning Incorporated Methods of finishing an edge of a glass sheet
US20130288010A1 (en) * 2012-04-27 2013-10-31 Ravindra Kumar Akarapu Strengthened glass article having shaped edge and method of making
AT13206U1 (de) * 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259978A (ja) * 2000-03-07 2001-09-25 Three M Innovative Properties Co ガラス板の端部を面取りする方法
CN1573364A (zh) * 2003-05-22 2005-02-02 液体空气乔治洛德方法利用和研究的具有监督和管理委员会的有限公司 用于激光切割的聚焦光学元件
JP2008018547A (ja) * 2006-07-11 2008-01-31 Seiko Epson Corp 基体の製造方法、tft基板の製造方法、多層構造基板の製造方法、表示装置の製造方法
US20130126573A1 (en) * 2010-07-12 2013-05-23 Filaser Inc. Method of material processing by laser filamentation
US20120196071A1 (en) * 2011-02-01 2012-08-02 Cornejo Ivan A Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US20130224439A1 (en) * 2012-02-28 2013-08-29 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby

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CN106102983B (zh) 2018-06-22
EP3099640B1 (en) 2022-01-12
TW201540410A (zh) 2015-11-01
CN106102983A (zh) 2016-11-09
KR20160113694A (ko) 2016-09-30
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