JP2017507498A5 - - Google Patents
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- Publication number
- JP2017507498A5 JP2017507498A5 JP2016561991A JP2016561991A JP2017507498A5 JP 2017507498 A5 JP2017507498 A5 JP 2017507498A5 JP 2016561991 A JP2016561991 A JP 2016561991A JP 2016561991 A JP2016561991 A JP 2016561991A JP 2017507498 A5 JP2017507498 A5 JP 2017507498A5
- Authority
- JP
- Japan
- Prior art keywords
- polarity
- fin
- substrate
- dielectric layer
- finfet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 26
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 25
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims 25
- 238000000034 method Methods 0.000 claims 23
- 229910052732 germanium Inorganic materials 0.000 claims 15
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 15
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 230000000903 blocking effect Effects 0.000 claims 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims 2
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000005669 field effect Effects 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361921453P | 2013-12-28 | 2013-12-28 | |
| US61/921,453 | 2013-12-28 | ||
| US14/573,021 | 2014-12-17 | ||
| US14/573,021 US9324717B2 (en) | 2013-12-28 | 2014-12-17 | High mobility transistors |
| PCT/US2014/072585 WO2015100456A1 (en) | 2013-12-28 | 2014-12-29 | High mobility transistors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017507498A JP2017507498A (ja) | 2017-03-16 |
| JP2017507498A5 true JP2017507498A5 (enExample) | 2018-02-01 |
| JP6644707B2 JP6644707B2 (ja) | 2020-02-12 |
Family
ID=53479727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016561991A Active JP6644707B2 (ja) | 2013-12-28 | 2014-12-29 | 高移動度トランジスタ |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9324717B2 (enExample) |
| EP (1) | EP3087603A4 (enExample) |
| JP (1) | JP6644707B2 (enExample) |
| CN (1) | CN105849905B (enExample) |
| WO (1) | WO2015100456A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104821336B (zh) * | 2015-04-20 | 2017-12-12 | 上海华力微电子有限公司 | 用于使用保形填充层改善器件表面均匀性的方法和系统 |
| EP3311415A4 (en) * | 2015-06-16 | 2019-01-16 | Intel Corporation | TRANSISTOR WITH A LUBLIC LAYER |
| CN107924944B (zh) * | 2015-09-11 | 2021-03-30 | 英特尔公司 | 磷化铝铟子鳍状物锗沟道晶体管 |
| CN106611787A (zh) * | 2015-10-26 | 2017-05-03 | 联华电子股份有限公司 | 半导体结构及其制作方法 |
| KR102532202B1 (ko) | 2016-01-22 | 2023-05-12 | 삼성전자 주식회사 | 반도체 소자 |
| US9768303B2 (en) * | 2016-01-27 | 2017-09-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and structure for FinFET device |
| WO2017218014A1 (en) | 2016-06-17 | 2017-12-21 | Intel Corporation | Field effect transistors with gate electrode self-aligned to semiconductor fin |
| US9922983B1 (en) | 2016-09-22 | 2018-03-20 | International Business Machines Corporation | Threshold voltage modulation through channel length adjustment |
| US10468310B2 (en) * | 2016-10-26 | 2019-11-05 | Globalfoundries Inc. | Spacer integration scheme for FNET and PFET devices |
| US10840350B2 (en) * | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Nanolaminate structure, semiconductor device and method of forming nanolaminate structure |
| US10424663B2 (en) * | 2017-05-23 | 2019-09-24 | International Business Machines Corporation | Super long channel device within VFET architecture |
| US11054748B2 (en) | 2018-09-21 | 2021-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dummy insertion for improving throughput of electron beam lithography |
| US11094597B2 (en) * | 2018-09-28 | 2021-08-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of semiconductor device with fin structures |
| US11923436B2 (en) * | 2020-08-07 | 2024-03-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Source/drain structure for semiconductor device |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7508031B2 (en) | 2005-07-01 | 2009-03-24 | Synopsys, Inc. | Enhanced segmented channel MOS transistor with narrowed base regions |
| JP2007258485A (ja) | 2006-03-23 | 2007-10-04 | Toshiba Corp | 半導体装置及びその製造方法 |
| WO2008039495A1 (en) * | 2006-09-27 | 2008-04-03 | Amberwave Systems Corporation | Tri-gate field-effect transistors formed by aspect ratio trapping |
| US9484462B2 (en) * | 2009-09-24 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin structure of fin field effect transistor |
| US9245805B2 (en) * | 2009-09-24 | 2016-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Germanium FinFETs with metal gates and stressors |
| US8278173B2 (en) * | 2010-06-30 | 2012-10-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating gate structures |
| US9761666B2 (en) * | 2011-06-16 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained channel field effect transistor |
| US20130011984A1 (en) * | 2011-07-07 | 2013-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Using Hexachlorodisilane as a Silicon Precursor for Source/Drain Epitaxy |
| US8624326B2 (en) * | 2011-10-20 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET device and method of manufacturing same |
| US8486770B1 (en) * | 2011-12-30 | 2013-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming CMOS FinFET device |
| US8629038B2 (en) * | 2012-01-05 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFETs with vertical fins and methods for forming the same |
| US9129827B2 (en) * | 2012-04-13 | 2015-09-08 | Intel Corporation | Conversion of strain-inducing buffer to electrical insulator |
| US8680576B2 (en) * | 2012-05-16 | 2014-03-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMOS device and method of forming the same |
| US8729634B2 (en) * | 2012-06-15 | 2014-05-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET with high mobility and strain channel |
| EP2682983B1 (en) * | 2012-07-03 | 2016-08-31 | Imec | CMOS device comprising silicon and germanium and method for manufacturing thereof |
| US8497171B1 (en) | 2012-07-05 | 2013-07-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | FinFET method and structure with embedded underlying anti-punch through layer |
| US8673718B2 (en) * | 2012-07-09 | 2014-03-18 | Globalfoundries Inc. | Methods of forming FinFET devices with alternative channel materials |
| US8841188B2 (en) * | 2012-09-06 | 2014-09-23 | International Business Machines Corporation | Bulk finFET with controlled fin height and high-K liner |
| US20140353767A1 (en) * | 2013-05-31 | 2014-12-04 | Stmicroelectronics, Inc. | Method for the formation of fin structures for finfet devices |
| KR102106348B1 (ko) * | 2013-09-27 | 2020-05-04 | 인텔 코포레이션 | 선택적 에피텍시 및 컨포멀 에피텍시의 조합에 의한 ｃｍｏｓ용의 패터닝된 실리콘 기판 상의 비실리콘 디바이스 이종층들 |
| US9023705B1 (en) * | 2013-11-01 | 2015-05-05 | Globalfoundries Inc. | Methods of forming stressed multilayer FinFET devices with alternative channel materials |
| US9136332B2 (en) * | 2013-12-10 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company Limited | Method for forming a nanowire field effect transistor device having a replacement gate |
-
2014
- 2014-12-17 US US14/573,021 patent/US9324717B2/en active Active
- 2014-12-29 EP EP14875258.7A patent/EP3087603A4/en active Pending
- 2014-12-29 CN CN201480071542.6A patent/CN105849905B/zh active Active
- 2014-12-29 JP JP2016561991A patent/JP6644707B2/ja active Active
- 2014-12-29 WO PCT/US2014/072585 patent/WO2015100456A1/en not_active Ceased
-
2016
- 2016-03-24 US US15/079,399 patent/US20160204198A1/en not_active Abandoned
- 2016-03-24 US US15/079,414 patent/US9805986B2/en active Active
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